Pinless transformer and electronic device

Abstract

The application relates to the technical field of communication, in particular to a pinless transformer and electronic equipment. The pinless transformer comprises a shell, a coil assembly, a plurality of substrates and a plurality of tin balls. The shell is internally provided with a mounting groove and a plurality of clamping grooves, and each clamping groove is arranged at the periphery of the mounting groove in a spaced manner. The coil body and a plurality of lead wires connected with the coil body, the coil body is located in the mounting groove, and the lead wires extend from the mounting groove to the clamping grooves. Each substrate is clamped in a clamping groove. One end of each tin ball is welded to a substrate and a lead wire, and the other end of each tin ball is exposed to the clamping groove. The pinless transformer of the application is provided with a plurality of clamping grooves in the shell, so that the substrate is clamped in the clamping groove, the tin ball is welded between the substrate and the lead wire, the pinless transformer is connected with the external PCB through the tin ball, the pinless design of the transformer is realized, and the PCB space is reasonably utilized, and the pin positioning degree and flatness are ensured.

Description

Technical Field

[0001] This application relates to the field of communication technology, and more particularly to a leadless transformer and electronic device. Background Technology

[0002] Transformers are mainly used in various wired and wireless network equipment, such as Ethernet equipment (routers, switches, network cards, etc.), fiber optic communication equipment (including SFP modules and fiber optic transceivers), industrial Ethernet equipment, wireless communication infrastructure (including base stations and radio frequency equipment), and power line communication (PLC) systems.

[0003] In conventional technologies, the pin structures of network transformers are mainly divided into two types: SMD (Surface Mount Device) and DIP (Dual In-line Package). SMD pin design has strict requirements for pin alignment and flatness, but metal pins are prone to deformation, requiring special protective measures at each stage of the manufacturing process to ensure that pin alignment and flatness meet standards. Furthermore, the extended metal pins of SMD devices affect the product width, making them unsuitable for the miniaturization design of RJ45 connectors. Pin packaging also requires through-hole soldering, which results in larger solder pads and occupies more PCB layout space. Utility Model Content

[0004] This application provides a leadless transformer and electronic device to solve the problems of easy deformation of leads, difficulty in ensuring the correctness and flatness of leads, and the space occupied by lead packages on PCB layout in conventional technologies.

[0005] In a first aspect, embodiments of this application provide a leadless transformer, comprising: The housing has an internal mounting groove and a plurality of snap-fit ​​grooves, with each snap-fit ​​groove spaced apart around the periphery of the mounting groove; A coil assembly, comprising a coil body and a plurality of leads connected to the coil body, the coil body being located within the mounting groove, and the leads extending from the mounting groove to the snap-fit ​​groove; Multiple substrates, each of which has a snap-fit ​​limit located in a snap-fit ​​groove; Multiple solder balls, one end of each solder ball is soldered to a substrate and a lead wire, and the other end of each solder ball is exposed in the snap-fit ​​groove.

[0006] Optionally, each of the substrates has a snap-fit ​​section and a connecting section, the snap-fit ​​section and the connecting section being arranged at an angle, the snap-fit ​​section being snapped into the snap-fit ​​groove, and the connecting section being parallel to the periphery of the groove opening of the mounting groove.

[0007] Optionally, each of the snap-fit ​​grooves has a snap-fit ​​protrusion on its inner wall, the snap-fit ​​protrusion being located at the end away from the connecting section, and the snap-fit ​​section having a contraction section at the end away from the connecting section, the contraction section abutting against the snap-fit ​​protrusion.

[0008] Optionally, each of the substrates has a connecting chamfer that connects the snap-fit ​​segment and the connecting segment.

[0009] Optionally, the snap-fit ​​section has a protruding limiting part, which abuts against the inner sidewall of the snap-fit ​​groove.

[0010] Optionally, the ends of all the solder balls furthest from the substrate are located on the same plane, and the plane is parallel to the periphery of the slot opening of the mounting groove.

[0011] Optionally, the housing is further provided with a plurality of connecting slots, each connecting slot being connected to the mounting slot and a snap-fit ​​slot, and each lead wire passing through a connecting slot.

[0012] Optionally, in the direction from the mounting groove to the snap-fit ​​groove, the distance between the bottom of the connecting groove and the opening of the connecting groove gradually decreases.

