A fixing device for memory bank heat sink

CN224922232UActive Publication Date: 2026-10-30SEMICONTEST CO LTD
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Patent Information

Application Number
CN202521200759.4
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-06-12
Publication Date
2026-10-30
Estimated Expiration
2035-06-12

AI Technical Summary

Technical Problem

[0005]本实用新型的主要目的在于提供一种用于内存条散热片的固定装置,通过设置的安装单元,来解决对不同规格内存条的夹持效果不够好的问题,通过设置的限位单元,来解决内存条的两侧需要设置有散热片,对散热片的固定效果不够好,同时固定装置的内部组件过多,需要轻量化的问题

Benefits of technology

一、本实用新型中,通过安装单元的设置,将内存条放置于两个活动板之间,随后在第一弹性柱和第一弹簧的弹力作用下使得两个活动板互相靠近,使得两个活动板夹紧内存条,在未夹紧内存条时,还可以启动气缸带动伸缩柱升降,进而带动顶板和内存条升降,进而调节内存条的高度,这样一方面可以夹持不同规格的内存条,另一方面还可以对内存条进行调节,方便内存条与主机的连接。

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Abstract

The utility model discloses a kind of fixing device for memory bank fin, it is related to memory bank fin mounting technical field, including mounting seat, still including the installation unit of being set to the top of mounting seat, and the limiting unit being set to the inside of mounting seat;Installation unit includes the clamping assembly for clamping memory bank being set to the top of mounting seat, and the lifting assembly being set to the bottom of clamping assembly;Limiting unit includes the linkage assembly fixedly connected to the bottom of clamping assembly, and the placement assembly being set to the side of linkage assembly.The utility model is a kind of fixing device for memory bank fin, different specifications of memory bank can be clamped, memory bank can also be adjusted, the connection of memory bank and host is facilitated, and on one hand, heat sink can be effectively fixed, on the other hand, the heat dissipation effect near memory bank is also optimized, the internal lightweight setting of fixing device can also achieve better cooling effect.
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Description

Technical Field

[0001] This utility model relates to the field of memory module heat sink installation technology, and in particular to a fixing device for memory module heat sinks. Background Technology

[0002] Traditionally, memory refers to random access memory, also known as main memory, which is the internal memory that directly exchanges data with the CPU. Currently, the only heat dissipation solution for memory is to attach heat sinks to the memory modules. However, the rotation of the fan in the computer case can easily cause the heat sinks to loosen, so heat sink fixing devices are needed to help secure the heat sinks.

[0003] A search revealed a publicly available (announcement) CN218122563U disclosure of a memory module locking structure for improved heat dissipation, belonging to the field of memory module installation technology. The structure includes a memory module slot with rotatably connected wire-like rotating brackets at both ends. These brackets have locking blocks for engaging the slots at both ends of the memory module. The wire-like structure of the rotating brackets at both ends of the memory module slot significantly reduces the area obstructing the front-to-back airflow, allowing for smooth and rapid airflow through the gaps between adjacent memory modules and effectively carrying away heat emitted from the sidewalls of the memory modules, thus improving heat dissipation. Furthermore, the small size of the rotating brackets ensures sufficient space for the installation of heat sinks or air shrouds. The overall structure is simple, easy to implement, and highly practical.

[0004] While the above solution can ensure sufficient installation space for heat sinks or air ducts, it is not ideal for clamping memory modules of different specifications due to the different specifications of memory modules from various manufacturers. Furthermore, heat sinks are required on both sides of the memory module, and the fixation effect of the heat sinks is not good enough. In addition, the internal components of the fixing device are too numerous, and weight reduction is required. Utility Model Content

[0005] The main purpose of this utility model is to provide a fixing device for heat sinks of memory modules. By setting up an installation unit, it solves the problem of insufficient clamping effect for memory modules of different specifications. By setting up a limiting unit, it solves the problem that the heat sinks on both sides of the memory module need to be set up, and the fixing effect of the heat sinks is not good enough. At the same time, the fixing device has too many internal components and needs to be lightweight.

[0006] To achieve the above objectives, this utility model provides the following technical solution: A fixing device for a heat sink of a memory module includes a mounting base, a mounting unit disposed at the top of the mounting base, and a limiting unit disposed inside the mounting base. The installation unit includes a clamping component disposed at the top of the mounting base for clamping the memory module, and a lifting component disposed at the bottom of the clamping component; The limiting unit includes a linkage component fixedly connected to the bottom end of the clamping component, and a placement component disposed on the side of the linkage component.

