LED carrier board and LED display module

Abstract

The utility model relates to display technical field especially is a kind of LED carrier plate and LED display module, including the first display substrate, middle base plate and second display substrate that are sequentially laminated, first display substrate and second display substrate are insulated by middle base plate setting;The surface of first display substrate away from middle base plate and the surface of second display substrate away from middle base plate are all provided with welding unit;Welding unit on first display substrate is electrically connected with first signal circuit;Welding unit on second display substrate is electrically connected with second signal circuit;Multiple first through holes are set up on plate body;Multiple welding units on first display substrate are connected in series or parallel by first signal circuit;Multiple welding units on second display substrate are connected in series or parallel by second signal circuit.The two display substrates of the utility model can be independently controlled, and the high transparency of LED carrier plate is considered.

Description

Technical Field

[0001] This utility model relates to the field of display technology, and in particular to an LED carrier board and an LED display module. Background Technology

[0002] With technological advancements and economic development, display devices are being used in more and more situations. In some outdoor locations, there is a need for display devices to be both transparent and to display clear and diverse images.

[0003] In existing display technologies, if the transparency of the display device is to be taken into account, most displays can only be displayed on one side. Although there are some double-sided displays on the market, the content they display is usually limited, meaning that only the same image can be displayed on both sides, and it is impossible to achieve separate control over the displayed images or information on both sides of the display.

[0004] Therefore, how to achieve independent control of both sides of the display device while maintaining a high level of transparency is a problem that urgently needs to be solved by those skilled in the art. Utility Model Content

[0005] The purpose of this invention is to provide an LED carrier board and an LED display module to solve the problem that high-transparency double-sided display devices in the prior art cannot control the display content on both sides independently.

[0006] To solve the above-mentioned technical problems, this utility model provides an LED carrier board, including a first display substrate, an intermediate substrate and a second display substrate stacked in sequence, wherein the first display substrate and the second display substrate are insulated from each other through the intermediate substrate;

[0007] Both the surface of the first display substrate away from the intermediate substrate and the surface of the second display substrate away from the intermediate substrate are provided with welding units;

[0008] The first display substrate is provided with a first signal circuit; the welding unit on the first display substrate is electrically connected to the first signal circuit;

[0009] The second display substrate is provided with a second signal circuit; the welding unit on the second display substrate is electrically connected to the second signal circuit;

[0010] The first display substrate, the second display substrate, and the intermediate substrate constitute a plate body, and the plate body is provided with a plurality of first through holes;

[0011] The plurality of welding units on the first display substrate are connected in series or in parallel through the first signal circuit;

[0012] The plurality of welding units on the second display substrate are connected in series or in parallel through the second signal circuit.

[0013] Optionally, in the LED carrier, the intermediate substrate includes a first sub-substrate and a second sub-substrate stacked together.

[0014] The first sub-substrate is disposed in contact with the first display substrate, and the second sub-substrate is disposed in contact with the second display substrate;

[0015] The first sub-substrate and the second sub-substrate are insulated from each other.

[0016] Optionally, in the LED carrier, the first sub-substrate and the second sub-substrate are bonded and fixed by adhesive.

[0017] Optionally, in the LED carrier, the intermediate substrate is a single-layer substrate.

[0018] Optionally, in the LED carrier board, the welding unit includes a power supply pad, a grounding pad, and a signal pad;

[0019] The power supply pad and the grounding pad are electrically connected to the intermediate substrate.

[0020] The signal pads on the first display substrate are electrically connected to the first signal circuit, and the signal pads on the second display substrate are electrically connected to the second signal circuit.

[0021] Optionally, in the LED carrier board, a plurality of the first through holes are arranged in multiple rows and columns on the board body, and the welding unit array is arranged on the surfaces of the first display substrate and the second display substrate, and is located in the area outside the first through holes.

[0022] Optionally, in the LED carrier, each of the welding units is surrounded by at least three of the first through holes;

[0023] Alternatively, the welding unit may be located between two adjacent first through holes.

