Memory bank cooling mechanism

Abstract

The utility model relates to memory bank heat dissipation technical field, especially a memory bank heat dissipation mechanism, the utility model has the advantages of: through the heat conduction silicone strip can efficiently with the heat conduction of the heat that memory particle produces to the heat dissipation waistcoat shell, through the heat dissipation waistcoat shell, a plurality of radiating fins and the fairing can greatly increase the heat dissipation area, improve the heat dissipation effect, through a plurality of fairing can guide the airflow of the machine case fan to a plurality of radiating fins between, and then make the airflow between a plurality of radiating fins surface take away heat, the airflow in the machine case is guided to pass through, and the airflow that penetrates is through the guidance extrusion of the guidance convex layer, makes the airflow channel narrow, improves the flow rate in the fairing inside, makes the heat dissipation waistcoat shell inside and the fairing inside constitute the pressure difference, makes the airflow in the heat dissipation waistcoat shell inside flow upwards and pass through a plurality of communication hole and discharge, makes the heat of memory bank plate body outer wall and the heat that conduction to the heat dissipation waistcoat shell take out.

Description

Technical Field

[0001] This utility model relates to the field of memory module heat dissipation technology, and in particular to a memory module heat dissipation mechanism. Background Technology

[0002] In today's era of rapid information technology development, the performance demands of electronic devices such as computers and servers are constantly increasing. As a key component for data storage and transmission in electronic devices, the operating speed and stability of memory modules directly affect the overall performance of the device. With the continuous increase in the operating frequency and data transfer rate of memory modules, the heat generated during operation has also increased significantly. Excessive temperature can lead to decreased memory performance, data transmission errors, and even device malfunctions, seriously affecting the normal use and lifespan of electronic devices. Currently, most memory modules are cooled by externally mounted metal heat spreaders; however, this cooling system has the following problems: Heatsinks achieve heat dissipation solely through the thermal conductivity of the metal panel and the fin structure to increase the heat dissipation area. However, their mounting position on the motherboard makes them perpendicular to the airflow direction of the cooling fan, resulting in poor airflow and ineffective utilization of the internal fan airflow. They can only provide static cooling, leading to poor heat dissipation performance. Utility Model Content

[0003] The purpose of this invention is to overcome the shortcomings of the prior art and provide a heat dissipation mechanism for memory modules, which effectively solves the deficiencies of the prior art.

[0004] The purpose of this utility model is achieved through the following technical solution: a memory module heat dissipation mechanism, including a memory module plate, several memory chips are fixedly connected to both sides of the memory module plate, a thermal grease strip is attached to the outer wall of the several memory chips, a heat dissipation heat sink shell is fixedly connected to the outer wall of the thermal grease strip, several heat dissipation fins are fixedly connected to both sides of the outer wall of the heat dissipation heat sink shell, several inclined guide plates are fixedly connected to the outer side of the several heat dissipation fins, a gap is left between the guide plates and the outer wall of the heat dissipation heat sink shell, the bottom of the heat dissipation heat sink shell is an open structure, a guide shroud is fixedly connected to the top of the heat dissipation heat sink shell, several connecting holes are opened at the center of the bottom surface of the inner wall of the guide shroud, the several connecting holes are all connected to the top of the inner wall of the heat dissipation heat sink shell, and a guide protrusion layer is fixedly connected to the center of the top of the inner wall of the guide shroud.

[0005] Preferably, in any of the above embodiments, the heat sink cover is placed over the memory module body, the gold fingers at the bottom of the memory module body protrude from the bottom opening of the heat sink cover, and a gap is left between the inner wall of the heat sink cover and the memory module body.

[0006] The technical effect achieved by adopting the above solution is that it allows air to enter from the bottom of the heat dissipation heat sink shell, forming an upward and downward airflow.

[0007] Preferably, in any of the above embodiments, the plurality of heat dissipation fins extend along the length direction of the heat dissipation heat jacket shell, the plurality of guide plates are all arranged perpendicularly to the heat dissipation fins, and the plurality of guide plates, heat dissipation fins, and heat dissipation heat jacket shell are all made of aluminum oxide.

[0008] The technical effect achieved by adopting the above solution is that alumina has excellent thermal conductivity, which can improve heat dissipation.

[0009] Preferably, in any of the above solutions, the length of the air guide shroud is adapted to the length of the heat dissipation jacket shell, and the distribution length of the plurality of connecting holes is adapted to the length of the air guide shroud.

[0010] The technical effect achieved by adopting the above solution is to match the flow width of the air guide with the length of the heat dissipation jacket shell, thereby maximizing the heat dissipation effect.

[0011] Preferably, in any of the above embodiments, the length of the guide protrusion layer is adapted to the length of the flow guide, the position of the guide protrusion layer protrudes in accordance with the position of the plurality of connecting holes, and both sides of the guide protrusion layer are inclined surfaces.