[0007] Preferably, the clamping assembly in the installation unit includes two fixed plates fixedly connected to both sides of the top of the mounting base, multiple sliding grooves opened inside the fixed plates, a first elastic column disposed inside the sliding groove, a first spring disposed on the side of the first elastic column, sliders fixedly connected to both ends of the first elastic column, and two movable plates respectively fixedly connected between the multiple sliders on both sides. The two active plates are arranged in parallel.

[0008] Preferably, the lifting assembly in the installation unit includes a support plate vertically fixedly connected to the middle of the mounting base, a cylinder disposed inside the support plate, a telescopic column disposed at the top of the cylinder, and a top plate fixedly connected to the top of the telescopic column.

[0009] Preferably, the linkage component in the limiting unit includes a connecting seat fixedly connected to the bottom end of the movable plate, a vertical groove opened in the middle of the top of the connecting seat for placing heat sinks, a placement groove opened on one side of the top of the connecting seat, a partition plate fixedly connected to the middle of the placement groove, a plurality of second elastic columns fixedly connected to both sides of the partition plate, a second spring disposed on the surface of the second elastic columns, a push plate fixedly connected to the second elastic columns on both sides respectively, and an extension plate fixedly connected to one side of the connecting seat.

[0010] Preferably, the placement component in the limiting unit includes multiple rectangular slots opened on both sides inside the mounting base, two horizontal plates fixedly connected to both sides of the partition plate, and a groove opened on the top of the horizontal plates.

[0011] Preferably, the limiting unit further includes limiting blocks fixedly connected to the front and rear sides of the connecting seat, and the limiting blocks are slidably connected to the corresponding rectangular grooves.

[0012] Preferably, the extension plate in the limiting unit is slidably connected to the corresponding groove, and the connecting seat is located inside the mounting seat.

[0013] Compared with the prior art, the present invention has the following beneficial effects: I. In this utility model, by setting up the installation unit, the memory module is placed between two movable plates. Then, under the elastic force of the first elastic column and the first spring, the two movable plates move closer to each other, so that the two movable plates clamp the memory module. When the memory module is not clamped, the cylinder can be activated to drive the telescopic column to rise and fall, thereby driving the top plate and the memory module to rise and fall, thereby adjusting the height of the memory module. In this way, on the one hand, memory modules of different specifications can be clamped, and on the other hand, the memory module can be adjusted to facilitate the connection between the memory module and the host.

[0014] II. In this utility model, by setting the limiting unit, after the memory module is clamped, the two heat sinks are placed in the vertical slot and the extension plate respectively. Since the second elastic column and the second spring are set on both sides of the partition plate, the two push plates are driven to fit against the two heat sinks respectively under the elastic force of the second elastic column and the second spring. At the same time, the position of the heat sink is restricted by the outer shell of the connecting seat and the mounting seat. One heat sink is close to the memory module, and the other heat sink is slightly farther away from the memory module. This setting effectively fixes the heat sinks on the one hand, and accelerates the cooling rate of the memory module by setting two heat sinks on one side on the other hand. It also optimizes the heat dissipation effect near the memory module. The lightweight design of the internal fixing device can also achieve better cooling effect. Attached Figure Description

[0015] Figure 1 This is a three-dimensional structural diagram of the present invention; Figure 2 This is a three-dimensional structural diagram of the connecting seat and the movable plate in this utility model; Figure 3 This is a cross-sectional view of the fixing plate in this utility model; Figure 4 This is a cross-sectional view of the connecting plate and the connecting seat in this utility model; Figure 5 This utility model Figure 4 Enlarged schematic diagram of the structure at point A in the middle; Figure 6 This is a cross-sectional view of the mounting base in this utility model.

[0016] In the picture: 1. Mounting bracket; 2. Installation unit; 201. Fixed plate; 202. Movable plate; 203. Slide groove; 204. Support plate; 205. Slider; 206. First elastic column; 207. First spring; 208. Top plate; 209. Telescopic column; 210. Cylinder; 3. Limiting unit; 301. Vertical groove; 302. Connecting seat; 303. Limiting block; 304. Extension plate; 305. Divider plate; 306. Placement groove; 307. Second elastic column; 308. Second spring; 309. Push plate; 310. Rectangular groove; 311. Horizontal plate; 312. Groove. Detailed Implementation

[0017] To make the technical means, creative features, objectives and effects of this utility model easier to understand, the present utility model will be further described below in conjunction with specific embodiments. Example

[0018] like Figures 1-6As shown, a fixing device for a memory module heat sink includes a mounting base 1, a mounting unit 2 disposed at the top of the mounting base 1, and a limiting unit 3 disposed inside the mounting base 1. The mounting unit 2 includes a clamping component disposed at the top of the mounting base 1 for clamping the memory module, and a lifting component disposed at the bottom of the clamping component; The limiting unit 3 includes a linkage component fixedly connected to the bottom end of the clamping component, and a placement component disposed on the side of the linkage component.

