Conductive adhesive film and electronic product

Abstract

The application relates to the field of electronic products, and discloses a conductive adhesive film and an electronic product. The conductive adhesive film comprises an insulating substrate, conductive columns, an elastic conductive piece and an elastic insulating layer. The conductive columns are provided in the insulating substrate in multiple numbers, and the conductive columns are arranged in extension along a first direction. The elastic conductive piece is embedded in the conductive columns along the first direction, and the two ends of the elastic conductive piece are flush with the two ends of the conductive columns. The elastic insulating layer is arranged on one side of the insulating substrate along the first direction. The elastic conductive piece is embedded in the conductive columns, the elastic support of the elastic conductive piece is utilized, the upright state and structural integrity of the conductive columns are maintained in the hot-pressing process, the conductive columns are prevented from being laterally bent, twisted or end collapsed, the two ends of the conductive columns are ensured to form close and stable physical contact with electrodes, the contact resistance is effectively reduced, and the connection reliability and product life are improved.

Description

Technical Field

[0001] This application relates to the field of electronic products, and more particularly to a conductive adhesive film and an electronic product. Background Technology

[0002] Anisotropic conductive films are key interconnect materials for achieving vertical conduction and lateral insulation between electronic components. Traditional methods typically disperse a large number of micron-sized conductive particles within an insulating colloid, using hot pressing to create conductive paths between electrodes. However, this method relies on randomly distributed particles forming point contact pathways under pressure; the conductive path is essentially a fragile "particle contact chain," its mechanical stability depending primarily on the encapsulation and binding of the cured colloid. During actual hot pressing, the colloid softens under heat and pressure, and uneven pressure transmission easily leads to lateral bending, overall twisting, and other deformation instability of the formed conductive path. More seriously, at the contact area between the conductive path and the electrode, localized pressure concentration or plastic deformation of the material can cause structural collapse and indentation, preventing the conductive channel from maintaining a tight and stable physical contact with the electrode. This results in a sudden increase in contact resistance or even complete circuit breakage, severely impacting connection reliability and product lifespan. Utility Model Content

[0003] In view of this, the purpose of this application is to overcome the shortcomings of the prior art and provide a conductive adhesive film and electronic product.

[0004] To achieve the above objectives, the technical solution adopted in this application is as follows: This application provides: A conductive adhesive film having a first orientation includes: Insulating substrate; A conductive post, wherein there are multiple conductive posts disposed within the insulating substrate, and the conductive posts extend along the first direction; An elastic conductive element is embedded in the conductive post along the first direction, and the two ends of the elastic conductive element are flush with the two ends of the conductive post. An elastic insulating layer is disposed on one side of the insulating substrate along the first direction.

[0005] Furthermore, the conductive column includes a filler and a conductive material, the conductive material being embedded within the filler, and the conductive material forming a conductive path along the first direction.

[0006] Furthermore, one end of the conductive post along the first direction is flush with the side of the elastic insulating layer that is away from the insulating substrate.

[0007] Furthermore, one end of the conductive post opposite to the elastic insulating layer protrudes from the side of the insulating substrate opposite to the elastic insulating layer.

[0008] Furthermore, the elastic conductive element includes a conductive substrate and a conductive layer, wherein the conductive layer is disposed on the peripheral surface of the conductive substrate.

[0009] Furthermore, the elastic conductive element extends in a spiral shape along the first direction.

[0010] Furthermore, the conductive substrate has a circular or rectangular cross-section.

[0011] Furthermore, the conductive substrate includes a plurality of first bends and a plurality of second bends, the first bends and the second bends being connected sequentially along the first direction, and the first bends being inclined relative to the second bends.

[0012] Furthermore, the first bend and the second bend are connected by an arc transition.

[0013] This application also provides an electronic product, which includes the conductive adhesive film described in any one of the above-mentioned methods.

[0014] This application incorporates an elastic conductive element within the conductive pillar. The elastic support of this element maintains the pillar's upright position and structural integrity during hot pressing, preventing lateral bending, twisting, or end collapse. This ensures a tight and stable physical contact between the conductive pillar's ends and the electrodes, effectively reducing contact resistance and improving connection reliability and product lifespan. Simultaneously, the elastic insulating layer buffers external pressure, protecting the chip from damage.

