An immersed liquid-cooled e-sport machine structure

Abstract

The utility model discloses an immersed liquid cooling e-sports machine structure, including the case, be equipped with the heat dissipation module, immersed liquid cooling module, storage module in the case, and the top of case is equipped with interface PCB board and touch display screen, the heat dissipation module includes microchannel heat exchanger and heat dissipation fan I, and immersed liquid cooling module includes the immersion tank, the GPU component and the mainboard component of being equipped in the immersion tank, and the immersion tank one side is equipped with the adapter plate, and the immersion tank top is equipped with the gasket, and the gasket is sealed and is attached with the case, and the immersion tank is connected with microchannel heat exchanger, and the storage module includes storage hard disk, power, heat dissipation fan II, and the mainboard component is connected with interface PCB board and adapter plate through the connecting line, and the adapter plate is connected with storage hard disk through the connecting line. The utility model will heat generating element be completely immersed in coolant, and the heat dissipation efficiency is higher, and the hardware is maintained in low temperature state for a long time, can prolong the life, and the whole e-sports machine structure is completely closed, and the maintenance period is longer.

Description

Technical Field

[0001] This utility model relates to the field of immersion liquid cooling technology, and in particular to an immersion liquid-cooled gaming console structure. Background Technology

[0002] Current mainstream gaming PCs generally employ a high-performance all-in-one liquid cooling system as the core, supplemented by optimized airflow and multiple case fans to ensure stable performance of the CPU and GPU under high load. The problems with existing technology are that all-in-one liquid cooling relies on air-liquid heat exchange, its cooling efficiency is greatly affected by ambient temperature, and it may fail to effectively dissipate heat. Furthermore, all-in-one liquid cooling requires regular checks of its sealing, posing a risk of leakage, and has a short maintenance cycle. Utility Model Content

[0003] This utility model aims to solve the technical problems existing in the prior art and provides an immersion liquid-cooled gaming machine structure. By completely immersing the heating element in the coolant for direct heat dissipation, the heat can be carried away by the liquid instantly, resulting in higher heat dissipation efficiency. The hardware is kept at a low temperature for a long time, which can significantly delay the aging process and extend the service life. The entire immersion liquid-cooled gaming machine structure is completely sealed, resulting in a longer maintenance cycle.

[0004] The technical solution of this utility model is: an immersion liquid-cooled gaming PC structure, including a chassis, in which a heat dissipation module, an immersion liquid cooling module, and a storage module are arranged sequentially from left to right. An interface PCB board and a touch screen are located on the top of the chassis. The interface PCB board is positioned above the immersion liquid cooling module, and the touch screen is positioned above the heat dissipation module. The heat dissipation module includes a microchannel heat exchanger and a cooling fan I. The immersion liquid cooling module includes an immersion chamber, a GPU component and a motherboard component housed within the immersion chamber. An adapter plate is located on one side of the immersion chamber, and a sealing gasket is located on the top of the immersion chamber. The sealing gasket is sealed and fitted to the chassis. The immersion chamber is connected to the microchannel heat exchanger to achieve coolant circulation. The storage module includes a storage hard drive, a power supply, and a cooling fan II. The motherboard component is connected to the interface PCB board and the adapter plate via connecting cables, and the adapter plate is connected to the storage hard drive via connecting cables.

[0005] Furthermore, the chassis described in this utility model includes a chassis body, and sealing plates I are respectively provided on the front and rear sides of the chassis body of the heat dissipation module and the storage module. The sealing plates I are provided with heat dissipation holes. Sealing plates II are respectively provided on the front and rear sides of the chassis body of the immersion liquid cooling module. Each sealing plate II is provided with a handle on the chassis body above it. The chassis body above the immersion liquid cooling module is provided with a top cover. The interface PCB board is embedded in the top cover. The touch screen is embedded in the chassis body.

[0006] Furthermore, the GPU component described in this utility model includes multiple GPUs arranged side by side mounted on a GPU mounting plate, and a support column is provided on the inner wall of the immersion tank, with the GPU mounting plate mounted on the support column.

[0007] Furthermore, the motherboard assembly described in this utility model includes a motherboard mounted on a motherboard mounting plate, the GPU being mounted on the motherboard, an inner rail being provided on the back of the motherboard mounting plate, a guide rail fixing plate being provided on the inner wall of the immersion tank, an outer rail being provided on the guide rail fixing plate, the inner rail and the outer rail being engaged and slidably connected, and the motherboard mounting plate and the guide rail fixing plate being fixedly connected.

