Backlight module and display device
Patent Information
- Application Number
- CN202522384324.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-11-10
- Publication Date
- 2026-10-30
- Estimated Expiration
- 2035-11-10
AI Technical Summary
[0002]在显示装置的背光模组设计时会使用到两张分光膜,这是因为为了追求背光模组的轻薄化,在COB模组(Chip On Board Module,板上芯片模组)设计时往往会采用0 OD,即LED与扩散板之间距离为0mm,而0 OD的设计若不搭配分光膜,由于LED发光角度的限制,会使得灯影十分明显,导致画面显示不均匀
[0021]本实用新型通过将灯板设置于背板的容置槽内,同时在灯板远离背板的一侧依次集成扩散层和功能层,以形成上述背光模组。其中,灯板上设置有多个发光芯片,用于发出光线。通过在灯板远离背板的一侧设置扩散层,当发光芯片发出光线穿过扩散层时,扩散层能增加其发光角度,通过提高发光芯片的发光角度,因而减少灯影的产生,进而有利于提高显示的均匀性和画面整体的显示效果。同时,通过设置扩散层,可以取消设置分光膜,有利于降低显示模组的成本,使得显示模组更加便于组装,省时省力,另外还有利于减少显示模组的厚度,增加显示模组的轻薄化程度。进一步地,扩散层远离背板的一侧还设置有功能层,功能层一方面能起到对扩散层的保护,另一方面还能对被扩散后的光线进一步处理,以使得背光模组满足显示需要。
Smart Images

Figure CN224922373U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of display device technology, and in particular to a backlight module and display device. Background Technology
[0002] Two beam-splitter films are used in the backlight module design of display devices. This is because, in pursuit of a thinner and lighter backlight module, COB (Chip On Board Module) designs often employ 0 OD (zero distance between the LED and the diffuser plate). However, without beam-splitter films, the limited LED emission angle results in very noticeable shadows, leading to uneven image display. Furthermore, adding beam-splitter films presents challenges such as high cost, increased film quantity leading to difficulties in film fixing, and increased assembly time. Increasing the OD value to improve the shadow problem would increase the thickness of the backlight module, thus diminishing the advantage of COB modules being thinner and lighter than POB (Package on Board) modules.
[0003] Therefore, there is an urgent need for a backlight module and display device to solve the above problems. Utility Model Content
[0004] Based on the above, the purpose of this utility model is to provide a backlight module and display device that has better display effect, while ensuring thinness and lightness, lower cost, and shorter assembly time.
[0005] To achieve the above objectives, the present invention adopts the following technical solution:
[0006] Backlight module, including:
[0007] Back panel;
[0008] A light panel is disposed on the back plate, and the light panel is provided with multiple light-emitting chips;
[0009] A diffusion layer is disposed on the side of the lamp panel away from the back plate. The light from the light-emitting chip can pass through the diffusion layer, and the diffusion layer can increase the light emission angle of the light-emitting chip.
[0010] A functional layer is disposed on the side of the diffusion layer away from the backplate, through which the light from the light-emitting chip can pass.
[0011] As a preferred embodiment of the backlight module, the diffusion layer includes a dispensing structure that is correspondingly disposed on the light-emitting chip. The dispensing structure has an air cavity inside and a first convex surface at one end away from the light-emitting chip. The light from the light-emitting chip can pass through the air cavity and through the first convex surface.
[0012] As a preferred embodiment of the backlight module, the dispensing structure includes a first adhesive near the light-emitting chip and a second adhesive covering the first adhesive. The second adhesive and the first adhesive form the air cavity, and the first convex surface is formed on the side away from the first adhesive.
[0013] As a preferred embodiment of the backlight module, the first colloid has a second convex surface protruding towards the air cavity on the side away from the light-emitting chip, and the light from the light-emitting chip passes through the second convex surface and enters the air cavity; and / or, the circumferential outer wall of the second colloid is inclined from the direction close to the light-emitting chip toward the direction away from the air cavity.
[0014] As a preferred embodiment of the backlight module, the diffusion layer is further provided with a first diffusion plate, which is disposed on the side of the dispensing structure away from the back plate.
[0015] As a preferred embodiment of the backlight module, the diffusion layer includes a second diffusion plate. The second diffusion plate has a relief groove on the side near the lamp plate that can be correspondingly covered to the light-emitting chip. The bottom of the relief groove is arc-shaped, and the light from the light-emitting chip enters the second diffusion plate through the arc-shaped bottom of the groove.
[0016] As a preferred embodiment of the backlight module, the diffusion layer further includes a quantum dot film disposed on the side of the second diffusion plate away from the back plate.
