A PCIE expansion board card

Abstract

The application relates to the technical field of circuit boards, and provides a PCIE expansion board card, which comprises an uplink interface module, a first downlink interface module, a second downlink interface module, an expansion chip, a flash memory module, a temperature acquisition and heat dissipation module, an encryption module and a master control chip. The uplink interface module, the first downlink interface module, the second downlink interface module, the flash memory module and the master control chip are connected with the expansion chip; the encryption module and the temperature acquisition and heat dissipation module are connected with the master control chip; the uplink interface module is used for connecting uplink equipment of the PCIE expansion board card; the first downlink interface module is used for connecting other PCIE expansion board cards; and the second downlink interface module is used for connecting PCIE equipment. The PCIE expansion board card can improve the data security and universality of the PCIE expansion board card.

Description

Technical Field

[0001] This application relates to the field of circuit board technology, and in particular to a PCIe expansion card. Background Technology

[0002] PCIe (Peripheral Component Interconnect Express) is a high-speed interface standard used to connect components in a computer. Its main advantages include high data transfer rates and good scalability, supporting a variety of devices such as graphics cards, solid-state drives, and network cards. However, current applications of PCIe have the following drawbacks: 1. The number of PCIe slots on a typical central processing unit (CPU) motherboard is limited and the design is relatively simple. Furthermore, the number of external devices is restricted by the motherboard's installation space, which limits the motherboard's functionality and makes it unable to meet the needs of higher-speed, higher-capacity, and higher-density data computing, transmission, and storage.

[0003] 2. The fixed interface design of PCIe expansion boards makes them unsuitable for various external devices with different PCIe interface types, severely limiting their functional compatibility. For example, if a CPU's PCIe controller routes PCIe signals to an x16 PCIe slot, and this x16 PCIe slot is divided into x8, x4, and x2 PCIe interfaces, it can only support any two of the following combinations (maximum of two interfaces): x8, x4, or x2. It cannot expand to include multiple x16 PCIe slots or combinations of three or more x8, x4, or x2 interfaces.

[0004] 3. Information security issues are becoming increasingly serious, with large-scale data breaches occurring frequently.

[0005] This shows that PCIe expansion cards currently suffer from issues of limited versatility and low data security. Utility Model Content

[0006] This application provides a PCIe expansion card that can solve the problems of low versatility and low data security of PCIe expansion cards.

[0007] This application provides a PCIe expansion card, including: Uplink interface module, first downlink interface module, second downlink interface module, expansion chip, flash memory module, temperature acquisition and heat dissipation module, encryption module, main control chip; The uplink interface module, the first downlink interface module, the second downlink interface module, the flash memory module, and the main control chip are all connected to the expansion chip. The encryption module and the temperature acquisition and heat dissipation module are also connected to the main control chip. The uplink interface module is used to connect to the uplink device of the PCIe expansion card. The first downlink interface module is used to connect to other PCIe expansion cards. The second downlink interface module is used to connect to PCIe devices. The uplink device can be other PCIe expansion cards or the CPU motherboard. The temperature acquisition and heat dissipation module is used to dissipate heat according to the signal output by the main control chip. The encryption module and the main control chip are used to implement the encryption and verification of the identity information of the PCIe expansion card.

[0008] Optionally, the uplink interface module is a PCIe x16 gold finger; The first end of the PCIe x16 gold finger connects to the upstream device of the PCIe expansion card, and the second end of the PCIe x16 gold finger connects to the expansion chip.

[0009] Optionally, the first downstream interface module is a PCIe x16 slot; The first end of the PCIe x16 slot is connected to the expansion chip, and the second end of the PCIe x16 slot is connected to other PCIe expansion cards.

[0010] Optionally, the second downlink interface module includes multiple connection units; The first end of each connection unit is connected to the expansion chip, and the second end of each connection unit is connected to the corresponding PCIe device.

