High-speed data transmission assembly based on dielectric waveguide and high-speed data transmission module

Abstract

The utility model discloses a high -speed data transmission subassembly and high -speed data transmission module based on dielectric waveguide, high -speed data transmission subassembly based on dielectric waveguide, including millimeter wave antenna, waveguide connecting piece, dielectric waveguide and medium lens, the chamber has in waveguide connecting piece inside, the outer surface of waveguide connecting piece is equipped with respectively the first butt joint and the second butt joint of intercommunication chamber, and the first butt joint corresponds with millimeter wave antenna, dielectric waveguide connects the second butt joint, and dielectric waveguide is used for transmitting antenna signal, medium lens is located in the chamber, and medium lens is used for the radiation angle of contraction antenna signal. Through the structure innovation of embedding medium lens in the chamber of waveguide connecting piece, realized the organic integration of dielectric waveguide transmission and beam shrinkage technology, effectively reduced millimeter wave signal energy diffusion and coupling loss on the transmission path, thereby prolonged millimeter wave signal transmission distance, and compared with copper interconnection and optical module has the advantage of low cost.

Description

Technical Field

[0001] This utility model relates to the field of data transmission technology, and in particular to a high-speed data transmission component and a high-speed data transmission module based on dielectric waveguides. Background Technology

[0002] With the continuous development and maturation of AI technology, the amount of data that data centers need to process is increasing daily. The demand for data transmission rates has risen from 100Gbps to 400Gbps, and then to 800Gbps, with transmission distance requirements generally within 10 meters. Currently, there are two main connection methods. The first is copper interconnect technology, which has a maximum transmission rate of around 200Gbps and a transmission distance of generally within 3 meters. The other is optical module technology, which can support transmission rates of 50Gbps to 800Gbps. Currently, many companies are developing 1.6Tbps optical communication technology, whose transmission distance can also fully cover the connection needs of data centers within 10 meters.

[0003] However, in practical applications, both copper interconnect technology and optical module technology face some technical shortcomings. Copper interconnect technology cannot make breakthroughs in terms of speed and distance, and suffers from severe signal attenuation. Although active copper cable technology can extend the distance to 5m, each cable consumes about 10W of power. While optical modules can fully meet the requirements in terms of speed and distance, their photoelectric conversion principle introduces a large data transmission delay. At the same time, optical modules also have high power consumption, around 15W for 400Gbps and over 20W for 800Gbps. In addition, the overall cost of optical module solutions is very high. Utility Model Content

[0004] The technical problem solved by this utility model is to provide a low-cost high-speed data transmission component and a high-speed data transmission module based on dielectric waveguide, which can realize data interconnection over short to medium distances.

[0005] To solve the above-mentioned technical problems, the present invention adopts the following technical solution: a high-speed data transmission component based on a dielectric waveguide, comprising a millimeter-wave antenna, a waveguide connector, a dielectric waveguide, and a dielectric lens. The waveguide connector has a cavity inside, and the outer surface of the waveguide connector is provided with a first pair of interfaces and a second pair of interfaces respectively communicating with the cavity. The first pair of interfaces corresponds to the millimeter-wave antenna. The dielectric waveguide is connected to the second pair of interfaces and is used to transmit antenna signals. The dielectric lens is disposed inside the cavity and is used to narrow the radiation angle of the antenna signal.

[0006] In one embodiment, one end of the dielectric waveguide is detachably plugged into the second pair of interfaces.

[0007] In one embodiment, a circuit board is also included, on which both the millimeter-wave antenna and the waveguide connector are disposed.

[0008] In one embodiment, the device further includes a chip electrically connected to the millimeter-wave antenna, the chip being packaged in the same AIP package as the millimeter-wave antenna.

[0009] In one embodiment, the first pair of interfaces is aligned with the second pair of interfaces.

[0010] In one embodiment, the dielectric lens is detachably mounted on the waveguide connector.

[0011] In one embodiment, the outer surface of the waveguide connector is further provided with a socket that communicates with the cavity, and the dielectric lens is inserted into the cavity through the socket.

[0012] In one embodiment, the dielectric waveguide includes a waveguide body, a buffer layer disposed on the outer surface of the waveguide body, and a metal layer disposed on the outer surface of the buffer layer.

[0013] In one embodiment, the waveguide connector has multiple chambers, multiple first pairs of interfaces, and multiple second pairs of interfaces, with each chamber, first pair of interfaces, and second pair of interfaces corresponding one-to-one. At least some of the chambers are provided with the dielectric lens. Any two chambers are isolated from each other, any two first pairs of interfaces are isolated from each other, and any two second pairs of interfaces are isolated from each other.