[0013] Optionally, the housing has a protruding abutment portion for abutting against the PCB board.

[0014] Secondly, embodiments of this application provide an electronic device, including a PCB board and a leadless transformer provided in the first aspect of this application, wherein the PCB board is soldered to all of the solder balls.

[0015] The technical solutions provided in this application have the following advantages compared with the prior art: The leadless transformer of this application has a mounting slot and multiple snap-fit ​​slots within its housing, with each snap-fit ​​slot spaced apart around the periphery of the mounting slot. The coil assembly includes a coil body and multiple leads connected to the coil body. The coil body is located within the mounting slot, and the leads extend from the mounting slot to the snap-fit ​​slots. Multiple substrates are snap-fitted into each snap-fit ​​slot. A soldering process is used to solder one end of each solder ball to each substrate and its corresponding lead, ensuring that the other end of each solder ball is exposed within the snap-fit ​​slot. This leadless transformer, by employing solder ball soldering technology, eliminates the alignment deviation problem of traditional lead structures, significantly improving product yield. Solder ball soldering provides excellent electrical connection performance and mechanical fixing strength, greatly improving soldering reliability and meeting the stringent reliability requirements of the networking industry. The leadless design reduces the transformer's volume by 30% compared to traditional structures, greatly satisfying the demands of modern communication equipment for high-density integration and miniaturization. For example, within an RJ45 (Registered Jack 45) network connector, this miniaturized design effectively saves space and enables a more compact layout. Attached Figure Description

[0016] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application.

[0017] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, for those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] One or more embodiments are illustrated by way of example with reference numerals in the accompanying drawings. These illustrations do not constitute a limitation on the embodiments. Elements with the same reference numerals in the drawings are denoted as similar elements. Unless otherwise stated, the figures in the drawings are not to be limited by scale.

[0019] Figure 1 This is a schematic diagram of a leadless transformer provided in an embodiment of this application; Figure 2 This is a schematic diagram of the structure of the substrate provided in the embodiments of this application; Figure 3 This is a schematic diagram of the structure of the shell provided in an embodiment of this application; Figure 4 for Figure 3 Enlarged view at point A; Figure 5 for Figure 3 A schematic diagram of a partial cross-sectional structure in the BB direction; Figure 6 This is a partial cross-sectional view of the PCB board and the leadless transformer.

[0020] Explanation of reference numerals in the attached figures: 1. Housing; 1a. Mounting groove; 1b. Snap-fit ​​groove; 1c. Connecting groove; 11. Snap-fit ​​protrusion; 12. Abutment part; 2. Coil assembly; 21. Coil body; 22. Lead wire; 3. Substrate; 31. Snap-fit ​​section; 32. Connecting section; 33. Shrinking section; 34. Connecting chamfer; 311. Limiting part; 4. Tin ball; 5. PCB board. Detailed Implementation

[0021] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0022] The following disclosure provides numerous different embodiments or examples for implementing various structures of this application. To simplify the disclosure, specific examples of components and arrangements are described below. These are merely examples and are not intended to limit the scope of this application. Furthermore, reference numerals and / or letters may be repeated in different examples. Such repetition is for simplification and clarity and does not in itself indicate a relationship between the various embodiments and / or arrangements discussed.

[0023] For ease of description, spatial relative terms may be used in the text to describe the relative position or movement of one element or feature relative to another element or feature, as shown in the figure. These relative terms include, for example, "inside," "outside," "middle," "outer," "below," "below," "above," "front," "back," etc. Such spatial relative terms are intended to include different orientations of the device in use or operation, other than those depicted in the figure. For example, if the device in the figure undergoes a positional flip, orientation change, or change of motion, these directional indications will change accordingly. For instance, an element described as "below other elements or features" or "below other elements or features" will subsequently be oriented "above other elements or features" or "above other elements or features." Therefore, the example term "below" can include both upper and lower orientations. The device may be otherwise oriented (rotated 90 degrees or in other directions), and the spatial relative descriptors used in the text will be interpreted accordingly.