[0017] As a preferred embodiment of the backlight module, the functional layer includes a lower diffusion layer, a prism layer, and a brightness enhancement film arranged sequentially from the diffusion layer toward the diffusion layer.
[0018] As a preferred embodiment of the backlight module, the prism layer includes two prism sheets; and / or, the brightness enhancement film is configured as a reflective anti-polarization brightness enhancement film.
[0019] The display device includes the backlight module described in any of the above embodiments.
[0020] The beneficial effects of this utility model are as follows:
[0021] This invention forms the aforementioned backlight module by placing a lamp board within a receiving groove in a back plate, and sequentially integrating a diffusion layer and a functional layer on the side of the lamp board away from the back plate. The lamp board contains multiple light-emitting chips for emitting light. By placing a diffusion layer on the side of the lamp board away from the back plate, the diffusion layer increases the emission angle of the light emitted by the light-emitting chips when it passes through. This increases the emission angle of the light-emitting chips, thereby reducing the generation of shadows and improving the uniformity of the display and the overall display effect. Simultaneously, by setting a diffusion layer, the beam splitter can be eliminated, which helps reduce the cost of the display module, making it easier to assemble, saving time and effort. It also helps to reduce the thickness of the display module, increasing its thinness and lightness. Furthermore, a functional layer is also provided on the side of the diffusion layer away from the back plate. This functional layer protects the diffusion layer and further processes the diffused light to ensure the backlight module meets display requirements. Attached Figure Description
[0022] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the description of the embodiments of this utility model will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the content of the embodiments of this utility model and these drawings without creative effort.
[0023] Figure 1 This is a schematic diagram of a backlight module provided in a specific embodiment of this utility model;
[0024] Figure 2 This is a schematic diagram illustrating the interaction between the adhesive dispensing structure and the light-emitting chip in a backlight module according to a specific embodiment of this utility model.
[0025] Figure 3 This is a cross-sectional view of the interaction between the adhesive dispensing structure and the light-emitting chip in a backlight module according to a specific embodiment of this utility model.
[0026] Figure 4 This is a schematic diagram of another backlight module provided in a specific embodiment of this utility model;
[0027] Figure 5 This is a schematic diagram of the second diffuser plate of another backlight module provided in a specific embodiment of this utility model.
[0028] In the picture:
[0029] 100. Back panel;
[0030] 200. Light panel; 210. Light-emitting chip;
[0031] 300, Diffusion layer; 310, Dispensing structure; 311, Air cavity; 312, First convex surface; 313, First colloid; 314, Second colloid; 315, Second convex surface; 316, Third convex surface; 317, Circumferential outer wall; 320, First diffusion plate; 330, Second diffusion plate; 331, Clearance groove; 340, Quantum dot film;
[0032] 400, Functional layer; 410, Lower expansion layer; 420, Prism layer; 421, Prism sheet; 430, Brightness enhancement film. Detailed Implementation
[0033] The embodiments of this utility model are described in detail below. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain this utility model, and should not be construed as limiting this utility model.
[0034] In the description of this utility model, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. The terms "first position" and "second position" refer to two different positions.
[0035] Unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," and "fixing" should be interpreted broadly. For example, they can refer to fixed connections or detachable connections; mechanical connections or electrical connections; direct connections or indirect connections through an intermediate medium; and connections within two components or interactions between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.
[0036] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.
[0037] The technical solution of this utility model will be further described below with reference to the accompanying drawings and specific embodiments.
[0038] Figure 1 This is a schematic diagram of a backlight module provided in a specific embodiment of this utility model; Figure 4 This is a schematic diagram of another backlight module provided in a specific embodiment of this utility model. (See diagram below.) Figure 1 and Figure 4 As shown, this embodiment provides a backlight module, which includes a backplate 100, a lamp board 200, a diffusion layer 300, and a functional layer 400. The lamp board 200 is disposed on the backplate 100, and a plurality of light-emitting chips 210 are disposed on the lamp board 200. The diffusion layer 300 is disposed on the side of the lamp board 200 away from the backplate 100, and the light from the light-emitting chips 210 can pass through the diffusion layer 300, which can increase the light emission angle of the light-emitting chips 210. The functional layer 400 is disposed on the side of the diffusion layer 300 away from the backplate 100, and the light from the light-emitting chips 210 can pass through the functional layer 400.
[0039] It is worth noting that the backlight module includes a back panel 100 and a lamp panel 200. Further, the back panel 100 includes a back panel bottom plate and back panel side plates surrounding the four sides of the back panel bottom plate. The four back panel side plates and the back panel bottom plate form an accommodating groove, and the lamp panel 200 is located in the accommodating groove (not shown in the figure).