[0008] Furthermore, in this utility model, the immersion tank has an outlet at the bottom and an inlet at the top on the side near the microchannel heat exchanger. A direct-flow pump is provided on the outer wall of the immersion tank between the outlet and the inlet. The microchannel heat exchanger is provided with connector I and connector II. The outlet is connected to the bottom inlet of the direct-flow pump, the top outlet of the direct-flow pump is connected to connector I, and connector II is connected to the inlet.

[0009] Furthermore, in this utility model, the cooling fan I is located on one side of the microchannel heat exchanger, the cooling fan II is located on one side of the storage hard disk, and the power supply is located at the bottom of the cooling fan II and the storage hard disk.

[0010] Furthermore, the power supply in this invention is provided with a power interface, which is located on one side of the chassis.

[0011] Compared with the prior art, this utility model has the following advantages: This utility model integrates the heat dissipation module, the immersion liquid cooling module, and the storage module into a single chassis. The entire immersion liquid-cooled gaming machine structure is completely sealed, preventing coolant leakage and extending maintenance cycles. The immersion liquid cooling module contains an immersion tank where the gaming machine's motherboard and GPU are submerged. Heat dissipation is achieved through heat exchange with the coolant. The heat dissipation module mainly exchanges heat with the coolant in the immersion tank and consists primarily of a microchannel heat exchanger and a cooling fan. The storage module houses the power supply and hard drive and utilizes a cooling fan for heat dissipation. By completely immersing the heat-generating components in the coolant for direct heat dissipation, the heat can be instantly carried away by the liquid, resulting in higher heat dissipation efficiency. The hardware is maintained at a low temperature for extended periods, significantly slowing down the aging process and extending its service life. Attached Figure Description

[0012] Figure 1 This is a perspective view of the present utility model; Figure 2 This is a perspective view of the present invention from another angle; Figure 3This is a schematic diagram of the internal structure of the present invention; Figure 4 This is a perspective view of the immersion liquid cooling module described in this utility model; Figure 5 This is a perspective view of the immersion liquid cooling module described in this utility model from another angle; Figure 6 This is a schematic diagram of the back structure of the motherboard fixing plate described in this utility model; Figure 7 This is a schematic diagram of the internal structure of the immersion tank described in this utility model; Figure 8 This is a schematic diagram showing the specific arrangement of the immersion tank and the microchannel heat exchanger in this utility model.

[0013] in: 1. Chassis; 101. Chassis body; 102. Cover plate I; 102a. Ventilation holes; 103. Cover plate II; 104. Handle; 105. Top cover; 2. Heat dissipation module; 201. Microchannel heat exchanger; 201a. Connector I; 201b. Connector II; 202. Cooling fan I; 3. Immersion liquid cooling module; 301. Immersion tank; 301a. Support column; 301b. Guide rail fixing plate; 301c. Outer rail; 301d. Liquid outlet; 301e. Liquid inlet; 302. GPU assembly; 3021. GPU; 3022. GPU fixing plate; 303. Mainboard assembly; 3031. Mainboard; 3032. Mainboard fixing plate; 3033. Inner rail; 304. Adapter plate; 305. Sealing gasket; 306. Straight-through pump; 4. Storage module; 401. Storage hard disk; 402. Power supply; 402a. Power interface; 403. Cooling fan II; 5. Interface PCB board; 6. Touch screen display. Detailed Implementation

[0014] The specific embodiments of this utility model are described in detail below with reference to the accompanying drawings.

[0015] Example: The accompanying drawings illustrate a specific embodiment of the immersion liquid-cooled gaming console structure of this utility model. (Refer to...) Figure 1 , Figure 2 , Figure 3 It mainly includes a chassis 1, and inside the chassis 1, from left to right, there are heat dissipation module 2, immersion liquid cooling module 3, and storage module 4.

[0016] The chassis 1 includes a housing 101, a heat dissipation module 2, and a storage module 4. Sealing plates I 102 are respectively installed on the front and rear sides of the housing 101. Sealing plates I 102 are fixed to the housing 101 with screws and have ventilation holes 102a for heat dissipation. Sealing plates II 103 are respectively installed on the front and rear sides of the housing 101 of the immersion liquid cooling module 3. Sealing plates II 103 are fixed to the housing 101 with screws. Each sealing plate II 103 has a handle 104 on the housing 101 above it for easy transport. A top cover 105 is installed on the housing 101 above the immersion liquid cooling module 3, and an interface PCB board 5 is embedded in the top cover 105. A touch screen display 6 is installed above the heat dissipation module 2 and is embedded in the housing 101.

