Magnetic device and electronic apparatus

Abstract

The application relates to the technical field of magnetic devices, and discloses a magnetic device and an electronic device. The magnetic device comprises a magnetic core, the magnetic core comprises spacers, middle columns and end plates arranged at two ends of the middle columns; windings are arranged on each middle column, and the windings are provided with lead wires at the ends; and terminals are arranged on the end plates and correspond to the ends of each middle column. The terminals are provided with clamping grooves and solder bosses. The clamping grooves are connected to one side of the terminals, the solder bosses are connected to the side of the clamping grooves away from the terminals, the solder bosses are deformed towards the lead wires and fix the lead wires after the lead wires are accommodated in the clamping grooves, and the clamping grooves and the solder bosses are located between the terminals and the side edges of the end plates. The application optimizes the space size of the magnetic device and improves the economy.

Description

Technical Field

[0001] This application relates to the field of magnetic device technology, specifically to a magnetic device and electronic device. Background Technology

[0002] In the manufacturing process of magnetic devices, taking common-mode inductors as an example, as key electromagnetic interference suppression components in electronic circuits, they typically include electrode terminals, a magnetic core, and windings wound on the magnetic core. The winding leads and terminals are fixed and connected through a soldering process. However, the traditional soldering process results in a solder joint that protrudes significantly from the surface of the magnetic core after the solder paste melts. This protruding solder joint will cause interference when it is subsequently assembled with the product casing or cover, forcing the package to design a special clearance structure (such as a groove or protrusion) at the corresponding position. This not only increases the complexity of the package but also increases the mold cost of the package and the overall manufacturing cost of the product. Utility Model Content

[0003] In view of this, this application provides a magnetic device and an electronic device to solve the aforementioned technical problems.

[0004] In a first aspect, embodiments of this application disclose a magnetic device, comprising: A magnetic core, the magnetic core comprising spaced-apart central columns and end plates respectively disposed at both ends of the central columns; A winding, wherein the winding is wound on each of the central columns, and the ends of the winding are led out; The terminal is disposed on the end plate and corresponds to the end of each of the central posts. The terminal is provided with a slot and a solder boss. The slot is connected to one side of the terminal, and the solder boss is connected to the side of the slot away from the terminal. After the slot accommodates the lead wire, the solder boss deforms toward the lead wire and fixes the lead wire. The slot and the solder boss are located between the side of the terminal and the end plate.

[0005] In one possible example, the terminal is provided with a first groove that connects the terminal and the solder boss to the side of the slot.

[0006] In one possible example, the terminal is provided with a second groove that connects to the solder boss and divides the solder boss into a spaced solder portion and a fastening portion.

[0007] In one possible example, after the solder boss deforms toward the lead and fixes the lead, the solder portion is welded to the lead and the solder portion and the lead form a solder joint located in the slot.

[0008] In one possible example, a gel layer is also included, which is disposed on the end plate, and each of the terminals is connected to the gel layer.

[0009] In one possible example, the end plate has a chamfered portion at one end opposite the center post, the chamfered portion exposing at least a portion of the solder boss.

[0010] In one possible example, the chamfer divides the outer side of the end plate apex corner into a first side connected to one side of the chamfer and a second side connected to the other side of the chamfer, wherein the area of ​​the first side is twice the area of ​​the second side.

[0011] In one possible example, a cover plate is also included, which is disposed on the side of the magnetic core away from the terminal and covers the magnetic core and winding, wherein the end plate away from the central post has a third groove, the third groove is located between adjacent terminals on the end plate, and the cover plate has a corresponding alignment block that matches the third groove.

[0012] In one possible example, the terminal is provided with a first connecting plate and a second connecting plate, the second connecting plate being connected to the other side of the terminal relative to the slot, the first connecting plate being located between the second connecting plate and the slot, and the second connecting plate being embedded in the colloid layer, the first connecting plate being attached to the end of the colloid layer away from the central column.

[0013] Secondly, embodiments of this application disclose an electronic device including the magnetic device described in any of the above embodiments.

