Computer with thermal energy recovery

Abstract

The utility model provides a computer with heat energy recovery, the computer with heat energy recovery includes mainboard, heat dissipation subassembly, mainboard subassembly, heat conduction subassembly and heat energy recovery subassembly, the heat dissipation subassembly covers the one side of the shell with opening to close the shell, the mainboard subassembly is located in the shell, one end of heat conduction subassembly is pasted in the mainboard subassembly for the heat conduction of mainboard subassembly, heat energy recovery subassembly with mainboard subassembly electricity is connected, one side of heat energy recovery subassembly is connected with heat dissipation subassembly, the other side of heat energy recovery subassembly is connected with the other end of heat conduction subassembly, for the heat of heat conduction subassembly is converted into electric energy and is transported to mainboard subassembly, and the redundant heat is cooled through heat dissipation subassembly, the utility model not only can recover heat energy to improve the battery endurance, satisfy the demand of user, and still can cool to the redundant heat.

Description

Technical Field

[0001] This utility model relates to the field of computer technology, specifically to a computer with heat recovery. Background Technology

[0002] Industrial laptops are a type of dedicated laptop primarily designed for outdoor mobile terminal scenarios, characterized by high reliability and long battery life. However, with the widespread adoption of artificial intelligence and big data analytics technologies, industrial laptops have been equipped with high-power components such as computing modules, display chips, and high-performance processors. As the number of high-power components increases, the battery life of industrial laptops decreases, gradually failing to meet user needs. Utility Model Content

[0003] This invention provides a computer with heat recovery, aiming to solve the problem that the battery life of current industrial laptops cannot meet user needs.

[0004] This utility model provides a computer with heat recovery, comprising a motherboard, a heat dissipation component, a motherboard assembly, a heat conduction component, and a heat recovery component; the heat dissipation component covers the open side of the housing to seal the housing; the motherboard assembly is disposed inside the housing; one end of the heat conduction component is attached to the motherboard assembly for conducting heat from the motherboard assembly; the heat recovery component is electrically connected to the motherboard assembly, one side of the heat recovery component is connected to the heat dissipation component, and the other side of the heat recovery component is connected to the other end of the heat conduction component, for converting the heat from the heat conduction component into electrical energy and then delivering it to the motherboard assembly, and excess heat is dissipated through the heat dissipation component.

[0005] Furthermore, the heat conduction component includes a heat-receiving substrate, a heat-dissipating substrate, and a conduit assembly; one side of the heat-receiving substrate is attached to the motherboard assembly, and the other side of the heat-receiving substrate is fitted with the conduit assembly; one side of the heat-dissipating substrate is fitted with the conduit assembly, and the other side of the heat-dissipating substrate is attached to the heat recovery component.

[0006] Furthermore, the conduit assembly includes a first heat pipe and a second heat pipe; both the first heat pipe and the second heat pipe include heat-absorbing parts and heat-releasing parts connected to each other, the heat-absorbing parts of the first heat pipe and the second heat pipe are fitted with the other side of the heated substrate, and the heat-releasing parts of the first heat pipe and the second heat pipe are fitted with one side of the heat-releasing substrate.

[0007] Furthermore, the heat recovery component includes a heat sink and a thermoelectric conversion component; one side of the heat sink is connected to the heat dissipation substrate, the other side of the heat sink is connected to the heat dissipation component, and the heat sink is also connected to the thermoelectric conversion component.

[0008] Further, the heat sink includes a first metal component and a second metal component; one side of the first metal component is connected to the heat dissipation substrate, and the other side of the first metal component is connected to the thermoelectric conversion component; one side of the second metal component is connected to the thermoelectric conversion component, and the other side of the second metal component is connected to the heat dissipation component; wherein, the thermal conductivity of the first metal component is higher than that of the second metal component, and the specific heat capacity of the first metal component is lower than that of the second metal component.

[0009] Furthermore, the side of the first metal part connected to the thermoelectric conversion assembly is provided with a first step portion to form a first step surface and a second step surface, and the side of the second metal part connected to the thermoelectric conversion assembly is provided with a second step portion to form a third step surface and a fourth step surface; the first step surface is connected to one side of the thermoelectric conversion assembly, the second step surface is connected to the third step surface, and the fourth step surface is connected to the other side of the thermoelectric conversion assembly.

