Capacitor element with double-sided wire-out structure

Abstract

The utility model discloses a capacitor element of double -sided wire -out structure relates to dry type self -healing shunt capacitor technical field, including plastic shell, capacitor core, upper end lead, lower end lead and epoxy resin filling layer, and the capacitor core is cylindrical structure, and the center cavity of axial existence exists in the center, the upper end lead is connected in the upper end surface of capacitor core, and is led out from the upper end of plastic shell, the lower end lead is connected in the lower end surface of capacitor core, and is led down through the wire -out hole of being arranged in the bottom of plastic shell. The utility model discloses through the synergistic innovation of core structure, and the electrical performance, reliability and system level heat dissipation capacity of capacitor are comprehensively promoted. The double -sided wire -out structure of element itself makes the current path shortest, and makes the heat along the core axial even distribution of current generation, avoids local overheating. When multiple elements are in parallel, form the current and heat dissipation path of vertical through whole module.

Description

Technical Field

[0001] This utility model relates to the technical field of dry-type self-healing parallel capacitors, specifically a capacitor element with a double-sided lead-out structure. Background Technology

[0002] In low-voltage reactive power compensation systems used in industrial applications such as submerged arc furnaces, dry-type self-healing parallel capacitors are key components. Currently, the capacitor elements inside these capacitors generally employ a structure where both leads are drawn from the same side (usually the top) of the element. This "single-sided lead" method has two significant drawbacks: Firstly, in terms of electrical performance, because one lead needs to pass through the middle of the capacitor core to converge with the other lead on the same side, the longer lead path creates a larger parasitic inductance when a large current flows. This not only increases the equivalent series inductance of the component but also leads to current concentration and uneven losses, ultimately causing a significantly higher local temperature rise on the lead convergence side (i.e., the output side) than on the other side of the component. Excessive local temperature rise accelerates the aging of the capacitor dielectric material, affecting the long-term operational stability and lifespan of the capacitor.

[0003] Secondly, regarding structural safety, this single-sided wiring method forces the two electrodes of the component to be very close in physical space. When multiple such components are connected in parallel to form a capacitor product, their two busbars must also be installed in the same end area of ​​the product. This greatly limits the insulation distance between the two busbars. Furthermore, the operating environment of an electric arc furnace is typically extremely harsh, with a large amount of conductive dust containing metal particles in the air. During long-term operation, this conductive dust can easily accumulate and bridge between closely spaced busbars, leading to a short circuit between the capacitor's electrodes. Such short circuits not only damage the capacitor itself but can also cause more serious equipment shutdowns or even safety accidents. Utility Model Content

[0004] To address the aforementioned problems, specifically those raised in the background section, this invention proposes a capacitor element with a double-sided lead structure. The element comprises a plastic casing, a capacitor core, an upper lead, a lower lead, and an epoxy resin potting layer. The capacitor core is cylindrical with an axial central cavity. The upper lead is connected to the upper surface of the capacitor core and extends from the upper port of the plastic casing. The lower lead is connected to the lower surface of the capacitor core and extends downward through a lead-out hole located at the bottom of the plastic casing. The space inside the plastic casing, excluding the capacitor core, is filled with an epoxy resin potting layer.

[0005] A further feature of this invention is that the outlet hole is composed of an inverted conical bevel hole and a vertical circular hole connected sequentially from top to bottom, and the lower lead wire is led out through the inverted conical bevel hole and the vertical circular hole in sequence.

[0006] A further feature of this invention is that the diameter of the vertical circular hole is slightly larger than the diameter of the lower lead wire.

[0007] A further feature of this invention is that the upper lead is a fuse structure, including a fuse tube and lead pins at both ends, wherein one lead pin is welded to the upper end face of the capacitor core, and the other lead pin is led out upwards; the middle section of the fuse structure is bent and accommodated in the central cavity of the capacitor core.

[0008] A further feature of this invention is that the upper leads of the capacitor elements are connected to the upper busbar, and the lower leads of each capacitor element are connected to the lower busbar. The upper and lower busbars are located at the upper and lower ends of the capacitor elements, respectively, and the upper and lower busbars are connected to the terminals via connecting wires.

[0009] The beneficial technical effects of this utility model are as follows: through synergistic innovation of the core structure, the electrical performance, reliability, and system-level heat dissipation capacity of the capacitor are comprehensively improved, specifically reflected in: 1. By using a built-in bent fuse as the upper lead and cleverly accommodating its bent part in the central cavity of the capacitor core, the overcurrent protection function is seamlessly integrated into the inside of the capacitor element.