[0017] The heat dissipation module 2 includes a microchannel heat exchanger 201 and a cooling fan I 202, with the cooling fan I 202 located on one side of the microchannel heat exchanger 201.

[0018] The immersion liquid cooling module 3 includes an immersion tank 301 containing coolant. The immersion tank 301 houses a GPU assembly 302 and a motherboard assembly 303, which are immersed in the coolant.

[0019] Combination Figure 3 , Figure 4 , Figure 5 The GPU assembly 302 includes multiple GPUs 3021 arranged side by side on a GPU mounting plate 3022. The inner wall of the immersion tank 301 is provided with two support columns 301a of equal height. The GPU mounting plate 3022 has two notches, which correspond to the two support columns 301a. The GPU mounting plate 3022 is mounted on the two support columns 301a through the two notches.

[0020] Combination Figure 3 , Figure 4 , Figure 6 , Figure 7The motherboard assembly 303 includes a motherboard 3031 mounted on a motherboard mounting plate 3032. The other end of the GPU 3021 rests on the motherboard 3031 to ensure a stable installation that will not fall off. Two inner rails 3033 are provided on both sides of the back of the motherboard mounting plate 3032. Two guide rail fixing plates 301b are provided on the inner wall of the immersion tank 301. Each of the two guide rail fixing plates 301b has an outer rail 301c. The two outer rails 301c correspond to the two inner rails 3033 for sliding and insertion. The motherboard mounting plate 3032 has an opening at the bottom and a sealing edge at the top. The bottom of the motherboard mounting plate 3032 is aligned with the two guide rail mounting plates 301b and pushed inward, so that the two inner rails 3033 are inserted and slide along the two outer rails 301c until the sealing edge at the top of the motherboard mounting plate 3032 abuts against the top surface of the two guide rail mounting plates 301b. Then, screws can be used to fix the sealing edge at the top of the motherboard mounting plate 3032 to the two guide rail mounting plates 301b, thus completing the installation of the motherboard 3031.

[0021] An adapter plate 304 is provided on the top right side of the immersion tank 301. The adapter plate 304 is sealed and installed on the immersion tank 301 to ensure that the coolant does not leak. A sealing gasket 305 is also provided on the top of the immersion tank 301. The sealing gasket 305 is sealed and fitted with the top cover 105 to ensure the airtightness of the immersion tank 301.

[0022] Storage module 4 includes a storage hard disk 401, a power supply 402, and a cooling fan II 403. The cooling fan II 403 is located on one side of the storage hard disk 401. There are two power supplies 402, one located at the bottom of the cooling fan II 403 and the other at the bottom of the storage hard disk 401. Each power supply 402 has a power interface 402a, which is located on one side of the chassis 1. Figure 2 As shown, the power interface 402a is exposed externally for easy wiring.

[0023] Furthermore, the motherboard 3031 of the motherboard assembly 303 is connected to the interface PCB board 5 and the adapter board 304 via connecting cables. The adapter board 304 is then connected to the storage hard drive 401 via connecting cables. The interface PCB board 5 mainly integrates USB ports. The interface adapters on the motherboard 3031 inside the immersion tank 301 are integrated on this interface PCB board 5. Part of the wires on the motherboard 3031 connect upwards to the interface PCB board 5, and the other part connects to the adapter board 304 on one side. Through the adapter board 304, the wires are transferred to the outside and then connected to the storage hard drive 401.

[0024] Furthermore, the immersion tank 301 is connected to the microchannel heat exchanger 201 to achieve coolant circulation, combined with Figure 8The immersion tank 301 has an outlet 301d at the bottom and an inlet 301e at the top on the side near the microchannel heat exchanger 201. A direct-flow pump 306 is installed on the outer wall of the immersion tank 301 between the outlet 301d and the inlet 301e. The microchannel heat exchanger 201 has connectors I 201a and II 201b. The outlet 301d is connected to the bottom inlet of the direct-flow pump 306, the top outlet of the direct-flow pump 306 is connected to connector I 201a, and connector II 201b is connected to the inlet 301e. The direct-flow pump 306 draws coolant from the immersion tank 301 through the outlet 301d, and then sends it to the microchannel heat exchanger 201 through connector I 201a for heat exchange. After heat exchange, the low-temperature coolant is output from connector I 201a and sent back into the immersion tank 301 through the inlet 301e, which quickly dissipates heat from the gaming motherboard 3031 and GPU 3021. The heat of the heat-generating components can be carried away by the liquid instantly, resulting in higher heat dissipation efficiency. The hardware is kept at a low temperature for a long time, which can significantly delay the aging process and extend its service life.