[0014] In summary, compared with the prior art, this application discloses a magnetic device and an electronic device. The magnetic device includes a magnetic core, a winding, and terminals. The magnetic core includes spaced-apart central pillars and end plates respectively disposed at both ends of the central pillars. The windings are wound on each central pillar, and leads are led out from the ends of the windings. Terminals are disposed on the end plates and correspond to the ends of each central pillar. The terminals are provided with slots and solder bosses. The slots are connected to one side of the terminals, and the solder bosses are connected to the side of the slots away from the terminals. After the slots accommodate the leads, the solder bosses deform toward the leads and fix the leads. The slots and solder bosses are located between the sides of the terminals and the end plates. That is, through the above-mentioned configuration, the spatial dimensions of the magnetic device are optimized and its economy is improved. Attached Figure Description

[0015] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0016] Figure 1 This is a schematic diagram of the structure of the magnetic device according to the first embodiment of this application; Figure 2 This is a schematic diagram of the structure of the magnetic device according to the second embodiment of this application; Figure 3 This is a schematic diagram of the structure of the magnetic device according to the third embodiment of this application; Figure 4 This is a schematic diagram of the terminal structure according to an embodiment of this application; Figure 5 This is a schematic diagram of the terminal structure from another angle in an embodiment of this application.

[0017] Figure descriptions: 1. Magnetic core; 11. Center post; 12. End plate; 13. Third groove; 121. First side; 122. Second side; 2. Winding; 21. Lead wire; 21a. Solder joint; 3. Terminal; 31. Slot; 32. Solder boss; 321. Solder part; 322. Fastening part; 33. First groove; 34. Second groove; 35. First connecting plate; 36. Second connecting plate; 4. Glue layer; 5. Chamfered part; 6. Cover plate; 61. Alignment block. Detailed Implementation

[0018] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this application. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this application as detailed in the claims.

[0019] It should be noted that, in this document, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes that element. Furthermore, components, features, and elements with the same names in different embodiments of this application may have the same meaning or different meanings, the specific meaning of which must be determined by its interpretation in that specific embodiment or further in conjunction with the context of that specific embodiment.

[0020] It should be understood that the specific embodiments described herein are merely illustrative of this application and are not intended to limit this application.

[0021] In the following description, the use of suffixes such as "module," "part," or "unit" to denote elements is solely for the purpose of illustrative purposes and has no specific meaning in itself. Therefore, "module," "part," or "unit" may be used interchangeably.

[0022] In the description of this application, it should be noted that the terms "upper," "lower," "left," "right," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on this application. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0023] The technical solutions shown in this application will be described in detail below through specific embodiments. It should be noted that the order of description of the following embodiments is not intended to limit the priority of the embodiments.

[0024] refer to Figures 1 to 3 The magnetic device in this application embodiment includes a magnetic core 1, a winding 2, and a terminal 3.

[0025] In the specific implementation process, the magnetic core 1 includes spaced-apart center columns 11 and end plates 12 respectively disposed at both ends of the center columns 11. The winding 2 is wound on each center column 11, and the end of the winding 2 is led out with a lead wire 21 for electrical connection. The terminal 3 is disposed on the end plate 12 and corresponds to the end of each center column 11, and is used to receive the lead wire 21 of the winding 2 on each center column 11.

[0026] The terminal 3 is provided with a slot 31 and a solder boss 32. The slot 31 is connected to one side of the terminal 3, and the solder boss 32 is connected to the side of the slot 31 away from the terminal 3. After the slot 31 accommodates the lead wire 21, the solder boss 32 deforms toward the lead wire 21 and fixes the lead wire 21. The slot 31 and the solder boss 32 are located between the side of the terminal 3 and the end plate 12.