[0024] To address the issues of easy pin deformation, difficulty in ensuring pin alignment and flatness, and the space occupied by pin packaging on the PCB board 5 in conventional technologies, this application provides a pinless transformer. Multiple slots 1b are formed inside the housing 1, allowing the substrate 3 to be secured in the slots 1b. Solder balls 4 are soldered between the substrate 3 and the lead wire 22, enabling the pinless transformer to connect to the external PCB board 5. This achieves a pinless design for the transformer, thereby making reasonable use of the PCB board 5 space and ensuring pin alignment and flatness.

[0025] Please see Figure 1 This application provides a leadless transformer, including a housing 1, a coil assembly 2, multiple substrates 3, and multiple solder balls 4. The housing 1 has a mounting groove 1a and multiple snap-fit ​​grooves 1b, with each snap-fit ​​groove 1b spaced apart around the periphery of the mounting groove 1a. The coil body 21 and multiple leads 22 connected to the coil body 21 are also present. The coil body 21 is located in the mounting groove 1a, and the leads 22 extend from the mounting groove 1a to the snap-fit ​​grooves 1b. Each substrate 3 is snapped into a snap-fit ​​groove 1b. One end of each solder ball 4 is soldered to a substrate 3 and a lead 22, and the other end of each solder ball 4 is exposed in the snap-fit ​​groove 1b.

[0026] In this embodiment, the housing 1 is generally made of materials such as bakelite, flame-retardant nylon, flame-retardant PET plastic, flame-retardant PBT plastic, and liquid crystal polymer. These materials generally have high temperature resistance, high voltage resistance, and flame retardancy. The housing 1 has a mounting groove 1a and multiple snap-fit ​​grooves 1b, with each snap-fit ​​groove 1b spaced apart around the periphery of the mounting groove 1a. The position of the snap-fit ​​grooves 1b is determined according to the connection position between the transformer and the circuit board. The coil assembly 2 is installed inside the housing 1. The coil assembly 2 includes a coil body 21 and multiple leads 22 connected to the coil body 21. The coil body 21 is located within the mounting groove 1a, and the leads 22 extend from the mounting groove 1a to the snap-fit ​​grooves 1b. The substrate 3 is generally made of silver, copper, or copper alloy, possessing good conductivity and solderability. Multiple substrates 3 are snap-fitted into each snap-fit ​​groove 1b. Multiple solder balls 4 are soldered to each substrate 3 and corresponding lead 22 using a soldering process, ensuring that the other end of each solder ball 4 is exposed in the slot 1b to achieve connection with external circuits and realize a leadless transformer design. Specifically, the diameter of the solder balls 4 can be selected between 0.1mm and 0.76mm depending on the current carrying capacity and space requirements. The alloy composition of the solder balls 4 is preferably SAC305 lead-free solder or Sn63Pb37 solder. The soldering process can use high-frequency soldering or laser soldering technology to ensure the stability of the soldering quality. In addition, the implantation of the solder balls 4 can be carried out by stencil printing or automatic ball implantation machine. The stencil printing method uses a high-precision stainless steel stencil with an opening tolerance controlled within ±5μm, a scraper pressure controlled within 50-100N, and a stencil separation speed controlled within ≤1mm / s. The automatic ball implantation machine is equipped with a vision positioning system with an accuracy of ±10μm, and uses a piezoelectric driven nozzle or vibratory feeder for feeding, with a ball implantation position accuracy CPK≥1.67. Through these specific implementation steps, the leadless transformer of this application achieves high-precision electrical connections and mechanical fixation. The solder ball 4-welding provides excellent electrical connection performance and mechanical fixation strength, significantly improving soldering reliability and meeting the stringent reliability requirements of the networking industry. The leadless design reduces the transformer's size by 30% compared to traditional structures, greatly satisfying the demands of modern communication equipment for high-density integration and miniaturization. For example, within an RJ45 network connector, this miniaturized design effectively saves space, enabling a more compact layout. Through high-precision ball-mounting technology and the application of automated equipment, the leadless transformer of this application not only improves production efficiency but also reduces production costs, giving it significant market competitiveness.

[0027] Please see Figures 1 to 4 In order to achieve a stable connection between the substrate 3 and the housing 1, and to ensure that the lead wire 22 and the solder ball 4 can be properly soldered on the substrate 3, each substrate 3 has a snap-fit ​​section 31 and a connecting section 32. The snap-fit ​​section 31 and the connecting section 32 are set at an angle. The snap-fit ​​section 31 is snapped into the snap-fit ​​groove 1b, and the connecting section 32 is parallel to the periphery of the groove opening of the mounting groove 1a.