[0012] The technical effect achieved by adopting the above scheme is that the airflow passes through the low-pressure area formed by the position of the protrusion of the guide protrusion layer and corresponds to the position of the connecting hole, thereby improving the pressure difference flow effect.

[0013] This utility model has the following advantages: 1. This memory module's heat dissipation mechanism efficiently transfers the heat generated by the memory chips to the heatsink housing via thermal grease strips. The heatsink housing, several heatsink fins, and airflow guides significantly increase the heat dissipation area and improve the cooling effect. Furthermore, the airflow guides the airflow from the chassis fan to the space between the heatsink fins, and the inclined guides direct the airflow in the direction of the heatsink fins' extension, allowing the airflow to carry away heat between the surfaces of the heatsink fins, thus improving the utilization of airflow within the chassis.

[0014] 2. This memory module heat dissipation mechanism guides airflow through the chassis via a flow guide shroud. The airflow is guided and compressed by the protruding guide layer, narrowing the airflow channel, increasing the flow velocity inside the flow guide shroud, and reducing the air pressure. This creates a pressure difference between the inside of the heatsink housing and the inside of the flow guide shroud, causing the airflow inside the heatsink housing to flow upwards and exit through several connecting holes. This removes heat from the outer wall of the memory module and the heat conducted to the heatsink housing, improving the heat dissipation effect. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the structure of this utility model; Figure 2 This is a top view of the structure of this utility model; Figure 3 This utility model Figure 2 Schematic diagram of the cross-sectional structure at point AA.

[0016] In the diagram: 1-Memory module body, 2-Heat heatsink shell, 3-Heat heatsink fins, 4-Blower plate, 5-Blower cover, 6-Guide protrusion layer, 7-Connecting hole, 8-Memory chip, 9-Temperature grease strip. Detailed Implementation

[0017] The present invention will be further described below with reference to the accompanying drawings, but the scope of protection of the present invention is not limited to the following description.

[0018] like Figures 1 to 3 As shown, a memory module heat dissipation mechanism includes a memory module body 1. Several memory chips 8 are fixedly connected to both sides of the memory module body 1. Thermal grease strips 9 are attached to the outer walls of the memory chips 8. A heat dissipation heat spreader shell 2 is fixedly connected to the outer wall of the thermal grease strip 9. Several heat dissipation fins 3 are fixedly connected to both sides of the outer wall of the heat dissipation heat spreader shell 2. Several inclined guide plates 4 are fixedly connected to the outer sides of the heat dissipation fins 3. There is a gap between the guide plates 4 and the outer wall of the heat dissipation heat spreader shell 2. The bottom of the heat dissipation heat spreader shell 2 is an open structure. A guide shroud 5 is fixedly connected to the top of the heat dissipation heat spreader shell 2. Several connecting holes 7 are opened at the center of the bottom surface of the inner wall of the guide shroud 5. The connecting holes 7 are all connected to the top of the inner wall of the heat dissipation heat spreader shell 2. A guide protrusion layer 6 is fixedly connected to the center of the top of the inner wall of the guide shroud 5.

[0019] As an optional technical solution of this utility model: the heat dissipation heat spreader shell 2 covers the outside of the memory module plate 1, the gold fingers at the bottom of the memory module plate 1 protrude from the bottom opening of the heat dissipation heat spreader shell 2, and there is a gap between the inner wall of the heat dissipation heat spreader shell 2 and the memory module plate 1, so that air can enter at the bottom of the heat dissipation heat spreader shell 2, forming an upward and downward airflow.

[0020] As an optional technical solution of this utility model: a plurality of heat dissipation fins 3 extend along the length direction of the heat dissipation jacket shell 2, a plurality of flow guide plates 4 are all arranged perpendicularly to the heat dissipation fins 3, and the plurality of flow guide plates 4, the heat dissipation fins 3 and the heat dissipation jacket shell 2 are all made of alumina material. Alumina material has excellent thermal conductivity and can improve the heat dissipation effect.

[0021] As an optional technical solution of this utility model: the length of the flow guide 5 is adapted to the length of the heat dissipation heat shield shell 2, and the distribution length of the plurality of connecting holes 7 is adapted to the length of the flow guide 5, so that the flow width of the flow guide 5 matches the length of the heat dissipation heat shield shell 2, thereby maximizing the heat dissipation effect.

[0022] As an optional technical solution of this utility model: the length of the guide protrusion layer 6 is adapted to the length of the flow guide shroud 5, the position of the protrusion of the guide protrusion layer 6 corresponds to the position of several connecting holes 7, and both sides of the guide protrusion layer 6 are inclined surfaces, so that the airflow passes through the low-pressure area formed by the position of the protrusion of the guide protrusion layer 6 and corresponds to the position of the connecting holes 7, thereby improving the pressure difference flow effect.