[0027] Therefore, the lead 21 of the winding 2 can be firmly wrapped and fixed in the slot 31 by the deformation of the solder boss 32 toward the lead 21. Then, the terminal 3 and the lead 21 can be reliably connected by external welding process. The overall structure of the slot 31 and the solder boss 32 is located in the space between the terminal 3 and the side of the end plate 12, without exceeding the side contour of the end plate 12. This effectively optimizes the internal space layout, avoids increasing the overall size of the device due to the protrusion of the welding structure, avoids the complexity of device packaging, saves the mold cost of packaging and the overall product manufacturing cost, and improves the reliability and consistency of the welding connection.

[0028] The magnetic core 1 includes at least two spaced-apart central columns 11 and end plates 12 respectively disposed at both ends of the central columns 11. The spaced-apart central column 11 structure provides a magnetic circuit basis for common-mode inductors to achieve their core function of suppressing common-mode noise. The windings 2 are respectively wound on different central columns 11 to form the coupling function required by the common-mode inductor.

[0029] In this embodiment, the winding 2 can be made of copper enameled wire. The winding 2 consists of at least one enameled wire. It is understood that metallic copper is an excellent conductive material with low resistance. Using copper enameled wire as the winding 2 can reduce the resistance of the inductor and improve the current transmission efficiency. In addition, copper has good thermal conductivity, which can effectively conduct heat away from the winding 2, avoiding the degradation or damage of inductor performance due to excessive temperature. On the other hand, copper enameled wire can usually withstand high temperatures and is suitable for applications in high-temperature environments. This is very important for magnetic devices that need to operate under high-temperature conditions. Furthermore, copper enameled wire has high corrosion resistance and can resist the erosion of some chemical substances, thereby extending the service life of magnetic devices.

[0030] Preferably, in this embodiment of the application, a reliable electrical and mechanical connection between the terminal 3 and the lead wire 21 is achieved by laser welding, in which case at least a portion of the solder boss 32 is melted into the lead wire 21 as solder during welding.

[0031] Continue to refer to Figure 4 and Figure 5Terminal 3 is provided with a first groove 33, which connects the terminal 3 and the solder boss 32 to the side of the slot 31. The first groove 33 makes the side of the slot 31 have an inner groove opening. After the solder boss 32 deforms towards the lead wire 21 and firmly covers and fixes the lead wire 21 of the winding 2, the deformed solder boss 32 is subjected to laser welding process, which melts it and fuses it with the lead wire 21, finally forming a dense and reliable solder joint 21a. In this process, the first groove 33 is not only a source of external force for the solder boss 32, but also a source of external force for the solder boss 32. The deformation caused by compression provides a guiding space and a preset area for the molten solder during laser welding, thereby effectively guiding and controlling the final shape of the solder. This ensures that the solder joint 21a formed in the slot 31 is full and firm, and its overall outline does not exceed the side of the end plate 12. This optimizes the spatial layout of the magnetic device, enabling the device to achieve excellent connection performance while strictly limiting its maximum size on the end plate side, providing a key guarantee for the miniaturization and high-density mounting of the device.

[0032] In one example, to further optimize the welding process and thermal management, the terminal 3 is provided with a second groove 34, which is connected to the solder boss 32 and divides the solder boss 32 into a spaced solder portion 321 and a fastening portion 322, that is, the solder portion 321 and the fastening portion 322 are two independent parts that are spaced apart.

[0033] During laser welding, external force can be used to deform the solder part 321 and the fastening part 322 toward the lead wire 21, thereby firmly covering and fixing the lead wire 21 of the winding 2 in the slot 31. Subsequently, during the laser welding process, the laser energy acts on the solder part 321, causing it to melt together with the lead wire 21 as solder, forming the final electrical connection point. The second groove 34 increases the thermal resistance of heat conduction from the solder part 321 to the fastening part 322 and the terminal 3, forming an effective thermal barrier, thereby significantly limiting the heat-affected zone and preventing other parts of the terminal 3 from deforming or deteriorating due to overheating. In addition, the second groove 34 physically isolates the solder part 321 and the fastening part 322, ensuring that the molten solder is concentrated in the area of ​​the solder part 321 under the action of surface tension, and does not flow excessively to the fastening part 322, thereby ensuring the controllability and consistency of the shape of the solder joint 21a.