[0010] This approach completely eliminates the need for external fuses and additional solder joints, giving the component self-protection capabilities without increasing its overall size, perfectly resolving the contradiction between space utilization and safety protection, and is particularly suitable for high-density installation applications.

[0011] 2. The composite stepped lead-out hole (composed of an inverted conical bevel hole and a vertical circular hole) forms a highly efficient sealing structure. The inverted conical bevel hole provides a large bonding area, allowing the epoxy resin potting layer to bond firmly, significantly enhancing tensile strength, vibration resistance, and long-term sealing stability, effectively coping with temperature changes and mechanical stress. The precise fit between the vertical circular hole and the lead wire effectively utilizes the viscosity resistance of the epoxy resin during potting to prevent leakage, ensuring high production yield and encapsulation integrity.

[0012] 3. The double-sided lead structure of the component itself minimizes the current path, reduces the equivalent series resistance at the source, and ensures that the heat generated by the current is evenly distributed along the core axis, avoiding localized overheating. When multiple components are connected in parallel, a current and heat dissipation path is formed that runs vertically through the entire module.

[0013] This system-level layout expands the heat dissipation area from one side of the traditional structure to both the top and bottom, allowing current and heat to be evenly distributed across the entire product's upper and lower planes. This fundamentally solves the problem of localized temperature rise caused by heat accumulation in parallel systems, ensuring a more uniform overall temperature field and significantly improving the product's lifespan and reliability. Attached Figure Description

[0014] Figure 1 A schematic diagram of the structure of this utility model is shown.

[0015] Figure 2 A schematic diagram of the cable outlet is shown.

[0016] Figure 3 A schematic diagram of the upper busbar is shown.

[0017] Figure 4 A schematic diagram of the lower busbar is shown.

[0018] Reference numerals: 1. Plastic casing; 11. Outlet hole; 111. Inverted conical bevel hole; 112. Vertical circular hole; 2. Capacitor core; 21. Central cavity; 3. Upper lead; 31. Fuse; 4. Lower lead; 5. Epoxy resin potting layer; 6. Upper busbar; 7. Lower busbar; 8. Connecting wire; 9. Terminal block. Detailed Implementation

[0019] Preferred embodiments of the present invention will now be described with reference to the accompanying drawings. Those skilled in the art should understand that these embodiments are merely illustrative of the technical principles of the present invention and are not intended to limit the scope of protection of the present invention.

[0020] This invention proposes a capacitor element with a double-sided lead structure, including a plastic shell 1, a capacitor core 2, an upper lead 3, a lower lead 4, and an epoxy resin potting layer 5. The capacitor core 2 has a cylindrical structure with an axial central cavity 21 at its center. The upper lead 3 is connected to the upper end face of the capacitor core 2 and leads out from the upper port of the plastic shell 1. The lower lead 4 is connected to the lower end face of the capacitor core 2 and leads out downward through the lead hole 11 located at the bottom of the plastic shell 1. This structure disperses the current collection points of the capacitor's two poles to the upper and lower end faces of the capacitor, which makes the current path shorter, effectively reducing the equivalent series resistance. More importantly, the heat generated by the current is also evenly distributed along the axial direction of the core, rather than accumulating on a single end face, thereby significantly improving the thermal balance of the element and avoiding local overheating.

[0021] The space inside the plastic casing 1, excluding the capacitor core 2, is filled with an epoxy resin potting layer 5.

[0022] The outlet hole 11 is composed of an inverted conical bevel hole 111 and a vertical circular hole 112 connected sequentially from top to bottom. The lower lead wire 4 passes through the inverted conical bevel hole 111 and the vertical circular hole 112 in sequence and is led out. While ensuring the sealing of the lower lead wire 4, it also provides reliable mechanical fixation for it.

[0023] The diameter of the vertical circular hole 112 is slightly larger than the diameter of the lower lead wire 4, and the gap formed between them can prevent epoxy resin leakage during the epoxy resin potting process.

[0024] The upper lead 3 is a fuse structure, including a fuse tube 31 and leads at both ends. One lead is soldered to the upper surface of the capacitor core 2, and the other lead extends upwards. The middle section of the fuse structure is bent and housed within the central cavity 21 of the capacitor core 2. The upper lead 3 adopts an internal fuse structure, with its bent portion housed within the central cavity 21. This design provides overcurrent protection without increasing the overall size of the component, maintaining a compact structure.