[0023] The working process of this utility model is as follows: When the user uses it... 1) The thermal grease strip 9 can efficiently conduct the heat generated by the memory chip 8 to the heatsink housing 2; 2) The heat dissipation area can be greatly increased and the heat dissipation effect can be improved by using the heat dissipation heat sink shell 2, several heat dissipation fins 3 and the air guide plate 4; 3) The airflow of the chassis fan can be guided to the space between the heat dissipation fins 3 by several guide plates 4. The airflow can be guided by the inclined surface to flow in the extension direction of the heat dissipation fins 3, thereby allowing the airflow to carry away heat between the surfaces of the heat dissipation fins 3. 4) The airflow inside the chassis can be guided through the airflow shroud 5. The airflow is guided and squeezed by the guide protrusion layer 6, which narrows the airflow channel, increases the flow velocity inside the airflow shroud 5, and reduces the air pressure. This creates a pressure difference between the inside of the heat sink shell 2 and the inside of the airflow shroud 5, causing the airflow inside the heat sink shell 2 to flow upward and pass through several connecting holes 7 to be discharged. This allows the heat from the outer wall of the memory module board 1 and the heat conducted to the heat sink shell 2 to be carried away.

[0024] In summary, this invention efficiently transfers the heat generated by the memory chips 8 to the heatsink housing 2 via the thermal grease strip 9. The heatsink housing 2, several heatsink fins 3, and guide plates 4 significantly increase the heat dissipation area and improve the cooling effect. Furthermore, the guide plates 4 direct the airflow from the chassis fan between the heatsink fins 3. The inclined guides direct the airflow in the direction of the heatsink fins 3, allowing the airflow to carry away heat between the surfaces of the heatsink fins 3, thus improving the utilization of airflow within the chassis. The guide shield 5 guides the airflow through the chassis. The airflow is guided and compressed by the guide protrusions 6, narrowing the airflow channel, increasing the flow velocity inside the guide shield 5, and reducing the air pressure. This creates a pressure difference between the interior of the heatsink housing 2 and the interior of the guide shield 5, causing the airflow inside the heatsink housing 2 to flow upwards and exit through several connecting holes 7. This removes heat from the outer wall of the memory module 1 and the heat transferred to the heatsink housing 2, further improving the cooling effect.

[0025] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A heat dissipation mechanism for a memory module, characterized in that: The system includes a memory module body (1), on both sides of which a number of memory chips (8) are fixedly connected. The outer walls of the memory chips (8) are together attached to a thermal grease strip (9). The outer wall of the thermal grease strip (9) is attached to a heat dissipation heat shield shell (2). The outer walls of the heat dissipation heat shield shell (2) are fixedly connected to a number of heat dissipation fins (3) on both sides. The outer sides of the heat dissipation fins (3) are together fixedly connected to a number of inclined guide plates (4). The guide plates (4) are separated from the outer wall of the heat dissipation heat shield shell (2). The bottom of the heat dissipation heat shield shell (2) is an open structure. The top of the heat dissipation heat shield shell (2) is fixedly connected to a guide shroud (5). The center of the bottom surface of the inner wall of the guide shroud (5) is provided with a number of connecting holes (7). The connecting holes (7) are all connected to the top of the inner wall of the heat dissipation heat shield shell (2). The center of the top of the inner wall of the guide shroud (5) is fixedly connected to a guide protrusion layer (6).

2. The memory module heat dissipation mechanism according to claim 1, characterized in that: The heat dissipation heat shield (2) covers the outside of the memory module board (1). The gold fingers at the bottom of the memory module board (1) protrude from the bottom opening of the heat dissipation heat shield (2). There is a gap between the inner wall of the heat dissipation heat shield (2) and the memory module board (1).

3. The memory module heat dissipation mechanism according to claim 1, characterized in that: Several heat dissipation fins (3) extend along the length of the heat dissipation jacket shell (2), and several flow guides (4) are arranged perpendicular to the heat dissipation fins (3). Several flow guides (4), heat dissipation fins (3), and heat dissipation jacket shell (2) are all made of aluminum oxide.

4. The memory module heat dissipation mechanism according to claim 1, characterized in that: The length of the flow guide (5) is adapted to the length of the heat dissipation vest shell (2), and the distribution length of the plurality of the connecting holes (7) is adapted to the length of the flow guide (5).

5. A memory module heat dissipation mechanism according to claim 1, characterized in that: The length of the guide protrusion layer (6) is adapted to the length of the flow guide (5), the position of the guide protrusion layer (6) is the same as the position of the several connecting holes (7), and both sides of the guide protrusion layer (6) are inclined surfaces.

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