storage server

Abstract

The present disclosure relates to a storage server, comprising a storage node and a heat dissipation device, wherein the storage node comprises a plurality of storage units; the heat dissipation device comprises a first heat exchange plate and a plurality of second heat exchange plates, the first heat exchange plate is arranged below the storage node, the plurality of second heat exchange plates are arranged at intervals on the first heat exchange plate and are in heat conduction contact with the first heat exchange plate, and a plurality of interval spaces for inserting the storage units are formed between any two adjacent second heat exchange plates, wherein a cooling medium flows through the first heat exchange plate, and the storage units exchange heat with the cooling medium through the first heat exchange plate and the second heat exchange plates. Through the above technical scheme, the storage server provided by the present disclosure has high heat dissipation efficiency and long service life.

Description

Technical Field

[0001] This disclosure relates to the field of server technology, and more particularly to a storage server. Background Technology

[0002] In related technologies, high-density storage servers mainly employ air cooling, using high-performance fans to force convection and expel heat-laden air to cool the storage nodes. However, the high-speed operation of these fans can generate significant noise and vibration, affecting the lifespan of the storage hard drives, and also suffers from low heat dissipation efficiency and high energy consumption. Utility Model Content

[0003] To overcome the problems existing in related technologies, this disclosure provides a storage server with high heat dissipation efficiency and long service life.

[0004] According to an exemplary embodiment of this disclosure, a storage server is provided, comprising: Storage node, the storage node comprising multiple storage units; and A heat dissipation device includes a first heat exchange plate and a plurality of second heat exchange plates. The first heat exchange plate is disposed below the storage node. The plurality of second heat exchange plates are arranged at intervals on the first heat exchange plate and are in thermally conductive contact with the first heat exchange plate. A plurality of spacers are formed between any two adjacent second heat exchange plates for the storage units to be inserted. The first heat exchange plate contains a cooling medium, and the storage unit exchanges heat with the cooling medium through the first heat exchange plate and the second heat exchange plate.

[0005] The technical solutions provided by the embodiments of this disclosure can include the following beneficial effects: In the storage server of this disclosure, the heat dissipation device includes a first heat exchange plate and a plurality of second heat exchange plates. The plurality of heat exchange plates are spaced apart on the first heat exchange plate so that a gap space is formed between any two adjacent second heat exchange plates. The storage unit is inserted into the gap space and contacts the second heat exchange plate. In this way, by circulating a cooling medium into the first heat exchange plate to dissipate heat from the first heat exchange plate, and because the second heat exchange plate is in thermally conductive contact with the first heat exchange plate, heat dissipation of the second heat exchange plate can be achieved. The second heat exchange plate and the storage unit are in close contact to ultimately dissipate heat from the storage unit. This technical solution can solve the problems of high noise and high energy consumption of traditional air cooling by using liquid cooling heat exchange. The space space can accommodate multiple storage units and meet the heat dissipation requirements of high-density storage servers. In addition, the design of placing the first heat exchange plate below the storage node can also avoid the risk of the cooling medium damaging the storage unit due to leakage of immersion liquid cooling.

[0006] In some possible implementations, the first heat exchange plate is provided with a connecting channel and a plurality of insertion slots. A plurality of second heat exchange plates are inserted one-to-one into the insertion slots. The connecting channel is distributed on opposite sides of each insertion slot, and the cooling medium within the connecting channel conducts heat with the second heat exchange plate. The insertion slots not only facilitate the installation and positioning of the second heat exchange plates on the first heat exchange plate but also shorten the distance between the second heat exchange plates and the cooling medium within the connecting channel, thereby improving the heat exchange efficiency between the cooling medium and the second heat exchange plates.

[0007] In some possible implementations, the second heat exchange plate includes a heat exchange plate body and a heat pipe. At least one side of the heat exchange plate body is provided with an embedding groove. The heat pipe has an interconnected heat exchange section and a condensation section, both of which are embedded in the embedding groove. Alternatively, the heat exchange section is embedded in the embedding groove, and at least a portion of the condensation section protrudes from the heat exchange plate body. The embedding groove ensures that the storage unit is in close contact with both the heat pipe and the second heat exchange plate, reducing thermal gaps and ensuring effective heat dissipation for the storage unit.