[0028] In one embodiment of this application, the snap-fit ​​groove 1b of the housing 1 is used to fix the snap-fit ​​section 31 of the substrate 3. When the substrate 3 is installed in place, its connecting section 32 is parallel to the periphery of the groove opening of the mounting groove 1a, providing a stable soldering platform for the lead wire 22. After the lead wire 22 extends out from the coil body 21, it is connected to the connecting section 32 of the substrate 3 through a soldering process. Then, solder balls 4 are soldered at the connection point between the lead wire 22 and the substrate 3, ensuring that the other end of the solder ball 4 is exposed in the snap-fit ​​groove 1b for connection with the external PCB board 5. The included angle between the snap-fit ​​section 31 and the connecting section 32 can be adjusted according to the design of the housing 1, usually 90 degrees, to achieve the best fixing effect. This design not only ensures a stable connection between the substrate 3 and the housing 1, but also provides precise positioning for the soldering of the lead wire 22 and the solder ball 4, thereby improving the reliability and efficiency of the soldering.

[0029] The leadless transformer of this application achieves a stable connection between the substrate 3 and the housing 1 by designing a substrate 3 with a snap-fit ​​section 31 and a connecting section 32, ensuring that the leads 22 and solder balls 4 can be properly soldered onto the substrate 3. The cooperation between the snap-fit ​​section 31 and the snap-fit ​​groove 1b provides stable mechanical support for the substrate 3, preventing displacement of the substrate 3 during the soldering process, thereby improving the stability of the soldering quality. The parallel arrangement of the connecting section 32 with the periphery of the mounting groove 1a provides a flat surface for soldering the leads 22, further ensuring the reliability of the soldering. This design also optimizes the internal space utilization of the transformer, making the layout of the leads 22 and solder balls 4 more compact, which helps to achieve miniaturization and high-density integration of the transformer. In high-density network equipment, this design can effectively reduce the area occupied by the PCB board 5 and improve the overall performance and reliability of the equipment.

[0030] Please see Figures 1 to 5 In order to make the connection between the substrate 3 and the housing 1 tighter, each snap-fit ​​groove 1b has a snap-fit ​​protrusion 11 protruding from its inner wall. The snap-fit ​​protrusion 11 is located at the end away from the connecting section 32. The snap-fit ​​section 31 has a contraction section 33 at the end away from the connecting section 32, and the contraction section 33 abuts against the snap-fit ​​protrusion 11.

[0031] In one embodiment, when the substrate 3 is snapped into the snap-fit ​​groove 1b, the contraction section 33 abuts against the snap protrusion 11. The snap-fit ​​groove 1b of the housing 1 and the snap-fit ​​section 31 of the substrate 3 are precision-machined to ensure dimensional accuracy and tight fit. The snap protrusion 11 can be designed as a protrusion with an arc-shaped guide surface, and its height and shape are optimized according to the thickness and material properties of the substrate 3. The contraction section 33 is correspondingly designed as a groove or bevel that matches the snap protrusion 11 to achieve a tight mechanical fit. During assembly, the snap-fit ​​section 31 of the substrate 3 is inserted into the snap-fit ​​groove 1b by a certain pressure or elastic deformation, so that the contraction section 33 abuts against the snap protrusion 11, thereby achieving a firm fixation of the substrate 3. This design not only improves the connection strength between the substrate 3 and the housing 1, but also ensures the stability of the substrate 3 when soldering the lead wire 22 and the solder ball 4.

[0032] Please see Figure 1 and Figure 2 In order to make the lead wire 22 more stable in the slot 1b and to prevent the sharp part of the substrate 3 from damaging the lead wire 22, each substrate 3 has a connecting chamfer 34, which connects the slot section 31 and the connecting section 32.

