A server mainboard heat dissipation structure

Abstract

The utility model aims at providing a server mainboard heat dissipation structure which can guarantee the memory heat dissipation effect and is reliable and stable in installation. The utility model discloses a heat dissipation fan and memory bank clamping assembly, the memory bank clamping assembly is including clamping block, a plurality of memory banks are fixedly clamped on the clamping block, a plurality of flow guide holes are evenly provided on the both sides of the clamping block, the heat dissipation fan is set up in the side of the clamping block through the guide air duct, and the flow guide hole on the side of the clamping block connected with the guide air duct is matched. The utility model is applied to the technical field of testing heat dissipation.

Description

Technical Field

[0001] This invention relates to the technical field of heat dissipation testing, and in particular to a heat dissipation structure for a server motherboard. Background Technology

[0002] Server equipment contains a motherboard, on which components such as processors and memory modules are mounted. To test the server motherboard after production, testing equipment is typically used to check its various functions. During testing, components such as memory modules and processors are installed and connected to the server motherboard, and then the motherboard is powered on for testing. This allows us to determine whether each component and connector on the server motherboard is functioning correctly.

[0003] To meet the demands of automated testing, modular connections are typically employed, integrating components such as processors and memory modules onto a motion module within the testing equipment. When the carrier board carrying the server motherboard under test (DUT) is transported to the testing station, the motion module drives the processor and memory modules to connect to the DUT. During testing, the memory modules generate heat after being powered on. To ensure stable operation, cooling fans are usually installed for cooling. However, because the moving end of the motion module needs to descend close to the server motherboard during testing… Figure 1 As shown, cooling fans are typically located on the side of the motion module. Components on the server motherboard and parts on the motion module can obstruct the airflow for cooling the memory modules, resulting in poor heat dissipation. Using multiple fans for cooling would increase costs.

[0004] If a heat dissipation structure that can guarantee effective heat dissipation of memory, reliable installation, and high stability can be provided, the above-mentioned technical problems can be solved well. Utility Model Content

[0005] The technical problem to be solved by this utility model is to overcome the shortcomings of the prior art and provide a server motherboard heat dissipation structure that can ensure memory heat dissipation effect, reliable installation, and high stability.

[0006] The technical solution adopted by this utility model is as follows: This utility model includes a cooling fan and a memory module clamping assembly. The memory module clamping assembly includes a clamping block, on which a plurality of memory modules are fixedly clamped. A plurality of airflow guide holes are provided on both sides of the clamping block. The cooling fan is disposed on one side of the clamping block through an airflow guide duct, and the airflow guide duct is connected to the airflow guide hole on the side of the clamping block.

[0007] As can be seen from the above scheme, the memory module clamping assembly connects to the moving end of the motion module of the testing equipment, thereby interfacing with the server motherboard under test during testing. The cooling fan delivers cool air to one end of several memory modules through the guiding air duct, and then the clamping block guides the airflow across the surface of the memory modules for heat exchange before exiting from the other end, achieving high-efficiency heat dissipation. Simultaneously, the cooling fan, positioned on the clamping block, is not obstructed by other components of the motion module, resulting in high heat dissipation stability.

[0008] In a preferred embodiment, a flow guiding cavity is provided inside the air guiding duct, the airflow input end of the cooling fan is connected to the input end of the flow guiding cavity, and the output end of the flow guiding cavity is engaged with the flow guiding hole.

[0009] In a preferred embodiment, the memory module mounting assembly further includes an adapter block, which is provided with several adapter circuit boards that are connected one-to-one with several memory modules. The memory modules cooperate with the motherboard of the server under test through the corresponding adapter circuit boards.

[0010] In a preferred embodiment, a gap is provided between two adjacent memory modules, and a plurality of the airflow holes are evenly distributed between each pair of adjacent memory modules.

[0011] A preferred embodiment is that the clamping block is further provided with a limiting block, which engages with the upper end of the memory module for limiting.

[0012] In a preferred embodiment, the plurality of memory modules and the plurality of airflow guide holes are all located between the limiting block and the adapter block, and the limiting block and the adapter block cooperate to guide airflow. Attached Figure Description

[0013] Figure 1 This is a schematic diagram of the existing server motherboard test heat dissipation structure; Figure 2 This is a three-dimensional structural schematic diagram of the present invention; Figure 3 This is a cross-sectional view of the present invention; Figure 4 This is a first structural schematic diagram of the storage strip clamping assembly; Figure 5 This is a schematic diagram of the second structure of the storage strip clamping assembly. Detailed Implementation

[0014] like Figures 2 to 5As shown, in this embodiment, the present invention includes a cooling fan 1 and a memory module clamping assembly. The memory module clamping assembly includes a clamping block 2, on which a plurality of memory modules 3 are fixedly clamped. A plurality of airflow guide holes 4 are provided on both sides of the clamping block 2. The cooling fan 1 is disposed on one side of the clamping block 2 through an airflow guide duct 5, and the airflow guide duct 5 is connected to the airflow guide holes 4 on the side of the clamping block 2.