[0008] In some possible implementations, both the heat exchange section and the condensation section are embedded in the embedding groove, and the heat exchange plate body is inserted into the insertion groove and welded to the first heat exchange plate. This welding fixation method ensures a more stable thermal contact between the second and first heat exchange plates, preventing poor contact due to vibration, ensuring heat dissipation stability, and meeting the long-term operating requirements of the storage server.

[0009] In some possible implementations, the heat exchange section is embedded in the embedding groove, at least a portion of the condensation section protrudes from the heat exchange plate and inserts into the insertion groove, the insertion groove communicating with the communicating channel to allow the cooling medium to make thermally conductive contact with the condensation section, and the heat exchange plate is welded to the first heat exchange plate to seal the insertion groove. Thus, cooling medium can also be introduced into the insertion groove to further improve the heat dissipation efficiency of the heat dissipation device.

[0010] In some possible implementations, the first heat exchange plate includes a flow channel plate and at least one manifold plate. The flow channel plate forms a connecting flow channel, and the manifold plate is disposed at the end of the flow channel plate and has a converging flow channel communicating with the connecting flow channel. The manifold plate or the flow channel plate is provided with an inlet and an outlet for the cooling medium to flow through. The converging flow channel enables uniform distribution and convergence of the cooling medium, ensuring balanced flow within the connecting flow channel and avoiding uneven heat dissipation caused by insufficient cooling medium in certain areas.

[0011] In some possible implementations, the connecting channel extends through two opposite ends of the flow channel plate, and each of the two ends is provided with a manifold. The liquid inlet and the liquid outlet are respectively arranged on the two manifolds, or the liquid inlet and the liquid outlet are arranged on the same manifold. The design of two manifolds can improve the flexibility of the layout of the liquid inlet and the liquid outlet on the first heat exchange plate.

[0012] In some possible implementations, the flow channel plate is provided with multiple weight-reducing sections, which are evenly spaced and penetrate the flow channel plate. A connecting flow channel is formed in the region between any two adjacent weight-reducing sections. The weight-reducing sections effectively reduce the weight of the heat dissipation device 2, facilitating installation and maintenance within the storage server, while also saving material costs.

[0013] In some possible implementations, the storage unit has opposing first and second sides, and two storage units are disposed between any two adjacent second heat exchange plates. The first sides of the two storage units are attached to each other, and their second sides are respectively attached to the second heat exchange plates. The heat generated on the second side is greater than that on the first side. This achieves targeted and efficient heat dissipation, avoiding overheating caused by concentrated heat and extending the lifespan of the storage unit. Furthermore, the close arrangement of the two storage units saves space, further increasing storage density and meeting high-density storage requirements.

[0014] In some possible implementations, the storage server includes a backplane with multiple openings for the second heat exchange plate to pass through. The backplane is attached to the first heat exchange plate, and multiple storage cells are supported on and electrically connected to the backplane. The backplane provides support for the storage cells while ensuring their electrical connection, enabling the storage nodes to perform their storage functions.

[0015] Other features and advantages of this disclosure will be described in detail in the following detailed description section. Attached Figure Description

[0016] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this disclosure and, together with the description, serve to explain the principles of this disclosure: Figure 1 This is a schematic diagram of the structure of a storage server provided in an exemplary embodiment of this disclosure; Figure 2 This is a schematic diagram of the structure of a storage server provided in an exemplary embodiment of the present disclosure, wherein a heat dissipation device is shown; Figure 3This is a schematic diagram of the structure of a storage server provided in an exemplary embodiment of the present disclosure, wherein a first heat exchange plate is shown; Figure 4 yes Figure 3 A cross-sectional view along the AA direction; Figure 5 yes Figure 4 A magnified view of a portion of point B in the middle; Figure 6 yes Figure 4 A magnified view of a portion of point C, showing the protruding / recessed structure; Figure 7 This is a schematic diagram of the structure of the first heat exchange plate provided in an exemplary embodiment of this disclosure; Figure 8 This is a schematic diagram of the structure of the second heat exchange plate provided in an exemplary embodiment of this disclosure; Figure 9 This is a schematic diagram of the structure of the second heat exchange plate provided in another exemplary embodiment of this disclosure; Figure 10 This is a partially enlarged schematic diagram of a storage service server provided in another exemplary embodiment of this disclosure.