[0040] The backlight module described above is formed by placing a lamp board 200 within a receiving groove of a back plate 100, and sequentially integrating a diffusion layer 300 and a functional layer 400 on the side of the lamp board 200 away from the back plate 100. The lamp board 200 has multiple light-emitting chips 210 for emitting light. By placing the diffusion layer 300 on the side of the lamp board 200 away from the back plate 100, when the light emitted by the light-emitting chips 210 passes through the diffusion layer 300, the diffusion layer 300 increases the light emission angle. By increasing the light emission angle of the light-emitting chips 210, the generation of shadows is reduced, thereby improving the uniformity of the display and the overall display effect. Simultaneously, by setting the diffusion layer 300, the beam splitter can be eliminated, which helps reduce the cost of the display module, making the display module easier to assemble, saving time and effort. Furthermore, it also helps to reduce the thickness of the display module, increasing its thinness and lightness. Furthermore, a functional layer 400 is provided on the side of the diffusion layer 300 away from the back panel 100. The functional layer 400 can protect the diffusion layer 300 on the one hand, and further process the diffused light on the other hand, so that the backlight module can meet the display requirements.
[0041] Figure 2 This is a schematic diagram of the cooperation between the adhesive dispensing structure 310 and the light-emitting chip 210 in a backlight module according to a specific embodiment of this utility model; Figure 3 This is a cross-sectional view of the bonding structure 310 and the light-emitting chip 210 in a backlight module according to a specific embodiment of this utility model; as an optional solution for the display module, such as Figures 1-3 As shown, the diffusion layer 300 includes a dispensing structure 310 that is correspondingly disposed on the light-emitting chip 210. That is, one dispensing structure 310 corresponds to one light-emitting chip 210, so that each light-emitting chip 210 is diffused by a dispensing structure 310, resulting in better diffusion effect and thus ensuring better overall display effect of the display module.
[0042] Specifically, the dispensing structure 310 has an air cavity 311 inside and a first convex surface 312 at the end away from the light-emitting chip 210. The light from the light-emitting chip 210 can pass through the air cavity 311, which can disperse the light. Then the light can further pass through the first convex surface 312 and exit the dispensing structure 310. The first convex surface 312 can refract the light, thereby increasing the light emission angle.
[0043] Optionally, the gas cavity 311 is filled with a special gas, which, while scattering the light, also allows the light passing through the gas cavity 311 to display different colors when excited. For example, the special gas can be a rare gas. When the rare gas is krypton, the light passing through the gas cavity 311 appears yellow; when the rare gas is neon, the light passing through the gas cavity 311 appears red; and when the rare gas is argon, the light passing through the gas cavity 311 appears blue-violet. Those skilled in the art can select the appropriate gas as needed, and no specific limitation is made here.
[0044] Furthermore, the dispensing structure 310 includes a first adhesive 313 near the light-emitting chip 210 and a second adhesive 314 covering the first adhesive 313. An air cavity 311 is formed between the second adhesive 314 and the first adhesive 313, and a first convex surface 312 is formed on the side away from the first adhesive 313. By setting the dispensing structure 310 as a first adhesive 313 and a second adhesive 314, it is easier to process and manufacture, and it is also easier to fill the air cavity 311 with a special gas.
[0045] In this embodiment, the processing method of the dispensing structure 310 is as follows: First, after setting the light-emitting chip 210 on the lamp board 200, the first dispensing is performed on each light-emitting chip 210 of the lamp board 200, forming a first adhesive 313. Simultaneously, a second adhesive 314 is formed on a corresponding mold. After the first adhesive 313 and the second adhesive 314 are both formed, the second adhesive 314 is removed from the mold and transferred together with the lamp board 200 to a special gas environment for bonding of the first adhesive 313 and the second adhesive 314. The bonding can be performed by heat fusion. By performing the bonding in a special gas environment, it can be ensured that air will not be filled into the gas cavity 311.
[0046] Optionally, the side of the first colloid 313 away from the light-emitting chip 210 is provided with a second convex surface 315 protruding towards the air cavity 311. Light from the light-emitting chip 210 passes through the second convex surface 315 and enters the air cavity 311. The second convex surface 315 can refract light, thereby increasing the light emission angle. It is worth noting that the side of the first colloid 313 closer to the light-emitting chip 210 can also be provided with a third convex surface 316. The third convex surface 316 can not only avoid interference of the first colloid 313 with the light-emitting chip 210, but also refract light to further achieve a light diffusion effect.