[0019] The clamping assembly in the mounting unit 2 includes two fixed plates 201 fixedly connected to the top two sides of the mounting base 1, multiple sliding grooves 203 opened inside the fixed plates 201, a first elastic post 206 disposed inside the sliding grooves 203, a first spring 207 disposed on the side of the first elastic post 206, sliders 205 fixedly connected to both ends of the first elastic post 206, and two movable plates 202 respectively fixedly connected between the multiple sliders 205 on both sides. The two active panels 202 are set in parallel.

[0020] The lifting assembly in the mounting unit 2 includes a support plate 204 vertically fixedly connected to the middle of the mounting base 1, a cylinder 210 disposed inside the support plate 204, a telescopic column 209 disposed at the top of the cylinder 210, and a top plate 208 fixedly connected to the top of the telescopic column 209.

[0021] The linkage components in the limiting unit 3 include a connecting seat 302 fixedly connected to the bottom of the movable plate 202, a vertical groove 301 opened in the middle of the top of the connecting seat 302 for placing heat sinks, a placement groove 306 opened on one side of the top of the connecting seat 302, a partition plate 305 fixedly connected to the middle of the placement groove 306, a plurality of second elastic columns 307 fixedly connected to both sides of the partition plate 305, a second spring 308 disposed on the surface of the second elastic columns 307, a push plate 309 fixedly connected to the second elastic columns 307 on both sides respectively, and an extension plate 304 fixedly connected to one side of the connecting seat 302.

[0022] The placement components in the limiting unit 3 include multiple rectangular slots 310 formed on both sides inside the mounting base 1, two horizontal plates 311 fixedly connected to both sides of the partition plate 305, and a groove 312 formed on the top of the horizontal plate 311.

[0023] The limiting unit 3 also includes a limiting block 303 fixedly connected to the front and rear sides of the connecting seat 302, and the limiting block 303 is slidably connected to the corresponding rectangular groove 310.

[0024] The extension plate 304 in the limiting unit 3 is slidably connected to the corresponding groove 312, and the connecting seat 302 is located inside the mounting seat 1.

[0025] The memory module is placed between the two movable plates 202. Then, under the elastic force of the first elastic column 206 and the first spring 207, the two movable plates 202 move closer to each other, clamping the memory module. When the memory module is not clamped, the cylinder 210 can be activated to drive the telescopic column 209 to rise and fall, thereby driving the top plate 208 and the memory module to rise and fall, thus adjusting the height of the memory module. This allows for clamping memory modules of different specifications and also allows for adjustment of the memory module, facilitating the connection between the memory module and the host. Example

[0026] like Figures 1-6 As shown, a fixing device for a memory module heat sink includes a mounting base 1, a mounting unit 2 disposed at the top of the mounting base 1, and a limiting unit 3 disposed inside the mounting base 1. The mounting unit 2 includes a clamping component disposed at the top of the mounting base 1 for clamping the memory module, and a lifting component disposed at the bottom of the clamping component; The limiting unit 3 includes a linkage component fixedly connected to the bottom end of the clamping component, and a placement component disposed on the side of the linkage component.

[0027] The clamping assembly in the mounting unit 2 includes two fixed plates 201 fixedly connected to the top two sides of the mounting base 1, multiple sliding grooves 203 opened inside the fixed plates 201, a first elastic post 206 disposed inside the sliding grooves 203, a first spring 207 disposed on the side of the first elastic post 206, sliders 205 fixedly connected to both ends of the first elastic post 206, and two movable plates 202 respectively fixedly connected between the multiple sliders 205 on both sides. The two active panels 202 are set in parallel.

[0028] The lifting assembly in the mounting unit 2 includes a support plate 204 vertically fixedly connected to the middle of the mounting base 1, a cylinder 210 disposed inside the support plate 204, a telescopic column 209 disposed at the top of the cylinder 210, and a top plate 208 fixedly connected to the top of the telescopic column 209.

[0029] The linkage components in the limiting unit 3 include a connecting seat 302 fixedly connected to the bottom of the movable plate 202, a vertical groove 301 opened in the middle of the top of the connecting seat 302 for placing heat sinks, a placement groove 306 opened on one side of the top of the connecting seat 302, a partition plate 305 fixedly connected to the middle of the placement groove 306, a plurality of second elastic columns 307 fixedly connected to both sides of the partition plate 305, a second spring 308 disposed on the surface of the second elastic columns 307, a push plate 309 fixedly connected to the second elastic columns 307 on both sides respectively, and an extension plate 304 fixedly connected to one side of the connecting seat 302.