[0010] Furthermore, the thermoelectric conversion component includes a thermoelectric conversion chip, connecting wires, and a main control module; one side of the thermoelectric conversion chip is connected to the first metal component, the other side of the thermoelectric conversion chip is connected to the second metal component, and the thermoelectric conversion chip is connected to the main control module through the connecting wires, and the main control module is electrically connected to the motherboard component.

[0011] Furthermore, the heat dissipation component includes a cover plate and a plurality of heat dissipation fins, one side of the cover plate is connected to the heat recovery component, and the other side of the cover plate is provided with the heat dissipation fins.

[0012] Furthermore, the motherboard assembly includes a motherboard, a processor, a display chip, and a battery assembly; the motherboard is provided with the processor, the display chip, and the battery assembly, and the processor and the display chip are both connected to the heat conduction assembly.

[0013] Furthermore, the battery assembly includes a first battery pack and a second battery pack, both of which are connected to the motherboard.

[0014] This utility model discloses a computer with heat recovery, comprising a casing, a heat dissipation component, a motherboard component, a heat conduction component, and a heat recovery component. The heat dissipation component covers the casing to seal it, and the motherboard component is housed inside the casing. One end of the heat conduction component is attached to the motherboard component to conduct heat from it, and the other end is connected to the heat recovery component, facilitating the absorption of heat from the heat conduction component. Simultaneously, the heat recovery component is also connected to the heat dissipation component. The heat recovery component can convert some of the absorbed heat into electrical energy and transfer it to the motherboard component to power it, thus achieving heat recovery. Excess heat can be dissipated through the heat dissipation component. This not only achieves heat dissipation but also heat recovery, improving the computer's battery life and meeting user needs. Attached Figure Description

[0015] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0016] Figure 1 This is an overall structural diagram of a computer with heat recovery provided in an embodiment of the present invention; Figure 2 yes Figure 1 An exploded view of the overall structure diagram shown; Figure 3 yes Figure 1 The front view of the overall structure diagram shown; Figure 4 yes Figure 3 Enlarged structural diagram of section A; Figure 5 yes Figure 3 An exploded view of the front view shown; Figure 6 This is a partial structural diagram of a computer with heat recovery provided in an embodiment of the present invention; Figure 7 This is an overall structural diagram of a heat conduction component provided in an embodiment of this utility model; Figure 8 This is an overall structural diagram of a thermoelectric conversion component provided in an embodiment of the present invention; Figure 9 This is an assembly drawing of a thermoelectric conversion component provided in an embodiment of the present invention; Figure 10 This is an overall structural diagram of the first metal part provided in an embodiment of the present invention; Figure 11This is an overall structural diagram of the second metal part provided in one embodiment of the present invention; Figure 12 This is a battery pack connection block diagram provided in one embodiment of the present invention; Figure 13 This is a schematic diagram of the connection of a heat sink provided in an embodiment of the present invention; Figure 14 This is a power supply schematic diagram of a thermoelectric conversion component provided in an embodiment of the present invention; Figure 15 This is a schematic diagram of a voltage regulated output module provided in one embodiment of this utility model.

[0017] Figure Descriptions: 10. Heat dissipation assembly; 11. Cover plate; 12. Heat dissipation fins; 20. Motherboard assembly; 21. Motherboard; 22. Processor; 23. Battery assembly; 231. First battery pack; 232. Second battery pack; 24. Display chip; 30. Heat conduction assembly; 31. Heat-receiving substrate; 32. Heat-dissipating substrate; 33. Conduit assembly; 331. First heat pipe; 332. Second heat pipe; 333. Heat-absorbing part; 334. Heat-dissipating part; 40. Heat recovery assembly; 41. Heat sink; 411. First metal part; 412. Second metal part; 413. First stepped part; 414. First stepped surface; 415. Second stepped surface; 416. Second stepped part; 417. Third stepped surface; 418. Fourth stepped surface; 42. Thermoelectric conversion assembly; 421. Thermoelectric conversion chip; 422. Connecting wire; 423. Main control module; 50. Housing. Detailed Implementation

[0018] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of the present utility model.

[0019] It should be understood that, when used in this specification and the appended claims, the terms “comprising” and “including” indicate the presence of the described features, integrals, operations, elements and / or components, but do not exclude the presence or addition of one or more other features, integrals, operations, elements, components and / or collections thereof.

[0020] It should also be understood that the terminology used in this specification is for the purpose of describing particular embodiments only and is not intended to limit the scope of the invention. As used in this specification and the appended claims, the singular forms “a,” “an,” and “the” are intended to include the plural forms unless the context clearly indicates otherwise. It should also be understood that the term “and / or” as used in this specification and the appended claims refers to any combination and all possible combinations of one or more of the associated listed items, and includes such combinations.