[0017] Explanation of reference numerals in the attached figures 1-Storage node; 11-Storage unit; 2-Heat dissipation device; 21-First heat exchange plate; 211-Flow channel plate; 2111-Connecting flow channel; 2112-Insertion slot; 2113-Weight reduction part; 2114-Protruding structure / recessed structure; 212-Manifold plate; 2121-Manifold flow channel; 2122-Liquid inlet; 2123-Liquid outlet; 22-Second heat exchange plate; 221-Heat exchange plate body; 2211-Embedding slot; 222-Heat pipe; 2221-Heat exchange section; 2222-Condensation section; 23-Interval space; 3-Back plate; 31-Opening; 4-Outer shell; 41-Shell; 411-Baffle; 42-Tray; 5-Computing node. Detailed Implementation

[0018] The specific embodiments of this disclosure are described in detail below with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are for illustration and explanation only and are not intended to limit this disclosure.

[0019] In this disclosure, unless otherwise stated, the directional terms such as "upper" and "lower" generally refer to the relative positions of the corresponding components in the direction of gravity when they are in use, and "inner" and "outer" generally refer to the relative positions of the corresponding components with respect to their own contours. Furthermore, the terms "first," "second," etc., are used to distinguish one element from another and do not indicate sequence or importance. In addition, in the following description, when referring to the accompanying drawings, unless otherwise explained, the same reference numerals in different drawings denote the same or similar elements. The above definitions are for explanation and illustration only and should not be construed as limiting the present disclosure.

[0020] According to the exemplary embodiments provided in this disclosure, refer to Figures 1 to 10 As shown, a storage server is provided, including: a storage node 1, which includes a plurality of storage units 11; and a heat dissipation device 2, which includes a first heat exchange plate 21 and a plurality of second heat exchange plates 22. The first heat exchange plate 21 is disposed below the storage node 1, and the plurality of second heat exchange plates 22 are arranged at intervals on the first heat exchange plate 21 and in thermal contact with the first heat exchange plate 21. A plurality of spacers 23 are formed between any two adjacent second heat exchange plates 22 for the storage units 11 to be inserted. Cooling medium flows in the first heat exchange plate 21, and the storage units 11 exchange heat with the cooling medium through the first heat exchange plate 21 and the second heat exchange plates 22.

[0021] Through the above technical solution, in the storage server disclosed herein, the heat dissipation device 2 includes a first heat exchange plate 21 and multiple second heat exchange plates 22. The multiple heat exchange plates are spaced apart on the first heat exchange plate 21 so that a space 23 is formed between any two adjacent second heat exchange plates 22. The storage unit 11 is inserted into the space 23 and contacts the second heat exchange plate 22. In this way, by passing a cooling medium into the first heat exchange plate 21 to dissipate heat from the first heat exchange plate 21, and since the second heat exchange plate 22 is in thermally conductive contact with the first heat exchange plate 21, heat dissipation of the second heat exchange plate 22 can be achieved. The second heat exchange plate 22 and the storage unit 11 are in close contact with each other, ultimately achieving heat dissipation of the storage unit 11. This technical solution can solve the problems of high noise and high energy consumption of traditional air cooling by using liquid cooling heat exchange. The space 23 can be set to accommodate multiple storage units 11, meeting the heat dissipation requirements of high-density storage servers. In addition, the design of placing the first heat exchange plate 21 below the storage node 1 can also avoid the risk of the cooling medium damaging the storage unit 11 due to leakage of immersion liquid cooling.