[0047] Preferably, the circumferential outer wall 317 of the second colloid 314 is inclined from the direction of approaching to moving away from the light-emitting chip 210 toward the direction of moving away from the air cavity 311. This arrangement allows light transmitted through the sidewall of the second colloid 314 to be refracted by the circumferential outer wall 317 of the second colloid 314, thereby further expanding the angle of the light.
[0048] In summary, the light transmission path of the light-emitting chip 210 within the dispensing structure 310 is as follows: the light first passes through the third convex surface 316 into the first colloid 313, where it undergoes a first deflection; then it passes through the second convex surface 315 into the air cavity 311, where it undergoes a second deflection; the air cavity 311 further disperses the light passing through it. Specifically, when the circumferential light passing through the second colloid 314 exits the dispensing structure 310 through the circumferential outer wall 317, a third deflection occurs, further increasing the light emission angle; similarly, when the light passing through the side of the second colloid 314 away from the first colloid 313 exits the dispensing structure 310 through the first convex surface 312, it also undergoes deflection.
[0049] Furthermore, the diffusion layer 300 is also provided with a first diffusion plate 320, which is disposed on the side of the dispensing structure 310 away from the back plate 100. By providing the diffusion plate, the diffusion effect of the diffusion layer 300 on light can be further increased.
[0050] It is worth noting that setting the diffusion layer 300 as described above can increase the OD value between the lamp panel 200 and the first diffusion plate 320 by approximately 3mm-4mm, thus achieving a better effect in reducing light shadows. Furthermore, the adhesive used in the first and second adhesive layers can be the same or different adhesives. Atomizing agents can also be added to the adhesives in the first and / or second adhesive layers to further enhance the light dispersion effect.
[0051] The display module employing the aforementioned dispensing structure 310, when the light-emitting chip 210 emits light at an angle within a 120° emission angle, achieves nearly 180° wide-angle white light after multiple refractions and through the krypton gas cavity 311. Furthermore, the light emitted by the light-emitting chip 210 at a 100° angle perpendicular to the backplate is uniformly scattered after passing through the lens of the second colloid 314. Simultaneously, the beam-splitting film and QD film are eliminated, resulting in greater thinness and easier assembly.
[0052] In other embodiments, the dispensing structure 310 can also be configured to seal the entire surface of the lamp panel 200 with adhesive. During the entire surface sealing process, an atomizing agent can be added to the adhesive to reduce the concentration of high-gloss areas and increase the proportion of diffuse reflection, thereby achieving the effect of expanding the light emission angle through the diffusion layer 300.
[0053] Figure 5This is a schematic diagram of the second diffuser plate 330 of another backlight module provided in a specific embodiment of this utility model, as another optional solution for the display module, such as... Figure 4 and Figure 5 As shown, the diffusion layer 300 includes a second diffusion plate 330. On the side of the second diffusion plate 330 near the lamp plate 200, there are corresponding clearance grooves 331 that can cover the light-emitting chips 210. The bottom of the clearance grooves 331 is arc-shaped, and the light from the light-emitting chips 210 enters the second diffusion plate 330 through the arc-shaped bottom. That is, by providing clearance grooves 331 that correspond one-to-one with each light-emitting chip 210 and have arc-shaped bottoms, the clearance grooves 331 can act as lenses, refracting the light emitted by the light-emitting chips 210 when it enters the diffusion plate, thus achieving a diffusion effect. Simultaneously, the diffusion plate itself has a light-diffusing effect, further improving the diffusion of the light emitted by the light-emitting chips 210 and effectively enhancing the overall display effect of the display module. Furthermore, the clearance grooves 331 also effectively improve the thinness and lightness of the display module.
[0054] Furthermore, the diffusion layer 300, in which the second diffusion plate 330 is disposed, also includes a quantum dot film 340, which is disposed on the side of the second diffusion plate 330 away from the back plate 100. The quantum dot film 340, also known as the QD film, can precisely control the wavelength of light through the "size effect" of quantum dots, optimizing the color gamut, brightness, and color reproduction of the display device, so as to further process the light diffused by the second diffusion layer 300 and improve the display effect of the display module.
[0055] For example, the second diffuser plate 330 is configured as follows: Figure 5 As shown, the clearance groove 331 extends in one direction, thus only diffusing light in a direction perpendicular to that direction. In other embodiments, the clearance groove 331 can also be a circular clearance groove 331, in which case the bottom of the circular clearance groove 331 is hemispherical, thus diffusing light in any circumferential direction. Alternatively, the bottom of the clearance groove 331 can be a curved surface, with a smooth transition for more uniform light diffusion; or, the bottom of the clearance groove 331 can be composed of multiple planes joined together, without specific limitations.