[0011] Optionally, the connection unit is an M.2 connector; The first end of the M.2 connector connects to the expansion chip, and the second end of the M.2 connector connects to the corresponding PCIe device.

[0012] Optionally, the flash memory module includes a first flash socket and a second flash socket; Both the first and second Flash sockets are connected to expansion chips.

[0013] Optionally, the PCIe expansion card also includes a power module; The power module is connected to the uplink interface module, the first downlink interface module, the second downlink interface module, the expansion chip, the flash memory module, the temperature acquisition and heat dissipation module, the encryption module, and the main control chip.

[0014] Optionally, the encryption module is an encryption chip; The encryption chip is connected to the main control chip.

[0015] Optionally, the temperature acquisition and heat dissipation module includes a temperature sensor, a heat dissipation device, an analog-to-digital converter chip, a first capacitor, a second capacitor, a third capacitor, a first resistor, a second resistor, a third resistor, and a fourth resistor; The first end of the analog-to-digital converter chip and the heat dissipation device are connected to the main control chip; The first power supply pin of the analog-to-digital converter (ADC) chip is connected to the first power supply and the first terminal of the first capacitor, respectively. The second power supply pin of the ADC chip is connected to the second power supply and the first terminal of the second capacitor, respectively. The second terminals of the first and second capacitors are both connected to ground. The first terminal of the first resistor is connected to the first and second pins of the ADC chip, respectively. The second terminal of the first resistor is connected to the third and fourth pins of the ADC chip, respectively. The first terminal of the second resistor is connected to the fifth and sixth pins of the ADC chip, respectively. The second terminal of the second resistor is connected to the first terminal of the temperature sensor and the second terminal of the third resistor, respectively. The first terminal of the third resistor is connected to the seventh pin of the ADC chip and the first terminal of the third capacitor, respectively. The second terminal of the third capacitor is connected to the eighth and ninth pins of the ADC chip and the first terminal of the fourth resistor, respectively. The second terminal of the fourth resistor is connected to the second terminal of the temperature sensor.

[0016] The above-mentioned solution in this application has the following beneficial effects: In the embodiments of this application, the PCIe expansion card includes an uplink interface module, a first downlink interface module, a second downlink interface module, an expansion chip, a flash memory module, a temperature acquisition and heat dissipation module, an encryption module, and a main control chip. The uplink interface module, the first downlink interface module, the second downlink interface module, the flash memory module, and the main control chip are all connected to the expansion chip. The encryption module and the temperature acquisition and heat dissipation module are both connected to the main control chip. The uplink interface module is used to connect to the uplink device of the PCIe expansion card, the first downlink interface module is used to connect to other PCIe expansion cards, and the second downlink interface module is used to connect to PCIe devices. The inclusion of the encryption module enables authentication of the PCIe expansion card, improving its data security. Connecting to other PCIe expansion cards or PCIe devices through the first and second downlink interface modules supports multi-level expansion, allowing for the creation of multiple interfaces. These interfaces are freely configurable, addressing the issues of insufficient PCIe ports and fixed interface splitting methods, thus improving the versatility of the PCIe expansion card.

[0017] Other beneficial effects of this application will be described in detail in the following detailed description section. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 This is a schematic diagram of the structure of the PCIe expansion card provided in this application; Figure 2 This is a schematic diagram of the temperature acquisition and heat dissipation module provided in this application; Figure 3 This is a connection diagram of the temperature acquisition and heat dissipation module provided in this application; Figure 4 This is a schematic diagram of PCIe expansion card cascading provided in this application; Figure 5 This is a schematic diagram of the interconnection of PCIe expansion cards provided in this application. Detailed Implementation

[0020] In the following description, specific details such as particular system architectures and techniques are set forth for illustrative purposes and not for limitation, in order to provide a thorough understanding of the embodiments of this application. However, those skilled in the art will understand that this application may also be implemented in other embodiments without these specific details. In other instances, detailed descriptions of well-known systems, apparatuses, circuits, and methods have been omitted so as not to obscure the description of this application with unnecessary detail.