[0033] In one embodiment of this application, the connecting chamfer 34 of the substrate 3 can be achieved through precision mold processing or machining to ensure a smooth transition of the chamfer. The connecting chamfer 34 can be designed as a 1 / 4 arc surface, and its size and shape are optimized according to the diameter of the lead 22 and the thickness of the substrate 3. During assembly, after the lead 22 extends from the mounting groove 1a, it can smoothly transition to the connecting section 32 through the guidance of the connecting chamfer 34, thereby achieving a stable weld between the lead 22 and the substrate 3. This design not only improves the layout flexibility of the lead 22, but also ensures that the lead 22 will not be damaged by the sharp shape of the substrate 3. The smooth transition of the connecting chamfer 34 significantly improves the layout flexibility of the lead 22, reduces the resistance and stress concentration that the lead 22 may encounter during the extension process, thereby improving the welding quality of the lead 22. This design optimizes the routing of the lead 22, making the connection between the lead 22 and the substrate 3 more stable and reducing the possibility of short circuits or poor solder joints during the welding process.

[0034] Please see Figures 2 to 5 To prevent the substrate 3 from shaking on the housing 1, the snap-fit ​​section 31 is provided with a limiting part 311, which abuts against the inner sidewall of the snap-fit ​​groove 1b.

[0035] In this embodiment, the limiting part 311 can be designed as a raised stop or flange, the height and shape of which are optimized according to the size of the snap-fit ​​groove 1b. When the snap-fit ​​section 31 of the substrate 3 is inserted into the snap-fit ​​groove 1b, the limiting part 311 abuts tightly against the inner sidewall of the snap-fit ​​groove 1b, thereby limiting the substrate 3 from shaking within the snap-fit ​​groove 1b and preventing the leadless transformer from failing. This design not only improves the connection stability between the substrate 3 and the housing 1, but also ensures the accuracy of the soldering process of the lead wire 22 and the solder ball 4. Multiple limiting parts 311 can be designed and distributed at different positions of the snap-fit ​​section 31 to provide a more stable limiting effect.

[0036] Please see Figure 1 and Figure 6 Since the aforementioned solution cannot guarantee that the connection between the pinless transformer and the external PCB board 5 remains flat, there may be a risk of poor soldering. In this embodiment, the ends of all solder balls 4 that are away from the substrate 3 are located on the same plane, and the plane is parallel to the periphery of the groove opening of the mounting groove 1a.

[0037] In one embodiment, precise welding processes and equipment ensure consistent welding height for each solder ball 4. For example, during the welding process, high-precision ball placement equipment and reflow ovens can be used, and precise temperature control and welding parameter settings ensure uniform melting and solidification of the solder balls 4. Specifically, a vision positioning system can be used to ensure precise placement of the solder balls 4, while optimizing the welding temperature profile ensures that the solder balls 4 can uniformly form a good metallurgical bond during the welding process. Furthermore, surface treatments such as cleaning and fluxing can be performed on the substrate 3 and lead 22 before welding to further improve welding quality.

[0038] It should be noted that this embodiment significantly improves the flatness of the connection between the leadless transformer and the external PCB board 5 by ensuring that the ends of all solder balls 4 furthest from the substrate 3 are on the same plane, and that this plane is parallel to the periphery of the slot opening of the mounting groove 1a. The flat surface of the solder balls 4 ensures good contact between the transformer and the PCB board 5, reducing the risk of cold solder joints and poor contact. This design improves the reliability and consistency of soldering, especially in high-density and high-precision soldering applications, effectively increasing the product yield. In high-speed network equipment, this design can ensure the stability and reliability of signal transmission, reducing signal interference and transmission errors caused by poor soldering.

[0039] Please see Figure 1 , Figure 3 as well as Figure 4 In order to make the extension of the lead wire 22 from the mounting slot 1a to the snap-fit ​​slot 1b more smoothly, the housing 1 is also provided with multiple connecting slots 1c. Each connecting slot 1c is connected to the mounting slot 1a and a snap-fit ​​slot 1b, and each lead wire 22 passes through a connecting slot 1c.

[0040] In one embodiment of this application, these connecting grooves 1c can be realized by precision mold processing or machining to ensure their dimensional accuracy and shape. The connecting groove 1c can be designed as rectangular or circular, and its width and depth are optimized according to the diameter of the lead 22. During assembly, each lead 22 extends from the mounting groove 1a and passes through the corresponding connecting groove 1c into the snap-fit ​​groove 1b, thereby achieving a smooth transition of the lead 22. This design not only improves the layout flexibility of the lead 22, but also ensures the smooth progress of the welding process. The inner wall of the connecting groove 1c can be designed as a smooth surface to reduce the friction of the lead 22 during the insertion process. The connecting groove 1c provides a clear channel for the lead 22, reducing the resistance and stress concentration that the lead 22 may encounter during the extension process, and avoiding entanglement or knotting between different leads 22, thereby improving the welding quality of the lead 22. This design optimizes the routing of the lead 22, making the connection between the lead 22 and the substrate 3 more stable, and reducing the possibility of short circuits or poor soldering during the welding process.