[0015] To make the above-mentioned objectives, features and advantages of this application more apparent and understandable, preferred embodiments are described below in detail with reference to the accompanying drawings. Attached Figure Description

[0016] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 A cross-sectional schematic diagram of the conductive adhesive film of this application is shown; Figure 2 A cross-sectional schematic diagram of the conductive pillar of this application is shown; Figure 3 A cross-sectional view of the conductive pillar according to another embodiment of this application is shown; Figure 4 This shows a cross-sectional view of the conductive substrate of this application with a circular cross-section; Figure 5 This shows a cross-sectional view of the conductive substrate of this application in a rectangular state; Figure 6 This invention presents a schematic diagram of the structure under acute-angle transition conditions between the first and second bends. Figure 7 This diagram shows a state where the first and second bends of this application undergo an arc transition.

[0018] Explanation of key component symbols: 100 - Insulating substrate; 200 - Conductive pillar; 210 - Filler; 220 - Conductive material; 300 - Elastic conductive element; 310 - Conductive substrate; 311 - First bending portion; 312 - Second bending portion; 320 - Conductive layer; 400 - Elastic insulating layer; Z - First direction. Detailed Implementation

[0019] The embodiments of this application are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application.

[0020] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0021] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0022] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0023] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0024] Conductive adhesive films are mainly used for the connection between chips and circuit boards to achieve the transmission of data or electrical signals. The existing conductive adhesive film production process requires hot pressing, which may cause the conductive channel (conductive post 200) to tilt, thus failing to conduct electricity well, resulting in poor contact and affecting product quality. Therefore, this application provides a conductive adhesive film to solve the above problems.

[0025] This application provides a conductive adhesive film with a first direction Z, which is the thickness direction of the conductive adhesive film. Specifically, the conductive adhesive film includes an insulating substrate 100, conductive pillars 200, elastic conductive elements 300, and an elastic insulating layer 400. Further, there are multiple conductive pillars 200 disposed within the insulating substrate 100. The conductive pillars 200 extend along the first direction Z. The elastic conductive elements 300 are embedded within the conductive pillars 200 along the first direction Z. The two ends of the elastic conductive elements 300 are flush with the two ends of the conductive pillars 200. The elastic insulating layer 400 is disposed on one side of the insulating substrate 100 along the first direction.

[0026] In this embodiment, the conductive adhesive film has not only a thickness direction, but also a width and a length direction. It can be understood that the width and length of the conductive adhesive film are adaptively adjusted according to the size of the chip.

[0027] Please see Figure 1As shown, multiple conductive pillars 200 are disposed inside the insulating substrate 100. Specifically, the multiple conductive pillars 200 are spaced apart along the width and length directions of the insulating substrate 100, and the positions of the conductive pillars 200 correspond one-to-one with the contacts of the chip and the circuit board, so that the contacts of the chip and the contacts of the circuit board are electrically connected through the conductive pillars 200 to realize the transmission of electrical signals and data.

[0028] Please continue reading Figure 1 As shown, an elastic conductive element 300 is embedded inside the conductive post 200, meaning the entire elastic conductive element 300 is located inside the conductive post 200, so that the conductive post 200 covers the entire elastic conductive element 300. During the hot pressing process of the entire conductive film, the conductive post 200 and the elastic conductive element 300 are subjected to compressive force in the thickness direction. Since the conductive post 200 is provided with a stable frame by the elastic conductive element 300, it is not easy to tilt when compressed, ensuring the stability of the position of the conductive post 200. This prevents the contact with the circuit board or chip contacts from being unable to make contact or only partially contacting due to displacement, resulting in poor contact and failure to connect the chip and the circuit board.

[0029] It is understandable that, since the elastic conductive element 300 has a certain degree of elasticity, when the elastic conductive element 300 is subjected to downward pressure, the elastic conductive element 300 will contract so that both ends of the elastic conductive element 300 are flush with both ends of the conductive post 200. Specifically, the upper end of the elastic conductive element 300 is flush with the upper end of the conductive post 200, and the lower end of the elastic conductive element 300 is flush with the lower end of the conductive post 200. Furthermore, the elastic conductive element 300 itself is conductive.

[0030] In this embodiment, the conductivity of the elastic conductive element 300 is greater than that of the conductive post 200. When the two ends of the conductive post 200 are in contact with the contacts of the circuit board and the contacts of the chip respectively, the elastic conductive element 300 will also be in contact with the contacts of the circuit board and the chip, thereby greatly improving the conductivity of the conductive adhesive film and making the electrical connection between the circuit board and the chip more stable.

[0031] In this embodiment, the insulating substrate 100 is an insulating material that provides a carrier for the conductive pillar 200 and the elastic conductive element 300, and provides insulation between two adjacent conductive pillars 200.

[0032] For example, the insulating substrate 100 may be an insulating material such as elastic silicone rubber or epoxy resin.