[0021] Furthermore, the directional terms used in this invention, such as "up," "down," "front," "back," "left," "right," "inner," "outer," and "side," are only for reference to the accompanying drawings and the product's usage state. Therefore, the directional terms used are for explaining and understanding this invention, and not for limiting it. Additionally, in the accompanying drawings, structures that are similar or identical are indicated by the same reference numerals.

[0022] See Figures 1 to 15 , Figure 1 This is an overall structural diagram of a computer with heat recovery provided in an embodiment of the present invention; Figure 2 yes Figure 1 An exploded view of the overall structure diagram shown; Figure 3 yes Figure 1 The front view of the overall structure diagram shown; Figure 4 yes Figure 3 Enlarged structural diagram of section A; Figure 5 yes Figure 3 An exploded view of the front view shown; Figure 6 This is a partial structural diagram of a computer with heat recovery provided in an embodiment of the present invention; Figure 7 This is an overall structural diagram of the heat conduction component 30 provided in one embodiment of the present invention; Figure 8 This is an overall structural diagram of the thermoelectric conversion component 42 provided in one embodiment of the present invention; Figure 9 This is an assembly drawing of the thermoelectric conversion component 42 provided in one embodiment of the present invention; Figure 10 This is an overall structural diagram of the first metal part 411 provided in an embodiment of this utility model; Figure 11 This is an overall structural diagram of the second metal part 412 provided in one embodiment of the present invention; Figure 12 This is a battery pack connection block diagram provided in one embodiment of the present invention; Figure 13 This is a connection diagram of the heat sink 41 provided in one embodiment of the present invention; Figure 14 This is a power supply schematic diagram of the thermoelectric conversion component 42 provided in one embodiment of the present invention; Figure 15 This is a schematic diagram of a voltage regulated output module provided in one embodiment of this utility model.

[0023] like Figures 1 to 15 As shown, the computer with heat recovery includes a heat dissipation assembly 10, a motherboard assembly 20, a heat conduction assembly 30, a heat recovery assembly 40, and a housing 50. The heat dissipation assembly 10 covers the open side of the housing 50 to seal the housing 50. The motherboard assembly 20 is disposed inside the housing 50. One end of the heat conduction assembly 30 is attached to the motherboard assembly 20 for conducting heat from the motherboard assembly 20. The heat recovery assembly 40 is electrically connected to the motherboard assembly 20, with one side connected to the heat dissipation assembly 10 and the other side connected to the other end of the heat conduction assembly 30. It converts the heat from the heat conduction assembly 30 into electrical energy and delivers it to the motherboard assembly 20, while excess heat is dissipated through the heat dissipation assembly 10.

[0024] Specifically, a computer with heat recovery, such as a computer or laptop with an independent power supply, may include a heat dissipation component 10, a motherboard component 20, a heat conduction component 30, a heat recovery component 40, and a housing 50. The housing 50 contains the motherboard component 20, which may include various functional modules for supporting the operation of the laptop, such as a processor 21, a display chip 24, and a battery component 23.

[0025] A heat conduction component 30 is mounted on the motherboard assembly 20, with one end connected to the motherboard assembly 20 and the other end connected to the heat recovery component 40. For example, the heat conduction component 30 may include interconnected heat-absorbing and heat-releasing components. These components can be directly connected or connected via a heat-conducting medium to facilitate heat transfer. One end of the heat-absorbing component 30 is connected to a heat source device in the motherboard assembly 20. For example, the heat-absorbing component can be attached to the processor 21 and the display chip 24 to absorb the heat emitted by the processor 21 and the display chip 24 during operation and transfer the heat to the heat-releasing component. The other end of the heat-releasing component 30 is connected to the heat recovery component 40, allowing it to transfer heat to the heat recovery component 40.

[0026] One side of the heat recovery component 40 is connected to the heat dissipation element of the heat conduction component 30, and the other side is connected to the heat dissipation component 10. When heat from the heat dissipation element is conducted to the heat recovery component 40, the heat recovery component 40 absorbs the heat and converts it into electrical energy. Simultaneously, the heat recovery component 40 is connected to the motherboard component 20 via an FPC, ribbon cable, etc., allowing it to conduct electrical energy to the motherboard component 20, thus charging it. Furthermore, the heat recovery component 40 is also connected to the heat dissipation component 10. Any remaining unconverted heat in the heat recovery component 40 can be conducted to the heat dissipation component 10, which can then act as the computer's casing, dissipating heat to the outside and achieving heat dissipation for the laptop without the need for a cooling fan.