[0056] In this embodiment, the functional layer 400 includes a lower diffusion layer 410, a prism layer 420, and a brightness enhancement film 430, which are sequentially disposed from near to away from the diffusion layer 300. The lower diffusion layer 410 homogenizes light, helps optimize the light transmitted through it, and improves light utilization. The prism layer 420 directs dispersed light towards the front viewing angle, significantly improving the brightness and light utilization of the screen front without increasing backlight power consumption, while also optimizing brightness uniformity over the viewing angle. The brightness enhancement film 430 improves screen brightness and optimizes the viewing angle without increasing power consumption.
[0057] Specifically, the prism layer 420 includes two prism sheets 421, which enhances the light-gathering effect. Furthermore, the brightness enhancement film 430 is configured as a reflective polarization-breaking brightness enhancement film 430. The reflective polarization-breaking brightness enhancement film 430 improves light utilization, provides more uniform brightness across the entire viewing angle, and is thinner, approximately 100μm.
[0058] It is worth noting that, in order to further improve the display effect of the display module or to enable the display module to have other display functions, the functional layer 400 can also be provided with other film layer structures, which are not specifically limited here.
[0059] This embodiment also discloses a display device including a backlight module as described in any of the above embodiments. The display device equipped with the aforementioned backlight module offers better display performance, greater thinness and lightness, and lower cost, thereby enhancing its market competitiveness.
[0060] The above description is only a preferred embodiment of this utility model. For those skilled in the art, there will be changes in the specific implementation method and application scope based on the idea of this utility model. The content of this specification should not be construed as a limitation of this utility model.
Claims
1. A backlight module, characterized in that, include: Back panel (100); A light panel (200) is disposed on the back plate (100), and a plurality of light-emitting chips (210) are disposed on the light panel (200); A diffusion layer (300) is disposed on the side of the lamp panel (200) away from the back plate (100). The light from the light-emitting chip (210) can pass through the diffusion layer (300), and the diffusion layer (300) can increase the light emission angle of the light-emitting chip (210). A functional layer (400) is disposed on the side of the diffusion layer (300) away from the back plate (100), and the light from the light-emitting chip (210) can pass through the functional layer (400).
2. The backlight module according to claim 1, characterized in that, The diffusion layer (300) includes a dispensing structure (310) corresponding to the light-emitting chip (210). The dispensing structure (310) has an air cavity (311) inside and a first convex surface (312) at one end away from the light-emitting chip (210). The light from the light-emitting chip (210) can pass through the air cavity (311) and through the first convex surface (312).
3. The backlight module according to claim 2, characterized in that, The dispensing structure (310) includes a first adhesive (313) near the light-emitting chip (210) and a second adhesive (314) covering the first adhesive (313). The air cavity (311) is formed between the second adhesive (314) and the first adhesive (313), and the first convex surface (312) is formed on the side away from the first adhesive (313).
4. The backlight module according to claim 3, characterized in that, The first colloid (313) has a second convex surface (315) protruding toward the air cavity (311) on the side away from the light-emitting chip (210). The light from the light-emitting chip (210) passes through the second convex surface (315) and enters the air cavity (311); and / or, the circumferential outer wall (317) of the second colloid (314) is inclined from the direction close to the light-emitting chip (210) toward the direction away from the air cavity (311).
5. The backlight module according to claim 2, characterized in that, The diffusion layer (300) is further provided with a first diffusion plate (320), which is disposed on the side of the dispensing structure (310) away from the back plate (100).
6. The backlight module according to claim 1, characterized in that, The diffusion layer (300) includes a second diffusion plate (330). The second diffusion plate (330) has a relief groove (331) on the side near the lamp plate (200) that can be correspondingly covered on the light-emitting chip (210). The bottom of the relief groove (331) is arc-shaped, and the light from the light-emitting chip (210) enters the second diffusion plate (330) through the arc-shaped bottom of the groove.
7. The backlight module according to claim 6, characterized in that, The diffusion layer (300) further includes a quantum dot film (340) disposed on the side of the second diffusion plate (330) away from the back plate (100).
8. The backlight module according to any one of claims 1-7, characterized in that, The functional layer (400) includes a lower diffusion layer (410), a prism layer (420), and a brightness enhancement film (430) arranged sequentially from the diffusion layer (300) toward the diffusion layer (300).
9. The backlight module according to claim 8, characterized in that, The prism layer (420) includes two prism sheets (421); and / or, the brightness enhancement film (430) is configured as a reflective anti-polarization brightness enhancement film (430).
10. A display device, characterized in that, Includes the backlight module as described in any one of claims 1-9.