[0024] Optionally, in the LED carrier board, a plurality of second through holes are provided on the edge of the board body, and two second through holes can be combined to form a first through hole.

[0025] Optionally, the LED carrier also includes a black ink layer;

[0026] The black ink layer covers the sidewalls of the plate.

[0027] An LED display module includes an LED light-emitting unit and an LED carrier board as described above, wherein the LED light-emitting unit is electrically connected to the welding unit.

[0028] The LED carrier board provided by this utility model includes a first display substrate, an intermediate substrate, and a second display substrate stacked sequentially. The first display substrate and the second display substrate are insulated from each other by the intermediate substrate. Welding units are provided on the surfaces of the first display substrate and the second display substrate away from the intermediate substrate. The first display substrate has a first signal circuit. The welding units on the first display substrate are electrically connected to the first signal circuit. The second display substrate has a second signal circuit. The welding units on the second display substrate are electrically connected to the second signal circuit. The first display substrate, the second display substrate, and the intermediate substrate form a board body, and the board body has multiple first through holes. The multiple welding units on the first display substrate are connected in series or parallel through the first signal circuit. The multiple welding units on the second display substrate are connected in series or parallel through the second signal circuit. This invention mounts a first display substrate and a second display substrate on both sides of a central substrate, and defines independent signal circuits on each of the two display substrates. These independent signal circuits are connected in series or parallel to the corresponding soldering units on the display substrates, allowing each substrate to receive its own control signal. This enables the display of different content on the first and second display substrates, achieving independent control of the two substrates. Furthermore, this invention also features a first through-hole occupying most of the substrate area, allowing light to pass through while maintaining high transparency for the LED carrier. This invention also provides an LED display module with the aforementioned beneficial effects. Attached Figure Description

[0029] To more clearly illustrate the technical solutions of the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0030] Figure 1 A schematic diagram of a specific embodiment of the LED carrier provided by this utility model;

[0031] Figure 2 A top view of a specific embodiment of the LED carrier provided by this utility model;

[0032] Figure 3 A top view of another specific embodiment of the LED carrier provided by this utility model;

[0033] Figure 4 A partial engineering structure diagram of the LED carrier plate according to another specific embodiment of the present invention;

[0034] Figure 5 A top view of another specific embodiment of the LED carrier provided by this utility model;

[0035] Figure 6 A schematic diagram of signal transmission in a specific embodiment of the LED carrier provided by this utility model;

[0036] Figure 7 A circuit structure diagram of a specific embodiment of the LED carrier board provided by this utility model;

[0037] Figure 8 A schematic diagram of signal transmission for another specific embodiment of the LED carrier provided by this utility model;

[0038] Figure 9 A schematic diagram of another specific embodiment of the LED carrier provided by this utility model;

[0039] Figure 10 This is a structural schematic diagram of one specific embodiment of the LED display module provided by this utility model.

[0040] Figure label:

[0041] 10-First display substrate; 20-Intermediate substrate; 30-Second display substrate; 40-Welding unit; 50-First through hole; 60-Second through hole; 70-Black ink layer; 11-First signal circuit; 21-First sub-substrate; 22-Second sub-substrate; 80-LED light-emitting unit; 90-LED carrier board; 100-LED display module. Detailed Implementation

[0042] To enable those skilled in the art to better understand the present invention, the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of them. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0043] The core of this utility model is to provide an LED carrier board 90, the structural schematic diagram of one specific embodiment of which is shown below. Figure 1 As shown, this is referred to as Specific Embodiment 1, which includes a first display substrate 10, an intermediate substrate 20 and a second display substrate 30 stacked in sequence, with the first display substrate 10 and the second display substrate 30 being insulated from each other by the intermediate substrate 20;

[0044] Welding units 40 are provided on the surface of the first display substrate 10 away from the intermediate substrate 20 and on the surface of the second display substrate 30 away from the intermediate substrate 20.