[0027] See Figure 2 As a further embodiment, the heat conduction component 30 includes a heat-receiving substrate 31, a heat-dissipating substrate 32, and a conduit assembly 33; one side of the heat-receiving substrate 31 is attached to the main board assembly 20, and the other side of the heat-receiving substrate 31 is fitted with the conduit assembly 33; one side of the heat-dissipating substrate 32 is fitted with the conduit assembly 33, and the other side of the heat-dissipating substrate 32 is attached to the heat recovery component 40.

[0028] The heat conduction component 30 may include a heat-receiving substrate 31, a heat-dissipating substrate 32, and a conduit assembly 33. The heat-receiving substrate 31 serves as a heat-absorbing element of the heat conduction component 30, the heat-dissipating substrate 32 serves as a heat-dissipating element of the heat conduction component 30, and the conduit assembly 33 serves as a heat-conducting medium for connecting the heat-receiving substrate 31 and the heat-dissipating substrate 32. Both the heat-receiving substrate 31 and the heat-dissipating substrate 32 may be made of copper, a material with high thermal conductivity. One side of the heat-receiving substrate 31 is attached to the mainboard assembly 20, for example, connected to a heat source device, and the other side of the heat-receiving substrate 31 is fitted into the conduit assembly 33. One side of the heat-dissipating substrate 32 is fitted into the conduit assembly 33, and the other side is attached to the heat recovery component 40.

[0029] With the above configuration, heat can be conducted from the heat source device to the heated substrate 31, then from the heated substrate 31 to the conduit assembly 33, then from the conduit assembly 33 to the heat dissipation substrate 32, and finally from the heat dissipation substrate 32 to the heat recovery assembly 40, thereby achieving heat dissipation of the heat source device.

[0030] In addition, the heated substrate 31 may be provided with multiple mounting holes for fixed connection with heat source devices, such as for mounting the processor 21 and the display chip 24. After the heated substrate 31 and the heat source devices are installed, the bottom of the heated substrate 31 is in close contact with the processor 21 and the display chip 24, and a thermally conductive gel medium is provided between the contact surfaces of the two to ensure the reliability of heat conduction.

[0031] The heat-dissipating substrate 32 can also be provided with multiple mounting holes for locking together with the heat recovery component 40. A thermally conductive gel medium is provided between the contact surfaces of the two to ensure the reliability of heat conduction.

[0032] As a further embodiment, the conduit assembly 33 includes a first heat pipe 331 and a second heat pipe 332; both the first heat pipe 331 and the second heat pipe 332 include heat-absorbing portions 333 and heat-releasing portions 334 connected to each other, the heat-absorbing portions 333 of the first heat pipe 331 and the second heat pipe 332 are fitted to the other side of the heated substrate 31, and the heat-releasing portions 334 of the first heat pipe 331 and the second heat pipe 332 are fitted to one side of the heat-releasing substrate 32.

[0033] The conduit assembly 33 may include multiple heat pipes. Heat pipes are mechanisms that utilize the latent heat of the working fluid (working medium) during phase change to transport large amounts of heat. When the evaporator end is heated, this heating energy vaporizes the working fluid near the pipe wall. At this time, the vapor pressure at the heat absorption end increases, causing the vapor to move towards the lower-pressure condensation end and generate a vapor flow. After cooling at the condensation end, the vapor releases its latent heat, condenses into liquid, and then flows back to the evaporator end via the capillary structure of the pipe wall, completing one cycle.

[0034] Multiple heat pipes may include a first heat pipe 331 and a second heat pipe 332, such as Figure 2 As shown, both the first heat pipe 331 and the second heat pipe 332 can be U-shaped pipes. Each U-shaped pipe can include an absorbing portion 333 and a releasing portion 334 connected to each other. The absorbing portion 333 is embedded in the heated substrate 31, and the releasing portion 334 is embedded in the releasing substrate 32. For example, grooves can be formed on both the heated substrate 31 and the releasing substrate 32 for welding the absorbing portion 333 or the releasing portion 334. Taking the heated substrate 31 as an example... Figure 7 As shown, a groove matching the shape of the heat-absorbing part 333 can be provided on both sides of the heated substrate 31. One groove is used to weld the heat-absorbing part 333 of the first heat pipe 331, and the other groove is used to weld the heat-absorbing part 333 of the second heat pipe 332.