[0014] To solve the above-mentioned technical problems, the second technical solution adopted by this utility model is: a high-speed data transmission module, including the above-mentioned high-speed data transmission component based on dielectric waveguide.

[0015] The beneficial effects of this invention are as follows: This high-speed data transmission component based on dielectric waveguides achieves an organic integration of dielectric waveguide transmission and beamforming technology through the innovative structure of embedding a dielectric lens within the waveguide connector cavity. This effectively reduces energy diffusion and coupling loss of millimeter-wave signals along the transmission path, thereby extending the transmission distance of millimeter-wave signals, making it particularly suitable for application environments such as data centers. Compared to traditional optical module solutions, this component adopts an all-dielectric transmission path, avoiding photoelectric and electro-optical conversion stages. It can significantly reduce system power consumption and data transmission latency while supporting the same high-speed transmission, and greatly reduce material costs. Compared to copper interconnect technology, dielectric waveguides have lower dielectric loss characteristics at high frequencies. Combined with the lens's optimized radiation angle, signal integrity can be maintained over longer distances, expanding the application scenarios for high-speed transmission. In addition, the cavity structure of the waveguide connector provides an independent transmission space for each antenna, effectively isolating electromagnetic interference between multiple channels. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0017] Figure 1 This is a schematic diagram of a high-speed data transmission component based on a dielectric waveguide.

[0018] Figure 2 This is a schematic cross-sectional view of a high-speed data transmission component based on a dielectric waveguide.

[0019] Figure 3 An exploded view of a high-speed data transmission component based on a dielectric waveguide;

[0020] Figure 4 This is a schematic diagram of the waveguide connector in a high-speed data transmission component based on a dielectric waveguide.

[0021] Figure 5 This is a schematic diagram of the cross-section of a dielectric waveguide;

[0022] Figure 6 A schematic cross-sectional view of a high-speed data transmission component based on a dielectric waveguide, representing another type of structure.

[0023] Figure 7 This is a schematic diagram of a waveguide connector in a high-speed data transmission component based on a dielectric waveguide, representing another type of structure.

[0024] Figure 8 This is a framework diagram of a high-speed data transmission module.

[0025] Explanation of icon numbers:

[0026] 1. Millimeter-wave antenna; 11. Receiving antenna; 12. Transmitting antenna;

[0027] 2. Waveguide connector; 21. Chamber; 22. First pair of interfaces; 23. Second pair of interfaces; 24. Socket;

[0028] 3. Dielectric waveguide; 31. Waveguide body; 32. Buffer layer; 33. Metal layer;

[0029] 4. Medium lens;

[0030] 5. Circuit board;

[0031] 6. Millimeter-wave transceiver module one;

[0032] 7. Millimeter-wave transceiver module two;

[0033] 81. Gold finger interface; 82. Modulator; 83. PA; 84. Demodulator; 85. LNA; 86. Data terminal. Detailed Implementation

[0034] The purpose, features, and advantages of this utility model will be further explained in conjunction with the embodiments and with reference to the accompanying drawings.

[0035] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0036] It should be noted that if the embodiments of this utility model involve directional indicators such as up, down, left, right, front, back, etc., the directional indicators are only used to explain the relative positional relationship and movement of the components in a specific posture as shown in the attached figure. If the specific posture changes, the directional indicators will also change accordingly.

[0037] Furthermore, if the embodiments of this utility model involve descriptions such as "first" or "second," such descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features.

[0038] Furthermore, if the meaning of "and / or" in the entire text is to include three parallel solutions, taking "and A / or B" as an example, it includes solution A, solution B, and a solution that simultaneously satisfies both A and B. Additionally, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this utility model.

[0039] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0040] Example 1

[0041] Embodiment 1 of this utility model is as follows: Please refer to Figures 1 to 4 A high-speed data transmission component based on dielectric waveguides includes a millimeter-wave antenna 1, a waveguide connector 2, a dielectric waveguide 3, and a dielectric lens 4. The waveguide connector 2 is a metal structure with a cavity 21 inside. The outer surface of the waveguide connector 2 is provided with a first pair of interfaces 22 and a second pair of interfaces 23 respectively communicating with the cavity 21. The first pair of interfaces 22 corresponds to the millimeter-wave antenna 1. The dielectric waveguide 3 is connected to the second pair of interfaces 23 and is used to transmit antenna signals. The dielectric lens 4 is disposed in the cavity 21 and is used to narrow the radiation angle of the antenna signal, making the energy of the millimeter-wave signal more concentrated and providing better directivity. In some specific products, the addition of the dielectric lens 4 can improve the signal strength at the receiving end by 10-20 dB.