[0021] It should be understood that, when used in this application specification and the appended claims, the term "comprising" indicates the presence of the described features, integrals, steps, operations, elements and / or components, but does not exclude the presence or addition of one or more other features, integrals, steps, operations, elements, components and / or a collection thereof.

[0022] It should also be understood that the term “and / or” as used in this application specification and the appended claims means any combination of one or more of the associated listed items and all possible combinations, and includes such combinations.

[0023] Furthermore, in the description of this application and the appended claims, the terms "first," "second," "third," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0024] References to "one embodiment" or "some embodiments" as described in this specification mean that one or more embodiments of this application include a specific feature, structure, or characteristic described in connection with that embodiment. Therefore, the phrases "in one embodiment," "in some embodiments," "in other embodiments," "in still other embodiments," etc., appearing in different parts of this specification do not necessarily refer to the same embodiment, but rather mean "one or more, but not all, embodiments," unless otherwise specifically emphasized. The terms "comprising," "including," "having," and variations thereof mean "including but not limited to," unless otherwise specifically emphasized.

[0025] To address the issues of low versatility and data security of PCIe expansion cards, this application provides a PCIe expansion card, including an uplink interface module, a first downlink interface module, a second downlink interface module, an expansion chip, a flash memory module, a temperature acquisition and heat dissipation module, an encryption module, and a main control chip. The uplink interface module, first downlink interface module, second downlink interface module, flash memory module, and main control chip are all connected to the expansion chip, while the encryption module and temperature acquisition and heat dissipation module are both connected to the main control chip. The uplink interface module is used to connect to the uplink device of the PCIe expansion card, the first downlink interface module is used to connect to other PCIe expansion cards, and the second downlink interface module is used to connect to PCIe devices. The inclusion of the encryption module enables authentication of the PCIe expansion card, improving its data security. Connecting to other PCIe expansion cards or PCIe devices through the first and second downlink interface modules supports multi-level expansion, allowing for the creation of multiple interfaces. These interfaces are freely configurable, solving the problems of insufficient PCIe ports and fixed interface splitting methods, thus improving the versatility of the PCIe expansion card.

[0026] The PCIE expansion card provided in this application will be illustrated below with specific examples.

[0027] like Figure 1 As shown, the PCIe expansion card includes an uplink interface module ( Figure 1 Uplink PCIe x16 and first downlink interface module ( Figure 1 PCIe x16 Slot and second downlink interface module ( Figure 1 M.2 in the middle), expansion chip ( Figure 1 PCIe Switch chip), flash memory module ( Figure 1 Flash1 and Flash2), temperature acquisition and heat dissipation module, encryption module (in the middle), Figure 1 The encryption chip in the middle can be an N32S003 chip, etc., and the main control chip ( Figure 1The main control chip in the system can be a microcontroller such as STM32; the uplink interface module, the first downlink interface module, the second downlink interface module, the flash memory module, and the main control chip are all connected to the expansion chip; the encryption module and the temperature acquisition and heat dissipation module are all connected to the main control chip; the uplink interface module is used to connect to the uplink device of the PCIe expansion card; the first downlink interface module is used to connect to other PCIe expansion cards; and the second downlink interface module is used to connect to PCIe devices (such as solid-state drives).

[0028] The temperature acquisition and heat dissipation module dissipates heat based on the signals output by the main control chip. The encryption chip and the main control chip are used to encrypt and verify the identity information of the PCIe expansion card. The client interacts with the encryption chip via the UART protocol. The encryption chip uses its existing functions to perform authentication. After successful authentication, it controls the expansion board to power on and sends a normal operation command to the main control chip; otherwise, it does not power on. Upon receiving the command, the main control chip configures the expansion chip's operating status, and the system operates normally. Furthermore, the expansion chip has built-in support for SM2, SM3, and SM4 security authentication, which can protect the security of sensitive data and prevent data leakage and tampering.