[0041] Please see Figure 4 In order to provide better support for the bottom of the lead wire 22 as it moves from the mounting groove 1a to the snap-fit ​​groove 1b, the distance between the bottom of the connecting groove 1c and the opening of the connecting groove 1c gradually decreases in the direction from the mounting groove 1a to the snap-fit ​​groove 1b.

[0042] In this embodiment, in the direction from the mounting groove 1a to the snap-fit ​​groove 1b, the distance between the bottom of the connecting groove 1c and its opening gradually decreases, forming a slope-shaped or wedge-shaped structure. This structure can be achieved through precision mold processing or machining to ensure its dimensional accuracy and shape. The connecting groove 1c can be designed as a slope, with its width being larger at the end near the mounting groove 1a and gradually decreasing at the end near the snap-fit ​​groove 1b. During assembly, after the lead wire 22 extends from the mounting groove 1a, it gradually transitions to the snap-fit ​​groove 1b along the slope-shaped structure of the connecting groove 1c, and the bottom of the lead wire 22 is well supported throughout the process. This design not only improves the layout flexibility of the lead wire 22 but also ensures the smooth progress of the welding process. The slope angle of the connecting groove 1c can be optimized according to the diameter and material properties of the lead wire 22, and is typically between 30 and 60 degrees with the vertical direction.

[0043] Please see Figure 3 , Figure 5 as well as Figure 6 To further ensure that the connection between the leadless transformer and the PCB board 5 remains parallel and to guarantee the welding quality, the housing 1 is provided with a protruding abutment part 12, which is used to abut against the PCB board 5.

[0044] In one embodiment, the abutment portion 12 can be achieved through precision molding or machining to ensure its dimensional accuracy and shape. For example, the abutment portion 12 can be designed as an annular protrusion, the height and shape of which are optimized according to the thickness of the PCB board 5 and the soldering requirements. When the leadless transformer is placed on the PCB board 5, the abutment portion 12 abuts tightly against the surface of the PCB board 5, thereby ensuring the parallelism between the transformer and the PCB board 5. This design not only improves the reliability of soldering but also reduces the possibility of cold solder joints and short circuits during the soldering process.

[0045] Secondly, please refer to Figures 1 to 6 This application provides an electronic device including a PCB board 5 and a leadless transformer provided in the first aspect of this application, wherein the PCB board 5 is soldered to all the solder balls 4.

[0046] In this embodiment, the leadless transformer is first placed at a predetermined position on the PCB board 5, ensuring that the abutment portion 12 on the transformer housing 1 is in close contact with the surface of the PCB board 5, thereby ensuring the parallelism between the transformer and the PCB board 5. Then, the solder balls 4 of the leadless transformer are soldered to the pads on the PCB board 5 using a soldering process. Specifically, reflow soldering technology can be used, and by precisely controlling the soldering temperature profile, a good metallurgical bond between the solder balls 4 and the pads is ensured. During the soldering process, high-precision soldering equipment and a vision positioning system can be used to ensure the accuracy and consistency of the soldering. For example, the soldering temperature profile may include a preheating zone (150-180℃), a reflow zone (220-250℃), and a cooling zone (cooling rate 2-3℃ / s) to ensure uniform melting and solidification of the solder balls 4. Through this implementation, the leadless transformer in the electronic device can achieve a stable and reliable electrical connection with the PCB board 5. The direct soldering between the solder balls 4 of the leadless transformer and the pads on the PCB board 5 eliminates the alignment deviation that may be caused by traditional pin structures, improving the accuracy and reliability of the soldering. Through this structural design, the electronic equipment of this application reduces the reliance on manual adjustments during the production process, improves production efficiency, reduces production costs, and has significant economic benefits and market competitiveness.