[0045] The first display substrate 10 is provided with a first signal circuit 11; the welding unit 40 on the first display substrate 10 is electrically connected to the first signal circuit 11.

[0046] The second display substrate 30 is provided with a second signal circuit; the welding unit 40 on the second display substrate 30 is electrically connected to the second signal circuit.

[0047] The first display substrate 10, the second display substrate 30 and the intermediate substrate 20 form a plate body, and a plurality of first through holes 50 are provided on the plate body;

[0048] Multiple welding units 40 on the first display substrate 10 are connected in series or in parallel through the first signal circuit 11;

[0049] Multiple welding units 40 on the second display substrate 30 are connected in series or in parallel through a second signal circuit.

[0050] Of course, the welding unit 40 is used for subsequent welding of LED light-emitting units.

[0051] As described above, the welding units 40 on the same display substrate can be connected in parallel. The following is a brief description of the case where the welding units 40 on the first display substrate 10 are connected in parallel through the first signal circuit 11, and the welding units 40 on the second display substrate 30 are connected in parallel through the second signal circuit.

[0052] The signal transmission diagram of the welding unit 40 connected in parallel with the signal circuit on the corresponding display substrate is shown in the figure below. Figure 6 As shown, Figure 6 Taking the first display substrate 10 as an example, even if there are some faulty welding units 40, it will not affect the signal transmission on other welding units 40, thus improving the working stability of the LED carrier board 90. Figure 7 The circuit diagram of the LED carrier board 90 after the corresponding LED light-emitting unit 80 (labeled as TX1826 chip in the figure) is provided in this preferred embodiment. D1, D2, and D3 are the LED light-emitting units 80 set on the three sets of welding units 40, DAT is the signal pin connected to the corresponding signal circuit, GND is the ground pin, VDD is the power supply pin, and NC is the empty pin. The control signal sent from the controller reaches the signal pin of the corresponding LED light-emitting unit 80. On the other hand, the 5V DC power (DC5V) provided by the controller is connected to the power supply pin of the corresponding LED light-emitting unit 80 in sequence.

[0053] Of course, the welding unit 40 can also be connected in series through a corresponding signal circuit. Specifically, the welding unit 40 includes a signal pad, which includes a signal input pad and a signal output pad. Multiple welding units 40 on the first display substrate 10 are connected in series through a first signal circuit 11. Multiple welding units 40 on the second display substrate 30 are connected in series through a second signal circuit.

[0054] In this preferred embodiment, each welding unit 40 is provided with corresponding signal input pads and signal output pads, so that the electrical signals in the first signal circuit 11 and the second signal circuit can flow sequentially through each welding unit 40. This greatly simplifies the complexity of the circuit and improves production efficiency. The corresponding signal transmission diagram is shown below. Figure 8 As shown (still taking the first display substrate 10 as an example).

[0055] In one specific embodiment, the intermediate substrate 20 is a single-layer substrate. That is, the intermediate substrate 20, as a single-layer substrate, simultaneously has a power supply circuit that supplies power to the first display substrate 10 and the second display substrate 30 on both sides. Specifically, a power supply circuit and a grounding circuit can be provided on the intermediate substrate 20, simultaneously supplying power to the welding units 40 on the first display substrate 10 and the second display substrate 30; or the intermediate substrate 20 is provided with a grounding circuit, and the first display substrate 10 and the second display substrate 30 are each provided with a power supply circuit; or, the intermediate substrate 20 is provided with a power supply circuit and a grounding circuit, and the first display substrate 10 and the second display substrate 30 are also each provided with a power supply circuit and connected to the power supply circuit on the intermediate substrate 20. This can reduce the total thickness of the LED carrier board 90, reduce the space occupied by the double-sided display screen, and provide more versatility for the LED carrier board 90. Of course, the intermediate substrate 20 can also be a multi-layer board, which will not be elaborated here.