[0030] The placement components in the limiting unit 3 include multiple rectangular slots 310 formed on both sides inside the mounting base 1, two horizontal plates 311 fixedly connected to both sides of the partition plate 305, and a groove 312 formed on the top of the horizontal plate 311.

[0031] The limiting unit 3 also includes a limiting block 303 fixedly connected to the front and rear sides of the connecting seat 302, and the limiting block 303 is slidably connected to the corresponding rectangular groove 310.

[0032] The extension plate 304 in the limiting unit 3 is slidably connected to the corresponding groove 312, and the connecting seat 302 is located inside the mounting seat 1.

[0033] After the memory module is clamped, the two heat sinks are placed in the vertical slot 301 and on the extension plate 304, respectively. Since the partition plate 305 is provided with a second elastic post 307 and a second spring 308 on both sides, the elastic force of the second elastic post 307 and the second spring 308 drives the two push plates 309 to fit against the two heat sinks respectively. At the same time, the position of the heat sinks is restricted by the connecting seat 302 and the outer shell of the mounting seat 1. One heat sink is close to the memory module, and the other heat sink is slightly farther away from the memory module. This setting effectively fixes the heat sinks and accelerates the cooling rate of the memory module by setting two heat sinks on one side. It also optimizes the heat dissipation effect near the memory module. The lightweight design of the internal fixing device can also achieve better cooling effect.

[0034] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of this utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claims. The scope of protection of this utility model is defined by the appended claims and their equivalents.

Claims

1. A fixing device for a heat sink of a memory module, comprising a mounting base (1), characterized in that, It also includes a mounting unit (2) disposed at the top of the mounting base (1) and a limiting unit (3) disposed inside the mounting base (1); The installation unit (2) includes a clamping component disposed at the top of the mounting base (1) for clamping the memory module, and a lifting component disposed at the bottom of the clamping component; The limiting unit (3) includes a linkage component fixedly connected to the bottom end of the clamping component, and a placement component disposed on the side of the linkage component.

2. The fixing device for a heat sink of a memory module according to claim 1, characterized in that: The clamping assembly in the installation unit (2) includes two fixed plates (201) fixedly connected to the top sides of the mounting base (1), multiple sliding grooves (203) opened inside the fixed plates (201), a first elastic column (206) set inside the sliding grooves (203), a first spring (207) set on the side of the first elastic column (206), sliders (205) fixedly connected to both ends of the first elastic column (206), and two movable plates (202) fixedly connected between the multiple sliders (205) on both sides respectively. The two active plates (202) are arranged in parallel between each other.

3. The fixing device for a memory module heatsink according to claim 2, characterized in that: The lifting assembly in the installation unit (2) includes a support plate (204) vertically fixedly connected to the middle of the mounting base (1), a cylinder (210) disposed inside the support plate (204), a telescopic column (209) disposed at the top of the cylinder (210), and a top plate (208) fixedly connected to the top of the telescopic column (209).

4. The fixing device for a heat sink of a memory module according to claim 3, characterized in that: The linkage components in the limiting unit (3) include a connecting seat (302) fixedly connected to the bottom of the movable plate (202), a vertical groove (301) opened in the middle of the top of the connecting seat (302) for placing heat sinks, a placement groove (306) opened on one side of the top of the connecting seat (302), a partition plate (305) fixedly connected to the middle of the placement groove (306), a plurality of second elastic columns (307) fixedly connected to both sides of the partition plate (305), a second spring (308) provided on the surface of the second elastic column (307), a push plate (309) fixedly connected to the second elastic columns (307) on both sides respectively, and an extension plate (304) fixedly connected to one side of the connecting seat (302).

5. A fixing device for a heat sink of a memory module according to claim 4, characterized in that: The placement components in the limiting unit (3) include multiple rectangular slots (310) opened on both sides inside the mounting base (1), two horizontal plates (311) fixedly connected to both sides of the partition plate (305), and a groove (312) opened on the top of the horizontal plate (311).

6. A fixing device for a heat sink of a memory module according to claim 5, characterized in that: The limiting unit (3) further includes a limiting block (303) fixedly connected to the front and rear sides of the connecting seat (302), and the limiting block (303) is slidably connected to the corresponding rectangular groove (310).

7. A fixing device for a heat sink of a memory module according to claim 6, characterized in that: The extension plate (304) in the limiting unit (3) is slidably connected to the corresponding groove (312), and the connecting seat (302) is located inside the mounting seat (1).

Citation Information

Patent Citations

  • Memory bank locking structure convenient for heat dissipation

    CN218122563U