[0034] That is, after the solder boss 32 deforms toward the lead wire 21 and fixes the lead wire 21, the solder part 321 is welded and fixed to the lead wire 21, and the solder part 321 and the lead wire 21 form a solder point 21a located in the slot 31. Thus, through the process of "mechanical fastening and then welding" and the unique groove design, the solder point 21a is ensured to be hidden inside the structure of the terminal 3 and the end plate 12.

[0035] In one example, the end plate 12 has a chamfered portion 5 at the top corner away from the central column 11. The chamfered portion 5 exposes at least part of the solder boss 32, thereby physically removing the magnetic material below the solder joint 21a of the lead wire 21 and the solder boss 32. This ensures that during laser welding, the high-energy laser beam and the area directly below the formed solder joint 21a are in a suspended state without magnets. This fundamentally avoids the risk of the laser energy being instantly absorbed by the magnetic core 1, which could lead to local overheating, damage, or microcracks in the magnet. This greatly improves the welding yield and long-term reliability of the device.

[0036] The chamfer value of the chamfered portion 5 is preferably 45°. This chamfer value is an optimized value determined after comprehensively considering the strength of the magnetic core structure, space utilization efficiency and laser welding process requirements. The 45° bevel is formed on the magnetic core 1 by grinding or directly forming, so that the magnetic material in this area is precisely removed, thereby allowing the solder boss 32 to be fully exposed from the chamfered portion 5. That is, through this preferred chamfer structure, the magnetic material directly below the welding point is completely removed, ensuring that during laser welding, the high-energy laser beam and the weld point 21a formed are in a suspended state without magnets.

[0037] Preferably, the chamfered portion 5 exposes the solder portion 321 of the solder boss 32. This ensures that only the solder portion 321, which serves as the welding functional area, is exposed, thus ensuring that the laser energy can be absorbed efficiently and in a concentrated manner. At the same time, it minimizes the conduction and diffusion of heat to the non-welding area and the magnetic core body. That is, there is no magnetic material directly below the projection area of ​​the solder portion 321 due to the chamfered portion 5, which fundamentally eliminates the risk of the magnet being damaged or developing microcracks due to instantaneous high temperature during laser welding.

[0038] The chamfered portion 5 divides the outer side of the top corner of the end plate 12 into a first side 121 connected to one side of the chamfered portion 5 and a second side 122 connected to the other side of the chamfered portion 5. The area of ​​the first side 121 is twice the area of ​​the second side 122. This specific area ratio ensures that the magnetic core 1 can maintain a sufficient magnetic circuit cross-sectional area after the welding area of ​​the slot 31 and the solder boss 32 is repositioned. This effectively reduces the magnetic resistance of the magnetic core 1 in the chamfered portion 5 area, ensuring the electromagnetic performance of the device. In addition, the larger area of ​​the first side 121 enhances the bonding area and adhesion between the end plate 12 and the colloid layer 4, improving the mechanical stability of the overall structure. In other words, this proportional design ensures the structural strength of the magnetic core 1 while providing the optimal space configuration for the arrangement of the third groove 13 and the installation of the terminal 3, achieving a balance between device miniaturization and performance optimization.

[0039] In one example, the magnetic device also includes a colloidal layer 4 disposed on the end plate 12. Specifically, the colloidal layer 4 can be formed by injection molding or bonding processes and cover the side of the end plate 12. Each terminal 3 is connected to the colloidal layer 4. Thus, the colloidal layer 4 can establish a reliable electrical isolation barrier between the terminals 3 and between the terminals 3 and the end plate 12. The colloidal layer 4 provides a solid mechanical support and adhesive force for the terminals 3, accurately positioning and firmly fixing the terminals 3 to the end plate 12, ensuring the structural integrity and reliability of the device under harsh environments such as vibration and impact.