[0056] Furthermore, the welding unit 40 includes a power supply pad, a grounding pad, and a signal pad;

[0057] The power supply pad and the grounding pad are electrically connected to the intermediate substrate 20;

[0058] The signal pads on the first display substrate 10 are electrically connected to the first signal circuit 11, and the signal pads on the second display substrate 30 are electrically connected to the second signal circuit.

[0059] In this specific embodiment, the internal structure of the welding unit 40 is further detailed. Specifically, the welding unit 40 includes a power supply pad, a ground pad, and a signal pad, corresponding to the power supply pin, ground pin, and signal pin of the LED light-emitting unit 80. The power supply pad and ground pad form the power supply circuit for the LED light-emitting unit 80. Since the power is supplied through the intermediate substrate 20, the power supply pad and ground pad need to pass through conductive holes to the corresponding display substrate and connect to the intermediate substrate 20. The signal pad on the first display substrate 10 provides display control signals to the corresponding LED light-emitting unit 80 through the first signal circuit 11, and the signal pad on the second display substrate 30 provides display control signals to the corresponding LED light-emitting unit 80 through the second signal circuit.

[0060] In one specific embodiment, a plurality of first through holes 50 are arranged in multiple rows and columns on the plate body, and welding units 40 are arranged in an array on the surfaces of the first display substrate 10 and the second display substrate 30, and are located in the area outside the first through holes 50.

[0061] This specific embodiment illustrates the arrangement of the first through-holes 50 on the board, specifically in a multi-row, multi-column array. Similarly, the welding units 40 are arranged in an array on the first display substrate 10 and the second display substrate 30. The welding units 40 should be arranged between and surrounded by the first through-holes 50, without overlap. This arrangement of the first through-holes 50 and the welding units 40 allows for the uniform arrangement of the LED light-emitting units 80 to display images. Simultaneously, the uniform arrangement of the light-transmitting first through-holes 50 ensures good light transmittance, i.e., transparency, on the board.

[0062] Furthermore, each welding unit 40 is surrounded by at least three first through holes 50;

[0063] Alternatively, the welding unit 40 is located between two adjacent first through holes 50.

[0064] You can refer to this. Figure 2 and Figure 3 ,in Figure 2 In the case where the welding unit 40 is surrounded by at least three first through holes 50, that is, at least three first through holes 50 are respectively arranged in different directions of the welding unit 40, further improving the uniformity of the distribution of the light-transmitting first through holes 50; Figure 3 The middle section shows the case where the welding unit 40 is located between two adjacent first through holes 50, and... Figure 3 The first through hole 50 is a strip-shaped through hole (or it can be a through hole of other shapes). The welding unit 40 is arranged between two adjacent first through holes 50, thereby reducing the difficulty of production while ensuring high transparency.

[0065] Furthermore, the edge of the plate is provided with multiple second through holes 60, and two second through holes 60 can be combined to form a first through hole 50.

[0066] Please refer to Figure 4 , Figure 4 The diagram shows a partial engineering structure of the board corresponding to this preferred embodiment. It can be seen that numerous semi-holes, or second through holes 60, are provided along the edges of the board. This is to ensure that when multiple LED carrier boards 90 are spliced ​​together to achieve a larger display area, the second through holes 60 on adjacent board edges can be joined to form new first through holes 50, achieving seamless splicing of adjacent boards. This solves the problem of reduced local light transmittance in the display area caused by the lack of openings at the board splicing points. In other words, this specific embodiment significantly improves the transparency and transparency uniformity of the display device spliced ​​with multiple LED carrier boards 90. Specifically, when the board is rectangular, at least one edge can be provided with a second through hole 60, preferably all four edges.

[0067] Furthermore, it also includes a black ink layer 70;

[0068] A layer of black ink 70 covers the sidewalls of the plate.