[0035] The heated substrate 31 conducts heat from the heat source device to the heat absorption part 333, and then conducts it to the heat release part 334 via the heat absorption part 333. The heat release part 334 then conducts the heat to the heat release substrate 32, thereby realizing the conduction of heat from the heat source device.

[0036] As a further embodiment, the heat recovery component 40 includes a heat sink 41 and a thermoelectric conversion component 42; one side of the heat sink 41 is connected to the heat dissipation substrate 32, the other side of the heat sink 41 is connected to the heat dissipation component 10, and the heat sink 41 is also connected to the thermoelectric conversion component 42.

[0037] The heat recovery component 40 may include a heat sink 41 and a thermoelectric conversion component 42. One side of the heat sink 41 is connected to the heat dissipation substrate 32, and the other side of the heat sink 41 is connected to the heat dissipation component 10. The heat sink 41 is also connected to the thermoelectric conversion component 42. Through its high thermal conductivity and structural design, the heat sink 41 can efficiently conduct heat out and dissipate it to the surrounding environment, serving as a passive heat dissipation device to control the heat source temperature and ensure stable operation of the equipment within a safe temperature range. The thermoelectric conversion component 42 absorbs heat and converts it into electrical energy. The combination of the heat sink 41 and the thermoelectric conversion component 42 enables waste heat utilization.

[0038] For example, one side of the heat sink 41 is connected to the heat-dissipating substrate 32, which can absorb the heat on the heat-dissipating substrate 32 and then dissipate the heat. The thermoelectric conversion component 42 captures the heat dissipated by the heat sink 41 and converts the heat into electrical energy. The other side of the heat sink 41 is connected to the heat dissipation component 10, which can conduct the remaining heat to the heat dissipation component 10.

[0039] In a further embodiment, the heat sink 41 includes a first metal component 411 and a second metal component 412; one side of the first metal component is connected to the heat dissipation substrate 32, the other side of the first metal component 411 is connected to the thermoelectric conversion assembly 42, one side of the second metal component 412 is connected to the thermoelectric conversion assembly 42, and the other side of the second metal component 412 is connected to the heat dissipation assembly 10; wherein, the thermal conductivity of the first metal component 411 is higher than that of the second metal component 412, and the specific heat capacity of the first metal component 411 is smaller than that of the second metal component 412.

[0040] The heat sink 41 may include a first metal component 411 and a second metal component 412. The first metal component 411 and the second metal component 412 are made of different metals, thus giving them different thermal conductivity and specific heat capacity, facilitating heat conduction and recovery. For example, the first metal component 411 may be copper, and the second metal component 412 may be made of die-cast aluminum alloy. Copper has a relatively high thermal conductivity and a relatively low specific heat capacity, allowing it to transfer heat quickly but with a relatively low heat capacity. After receiving the same amount of heat, its surface temperature is relatively high, allowing the first metal component 411 to quickly absorb heat from the heat-dissipating substrate 32. On the other hand, die-cast aluminum alloy has a relatively low thermal conductivity and a relatively high specific heat capacity, allowing it to transfer heat slowly but with a strong heat capacity. After receiving the same amount of heat, its surface temperature is relatively low, allowing the second metal component 412 to absorb heat from the first metal component 411 more slowly. This creates a temperature difference between the first metal component 411 and the second metal component 412, facilitating the thermoelectric conversion component 42 to convert heat into electrical energy.

[0041] One side of the first metal component 411 is connected to the heat-dissipating substrate 32, and the other side is connected to the thermoelectric conversion assembly 42. One side of the second metal component 412 is connected to the thermoelectric conversion assembly 42, and the other side is connected to the heat dissipation assembly 10. That is, the thermoelectric conversion assembly 42 is located between the first metal component 411 and the second metal component 412. Simultaneously, the first metal component 411 and the second metal component 412 can be interconnected. The first metal component 411 can quickly absorb heat from the heat-dissipating substrate 32 and conduct the absorbed heat to the second metal component 412. Since the second metal component 412 absorbs heat more slowly, it can dissipate the heat to the surrounding environment. The thermoelectric conversion assembly 42, located between the first metal component 411 and the second metal component 412, can fully absorb the heat dissipated by the first metal component 411 and the second metal component 412, thereby converting more electrical energy. Furthermore, the second metal component 412 is also connected to the heat dissipation assembly 10, and excess heat can be conducted to the heat dissipation assembly 10 through the second metal component 412.