[0025] The upper lead 3 of each capacitor element is connected to the upper busbar 6, and the lower lead 4 of each capacitor element is connected to the lower busbar 7. The upper busbar 6 and the lower busbar 7 are located at the upper and lower ends of the capacitor element, respectively. The upper busbar 6 and the lower busbar 7 are connected to the terminal 9 through connecting wires 8.

[0026] During operation, the upper leads 3 of each component connect to the upper busbar 6, and the lower leads connect to the lower busbar 7, forming a vertically integrated electrical circuit. This parallel structure allows current and the resulting heat to diffuse along both the upper and lower planes of the product. Compared to traditional structures where all current connection points are located at the same end, it significantly improves the system's heat dissipation area and efficiency. The balanced heating of each component, combined with the uniform heat dissipation layout at the system level, ensures a lower overall temperature rise and a more uniform temperature field for the parallel capacitor product, fundamentally solving the problem of shortened product lifespan and reduced reliability caused by localized overheating.

[0027] Although the present invention has been described with reference to preferred embodiments, various modifications can be made to it and components can be replaced with equivalents without departing from the scope of the present invention. In particular, the technical features mentioned in the various embodiments can be combined in any manner as long as there is no structural conflict. The present invention is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

[0028] In the description of this utility model, terms such as "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," which indicate direction or positional relationships, are based on the direction or positional relationships shown in the accompanying drawings. These are used merely for ease of description and do not indicate or imply that the device or element must have a specific orientation, or be constructed and operated in a specific orientation; therefore, they should not be construed as limitations on this utility model. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0029] Furthermore, it should be noted that, in the description of this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0030] The term "comprising" or any other similar term is intended to cover non-exclusive inclusion, such that a process, article, or apparatus / device that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to those processes, articles, or apparatus / devices.

[0031] The technical solution of this utility model has been described in conjunction with the preferred embodiments shown in the accompanying drawings. However, it will be readily understood by those skilled in the art that the protection scope of this utility model is obviously not limited to these specific embodiments. Without departing from the principle of this utility model, those skilled in the art can make equivalent changes or substitutions to the relevant technical features, and the technical solutions after these changes or substitutions will all fall within the protection scope of this utility model.

Claims

1. A capacitor element with a double-sided lead structure, comprising a plastic shell (1), a capacitor core (2), an upper lead (3), a lower lead (4), and an epoxy resin potting layer (5), characterized in that: The capacitor core (2) has a cylindrical structure with an axial central cavity (21) at its center. The upper lead (3) is connected to the upper end face of the capacitor core (2) and leads out from the upper port of the plastic shell (1); The lower lead (4) is connected to the lower end face of the capacitor core (2) and passes through the wire outlet (11) at the bottom of the plastic shell (1) and leads downward. The space inside the plastic shell (1), excluding the capacitor core (2), is filled with an epoxy resin potting layer (5).

2. A capacitor element with a double-sided lead-out structure according to claim 1, characterized in that: The outlet hole (11) is composed of an inverted conical slope hole (111) and a vertical circular hole (112) connected sequentially from top to bottom. The lower lead wire (4) passes through the inverted conical slope hole (111) and the vertical circular hole (112) in sequence and is led out.

3. A capacitor element with a double-sided lead-out structure according to claim 2, characterized in that: The diameter of the vertical circular hole (112) is slightly larger than the diameter of the lower lead wire (4).

4. A capacitor element with a double-sided lead-out structure according to claim 1, characterized in that: The upper lead (3) is a fuse structure, including a fuse tube (31) and lead pins at both ends, one lead pin is welded to the upper end face of the capacitor core (2), and the other lead pin is led out upward; the middle section of the fuse structure is bent and accommodated in the central cavity (21) of the capacitor core (2).

5. A capacitor element with a double-sided lead-out structure according to claim 1, characterized in that: The upper lead (3) of each capacitor element is connected to the upper busbar (6), and the lower lead (4) of each capacitor element is connected to the lower busbar (7). The upper busbar (6) and the lower busbar (7) are located at the upper and lower ends of the capacitor element, respectively. The upper busbar (6) and the lower busbar (7) are connected to the terminal block (9) through connecting wires (8).

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