[0025] Of course, the above embodiments are only for illustrating the technical concept and features of this utility model, and their purpose is to enable those skilled in the art to understand the content of this utility model and implement it accordingly. They should not be used to limit the protection scope of this utility model. All modifications made in accordance with the spirit and essence of the main technical solution of this utility model should be covered within the protection scope of this utility model.

Claims

1. A submersible liquid-cooled gaming console structure, characterized in that: The system includes a chassis (1), which contains, from left to right, a heat dissipation module (2), an immersion liquid cooling module (3), and a storage module (4). The top of the chassis (1) has an interface PCB board (5) and a touch screen display (6). The interface PCB board (5) is positioned above the immersion liquid cooling module (3), and the touch screen display (6) is positioned above the heat dissipation module (2). The heat dissipation module (2) includes a microchannel heat exchanger (201) and a cooling fan I (202). The immersion liquid cooling module (3) includes an immersion chamber (301), a GPU assembly (302) housed within the immersion chamber (301), and a motherboard assembly (302). 3) An adapter plate (304) is provided on one side of the immersion tank (301), and a sealing gasket (305) is provided on the top of the immersion tank (301). The sealing gasket (305) is sealed and fitted to the chassis (1). The immersion tank (301) is connected to the microchannel heat exchanger (201) to realize coolant circulation. The storage module (4) includes a storage hard disk (401), a power supply (402), and a cooling fan II (403). The motherboard assembly (303) is connected to the interface PCB board (5) and the adapter plate (304) respectively through connecting wires. The adapter plate (304) is connected to the storage hard disk (401) through connecting wires.

2. The immersion liquid-cooled gaming console structure according to claim 1, characterized in that: The chassis (1) includes a chassis (101). The front and rear sides of the chassis (101) of the heat dissipation module (2) and the storage module (4) are respectively provided with sealing plates I (102). The sealing plates I (102) are provided with heat dissipation holes (102a). The front and rear sides of the chassis (101) of the immersion liquid cooling module (3) are respectively provided with sealing plates II (103). Each sealing plate II (103) is provided with a handle (104) on the chassis (101) above it. The chassis (101) above the immersion liquid cooling module (3) is provided with a top cover (105). The interface PCB board (5) is embedded in the top cover (105). The touch screen (6) is embedded in the chassis (101).

3. The immersion liquid-cooled gaming console structure according to claim 2, characterized in that: The GPU assembly (302) includes a plurality of GPUs (3021) arranged side by side on a GPU mounting plate (3022), and a support column (301a) is provided on the inner wall of the immersion tank (301), and the GPU mounting plate (3022) is mounted on the support column (301a).

4. The immersion liquid-cooled gaming console structure according to claim 3, characterized in that: The motherboard assembly (303) includes a motherboard (3031) mounted on a motherboard mounting plate (3032), a GPU (3021) mounted on the motherboard (3031), an inner rail (3033) on the back of the motherboard mounting plate (3032), a guide rail mounting plate (301b) on the inner wall of the immersion tank (301), an outer rail (301c) on the guide rail mounting plate (301b), the inner rail (3033) and the outer rail (301c) are engaged and slidably connected, and the motherboard mounting plate (3032) and the guide rail mounting plate (301b) are fixedly connected.

5. The immersion liquid-cooled gaming console structure according to claim 1, characterized in that: The immersion tank (301) has an outlet (301d) at the bottom and an inlet (301e) at the top on the side near the microchannel heat exchanger (201). A straight-through pump (306) is provided on the outer wall of the immersion tank (301) between the outlet (301d) and the inlet (301e). The microchannel heat exchanger (201) is provided with connector I (201a) and connector II (201b). The outlet (301d) is connected to the bottom inlet of the straight-through pump (306), the top outlet of the straight-through pump (306) is connected to connector I (201a), and connector II (201b) is connected to the inlet (301e).

6. The immersion liquid-cooled gaming console structure according to claim 1, characterized in that: The cooling fan I (202) is located on one side of the microchannel heat exchanger (201), the cooling fan II (403) is located on one side of the storage hard disk (401), and the power supply (402) is located at the bottom of the cooling fan II (403) and the storage hard disk (401).

7. The immersion liquid-cooled gaming console structure according to claim 6, characterized in that: The power supply (402) is provided with a power interface (402a), which is located on one side of the chassis (1).

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