[0022] In the storage server provided in this disclosure, as an exemplary embodiment, reference is made to... Figure 2 , Figure 3 , Figure 4 and Figure 5As shown, the first heat exchange plate 21 may be provided with a connecting channel 2111 and multiple insertion slots 2112. Multiple second heat exchange plates 22 may be inserted into the insertion slots 2112 one by one. Each insertion slot 2112 may have a connecting channel 2111 distributed on opposite sides. The cooling medium in the connecting channel 2111 can conduct heat with the second heat exchange plate 22. That is, when the storage unit 11 is working, it transfers the heat generated by itself to the second heat exchange plate 22. The second heat exchange plate 22 transfers heat to the first heat exchange plate 21 through thermally conductive contact with the first heat exchange plate 21. The first heat exchange plate 21 is provided with a connecting channel 2111 and a cooling medium flows in the connecting channel 2111. Thus, the cooling medium can remove the heat of the first heat exchange plate 21, thereby achieving heat dissipation for the second heat exchange plate 22 and the storage unit 11. The insertion slots 2112 not only facilitate the installation and positioning of the second heat exchange plate 22 on the first heat exchange plate 21, but also shorten the distance between the second heat exchange plate 22 and the cooling medium in the connecting channel 2111, thereby improving the heat exchange efficiency between the cooling medium and the second heat exchange plate 22. Furthermore, the connecting channels 2111 distributed on both sides of each insertion slot 2112 enable heat dissipation from both sides of the second heat exchange plate 22, resulting in more uniform heat exchange, avoiding local heat dissipation dead zones, and further improving heat exchange efficiency.

[0023] In the storage server provided in this disclosure, as an exemplary embodiment, reference is made to... Figure 8 or Figure 9 As shown, the second heat exchange plate 22 may include a heat exchange plate body 221 and a heat pipe 222. At least one side of the heat exchange plate body 221 may be provided with an embedding groove 2211. The heat pipe 222 may have a heat exchange section 2221 and a condensation section 2222 that are interconnected. The heat exchange section 2221 and the condensation section 2222 may both be embedded in the embedding groove 2211, or the heat exchange section 2221 may be embedded in the embedding groove 2211 and at least a portion of the condensation section 2222 may protrude from the heat exchange plate body 221. The embedding groove 2211 ensures that the storage unit 11 is in close contact with the heat pipe 222 and also in close contact with the second heat exchange plate 22, reducing the thermal gap and ensuring the heat dissipation effect on the storage unit 11.

[0024] The provision that at least one side of the heat exchange plate 221 can be provided with an embedding groove 2211 means that the embedding groove 2211 can be provided on one side of the heat exchange plate 221, that is, a heat pipe 222 is provided on one side of the heat exchange plate 221. Alternatively, both sides of the heat exchange plate 221 can be provided with embedding grooves 2211 for laying heat pipes 222. The choice can be made according to the heat dissipation requirements of the storage node 1 in the actual situation, and this disclosure does not impose specific restrictions on this.

[0025] It should be noted that in this disclosure, the heat pipe 222 can be a pulsed heat pipe 222. The pulsed heat pipe 222 does not rely on a traditional capillary structure, but utilizes the self-excited oscillation and phase change cycle of the working fluid to achieve heat transfer. Therefore, it has the characteristics of simple structure, extremely high heat transfer efficiency, and is unaffected by gravity, enabling uniform heat dissipation in any area along the direction of gravity. In other embodiments, the heat pipe 222 can also be any other heat transfer element that can improve heat exchange efficiency, such as a vapor chamber or a semiconductor cooling chip. In yet another embodiment, the heat pipe 222 can also be any other heat-conducting layer that can improve heat exchange efficiency. This heat-conducting layer is disposed on both sides of the second heat exchange plate 22 and is attached to the storage unit 11. For example, a graphene heat-conducting layer, a composite metal heat-conducting layer, or a heat-conducting silicone pad, etc., can all improve the heat exchange efficiency between the second heat exchange plate 22 and the storage unit 11. This disclosure does not impose specific limitations on this.