[0040] Furthermore, terminal 3 is provided with a first connecting plate 35 and a second connecting plate 36. The second connecting plate 36 is connected to the other side of terminal 3 opposite to the slot 31. The first connecting plate 35 is located between the second connecting plate 36 and the slot 31, and the second connecting plate 36 is embedded in the colloid layer 4. The first connecting plate 35 is attached to the end of the colloid layer 4 away from the central post 11. Thus, the first connecting plate 35, the second connecting plate 36, and the slot 31 together constitute a stable multi-level fixing structure. In the assembled state of terminal 3, the second connecting plate 36 is completely embedded and covered inside the colloid layer 4. This embedded design provides strong main anchoring force for terminal 3, ensuring its firmness in the colloid layer 4 and effectively resisting axial pull-out force and lateral stress generated during welding or use. The first connecting plate 35 is attached to the outer surface of the end of the colloid layer 4 away from the central column 11. This large-area surface contact structure enhances the torsional stability of terminal 3 and prevents it from deflecting under force. On the other hand, it works in conjunction with the embedded second connecting plate 36 to form a double-safety fixing mechanism that combines "internal embedding" and "external support".

[0041] Meanwhile, the first connecting plate 35 is attached to the outer surface of the end of the colloid layer 4 away from the central column 11. The first connecting plate 35 is also used as an external pin of the magnetic device. This integrated design enables the first connecting plate 35 to have dual functions: by attaching to the outer surface of the colloid layer 4, it enhances the torsional stability of the terminal 3 and serves as an exposed pin structure to directly solder or plug into external circuits (such as printed circuit boards) to realize the electrical interconnection function of the device.

[0042] In one example, the magnetic device also includes a cover plate 6, which is located on the side of the magnetic core 1 away from the terminal 3 and covers the magnetic core 1 and the winding 2 to provide protection and insulation.

[0043] The end plate 12 has a third groove 13 at the end opposite to the central column 11. The third groove 13 is located between adjacent terminals 3 on the end plate 12. The cover plate 6 has a corresponding alignment block 61 that matches the third groove 13. During device assembly, the alignment block 61 of the cover plate 6 can be precisely aligned and connected to the third groove 13 of the end plate 12. This "bump-groove" mating structure ensures that the relative position between the cover plate 6 and the magnetic core 1 is unique and accurate, effectively preventing misalignment that may occur during assembly. The engagement of the alignment block 61 and the third groove 13 forms a mechanical interlock, which significantly enhances the connection strength between the cover plate 6 and the magnetic core 1, and improves the overall mechanical stability and vibration and impact resistance of the device.

[0044] It is understood that in this embodiment, the magnetic core 1 is made of magnetic material, which may include one or more of ferrite material, magnetic metal alloy material, iron-silicon alloy material or soft magnetic material to meet the working requirements of magnetic device.

[0045] Furthermore, the central column 11 in this embodiment can be designed as a rectangular structure, so that the windings 2 can be stacked more easily, that is, more winding space is provided, and the edges and corners of the rectangular body can also be used to adjust the magnetic field distribution of the magnetic device, which helps to optimize the performance of the device and makes it easier to process and manufacture in the production process.

[0046] In summary, in a preferred embodiment, this application provides a high-performance, miniaturized magnetic device. Through the slot 31, solder boss 32, first groove 33, and second groove 34 designed on the terminal 3, in coordination with the chamfered portion 5 at a specific angle on the end plate 12, the lead wire 21, after being pre-fixed in the slot 31 by the deformation of the solder boss 32, can be laser welded to form a reliable solder joint that is concealed inside the terminal 3 and does not protrude from the side wall of the magnetic core 1. At the same time, the chamfered structure ensures that there is no magnet under the solder joint, fundamentally avoiding laser thermal damage. Combined with the insulating fixation of the colloid layer 4 and the dual anchoring and pin functions of the connecting plate of the terminal 3, this structure significantly improves welding reliability, electrical safety, and mechanical stability while achieving ultra-thin and high-density mounting of the device.

[0047] This application also discloses an electronic device, including a magnetic device as described in any of the above embodiments. For other working principles and processes of the electronic device in this embodiment, please refer to the description of the magnetic device in the above embodiment, which will not be repeated here.