[0069] You can refer to this. Figure 5 In this specific embodiment, the sidewalls of the board are covered with a black ink layer 70. Specifically, the process of setting the black ink layer 70 on the sidewalls of the board includes printing characters, baking, sandblasting, printing alkali-removing protective ink (FI-PT100), baking, CNC milling of the shape, black holes on the sidewalls, removing strong alkali-resistant ink, and high-pressure water washing. In this preferred embodiment, the black ink layer 70 not only improves the appearance consistency of the board, but also acts as a surface protective layer, preventing water or other dirt from directly contacting the exposed circuits on the sidewalls and causing LED carrier board 90 to malfunction, thus effectively improving the working stability of LED carrier board 90.

[0070] The LED carrier board 90 provided by this utility model includes a first display substrate 10, an intermediate substrate 20, and a second display substrate 30 stacked sequentially. Welding units 40 are provided on the surfaces of the first display substrate 10 and the second display substrate 30 away from the intermediate substrate 20. The first display substrate 10 includes a first signal circuit 11. The welding units 40 on the first display substrate 10 are electrically connected to the first signal circuit 11. The second display substrate 30 includes a second signal circuit. The welding units 40 on the second display substrate 30 are electrically connected to the second signal circuit. The first display substrate 10, the second display substrate 30, and the intermediate substrate 20 form a board body, and a plurality of first through holes 50 are provided on the board body. The plurality of welding units 40 on the first display substrate 10 are connected in series or parallel through the first signal circuit 11. The plurality of welding units 40 on the second display substrate 30 are connected in series or parallel through the second signal circuit. This invention mounts a first display substrate 10 and a second display substrate 30 on both sides of an intermediate substrate 20, and defines independent signal circuits on each of the two display substrates. By connecting the independent signal circuits in series or in parallel with the corresponding welding units 40 on the display substrates, the first display substrate 10 and the second display substrate 30 can receive corresponding control signals independently, so as to display different content on the first display substrate 10 and the second display substrate 30 and realize independent control of the two display substrates. In addition, this invention also opens a first through hole 50 occupying most of the area of ​​the board to allow light to pass through, thereby ensuring the high transparency of the LED carrier board 90.

[0071] Based on the first embodiment, the intermediate substrate 20 is further improved to obtain the second embodiment, and the corresponding structural diagram is shown below. Figure 9 As shown, it includes a first display substrate 10, an intermediate substrate 20 and a second display substrate 30 stacked in sequence, with the first display substrate 10 and the second display substrate 30 being insulated from each other by the intermediate substrate 20;

[0072] Welding units 40 are provided on the surface of the first display substrate 10 away from the intermediate substrate 20 and the surface of the second display substrate 30 away from the intermediate substrate 20. The welding units 40 are used to electrically connect the LED light-emitting units 80.

[0073] The first display substrate 10 is provided with a first signal circuit 11; the welding unit 40 on the first display substrate 10 is electrically connected to the first signal circuit 11.

[0074] The second display substrate 30 is provided with a second signal circuit; the welding unit 40 on the second display substrate 30 is electrically connected to the second signal circuit.

[0075] The first display substrate 10, the second display substrate 30 and the intermediate substrate 20 form a plate body, and a plurality of first through holes 50 are provided on the plate body;

[0076] The intermediate substrate 20 includes a first sub-substrate 21 and a second sub-substrate 22 stacked together;

[0077] The first sub-substrate 21 is in contact with the first display substrate 10, and the second sub-substrate 22 is in contact with the second display substrate 30;

[0078] The first sub-substrate 21 and the second sub-substrate 22 are insulated from each other;

[0079] Multiple welding units 40 on the first display substrate 10 are connected in series or in parallel through the first signal circuit 11;

[0080] Multiple welding units 40 on the second display substrate 30 are connected in series or in parallel through a second signal circuit.