[0042] like Figure 13 As shown, Figure 13 The thermoelectric conversion module is a thermoelectric conversion component 42. Heat pipe #1 and heat pipe #2 are the first heat pipe 331 and the second heat pipe 332, respectively. The heat of the motherboard 21 is conducted to the copper and die-cast aluminum alloy in sequence through the heat-receiving substrate 31, the heat-dissipating substrate 32, heat pipe #1 and heat pipe #2. The thermoelectric conversion module converts the heat into electrical energy, and the excess heat is conducted to the external heat dissipation fins 12.

[0043] As a further embodiment, the side of the first metal member 411 connected to the thermoelectric conversion assembly 42 is provided with a first step portion 413 to form a first step surface 414 and a second step surface 415, and the side of the second metal member 412 connected to the thermoelectric conversion assembly 42 is provided with a second step portion 416 to form a third step surface 417 and a fourth step surface 418; the first step surface 414 is connected to one side of the thermoelectric conversion assembly 42, the second step surface 415 is connected to the third step surface 417, and the fourth step surface 418 is connected to the other side of the thermoelectric conversion assembly 42.

[0044] Among them, such as Figure 10 and Figure 11 As shown, both the first metal part 411 and the second metal part 412 can be L-shaped metal blocks. The side of the first metal part 411 connected to the thermoelectric conversion assembly 42 (such as the front side) is provided with a first step portion 413. A first step surface 414 and a second step surface 415 can be formed on the first metal part 411 through the first step portion 413. Similarly, the side of the second metal part 412 connected to the thermoelectric conversion assembly 42 (such as the front side) is provided with a second step portion 416. A third step can be formed on the second metal part 412 through the second step portion 416. With surface 417 and fourth step surface 418, the first metal part 411 and the second metal part 412 each form three contact surfaces. The first contact surface of the first metal part 411 is the first step surface 414, its second contact surface is the second step surface 415, and its third contact surface is the back side. The first contact surface of the second metal part 412 is the third step surface 417, its second contact surface is the fourth step surface 418, and its third contact surface is the back side. Thus, the first metal part 411 and the second metal part 412 have a total of 6 contact surfaces, which can improve the efficiency of heat conduction.

[0045] The first step surface 414 is connected to the thermoelectric conversion component 42, the second step surface 415 is connected to the third step surface 417, and the fourth step surface 418 is connected to the thermoelectric conversion component 42, such as... Figure 10 As shown, the area of ​​the first step surface 414 is larger than that of the second step surface 415. Therefore, most of the heat is conducted to the first step surface 414, and a small portion of the heat is conducted to the second step surface 415. Since the second step surface 415 is connected to the third step surface 417, a small portion of the heat is conducted to the second metal part 412 through the second step surface 415, and then to the heat dissipation assembly 10 through the second metal part 412. The heat dissipation assembly 10 can conduct heat to the outside through natural convection, radiation, etc., so that the temperature of the first metal part 411 is stably higher than that of the second metal part 412. The fourth step surface 418 of the second metal part 412 is connected to the heat energy conversion assembly, which allows a temperature difference to be generated between the side of the thermoelectric conversion assembly 42 connected to the first metal part 411 and the side connected to the second metal part 412, which facilitates heat absorption.

[0046] See Figure 8 and Figure 9 As a further embodiment, the thermoelectric conversion assembly 42 includes a thermoelectric conversion chip 421, a connecting wire 422, and a main control module 423; one side of the thermoelectric conversion chip 421 is connected to the first metal component 411, the other side of the thermoelectric conversion chip 421 is connected to the second metal component 412, and the thermoelectric conversion chip 421 is connected to the main control module 423 through the connecting wire 422, and the main control module 423 is electrically connected to the motherboard assembly 20.

[0047] The thermoelectric conversion assembly 42 may include a thermoelectric conversion chip 421, connecting wires 422, and a main control module 423. One side (e.g., the front side) of the thermoelectric conversion chip 421 is connected to the first metal component 411, and the other side (e.g., the back side) is connected to the second metal component 412. The thermoelectric conversion chip 421 is also connected to the main control module 423 via the connecting wires 422. As mentioned above, the temperature of the first metal component 411 is higher than the temperature of the second metal component 412, therefore the front side temperature of the thermoelectric conversion chip 421 is higher than its back side temperature, thus creating a temperature difference.