[0033] In this embodiment, an elastic insulating layer 400 is provided on the upper surface of the insulating substrate 100. The upper end of the conductive post 200 is connected to the contact of the chip. The elastic insulating layer 400 has a certain elasticity. During the chip test pressure process, the elastic insulating layer 400 can absorb the pressure to prevent the chip from being damaged due to excessive force.

[0034] For example, the elastic insulating layer 400 is made of polyimide, which can withstand a certain degree of deformation to meet the needs of chip testing.

[0035] In some embodiments, the conductive post 200 includes a filler 210 and a conductive material 220, wherein the conductive material 220 is embedded in the filler 210 and forms a conductive path along a first direction Z.

[0036] Please see Figure 2 and Figure 3 As shown, in this embodiment, the filler 210 and the insulating substrate 100 are made of the same material, which is epoxy resin, for example. In the molding of the conductive pillar 200, the conductive material 220 needs to be mixed in the liquid epoxy resin. The conductive material 220 is a metal that can conduct electricity, and the metal can be magnetized or has magnetic properties, so that the conductive pillar 200 can be arranged along the thickness direction to form a conductive chain under a magnetic field or electric field to achieve the function of electrical conduction. The elastic conductive element 300 is also oriented along the thickness direction in the magnetic field or electric field. At this time, the elastic conductive element 300 is oriented and located in the filler 210 under the magnetic field or electric field. Then, it is cured by hot pressing. At this time, the conductive material 220 and the filler 210 are combined to form the conductive pillar 200 located in the insulating substrate 100.

[0037] For example, the conductive material 220 can be magnetic sheet-like or fibrous nickel powder.

[0038] In some embodiments, one end of the conductive post 200 along the first direction Z is flush with the side of the elastic insulating layer 400 away from the insulating substrate 100, and the other end of the conductive post 200 away from the elastic insulating layer 400 protrudes from the side of the insulating substrate 100 away from the elastic insulating layer 400.

[0039] Please continue reading. Figure 1 As shown, in order to ensure that the conductive post 200 makes full contact with the contacts of the circuit board and the chip, the conductive post 200 protrudes from the bottom surface of the insulating substrate 100. This prevents poor contact between the conductive post 200 and the contacts of the circuit board due to the concavity. It can be understood that since the elastic insulating layer 400 can undergo a certain deformation, if the chip is pressed down, the elastic insulating layer 400 will be deformed under pressure, thereby ensuring that the upper end of the conductive post 200 makes full contact with the contacts of the chip and ensuring the stability of the connection.

[0040] In some embodiments, the elastic conductive element 300 includes a conductive substrate 310 and a conductive layer 320, wherein the conductive layer 320 is disposed on the peripheral surface of the conductive substrate 310.

[0041] Please continue reading. Figure 4 and Figure 5As shown, the conductive substrate 310 is the skeleton of the entire elastic conductive element 300, mainly used to provide elastic force when compressed and contracted. Since the elastic conductive element 300 needs to be arranged along the thickness direction of the conductive film in a magnetic field or electric field, a layer of nickel powder can be set on the outer peripheral surface of the conductive substrate 310 so that the elastic conductive element 300 can be oriented in a magnetic field or electric field. In order to ensure that the elastic conductive element 300 has excellent conductivity, a conductive layer 320 is set on the outer surface of the conductive substrate 310. It can be understood that the conductivity of the conductive layer 320 is greater than that of the conductive substrate 310.

[0042] For example, the conductive layer 320 can be made of gold, that is, a layer of gold can be electroplated on the outer peripheral surface of the conductive substrate 310 to ensure that the elastic conductive component 300 has excellent conductivity.

[0043] For example, the conductive substrate 310 is a beryllium copper alloy, which has excellent elasticity and conductivity to meet the elasticity and conductivity requirements of the entire elastic conductive component 300.

[0044] In some embodiments, the elastic conductive element 300 extends in a spiral shape along the first direction Z.

[0045] Please see Figure 1 and Figure 2 As shown, in order to enable the elastic conductive element 300 to have a certain elasticity, the elastic conductive element 300 is set in a spiral shape. Specifically, the elastic conductive element 300 is spring-shaped and extends along the thickness direction of the conductive film to meet the requirements of resisting compressive deformation and preventing the conductive column 200 from tilting.

[0046] In some embodiments, the conductive substrate 310 has a circular or rectangular cross-section.

[0047] Please see Figure 4 and Figure 5 As shown, the cross-sectional shape of the conductive substrate 310 can be circular or rectangular. Correspondingly, the shape of the conductive layer 320 located on the outer periphery of the conductive substrate 310 is also circular or rectangular, thus adapting to the shape of the conductive substrate 310.