[0042] In a high-speed data transmission component with a single-antenna architecture, the millimeter-wave antenna 1 can be a receiving antenna or a transmitting antenna.

[0043] One end of the dielectric waveguide 3 is detachably plugged into the second pair of interfaces 23. The dielectric waveguide 3 and the second pair of interfaces 23 adopt a detachable plug-in connection method, which enables the dielectric waveguide 3 to be quickly installed or removed on site, facilitating maintenance, upgrades and fault replacement after system deployment. No welding or permanent fixing process is required, which reduces assembly complexity and maintenance costs. At the same time, it supports flexible selection of different specifications of dielectric waveguide 3 according to the actual transmission distance, improving the versatility and configuration flexibility of the components.

[0044] Optionally, the high-speed data transmission component based on dielectric waveguides also includes a circuit board 5, on which the millimeter-wave antenna 1 and the waveguide connector 2 are both disposed. Integrating the millimeter-wave antenna 1 and the waveguide connector 2 onto the same circuit board 5 achieves board-level integrated design of the RF front-end and the waveguide interface, shortens the electrical path between the millimeter-wave antenna 1 and the waveguide connector 2, reduces interconnection losses and parasitic parameters, and helps improve signal integrity; at the same time, it facilitates mass production using standard SMT surface mount technology, improves production efficiency and assembly consistency, reduces overall manufacturing costs, and supports miniaturization and thinning of the component.

[0045] In one or more embodiments, the high-speed data transmission component based on dielectric waveguides further includes a chip electrically connected to the millimeter-wave antenna 1, the chip and the millimeter-wave antenna 1 being packaged in the same AIP (Air-In-Package) device. By co-packaging the chip and the millimeter-wave antenna 1 in an AIP device, the integration of the RF front-end is further improved, the interconnect length from the chip to the millimeter-wave antenna 1 is greatly shortened, transmission line loss and electromagnetic interference are significantly reduced, high-frequency performance is improved, and the component's footprint is reduced. This provides conditions for constructing higher-density multi-channel arrays and enhances the system's environmental adaptability and reliability.

[0046] In this embodiment, the first pair of interfaces 22 and the second pair of interfaces 23 are aligned to form a direct signal transmission path between the millimeter-wave antenna 1 and the dielectric waveguide 3. This effectively avoids signal reflection and energy loss caused by interface misalignment, optimizes impedance continuity, improves transmission efficiency, simplifies the internal cavity structure design of the waveguide connector 2, and reduces processing difficulty and manufacturing cost.

[0047] In some embodiments, the dielectric lens 4 is fixedly mounted on the waveguide connector 2 without being detachable. In other embodiments, the dielectric lens 4 is detachably mounted on the waveguide connector 2, which allows the dielectric lens 4 to be flexibly replaced according to different transmission distances, bandwidth requirements, or environmental conditions. This facilitates the selection of dielectric lenses 4 with different materials, thicknesses, or curvature parameters to optimize the beam contraction effect without the need to replace the entire waveguide connector 2, reducing material inventory and maintenance costs, and also providing convenience for modular design and functional expansion of the product.

[0048] In this embodiment, the outer surface of the waveguide connector 2 is also provided with a socket 24 communicating with the cavity 21, and the dielectric lens 4 is inserted into the cavity 21 through the socket 24. By opening the socket 24 on the outer surface of the waveguide connector 2 to achieve lateral insertion installation of the lens, the lens disassembly and assembly process is greatly simplified while ensuring the alignment accuracy between the lens and the antenna. It supports online replacement or upgrade of the lens without disassembling the antenna and the dielectric waveguide 3, improving the maintainability and ease of operation of the system, while maintaining the overall compact structure of the waveguide connector 2.