[0048] like Figure 8 As shown, the size and shape of the main control module 423 can be designed according to the selection of components and battery pack capacity. It can be square or irregular in shape; a square shape is used in the figure. The main control module 423 is connected to the thermoelectric conversion chip 421 via a connecting wire 422. The electrical energy generated by the thermoelectric conversion chip 421 is transmitted to the main control module 423 through the connecting wire 422. The main control module 423 can be connected to the battery pack via FPC, ribbon cable, etc., to achieve battery charging.

[0049] The thermoelectric conversion chip 421 generates electricity using the Seebeck effect. The first metal component 411 has a higher temperature, while the second metal component 412, which is closer to the external environment, has a lower temperature. This temperature difference between the conductors at both ends of the thermoelectric conversion chip 421 generates an electromotive force in the circuit, thus producing a current. Charge carriers diffuse from the hot side of the semiconductor, causing them to accumulate on one side and creating a potential difference. This potential difference is proportional to the temperature difference on the semiconductor and can be directly converted into electrical energy.

[0050] like Figure 14As shown, a large-capacity capacitor is connected in parallel at the output terminal of the thermoelectric conversion component 42. The capacitor's charging and discharging characteristics are used to absorb intermittent electrical energy. The output terminal of the capacitor is connected to a voltage regulator module. The voltage regulator module may include a boost converter chip, which converts the input voltage from the previous stage into a stable output voltage. The input voltage of the boost converter chip is 2.6V-5V, and the output voltage can be adjusted according to the battery charging voltage, such as to 12V. The principle of the voltage regulator module is as follows: Figure 15 As shown, the charging management module detects the battery's charge level, ambient temperature, and whether the adapter is connected to determine whether to charge the battery.

[0051] As a further embodiment, the heat dissipation assembly 10 includes a cover plate 11 and a plurality of heat dissipation fins 12. One side of the cover plate 11 is connected to the heat recovery assembly 40, and the other side of the cover plate 11 is provided with the heat dissipation fins 12.

[0052] The heat dissipation component 10 may include a cover plate 11, the inner side of which is connected to the heat recovery component 40, and the outer side of which is provided with a plurality of heat dissipation fins 12. The cover plate 11 can absorb excess heat from the heat recovery component 40 and conduct the heat to the external environment through the heat dissipation fins 12.

[0053] As a further embodiment, the motherboard assembly 20 includes a motherboard 21, a processor 21, a display chip 24, and a battery assembly 23; the motherboard 21 is provided with the processor 21, the display chip 24, and the battery assembly 23, and the processor 21 and the display chip 24 are both connected to the heat conduction assembly 30.

[0054] The motherboard assembly 20 may include a motherboard 21, a processor 21, a display chip 24, and a battery assembly 23. The motherboard 21 may be housed within the housing 50. The processor 21, the display chip 24, and the battery assembly 23 may be mounted on the motherboard 21. The battery assembly 23 is used to power the various devices on the motherboard 21. The processor 21 and the display chip 24 are connected to the heat conduction assembly 30. For example, the processor 21 and the display chip 24 may be connected to the heat-receiving substrate 31, which can conduct heat to the heat-receiving substrate 31.

[0055] As a further embodiment, the battery assembly 23 includes a first battery pack 231 and a second battery pack 232, both of which are connected to the motherboard 21.

[0056] The battery assembly 23 may include multiple battery packs, such as a first battery pack 231 and a second battery pack 232, for powering the motherboard 21. Figure 12As shown, when the thermoelectric conversion component 42 is operating, the charging management module reads data such as the battery's internal charge level and determines which battery to charge based on the status data of battery #1 (first battery pack 231) and battery #2 (second battery pack 232). For example, it can prioritize the determination based on the battery's charge level. If the charge level of #1 is greater than that of #2, then battery pack #2 is charged while battery pack #1 discharges. If the charge level of battery pack #2 is greater than that of battery pack #1, then battery pack #1 is charged while battery pack #2 discharges. In this case, one battery can act as a charging component to collect electrical energy from the thermoelectric conversion module, while the other battery acts as a discharging component to supply power to the motherboard 21. This separates battery pack #1 and battery pack #2, allowing battery #2 to discharge while battery #1 is charging, without interference.

[0057] This utility model discloses a computer with heat recovery. One end of a heat conduction component is attached to the motherboard assembly to absorb heat from the motherboard assembly. The other end of the heat conduction component is connected to a heat recovery component, which can absorb heat from the heat conduction component. At the same time, the heat conduction component is also connected to a heat dissipation component. The heat conduction component can convert some of the heat into electrical energy and transfer it to the motherboard assembly to power the motherboard assembly, thus realizing heat recovery. Excess heat can be dissipated through the heat dissipation component. This not only achieves heat dissipation but also recovers heat, improving the computer's battery life and meeting user needs.