[0026] Based on the above embodiments, as an exemplary embodiment, refer to Figure 8 As shown, the heat exchange section 2221 and the condensation section 2222 can both be embedded in the embedding groove 2211, and the heat exchange plate 221 can be inserted into the insertion groove 2112 and welded to the first heat exchange plate 21. In this disclosure, the condensation section 2222 can be flush with the lower end of the heat exchange plate 221. In this case, both the heat exchange section 2221 and the condensation section 2222 are arranged in the embedding groove 2211, and the heat exchange plate 221 can be inserted into the insertion groove 2112, or the heat exchange plate 221 and the condensation section 2222 can be inserted together into the insertion groove 2112. In this way, the two sides of the heat pipe 222 are in contact with the second heat exchange plate 22 and the storage unit 11 respectively, so as to improve the heat exchange efficiency between the second heat exchange plate 22 and the storage unit 11. Furthermore, welding ensures a more stable thermal contact between the second heat exchange plate 22 and the first heat exchange plate 21, preventing poor contact due to vibration, ensuring heat dissipation stability, and meeting the long-term operating requirements of the storage server. In other embodiments, the second heat exchange plate 22 can also be fixed to the first heat exchange plate 21 by any other suitable method, such as bonding or snap-fitting, and this disclosure does not impose any specific limitations on this.

[0027] As another exemplary embodiment, reference Figure 9 and Figure 10As shown, the heat exchange section 2221 can be embedded in the embedding groove 2211, and at least a portion of the condensing section 2222 can protrude from the heat exchange plate body 221 and be inserted into the insertion groove 2112. The insertion groove 2112 can communicate with the connecting channel 2111 so that the cooling medium can make thermal contact with the condensing section 2222. The heat exchange plate body 221 can be welded to the first heat exchange plate 21 to seal the insertion groove 2112. In other words, the condensing section 2222 can protrude at least partially from the lower end of the heat exchange plate 221. Thus, the condensing section 2222 can be inserted into the insertion slot 2112, while the heat exchange plate 221 is arranged above the first heat exchange plate 21. At this time, cooling medium can be introduced into the insertion slot 2112. That is, the insertion slot 2112 can be connected to the connecting channel 2111, or the two ends of the insertion slot 2112 can be connected to the confluence channel 2121 respectively, so as to facilitate the introduction of cooling medium. This allows the heat pipe 222 to directly contact the cooling medium, and the heat pipe 222 can directly exchange heat with the cooling medium, thereby improving the heat exchange efficiency of the heat dissipation device 2. Based on the above embodiments, the heat exchange plate 221 and the first heat exchange plate 21 can be sealed and welded. On the one hand, this can improve the reliability of the connection between the heat exchange plate 221 and the first heat exchange plate 21, and on the other hand, it can prevent the cooling medium in the insertion slot 2112 from leaking, thereby improving the reliability of the heat dissipation device 2 for heat dissipation of the storage server.

[0028] In the storage server provided in this disclosure, as an exemplary embodiment, reference is made to... Figure 7 As shown, the first heat exchange plate 21 may include a flow channel plate 211 and at least one manifold plate 212. The flow channel plate 211 may form a connecting flow channel 2111. The manifold plate 212 may be disposed at the end of the flow channel plate 211 and shall have a manifold flow channel 2121 communicating with the connecting flow channel 2111. The manifold plate 212 or the flow channel plate 211 may be provided with an inlet 2122 and an outlet 2123 for the flow of cooling medium. In this way, the cooling medium can flow through the inlet 2122, pass through the manifold flow channel 2121, and enter the connecting flow channel 2111, and then exit from the outlet 2123 to remove the heat in the first heat exchange plate 21, thereby facilitating heat exchange between the first heat exchange plate 21 and the second heat exchange plate 22 and the storage unit 11. The configuration of the flow channel 2121 enables uniform distribution and convergence of the cooling medium, ensuring balanced flow within the connecting channel 2111 and preventing uneven heat dissipation caused by insufficient cooling medium in certain areas. The separate design of the flow channel plate 211 and the flow channel plate 212 also facilitates processing, manufacturing, and subsequent maintenance, reducing production difficulty. The flexible arrangement of the liquid inlet 2122 and the liquid outlet 2123 (which can be on the flow channel plate 211 or the flow channel plate 212) can adapt to the installation layout requirements of different servers and improve equipment compatibility.