[0081] Furthermore, the welding unit 40 includes a power supply pad, a grounding pad, and a signal pad;

[0082] A first power supply circuit is provided on the first display substrate 10 and / or the first sub-substrate 21 (for example, the first display substrate is provided with a first power supply circuit, or the first sub-substrate is provided with a first power supply circuit, or both the first display substrate and the first sub-substrate are provided with a first power supply circuit and are electrically connected). The first sub-substrate 21 is provided with a first grounding circuit. The power supply pads on the first display substrate 10 are electrically connected to the first power supply circuit. The grounding pads on the first display substrate 10 are electrically connected to the first grounding circuit. The signal pads on the first display substrate 10 are electrically connected to the first signal circuit.

[0083] The second display substrate 30 and / or the second sub-substrate 22 are provided with a second power supply circuit (for example, the second display substrate is provided with a second power supply circuit; or the second sub-substrate is provided with a second power supply circuit; or both the second display substrate and the second sub-substrate are provided with a second power supply circuit and are electrically connected). The second sub-substrate 22 is provided with a second grounding circuit. The power supply pads on the second display substrate 30 are electrically connected to the second power supply circuit. The grounding pads on the second display substrate 30 are electrically connected to the second grounding circuit. The signal pads on the second display substrate 30 are electrically connected to the second signal circuit.

[0084] The difference between this specific embodiment and the above specific embodiment is that the intermediate substrate 20 is divided into two sub-substrates in this specific embodiment. The rest of the structure is the same as the above specific embodiment, and will not be described in detail here.

[0085] Please refer to Figure 9In this specific embodiment, the intermediate substrate 20 is divided into a first sub-substrate 21 that supplies power to the first display substrate 10 and a second sub-substrate 22 that supplies power to the second display substrate 30. That is, the first display substrate 10 and the second display substrate 30 not only receive control signals independently, but also have independent power supplies. This enables the LED carrier board 90 to display on one side or on both sides simultaneously. The two sides can display different images or the same image, further enhancing the display diversity of the LED carrier board 90, thus broadening the application scenarios and increasing the versatility of this utility model.

[0086] Furthermore, the first sub-substrate 21 and the second sub-substrate 22 are bonded and fixed together by adhesive. Using adhesive to fix the first sub-substrate 21 and the second sub-substrate 22 has high fixing efficiency and low production cost. Moreover, most adhesives are themselves insulators, which can easily achieve insulation between the first sub-substrate 21 and the second sub-substrate 22, greatly simplifying the production process.

[0087] like Figure 10 As shown, this utility model also provides an LED display module 100, including an LED light-emitting unit 80 and an LED carrier board 90 of any of the above types. The LED light-emitting unit 80 is electrically connected to the welding unit 40. Figure 10 In the image, the entire LED display module 100 is outlined by a dashed frame.

[0088] The LED light-emitting unit 80 can be an LED light-emitting chip, or it can be an LED lamp bead formed by integrating and packaging LED light-emitting chips of three light-emitting colors: red, green, and blue. Of course, the driver chip that sends the driving signal to the LED light-emitting unit 80 can be integrated into the LED lamp bead or set separately. This utility model does not limit this.

[0089] The LED carrier board 90 provided by this utility model includes a first display substrate 10, an intermediate substrate 20, and a second display substrate 30 stacked sequentially. Welding units 40 are provided on the surfaces of the first display substrate 10 and the second display substrate 30 away from the intermediate substrate 20. The first display substrate 10 includes a first signal circuit 11. The welding units 40 on the first display substrate 10 are electrically connected to the first signal circuit 11. The second display substrate 30 includes a second signal circuit. The welding units 40 on the second display substrate 30 are electrically connected to the second signal circuit. The first display substrate 10, the second display substrate 30, and the intermediate substrate 20 form a board body, and a plurality of first through holes 50 are provided on the board body. The plurality of welding units 40 on the first display substrate 10 are connected in series or parallel through the first signal circuit 11. The plurality of welding units 40 on the second display substrate 30 are connected in series or parallel through the second signal circuit. This invention mounts a first display substrate 10 and a second display substrate 30 on both sides of an intermediate substrate 20, and defines independent signal circuits on each of the two display substrates. By connecting the independent signal circuits in series or in parallel with the corresponding welding units 40 on the display substrates, the first display substrate 10 and the second display substrate 30 can receive corresponding control signals independently, so as to display different content on the first display substrate 10 and the second display substrate 30 and realize independent control of the two display substrates. In addition, this invention also opens a first through hole 50 occupying most of the area of ​​the board to allow light to pass through, thereby ensuring the high transparency of the LED carrier board 90.