[0049] like Figure 5As shown, in some embodiments, the dielectric waveguide 3 includes a waveguide body 31 and a metal layer 33 disposed on the outer surface of the waveguide body 31, wherein the metal layer 33 provides continuous electromagnetic shielding for the internal transmission path, effectively suppressing the coupling of external electromagnetic interference. In other embodiments, the dielectric waveguide 3 further includes a buffer layer 32, in which case the buffer layer 32 is disposed on the outer surface of the waveguide body 31, and the metal layer 33 is disposed on the outer surface of the buffer layer 32. The waveguide body 31 is wrapped with a buffer layer 32, which optimizes transmission performance and structural reliability through multiple mechanisms: In terms of electromagnetic characteristics, the low dielectric constant buffer layer 32 effectively reduces the overall effective dielectric constant of the dielectric waveguide 3, making the signal phase velocity closer to the speed of light, significantly reducing transmission delay and dispersion, while widening the operating bandwidth and improving cutoff frequency characteristics; In terms of mechanical structure, the buffer layer 32, as a flexible buffer medium, can absorb stress caused by temperature changes or bending deformation, preventing the metal layer 33 from cracking or peeling, thereby ensuring the reliability and durability of the dielectric waveguide 3 under small bending radii; In terms of manufacturing process, the soft buffer layer 32 can fill the microscopic defects on the surface of the waveguide body 31, providing a smooth and uniform coating substrate, simplifying the metallization process and improving the continuity and density of the metal layer 33; In addition, the buffer layer 32 also optimizes the field distribution mode of the cross section of the waveguide body 31, helps suppress the propagation of higher-order modes and surface waves, further enhances the purity of the main mode transmission, and reduces inter-symbol interference.

[0050] In one or more embodiments, the dielectric waveguide 3 is a plastic structural component. Optionally, the dielectric waveguide 3 is made of PTFE (polytetrafluoroethylene). Specifically, the waveguide body 31 is a plastic structural component, which can be made of materials such as PTFE; the buffer layer 32 is made of materials such as flexible foam or flexible foam (such as polyethylene foam).

[0051] like Figure 6 and Figure 7As shown, in another specific implementation of this embodiment, the waveguide connector 2 has multiple chambers 21, multiple first pairs of interfaces 22, and multiple second pairs of interfaces 23. The chambers 21, first pairs of interfaces 22, and second pairs of interfaces 23 correspond one-to-one. At least some of the chambers 21 are equipped with the dielectric lens 4. Any two chambers 21 are isolated from each other, any two first pairs of interfaces 22 are isolated from each other, and any two second pairs of interfaces 23 are isolated from each other. The waveguide connector 2 is provided with multiple isolated chambers 21 and corresponding first pairs of interfaces 22 and second pairs of interfaces 23, and the dielectric lens 4 is configured in at least some of the chambers 21, forming a multi-channel independent transmission architecture. This enables parallel transmission of multiple millimeter-wave signals within the same component, significantly improving the overall data throughput. Simultaneously, the physical isolation design of each chamber effectively reduces electromagnetic coupling and signal crosstalk between channels, ensuring the isolation and signal purity of multi-channel transmission. It supports collaborative operation with multiple antenna arrays, meeting the expansion requirements of high-bandwidth application scenarios. Since the dielectric lens 4 has the function of narrowing the radiation angle of the antenna signal, in this embodiment, the presence of the dielectric lens 4 is also helpful in solving the interference problem between adjacent antennas.

[0052] like Figure 8 As shown, this embodiment also provides a high-speed data transmission module, including the above-mentioned high-speed data transmission component based on dielectric waveguide. Specifically, the high-speed data transmission module includes two sets of cooperating high-speed data transmission components based on dielectric waveguide. One set of high-speed data transmission components based on dielectric waveguide is a millimeter-wave transceiver module 6, and the other set of high-speed data transmission components based on dielectric waveguide is a millimeter-wave transceiver module 7. The dielectric waveguide 3 connects the millimeter-wave transceiver module 6 and the millimeter-wave transceiver module 7.