[0029] In some embodiments, the connecting channel 2111 includes multiple spaced-apart branch channels. These branch channels can be arranged at intervals and connected end-to-end to allow the cooling medium to flow in a serpentine pattern within the first heat exchange plate 21. The branch channels on both sides can be connected to the inlet 2122 and the outlet 2123 respectively through the confluence channel 2121, thereby achieving uniform heat dissipation of the cooling medium onto the first heat exchange plate 21. In other embodiments, the connecting channel 2111 includes multiple spaced-apart branch channels. Both ends of each branch channel can be connected to the confluence channel 2121. The confluence channel 2121 is provided with an inlet 2122 and an outlet 2123 for the cooling medium to enter and exit, thereby also achieving heat exchange between the cooling medium and the first heat exchange plate 21. This disclosure does not impose specific limitations on this embodiment.

[0030] It should be added that the storage server may also be equipped with a coolant system, which is connected to the inlet 2122 and the outlet 2123 for providing and recovering the cooling medium. This disclosure does not involve any improvement to the principle and structure of the coolant system, so it will not be described in detail here.

[0031] In the storage server provided in this disclosure, as an exemplary embodiment, reference is made to... Figure 4 and Figure 6 As shown, the connecting channel 2111 may have a channel wall, which may be provided with multiple protruding structures or recessed structures 2114. The multiple protruding structures or recessed structures 2114 may be arranged at even intervals. The provision of the protruding structures or recessed structures 2114 can increase the contact area between the cooling medium and the channel wall, i.e., the first heat exchange plate 21, thereby improving the heat exchange efficiency. This design does not require additional channel volume, further improving heat dissipation capacity within a limited space, and adapting to the high heat load requirements of high-density storage servers.

[0032] In the storage server provided in this disclosure, as an exemplary embodiment, reference is made to... Figure 7 As shown, the connecting channel 2111 can extend through two opposite ends of the channel plate 211. Each end can be provided with a manifold 212. The inlet 2122 and outlet 2123 can be arranged on the two manifolds 212 respectively, or the inlet 2122 and outlet 2123 can be arranged on the same manifold 212. The design of the two manifolds 212 improves the flexibility of the layout of the inlet 2122 and outlet 2123 on the first heat exchange plate 21. For example, when the inlet 2122 and outlet 2123 are respectively arranged on two manifolds 212, the flow distance of the cooling medium within the channel is increased, resulting in more thorough heat exchange. When the inlet 2122 and outlet 2123 are arranged on the same manifold 212, the structure of the heat dissipation device 2 is more compact, adapting to smaller installation spaces and improving layout flexibility.

[0033] In the storage server provided in this disclosure, as an exemplary embodiment, reference is made to... Figure 3 As shown, the flow channel plate 211 is provided with multiple weight-reducing parts 2113. These weight-reducing parts 2113 are evenly spaced and penetrate the flow channel plate 211. A connecting flow channel 2111 can be formed in the area between any two adjacent weight-reducing parts 2113. The weight-reducing parts 2113 effectively reduce the weight of the heat dissipation device 2, facilitating installation and maintenance within the storage server, while also saving material costs. Furthermore, the spaced arrangement of the weight-reducing parts 2113 and the connecting flow channel 2111 ensures that the flow channel plate 211 experiences more balanced stress without affecting the integrity of the flow channel and the heat exchange area, thus reducing the risk of deformation and improving structural stability.

[0034] In the storage server provided in this disclosure, as an exemplary embodiment, the first heat exchange plate 21 can be made of aluminum. During processing, a insertion groove 2112 for inserting and welding the second heat exchange plate 22 is first milled at a suitable position on the first heat exchange plate 21. The connecting channels 2111 within the first heat exchange plate 21 can be formed by an extrusion process. In other embodiments, to simplify the processing while ensuring heat dissipation, 2 to 4 connecting channels 2111 can be opened only near the insertion groove 2112, and converging channels 2121 can be milled at suitable positions on the two converging plates 212, so that after the converging plates 212 are welded to the heat exchange plates, the connecting channels 2111 and the converging channels 2121 can form a sealed channel for the flow of cooling medium.