[0048] In this embodiment, when the elastic conductive element 300 is in the shape of a spring, the cross-sectional shape of the conductive substrate 310 is circular.

[0049] In another embodiment, the conductive substrate 310 includes a plurality of first bending portions 311 and a plurality of second bending portions 312, the first bending portions 311 and the second bending portions 312 being connected sequentially along a first direction Z, and the first bending portions 311 being inclined relative to the second bending portions 312.

[0050] Please see Figure 6As shown, the conductive substrate 310 comprises a first bent portion 311 and a second bent portion 312 connected to each other. Specifically, the first bent portion 311 and the second bent portion 312 are integrally formed and extend along the thickness direction of the conductive adhesive film. In order to meet the requirement that the conductive substrate 310 deforms under pressure, the second bent portion 312 is inclined relative to the first bent portion 311. It can be understood that when the conductive substrate 310 is compressed, the first bent portion 311 and the second bent portion 312 will deform along the first direction Z and move closer to each other.

[0051] Please see Figure 6 As shown, there is an acute angle transition between the first bending portion 311 and the second bending portion 312. When the cross-section of the conductive substrate 310 is circular, the conductive substrate 310 as a whole is a sawtooth-shaped metal strip; when the cross-section of the conductive substrate 310 is rectangular, the conductive substrate 310 as a whole is a sawtooth-shaped spring piece.

[0052] In some embodiments, the first bend 311 and the second bend 312 are connected by an arc transition.

[0053] Please see Figure 7 As shown, in order to prevent breakage at the connection between the first bend 311 and the second bend 312 when the conductive substrate 310 is under pressure, the connection between the first bend 311 and the second bend 312 is made with an arc transition, thereby preventing stress concentration at the first bend 311 and the second bend 312 and thus preventing breakage.

[0054] This application also provides an electronic product, which includes the conductive adhesive film of any of the above embodiments, and the electronic product also includes a circuit board and a chip. The conductive adhesive film is located between the circuit board and the chip. The connection contacts of the circuit board and the connection contacts of the chip are all connected to the conductive post 200 and are arranged in a one-to-one correspondence.

[0055] It is understandable that, since the electronic product includes a conductive adhesive film, the product possesses all the technical effects of a conductive adhesive film.

[0056] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0057] Although embodiments of this application have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting this application. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of this application.

Claims

1. A conductive adhesive film having a first direction (Z), characterized in that, include: Insulating substrate (100); A plurality of conductive posts (200) are disposed within the insulating substrate (100), and the conductive posts (200) extend along the first direction (Z). An elastic conductive element (300) is embedded in the conductive post (200) along the first direction (Z), and the two ends of the elastic conductive element (300) are flush with the two ends of the conductive post (200). An elastic insulating layer (400) is disposed on one side of the insulating substrate (100) along the first direction (Z).

2. The conductive adhesive film according to claim 1, characterized in that, The conductive post (200) includes a filler (210) and a conductive material (220). The conductive material (220) is embedded in the filler (210) and forms a conductive path along the first direction (Z).

3. The conductive adhesive film according to claim 1, characterized in that, One end of the conductive post (200) along the first direction (Z) is flush with the side of the elastic insulating layer (400) away from the insulating substrate (100).

4. The conductive adhesive film according to claim 1, characterized in that, The conductive post (200) protrudes from the side of the elastic insulating layer (400) away from the insulating substrate (100) away from the elastic insulating layer (400).

5. The conductive adhesive film according to claim 1, characterized in that, The elastic conductive element (300) includes a conductive substrate (310) and a conductive layer (320), wherein the conductive layer (320) is disposed on the peripheral surface of the conductive substrate (310).

6. The conductive adhesive film according to claim 1, characterized in that, The elastic conductive element (300) extends in a spiral shape along the first direction (Z).

7. The conductive adhesive film according to claim 5, characterized in that, The conductive substrate (310) has a circular or rectangular cross-section.

8. The conductive adhesive film according to claim 5, characterized in that, The conductive substrate (310) includes a plurality of first bends (311) and a plurality of second bends (312), the first bends (311) and the second bends (312) are connected sequentially along the first direction (Z), and the first bends (311) are inclined relative to the second bends (312).

9. The conductive adhesive film according to claim 8, characterized in that, The first bend (311) and the second bend (312) are connected by an arc transition.

10. An electronic product, characterized in that, The conductive adhesive film included in any one of claims 1 to 9.

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