[0029] It should be noted that in the aforementioned PCIe expansion cards, data from the uplink device is transmitted to the expansion chip via the uplink interface module, and then transmitted to the downlink device (other PCIe expansion cards or PCIe devices) via the first or second downlink interface module. When the expansion chip boots up, it reads data from the flash memory module to load firmware (the flash memory module can be connected to a flash memory chip storing the data and firmware). The expansion chip stores encrypted identification information (such as ID, signature, etc.) of the PCIe expansion card. A client (such as a CPU motherboard, which pre-stores the PCIe expansion card's identification information) sends a request for the identification information to the expansion chip via the uplink interface module. The expansion chip then sends the encrypted identification information and data to the client, which verifies the information (e.g., decrypting the encrypted identification information based on its own functions and comparing it with the pre-stored identification information), thus authenticating the PCIe expansion card. The temperature acquisition and heat dissipation module is used to detect and dissipate heat.

[0030] The expansion chip can be a PCIe 5.0 switch chip, used to expand the CPU's PCIe controller to multiple PCIe interfaces. These PCIe interfaces can connect to multiple x16, x8, x4, or x2 PCIe slots or M.2 connectors. PCIe x16, x8, and x4 can be further separated on the adapter board according to the user's actual needs. x16, x8, x4, and x2 are different specifications of PCIe interfaces; x16 refers to 16 PCIe lanes, x8 to 8, x4 to 4, and x2 to 2.

[0031] The aforementioned uplink interface module is a PCIe x16 gold finger. The first end of the PCIe x16 gold finger connects to the uplink device of the PCIe expansion card, and the second end of the PCIe x16 gold finger connects to the expansion chip.

[0032] For example, the aforementioned PCIe x16 gold fingers can be PCIe 5.0 x16 gold fingers, which can be directly connected to the CPU motherboard and fixed inside the computer case via a hard connection, or they can be connected to the CPU motherboard via a flexible ribbon cable, such as... Figure 1 As shown, the CPU motherboard includes a CPU, which has a built-in PCIe controller and a PEIe x16 interface. The PEIe x16 interface can be connected to a PCIe slot and connects to the PCIe x16 connector via the PEIe x16 interface. Multiple first-downlink interface modules can be configured according to actual needs.

[0033] The aforementioned first downstream interface module is a PCIe x16 slot; the first end of the PCIe x16 slot is connected to the expansion chip, and the second end of the PCIe x16 slot is connected to other PCIe expansion cards.

[0034] The second downlink interface module includes multiple connection units; the first end of each connection unit is connected to the expansion chip, and the second end of each connection unit is connected to the corresponding PCIe device.

[0035] The aforementioned connection unit is an M.2 connector; the first end of the M.2 connector is connected to the expansion chip, and the second end of the M.2 connector is connected to the corresponding PCIe device.

[0036] The flash memory module includes a first flash socket and a second flash socket; both the first flash socket and the second flash socket are connected to an expansion chip.

[0037] For example, the first and second Flash sockets are used to place Flash chips. The Flash chips store pre-programmed PCIe interface configurations. The expansion chip reads the PCIe interface configuration stored in the Flash chips and configures its own PCIe interface accordingly. Figure 1 As shown, the flash memory module is connected to the expansion chip via the Serial Peripheral Interface (SPI) protocol.

[0038] The PCIe expansion card also includes a power module; the power module is connected to the uplink interface module, the first downlink interface module, the second downlink interface module, the expansion chip, the flash memory module, the temperature acquisition and heat dissipation module, the encryption module, and the main control chip (not shown in the figure). It provides power to the various modules and chips in the PCIe expansion card, and the encryption module can control the connection or disconnection of the power module.