[0058] The above description is merely a specific embodiment of this utility model, but the protection scope of this utility model is not limited thereto. Any person skilled in the art can easily conceive of various equivalent modifications or substitutions within the technical scope disclosed in this utility model, and these modifications or substitutions should all be covered within the protection scope of this utility model. Therefore, the protection scope of this utility model should be determined by the scope of the claims.

Claims

1. A computer with heat recovery, characterized in that, include: case; A heat dissipation assembly that covers the side of the housing with an opening to close the housing; A motherboard assembly, wherein the motherboard assembly is disposed within the housing; A heat conduction component, one end of which is attached to the motherboard component for conducting heat from the motherboard component; A heat recovery component is electrically connected to the motherboard component. One side of the heat recovery component is connected to the heat dissipation component, and the other side of the heat recovery component is connected to the other end of the heat conduction component. The heat recovery component is used to convert the heat of the heat conduction component into electrical energy and then deliver it to the motherboard component. Excess heat is dissipated through the heat dissipation component.

2. The computer with heat recovery as described in claim 1, characterized in that, The heat conduction assembly includes a heated substrate, a heat dissipating substrate, and a conduit assembly; One side of the heated substrate is attached to the motherboard assembly, and the other side of the heated substrate is fitted with the conduit assembly; One side of the heat-releasing substrate is fitted with the conduit assembly, and the other side of the heat-releasing substrate is attached to the heat recovery assembly.

3. The computer with heat recovery as described in claim 2, characterized in that, The conduit assembly includes a first heat pipe and a second heat pipe; Both the first heat pipe and the second heat pipe include heat-absorbing parts and heat-releasing parts connected to each other. The heat-absorbing parts of the first heat pipe and the second heat pipe are fitted into the other side of the heated substrate, and the heat-releasing parts of the first heat pipe and the second heat pipe are fitted into one side of the heat-releasing substrate.

4. The computer with heat recovery as described in claim 2, characterized in that, The heat recovery assembly includes a heat sink and a thermoelectric conversion assembly; One side of the heat sink is connected to the heat dissipation substrate, the other side of the heat sink is connected to the heat dissipation component, and the heat sink is also connected to the thermoelectric conversion component.

5. The computer with heat recovery as described in claim 4, characterized in that, The heat sink includes a first metal component and a second metal component; One side of the first metal part is connected to the heat dissipation substrate, and the other side of the first metal part is connected to the thermoelectric conversion assembly. One side of the second metal part is connected to the thermoelectric conversion assembly, and the other side of the second metal part is connected to the heat dissipation assembly. The thermal conductivity of the first metal component is higher than that of the second metal component, and the specific heat capacity of the first metal component is lower than that of the second metal component.

6. The computer with heat recovery as described in claim 5, characterized in that, The first metal part has a first step portion on the side connected to the thermoelectric conversion assembly to form a first step surface and a second step surface, and the second metal part has a second step portion on the side connected to the thermoelectric conversion assembly to form a third step surface and a fourth step surface; The first step surface is connected to one side of the thermoelectric conversion component, the second step surface is connected to the third step surface, and the fourth step surface is connected to the other side of the thermoelectric conversion component.

7. The computer with heat recovery as described in claim 5, characterized in that, The thermoelectric conversion component includes a thermoelectric conversion chip, connecting wires, and a main control module; One side of the thermoelectric conversion chip is connected to the first metal component, and the other side of the thermoelectric conversion chip is connected to the second metal component. The thermoelectric conversion chip is connected to the main control module through the connecting wire, and the main control module is electrically connected to the motherboard assembly.

8. The computer with heat recovery as described in claim 1, characterized in that, The heat dissipation assembly includes a cover plate and multiple heat dissipation fins. One side of the cover plate is connected to the heat recovery assembly, and the other side of the cover plate is provided with the heat dissipation fins.

9. The computer with heat recovery as described in claim 1, characterized in that, The motherboard assembly includes a motherboard, a processor, a display chip, and a battery assembly; The motherboard is equipped with the processor, the display chip, and the battery assembly, and both the processor and the display chip are connected to the heat conduction assembly.

10. The computer with heat recovery as described in claim 9, characterized in that, The battery assembly includes a first battery pack and a second battery pack, both of which are connected to the motherboard.

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