[0015] like Figure 3 As shown, in this embodiment, a guide cavity 6 is provided inside the guide air duct 5. The airflow input end of the cooling fan 1 is connected to the input end of the guide cavity 6, and the output end of the guide cavity 6 cooperates with the guide hole 4. The cooling fan 1 inputs cold air into the guide air duct 5, which fixes the airflow and guides it through the guide cavity 6 to the guide hole 4. The cold air is then output through the guide hole 4 to the memory module 3 for cooling. Subsequently, the airflow is output to the guide hole 4 on the other side of the clamping block 2, thus sending the hot airflow out of the clamping block 2. The motion module of the test equipment includes a docking cylinder. The clamping block 2 is mounted on the movable end of the docking cylinder. The test motion module first descends as a whole, and after positioning, the docking cylinder drives the clamping block 2 to descend, thereby docking with the memory module slot of the motherboard of the server under test.

[0016] like Figure 3 and Figure 4 As shown, in this embodiment, the memory module mounting assembly further includes an adapter block 7. The adapter block 7 is equipped with several adapter circuit boards that correspond one-to-one with several memory modules 3. The memory modules 3 cooperate with the motherboard of the server under test through their respective adapter circuit boards. The memory modules 3 are fixed to the mounting block 2 via the adapter block 7, and simultaneously connected to the motherboard of the server under test via the adapter circuit boards of the adapter block 7. This design keeps the memory modules 3 away from the motherboard, allowing for more precise heat dissipation, and also reduces wear on the gold fingers of the memory modules 3, extending their lifespan.

[0017] like Figure 5 As shown, in this embodiment, a gap is provided between two adjacent memory modules 3, and a plurality of airflow guide holes 4 are evenly distributed between each pair of adjacent memory modules 3. By setting the gap, an airflow channel is created, and the airflow guide holes 4 are set to correspond to the airflow channel, resulting in higher heat dissipation efficiency.

[0018] like Figure 4 and Figure 5As shown, in this embodiment, the clamping block 2 is further provided with a limiting block 8, which engages with the upper end of the memory module 3 for limiting. The limiting block 8 is used in conjunction with the adapter block 7 to limit the memory module 3, ensuring a more stable installation.

[0019] like Figure 4 and Figure 5 As shown, in this embodiment, several memory modules 3 and several airflow guide holes 4 are located between the limiting block 8 and the adapter block 7. The limiting block 8 and the adapter block 7 cooperate to guide airflow. By limiting the airflow through the limiting block 8 and the adapter block 7, the airflow is guided to the surface of the memory modules 3, thereby improving the heat dissipation effect.

[0020] Although the embodiments of this utility model are described with reference to actual solutions, they do not constitute a limitation on the meaning of this utility model. For those skilled in the art, modifications to the implementation schemes and combinations with other schemes based on this specification are obvious.

Claims

1. A server motherboard heat dissipation structure, comprising a cooling fan (1) and a memory module mounting assembly, characterized in that: The memory module clamping assembly includes a clamping block (2), on which several memory modules (3) are fixedly clamped. Several air guide holes (4) are provided on both sides of the clamping block (2). The cooling fan (1) is provided on one side of the clamping block (2) through a guide air duct (5). The guide air duct (5) is connected to the air guide hole (4) on the side of the clamping block (2).

2. The server motherboard heat dissipation structure according to claim 1, characterized in that: The air duct (5) is provided with a flow guide cavity (6), the airflow input end of the cooling fan (1) is connected to the input end of the flow guide cavity (6), and the output end of the flow guide cavity (6) is engaged with the flow guide hole (4).

3. The server motherboard heat dissipation structure according to claim 1, characterized in that: The memory module mounting assembly also includes an adapter block (7), which is provided with several adapter circuit boards that are connected one-to-one with several memory modules (3). Several memory modules (3) cooperate with the motherboard of the server under test through the corresponding adapter circuit boards.

4. The server motherboard heat dissipation structure according to claim 1, characterized in that: A gap is provided between two adjacent memory modules (3), and several flow guide holes (4) are evenly distributed between each pair of adjacent memory modules (3).

5. A server motherboard heat dissipation structure according to claim 3, characterized in that: The clamping block (2) is also provided with a limiting block (8), which is matched with the upper end of the memory module (3).

6. A server motherboard heat dissipation structure according to claim 5, characterized in that: Several memory modules (3) and several air guide holes (4) are located between the limiting block (8) and the adapter block (7), and the limiting block (8) and the adapter block (7) cooperate to guide airflow.

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