[0039] The encryption module is an encryption chip; the encryption chip is connected to the main control chip.

[0040] For example, the aforementioned encryption chip can be a chip such as the N32S003. This chip possesses security functions such as identity authentication, key negotiation, data encryption, and critical data storage based on national or international cryptographic algorithms. It also features secure boot, secure data storage, key security protection, programming code protection, secure program upgrades, and globally unique identification. During the identity verification process, all signature and verification operations require a hash operation on the message to achieve secure storage, node authentication, and copyright protection. The main control chip is equipped with a PCIe 5.0 switch function pin to ensure normal chip operation. The encryption chip pre-stores identification information. When performing identity verification on the PCIe expansion card, the encryption chip encrypts the identification information based on its own encryption function before sending it.

[0041] like Figure 2 As shown, the temperature acquisition and heat dissipation module includes a temperature sensor ( Figure 2 The RTD in the middle), heat dissipation device (such as fan), analog-to-digital converter chip, first capacitor, second capacitor ( Figure 2 The first and second capacitors are both 0.1µF), and the third capacitor ( Figure 2 C in i ), first resistor ( Figure 2 The resistor R in REF ), second resistor ( Figure 2 The resistor R connected to pin FORCE+ in the middle CABLE ), third resistor ( Figure 2 The resistor R connected to pin RTDIN+ in the middle CABLE ), fourth resistor ( Figure 2 The resistor R connected to pin RTDIN- in the middle CABLE ).

[0042] The first end of the analog-to-digital converter chip ( Figure 2 The host interface (including six pins: DRDY, SDI, SCLK, CS, SDO, and NC) and the heat dissipation device are all connected to the main control chip.

[0043] The first power supply pin of the analog-to-digital converter chip ( Figure 2 The pins of DVDD in the circuit are respectively connected to the first power supply ( Figure 2 V connected to DVDD DD The second power supply pin of the analog-to-digital converter chip is connected to the first terminal of the first capacitor. Figure 2 The pin VDD in the middle is respectively connected to the second power supply ( Figure 2 V connected to VDD DD The first terminal of the first capacitor and the second terminal of the second capacitor are connected to ground. The first terminal of the first resistor is connected to the first pin of the analog-to-digital converter chip. Figure 2 Pin BIAS), second pin ( Figure 2 The first resistor is connected to pin REFIN+, and the second end of the first resistor is connected to pin 3 of the analog-to-digital converter chip. Figure 2 pin REFIN-), fourth pin ( Figure 2 The first terminal of the second resistor is connected to the ISENSOR pin of the analog-to-digital converter chip, and the first terminal of the second resistor is connected to the fifth pin of the analog-to-digital converter chip. Figure 2 pin FORCE+), pin 6 ( Figure 2 The second resistor is connected to pin FORCE2 in the circuit. The second end of the second resistor is connected to the first end of the temperature sensor and the second end of the third resistor, respectively. The first end of the third resistor is connected to pin 7 of the analog-to-digital converter chip. Figure 2 The first terminal of the third capacitor is connected to pin RTDIN+, and the second terminal of the third capacitor is connected to pin 8 of the analog-to-digital converter chip. Figure 2 Pin RTDIN-), pin 9 ( Figure 2 The first terminal of the fourth resistor is connected to the FORCE- pin in the circuit, and the second terminal of the fourth resistor is connected to the second terminal of the temperature sensor.

[0044] The connection between the temperature acquisition and heat dissipation module and the main control chip is as follows: Figure 3As shown, the temperature sensor transmits the collected temperature data Temp N / P to the analog-to-digital converter module (i.e., the analog-to-digital converter chip). The analog-to-digital converter module transmits data with the main control chip through the SPI and DRDY protocols. The main control chip outputs a heat dissipation control signal (EN) to the heat dissipation device, and the heat dissipation device starts or stops according to the heat dissipation control signal.