[0035] In the storage server provided in this disclosure, as an exemplary embodiment, reference is made to... Figure 2 As shown, the storage unit 11 can have a first side and a second side. Two storage units 11 can be arranged between any two adjacent second heat exchange plates 22. The first sides of the two storage units 11 can be attached to each other, and the second sides can be attached to the second heat exchange plates 22 respectively. The heat generation of the second side is greater than that of the first side. That is to say, two storage units 11 can be arranged between any two adjacent second heat exchange plates 22, and the side of the two storage units 11 with less heat generation is attached to each other, while the side with more heat generation is attached to the second heat exchange plate 22. Thus, on the one hand, targeted and efficient heat dissipation can be achieved, avoiding overheating caused by concentrated heat generation and extending the service life of the storage unit 11; on the other hand, by arranging the two storage units 11 together, space can be saved, further increasing the storage density and meeting the needs of high-density storage.

[0036] In the storage server provided in this disclosure, as an exemplary embodiment, reference is made to... Figure 2As shown, the storage server may include a backplane 3, which may have multiple openings 31 for the second heat exchange plate 22 to pass through. The backplane 3 can be attached to the first heat exchange plate 21, and multiple storage units 11 can be supported on the backplane 3 and electrically connected to it. The backplane 3 supports the storage units 11 while ensuring their electrical connection, enabling the storage nodes 1 to perform their storage functions. Furthermore, the openings 31 allow the second heat exchange plate 22 to directly pass through the backplane 3 and attach to the storage units 11, ensuring heat dissipation while allowing the backplane 3 to directly attach to the first heat exchange plate 21, thus improving the structural reliability of the storage server.

[0037] In the storage server provided in this disclosure, as an exemplary embodiment, reference is made to... Figure 1 As shown, the storage server may include a housing 4, which may include a casing 41 and a tray 42. The tray 42 is movably connected to the casing 41, and the storage node 1 and the heat dissipation device 2 can be housed within the tray 42. The housing 4 provides protection for the storage node 1 and the heat dissipation device 2, preventing damage from external forces. The movable connection between the tray 42 and the casing 41 facilitates the installation, maintenance, and replacement of the storage node 1 and the heat dissipation device 2 without disassembling the entire housing 4.

[0038] Based on the above implementation methods, refer to Figure 1 As shown, the housing 41 may be equipped with a partition 411. The storage server may include a compute node 5, which can be separated from the storage node 1 by the partition 411 and is movably connected to the housing 41. In this way, the partition 411 can physically separate the compute node 5 from the storage node 1, preventing mutual interference from vibration and heat during operation and improving their respective operational stability. At the same time, the movable connection design of the compute node 5 gives the storage server a certain degree of scalability, allowing for the addition or removal of compute nodes 5 as needed to adapt to different application scenarios, thus improving the practicality and cost-effectiveness of the device.

[0039] It should be explained here that computing node 5 can be a CPU (Central Processing Unit) / GPU (Graphics Processing Unit), etc., used to execute applications or perform calculations and processing, and transmit data to storage node 1 for storage. This disclosure does not involve improvements to the location or structure of computing node 5, so it will not be described in detail here.

[0040] In summary, when assembling the storage server provided in this disclosure, the first heat exchange plate 21 is first inserted into the insertion slot 2112 on the second heat exchange plate 22, and then the first heat exchange plate 21 and the second heat exchange plate 22 are welded together. Subsequently, the heat dissipation device 2 is directly installed and fixed in the tray 42. Then, the through 31 on the back plate 3 passes through the second heat exchange plate 22 so that the back plate 3 is supported on the first heat exchange plate 21. Finally, two storage units 11 are inserted into the space 23 between any two adjacent second heat exchange plates 22, ensuring that the side with lower heat generation of the two storage units 11 faces each other, and the side with higher heat generation is in contact with the second heat exchange plate 22. Finally, the tray 42 is pushed into the housing 41, and the computing node 5 is connected to the housing 4, thus realizing the assembly of the storage server.