[0047] It should be understood that the terminology used herein is for the purpose of describing particular exemplary embodiments only and is not intended to be limiting. Unless the context clearly indicates otherwise, the singular forms “a,” “an,” and “described” as used herein may also include the plural forms. The terms “comprising,” “including,” “containing,” and “having” are inclusive and therefore indicate the presence of the stated features, steps, operations, elements, and / or components, but do not exclude the presence or addition of one or more other features, steps, operations, elements, components, and / or combinations thereof. The method steps, processes, and operations described herein are not construed as requiring them to be performed in a particular order described or illustrated unless the order of performance is explicitly indicated. It should also be understood that additional or alternative steps may be used.

[0048] Although terms such as first, second, third, etc., may be used in this document to describe multiple elements, components, regions, layers, and / or segments, these elements, components, regions, layers, and / or segments should not be limited by these terms. These terms may be used only to distinguish one element, component, region, layer, or segment from another. Unless the context clearly indicates otherwise, terms such as "first," "second," and other numerical terms used herein do not imply order or sequence. Therefore, the first element, component, region, layer, or segment discussed below may be referred to as the second element, component, region, layer, or segment without departing from the teachings of the exemplary embodiments.

[0049] The above description is merely a specific embodiment of this application, enabling those skilled in the art to understand or implement this application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of this application. Therefore, this application is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features claimed herein.

Claims

1. A leadless transformer, characterized in that, include: The housing (1) is provided with a mounting groove (1a) and a plurality of snap-fit ​​grooves (1b) inside the housing (1), and each of the snap-fit ​​grooves (1b) is spaced apart at the periphery of the mounting groove (1a); A coil assembly (2) includes a coil body (21) and a plurality of leads (22) connected to the coil body (21). The coil body (21) is located in the mounting groove (1a), and the leads (22) extend from the mounting groove (1a) to the snap-fit ​​groove (1b). Multiple substrates (3), each of the substrates (3) being snapped into a snap-in slot (1b); Multiple solder balls (4), one end of each solder ball (4) is soldered to a substrate (3) and a lead wire (22), and the other end of each solder ball (4) is exposed in the snap-fit ​​groove (1b).

2. The leadless transformer according to claim 1, characterized in that, Each of the substrates (3) has a snap-fit ​​section (31) and a connecting section (32), the snap-fit ​​section (31) and the connecting section (32) are arranged at an angle, the snap-fit ​​section (31) is snapped into the snap-fit ​​groove (1b), and the connecting section (32) is parallel to the periphery of the opening of the mounting groove (1a).

3. The leadless transformer according to claim 2, characterized in that, Each of the snap-fit ​​grooves (1b) has a snap-fit ​​protrusion (11) on its inner wall. The snap-fit ​​protrusion (11) is located at one end away from the connecting section (32). The snap-fit ​​section (31) has a contraction section (33) at one end away from the connecting section (32). The contraction section (33) abuts against the snap-fit ​​protrusion (11).

4. The leadless transformer according to claim 2, characterized in that, Each of the substrates (3) has a connecting chamfer (34) that connects the snap-fit ​​section (31) and the connecting section (32).

5. The leadless transformer according to claim 3, characterized in that, The snap-fit ​​section (31) is provided with a limiting part (311), which abuts against the inner sidewall of the snap-fit ​​groove (1b).

6. The leadless transformer according to any one of claims 1-5, characterized in that, All the solder balls (4) are located on the same plane at the end away from the substrate (3), and the plane is parallel to the periphery of the groove opening of the mounting groove (1a).

7. The leadless transformer according to any one of claims 1-5, characterized in that, The housing (1) is also provided with a plurality of connecting slots (1c), each of the connecting slots (1c) is connected to the mounting slot (1a) and a snap-fit ​​slot (1b), and each of the lead wires (22) passes through a connecting slot (1c).

8. The leadless transformer according to claim 7, characterized in that, In the direction from the mounting groove (1a) to the snap-fit ​​groove (1b), the distance between the bottom of the connecting groove (1c) and the opening of the connecting groove (1c) gradually decreases.

9. The leadless transformer according to any one of claims 1-5, characterized in that, The housing (1) has a protruding abutment (12) for abutting against the PCB board (5).

10. An electronic device, characterized in that, Includes a PCB board (5) and a leadless transformer as claimed in any one of claims 1-9, wherein the PCB board (5) is soldered to all of the solder balls (4).

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