[0045] For example, the main control chip can be a microcontroller such as STM32. The temperature sensor is used to collect ambient temperature data and transmit it to the analog-to-digital converter. After the analog-to-digital converter converts the ambient temperature data, it transmits it to the main control chip via the SPI protocol. The main control chip outputs a heat dissipation control signal (EN) to control the heat dissipation device. If the output heat dissipation control signal is high, the heat dissipation device is in the start state; if it is low, the heat dissipation device is in the off state. The STM32 can output a high-level heat dissipation control signal when the ambient temperature data is greater than or equal to the preset temperature, and output a low-level heat dissipation control signal when it is less than the preset temperature, according to its own temperature alarm function.

[0046] In some embodiments of this application, the expansion chip in the PCIe expansion card can expand to provide five PCIe x16 interfaces. Each PCIe x16 can be freely configured to be split into two PCIe x8 interfaces, four PCIe x4 interfaces, one PCIe x8 and two PCIe x4 interfaces, one PCIe x8, one PCIe x4 and two PCIe x2 interfaces, one PCIe x8 and four PCIe x2 interfaces, etc. The interface configuration is shown in Table 1. Table 1

[0047] In another embodiment of this application, the expansion chip in the PCIe expansion card can be expanded to provide 11 PCIe x8 slots. Each PCIe x8 slot can be freely configured to split into 2 PCIe x4 slots, 1 PCIe x4 slot with 2 PCIe x2 slots, 4 PCIe x2 slots, etc. The interface settings are shown in Table 2: Table 2

[0048] For example, cascading of PCIe expansion cards can be achieved through the first connection module, such as... Figure 4 As shown, the PCIe expansion board (i.e., PCIe expansion card) is connected to the CPU in the CPU motherboard. The PCIe expansion board expands to PCIe slots or M.2 through the PCIe switch chip, and one of the PCIe slots is connected to the PCIe switch chips of other PCIe expansion boards.

[0049] It can also enable cross-domain interconnection of PCIe expansion cards, such as... Figure 5 As shown, CPU0 in CPU motherboard 0 is connected to the PCIe Switch chip of PCIe expansion board 0, and CPU2 in CPU motherboard 1 is connected to the PCIe Switch chip of PCIe expansion board 1. The PCIe Switch chip of PCIe expansion board 0 and the PCIe Switch chip of PCIe expansion board 1 are connected through PCIe x16. Both PCIe expansion board 0 and PCIe expansion board 1 expand to PCIe Slot or M.2 through PCIe Switch chips.

[0050] It is worth mentioning that the encryption module enables authentication of the PCIe expansion card, improving its data security. The downlink interface module connects to other PCIe expansion cards or PCIe devices, supporting multi-level expansion and allowing for the creation of multiple interfaces. These interfaces are freely configurable, resolving issues of insufficient PCIe ports and fixed interface splitting methods, thus enhancing the versatility of the PCIe expansion card.

[0051] Furthermore, the PCIe expansion card of this application expands to multiple PCIe X16, X8, X4, and X2 interfaces, which can be freely configured. Expansion cards can be cascaded and interconnected across domains, and the installation method is flexible. It solves the key bottlenecks of insufficient number of PCIe channels / ports and fixed interface splitting in high-speed signal transmission and storage, providing strong support for high-performance computing scenarios, supporting data transmission with higher speed, capacity, and density, and meeting the application scenarios of high-speed data throughput requirements such as AI training and 8K video processing.

[0052] The expansion board provides security functions such as identity authentication, key negotiation, data encryption, and critical data storage based on national / international cryptographic algorithms. It features secure boot, secure data storage, key security protection, programming code protection, secure program upgrade, and globally unique identification, protecting the security of sensitive data, preventing data leakage and tampering, and also eliminating product copying and counterfeit parts incidents.

[0053] The above description is the preferred embodiment of this application. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the principles described in this application, and these improvements and modifications should also be considered within the scope of protection of this application.