[0041] The preferred embodiments of this disclosure have been described in detail above with reference to the accompanying drawings. However, this disclosure is not limited to the specific details of the above embodiments. Within the scope of the technical concept of this disclosure, various simple modifications can be made to the technical solutions of this disclosure, and these simple modifications all fall within the protection scope of this disclosure.

[0042] It should also be noted that the various specific technical features described in the above specific embodiments can be combined in any suitable manner without contradiction. In order to avoid unnecessary repetition, this disclosure will not describe the various possible combinations separately.

[0043] Furthermore, various different embodiments of this disclosure can be combined in any way, as long as they do not violate the spirit of this disclosure, they should also be regarded as the content disclosed in this disclosure.

Claims

1. A storage server, characterized in that, include: A storage node, wherein the storage node comprises multiple storage units; as well as A heat dissipation device includes a first heat exchange plate and a plurality of second heat exchange plates. The first heat exchange plate is disposed below the storage node. The plurality of second heat exchange plates are arranged at intervals on the first heat exchange plate and are in thermally conductive contact with the first heat exchange plate. A plurality of spacers are formed between any two adjacent second heat exchange plates for the storage units to be inserted. The first heat exchange plate contains a cooling medium, and the storage unit exchanges heat with the cooling medium through the first heat exchange plate and the second heat exchange plate.

2. The storage server according to claim 1, characterized in that, The first heat exchange plate is provided with a connecting channel and multiple insertion slots. Multiple second heat exchange plates are inserted into the insertion slots one by one. The connecting channels are distributed on opposite sides of each insertion slot. The cooling medium in the connecting channel conducts heat with the second heat exchange plate.

3. The storage server according to claim 2, characterized in that, The second heat exchange plate includes a heat exchange plate body and a heat pipe. At least one side of the heat exchange plate body is provided with an embedding groove. The heat pipe has a heat exchange section and a condensation section that are interconnected. Both the heat exchange section and the condensation section are embedded in the embedding groove. Alternatively, the heat exchange section is embedded in the embedding groove and at least a portion of the condensation section protrudes from the heat exchange plate body.

4. The storage server according to claim 3, characterized in that, Both the heat exchange section and the condensation section are embedded in the embedding groove, and the heat exchange plate body is inserted into the insertion groove and welded to the first heat exchange plate.

5. The storage server according to claim 3, characterized in that, The heat exchange section is embedded in the embedding groove, and at least a portion of the condensation section protrudes from the heat exchange plate and is inserted into the insertion groove. The insertion groove is connected to the connecting channel so that the cooling medium and the condensation section can make thermal contact. The heat exchange plate is welded to the first heat exchange plate to seal the insertion groove.

6. The storage server according to any one of claims 1-5, characterized in that, The first heat exchange plate includes a flow channel plate and at least one manifold plate. The flow channel plate forms a connecting flow channel. The manifold plate is disposed at the end of the flow channel plate and is provided with a converging flow channel communicating with the connecting flow channel. The manifold plate or the flow channel plate is provided with an inlet and an outlet for the cooling medium to flow through.

7. The storage server according to claim 6, characterized in that, The connecting channel extends through two opposite ends of the channel plate, and each of the two ends is provided with a manifold. The liquid inlet and the liquid outlet are respectively arranged on the two manifolds, or the liquid inlet and the liquid outlet are arranged on the same manifold.

8. The storage server according to claim 6, characterized in that, The flow channel plate is provided with multiple weight-reducing parts, which are evenly spaced and penetrate the flow channel plate. The flow channel plate forms a connecting flow channel in the area between any two adjacent weight-reducing parts.

9. The storage server according to claim 1, characterized in that, The storage unit has a first side and a second side, and two storage units are arranged between any two adjacent second heat exchange plates. The first sides of the two storage units are attached to each other, and the second sides are respectively attached to the second heat exchange plates. The heat generation of the second side is greater than that of the first side.

10. The storage server according to claim 1, characterized in that, The storage server includes a backplane with multiple openings for the second heat exchange plate to pass through. The backplane is attached to the first heat exchange plate, and multiple storage units are supported on the backplane and electrically connected to the backplane.

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