[0053] In this embodiment, the millimeter-wave transceiver module 6 and the millimeter-wave transceiver module 7 have basically the same structure. The circuit board 5 of the high-speed data transmission component based on the dielectric waveguide is equipped with a gold finger interface 81, a modulator 82, a PA83 (power amplifier), a demodulator 84, an LNA85 (low-noise amplifier), a waveguide connector 2, and a millimeter-wave antenna 1. The millimeter-wave antenna 1 includes a receiving antenna 11 and a transmitting antenna 12. The gold finger interface 81 is used to connect to the data terminal 86. The modulator 82 modulates the data sent by the data terminal 86 to the millimeter-wave frequency band. The modulation algorithm is not limited, such as ASK, PAM4, PSK, QAM, etc. This modulation technology is existing technology and will not be described further. The PA83 amplifies the modulated millimeter-wave signal according to the transmission distance requirements. The transmitting antenna 12 converts the signal amplified by the PA83 into a wireless signal with a certain directionality and transmits the wireless signal to the dielectric waveguide 3 for transmission. The antenna type is not limited; it can be an AIP antenna, a board-level antenna, or an antenna on... CHIP, etc.; Receiving antenna 11 is used to receive wireless signals transmitted by dielectric waveguide 3 and convert the wireless signals into electrical signals. The antenna type is not limited; it can be an AIP antenna, a board-level antenna, or an Antennaon. CHIP, etc.; LNA85 amplifies the signal from receiving antenna 11 to a reasonable range for subsequent circuit processing; demodulator 84 recovers the real data stream from the millimeter-wave band signal of LNA85 through demodulation algorithm. The demodulation algorithm is not limited, such as ASK, PAM4, PSK, QAM, etc. This demodulation technology is existing technology and will not be described in detail; the waveguide connector 2 contains multiple cavities 21, which have three main functions: First, each millimeter-wave antenna 1 corresponds to an independent cavity 21, thereby shielding the interference between adjacent transmitting and receiving antennas; Second, each cavity 21 integrates a dielectric lens 4, which can be made of plastic material. The dielectric lens 4 is used to change the radiation angle of the millimeter-wave wireless signal, making its energy more concentrated, so that it can transmit over a longer distance; Third, it is used to install and fix the dielectric waveguide 3. Each dielectric waveguide 3 corresponds to an independent second pair of interfaces 23 and is connected to the corresponding cavity 21. Millimeter-wave transceiver module 1 (6) and millimeter-wave transceiver module 2 (7) can each contain multiple radio frequency transceiver channels, which can be specifically designed according to the number of data transfer requirements. Figure 8 The modules in the code are all represented graphically by superimposing multiple modules.

[0054] The above are merely optional embodiments of this utility model and do not limit the patent scope of this utility model. Any equivalent structural transformations made based on the inventive concept of this utility model and the contents of this utility model specification and drawings, or direct / indirect applications in other related technical fields, are included within the patent protection scope of this utility model.

Claims

1. A high-speed data transmission component based on a dielectric waveguide, characterized in that, include Millimeter-wave antenna; The waveguide connector has a cavity inside and the outer surface of the waveguide connector is provided with a first pair of interfaces and a second pair of interfaces that communicate with the cavity respectively. The first pair of interfaces corresponds to the millimeter-wave antenna. Dielectric waveguide, the dielectric waveguide connects to the second pair of interfaces, and the dielectric waveguide is used to transmit antenna signals; A dielectric lens is placed inside the cavity and is used to narrow the radiation angle of the antenna signal.

2. The high-speed data transmission component based on dielectric waveguide according to claim 1, characterized in that, One end of the dielectric waveguide can be detachably plugged into the second pair of interfaces.

3. The high-speed data transmission component based on dielectric waveguide according to claim 1, characterized in that, It also includes a circuit board, on which the millimeter-wave antenna and the waveguide connector are both mounted.

4. The high-speed data transmission component based on dielectric waveguide according to claim 1, characterized in that, It also includes a chip electrically connected to the millimeter-wave antenna, the chip and the millimeter-wave antenna being packaged in the same AIP package device.

5. The high-speed data transmission component based on dielectric waveguide according to claim 1, characterized in that, The first pair of interfaces is aligned with the second pair of interfaces.

6. The high-speed data transmission component based on dielectric waveguide according to claim 1, characterized in that, The dielectric lens can be detachably mounted on the waveguide connector.

7. The high-speed data transmission component based on dielectric waveguide according to claim 6, characterized in that, The outer surface of the waveguide connector is also provided with a socket that communicates with the cavity, and the dielectric lens is inserted into the cavity through the socket.

8. The high-speed data transmission component based on dielectric waveguide according to claim 1, characterized in that, The dielectric waveguide includes a waveguide body, a buffer layer disposed on the outer surface of the waveguide body, and a metal layer disposed on the outer surface of the buffer layer.

9. The high-speed data transmission component based on dielectric waveguide according to claim 1, characterized in that, The waveguide connector has multiple chambers, multiple first pairs of interfaces, and multiple second pairs of interfaces. The chambers, first pairs of interfaces, and second pairs of interfaces correspond one-to-one. At least some of the chambers are equipped with the dielectric lens. Any two chambers are isolated from each other, any two first pairs of interfaces are isolated from each other, and any two second pairs of interfaces are isolated from each other.

10. A high-speed data transmission module, characterized in that, Includes the high-speed data transmission component based on dielectric waveguide as described in any one of claims 1-9.

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