Claims

1. A PCIe expansion card, characterized in that, include: Uplink interface module, first downlink interface module, second downlink interface module, expansion chip, flash memory module, temperature acquisition and heat dissipation module, encryption module, main control chip; The uplink interface module, the first downlink interface module, the second downlink interface module, the flash memory module, and the main control chip are all connected to the expansion chip. The encryption module and the temperature acquisition and heat dissipation module are both connected to the main control chip. The uplink interface module is used to connect to the uplink device of the PCIe expansion card. The first downlink interface module is used to connect to other PCIe expansion cards. The second downlink module is used to connect to PCIe devices. The uplink device is other PCIe expansion cards or a CPU motherboard. The temperature acquisition and heat dissipation module is used to dissipate heat according to the signal output by the main control chip. The encryption module and the main control chip are used to implement encrypted verification of the identity information of the PCIe expansion card.

2. The PCIe expansion card according to claim 1, characterized in that, The uplink interface module is a PCIE x16 gold finger; The first end of the PCIe x16 gold finger is connected to the uplink device of the PCIe expansion card, and the second end of the PCIe x16 gold finger is connected to the expansion chip.

3. The PCIe expansion card according to claim 2, characterized in that, The first downlink interface module is a PCIe x16 slot; The first end of the PCIe x16 slot is connected to the expansion chip, and the second end of the PCIe x16 slot is connected to other PCIe expansion cards.

4. The PCIe expansion card according to claim 3, characterized in that, The second downlink interface module includes multiple connection units; The first end of each of the connection units is connected to the expansion chip, and the second end of each of the connection units is connected to the corresponding PCIe device.

5. The PCIe expansion card according to claim 4, characterized in that, The connection unit is an M.2 connector; The first end of the M.2 connector is connected to the expansion chip, and the second end of the M.2 connector is connected to the corresponding PCIe device.

6. The PCIe expansion card according to claim 1, characterized in that, The flash memory module includes a first Flash socket and a second Flash socket; Both the first Flash socket and the second Flash socket are connected to the expansion chip.

7. The PCIe expansion card according to claim 1, characterized in that, The PCIe expansion card also includes a power module; The power module is connected to the uplink interface module, the first downlink interface module, the second downlink interface module, the expansion chip, the flash memory module, the temperature acquisition and heat dissipation module, the encryption module, and the main control chip.

8. The PCIe expansion card according to claim 1, characterized in that, The encryption module is an encryption chip; The encryption chip is connected to the main control chip.

9. The PCIe expansion card according to claim 1, characterized in that, The temperature acquisition and heat dissipation module includes a temperature sensor, a heat dissipation device, an analog-to-digital converter chip, a first capacitor, a second capacitor, a third capacitor, a first resistor, a second resistor, a third resistor, and a fourth resistor; The first end of the analog-to-digital converter chip and the heat dissipation device are connected to the main control chip; The first power supply pin of the analog-to-digital converter (ADC) chip is connected to the first power supply and the first terminal of the first capacitor, respectively. The second power supply pin of the ADC chip is connected to the second power supply and the first terminal of the second capacitor, respectively. The second terminals of the first and second capacitors are both connected to ground. The first terminal of the first resistor is connected to the first and second pins of the ADC chip, respectively. The second terminal of the first resistor is connected to the third and fourth pins of the ADC chip, respectively. The first terminal of the second resistor is connected to the fifth and sixth pins of the ADC chip, respectively. The second terminal of the second resistor is connected to the first terminal of the temperature sensor and the second terminal of the third resistor, respectively. The first terminal of the third resistor is connected to the seventh pin of the ADC chip and the first terminal of the third capacitor, respectively. The second terminal of the third capacitor is connected to the eighth and ninth pins of the ADC chip and the first terminal of the fourth resistor, respectively. The second terminal of the fourth resistor is connected to the second terminal of the temperature sensor.

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