[0048] The magnetic devices and electronic devices provided in this application have been described in detail above. Specific examples have been used to illustrate the principles and implementation methods of this application. It should be noted that the descriptions of each embodiment in this application have different emphases. Parts not described in detail or in a certain embodiment can be referred to the relevant descriptions of other embodiments.

[0049] The above are merely preferred embodiments of this application and do not limit the patent scope of this application. The technical features of the technical solution of this application can be combined arbitrarily. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. Any equivalent structural or procedural transformations made using the content of this application's specification and drawings, or direct or indirect applications in other related technical fields, are also included within the patent protection scope of this application, as long as the combination of these technical features does not contradict each other.

[0050] The present application has been described in detail above. Specific examples have been used to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only for the purpose of helping to understand the core ideas of the present application. At the same time, for those skilled in the art, there will be changes in the specific implementation methods and application scope based on the ideas of the present application. Therefore, the content of this specification should not be construed as a limitation of the present application.

Claims

1. A magnetic device, characterized in that, include: The magnetic core (1) includes spaced central columns (11) and end plates (12) respectively disposed at both ends of the central columns (11). The winding (2) is wound on each of the central columns (11), and the ends of the winding (2) are led out with leads (21). Terminal (3), the terminal (3) is disposed on the end plate (12) and corresponds to the end of each of the central posts (11). The terminal (3) is provided with a slot (31) and a solder boss (32). The slot (31) is connected to one side of the terminal (3). The solder boss (32) is connected to the side of the slot (31) away from the terminal (3). After the slot (31) accommodates the lead wire (21), the solder boss (32) deforms toward the lead wire (21) and fixes the lead wire (21). The slot (31) and the solder boss (32) are located between the side of the terminal (3) and the end plate (12).

2. The magnetic device as described in claim 1, characterized in that, The terminal (3) is provided with a first groove (33), which is connected to the side of the slot (31) between the terminal (3) and the solder boss (32).

3. The magnetic device as described in claim 1, characterized in that, The terminal (3) is provided with a second groove (34), which is connected to the solder boss (32) and divides the solder boss (32) into a spaced solder portion (321) and a fastening portion (322).

4. The magnetic device as described in claim 3, characterized in that, After the solder boss (32) deforms toward the lead wire (21) and fixes the lead wire (21), the solder part (321) is welded and fixed to the lead wire (21), and the solder part (321) and the lead wire (21) form a solder joint (21a) located in the slot (31).

5. The magnetic device as described in claim 1, characterized in that, It also includes a colloid layer (4) disposed on the end plate (12), and each of the terminals (3) is connected to the colloid layer (4).

6. The magnetic device as described in claim 1, characterized in that, The end plate (12) has a chamfered portion (5) at one end opposite to the central column (11), and the chamfered portion (5) exposes at least part of the solder boss (32).

7. The magnetic device as described in claim 6, characterized in that, The chamfered portion (5) divides the outer side of the top corner of the end plate (12) into a first side (121) connected to one side of the chamfered portion (5) and a second side (122) connected to the other side of the chamfered portion (5), wherein the area of ​​the first side (121) is twice the area of ​​the second side (122).

8. The magnetic device as described in claim 1, characterized in that, It also includes a cover plate (6), which is located on the side of the magnetic core (1) away from the terminal (3) and covers the magnetic core (1) and the winding (2). The end plate (12) away from the central column (11) is provided with a third groove (13), which is located between adjacent terminals (3) on the end plate (12). The cover plate (6) is provided with a matching block (61) that matches the third groove (13).

9. The magnetic device as described in claim 5, characterized in that, The terminal (3) is provided with a first connecting plate (35) and a second connecting plate (36). The second connecting plate (36) is connected to the other side of the terminal (3) relative to the slot (31). The first connecting plate (35) is located between the second connecting plate (36) and the slot (31). The second connecting plate (36) is embedded in the colloid layer (4). The first connecting plate (35) is attached to the end of the colloid layer (4) away from the central column (11).

10. An electronic device, characterized in that, Includes the magnetic device as described in any one of claims 1 to 9.

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