[0090] The various embodiments in this specification are described in a progressive manner, with each embodiment focusing on its differences from other embodiments. Similar or identical parts between embodiments can be referred to interchangeably. For the apparatus disclosed in the embodiments, since it corresponds to the method disclosed in the embodiments, the description is relatively simple; relevant parts can be referred to in the method section.

[0091] It should be noted that in this specification, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0092] The LED carrier board and LED display module provided by this utility model have been described in detail above. Specific examples have been used to illustrate the principles and implementation methods of this utility model. The descriptions of the above embodiments are only for the purpose of helping to understand the method and core ideas of this utility model. It should be noted that for those skilled in the art, several improvements and modifications can be made to this utility model without departing from the principles of this utility model, and these improvements and modifications also fall within the protection scope of this utility model.

Claims

1. An LED carrier board, characterized in that, It includes a first display substrate, an intermediate substrate, and a second display substrate stacked sequentially, wherein the first display substrate and the second display substrate are insulated from each other by the intermediate substrate; Both the surface of the first display substrate away from the intermediate substrate and the surface of the second display substrate away from the intermediate substrate are provided with welding units; The first display substrate is provided with a first signal circuit; the welding unit on the first display substrate is electrically connected to the first signal circuit; The second display substrate is provided with a second signal circuit; the welding unit on the second display substrate is electrically connected to the second signal circuit; The first display substrate, the second display substrate, and the intermediate substrate constitute a plate body, and the plate body is provided with a plurality of first through holes; The plurality of welding units on the first display substrate are connected in series or in parallel through the first signal circuit; The plurality of welding units on the second display substrate are connected in series or in parallel through the second signal circuit.

2. The LED carrier board as described in claim 1, characterized in that, The intermediate substrate includes a first sub-substrate and a second sub-substrate stacked together. The first sub-substrate is disposed in contact with the first display substrate, and the second sub-substrate is disposed in contact with the second display substrate; The first sub-substrate and the second sub-substrate are insulated from each other.

3. The LED carrier board as described in claim 2, characterized in that, The first sub-substrate and the second sub-substrate are bonded and fixed together by adhesive.

4. The LED carrier board as described in claim 1, characterized in that, The intermediate substrate is a single-layer substrate.

5. The LED carrier board as described in claim 1, characterized in that, The welding unit includes a power supply pad, a grounding pad, and a signal pad; The power supply pad and the grounding pad are electrically connected to the intermediate substrate. The signal pads on the first display substrate are electrically connected to the first signal circuit, and the signal pads on the second display substrate are electrically connected to the second signal circuit.

6. The LED carrier board as described in claim 1, characterized in that, Multiple first through holes are arranged in multiple rows and columns on the plate body, and the welding unit array is arranged on the surface of the first display substrate and the second display substrate, and is located in the area outside the first through holes.

7. The LED carrier board as described in claim 6, characterized in that, Each of the welding units is surrounded by at least three of the first through holes; Alternatively, the welding unit may be located between two adjacent first through holes.

8. The LED carrier board as described in claim 7, characterized in that, The edge of the plate has multiple second through holes, and two second through holes can be joined together to form a first through hole.

9. The LED carrier board according to any one of claims 1 to 8, characterized in that, It also includes a black ink layer; The black ink layer covers the sidewalls of the plate.

10. An LED display module, characterized in that, It includes an LED light-emitting unit and an LED carrier as described in any one of claims 1 to 9, wherein the LED light-emitting unit is electrically connected to the welding unit.

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