A high waterproof power adapter filled with glue

Abstract

The utility model relates to the field of power adapter discloses a kind of glue filling type high waterproof power adapter, including shell, the top of shell is connected with cover plate by bolt activity, the inside of shell is installed with circuit board module, the inside of shell is filled with heat-conducting potting glue, the heat-conducting potting glue is heat-conducting silica gel, sealing ring is jointly installed between shell and cover plate, the top surface of shell is provided with inner sealing groove. In the utility model, circuit board module is completely covered using high heat-conducting potting glue, heat generated when component works can be rapidly and uniformly conducted to the whole shell outer wall, internal working temperature can be effectively reduced, product service life is extended, and because elastic heat-conducting silica gel material is selected as potting glue, its adhesion with component and shell is moderate, when product needs maintenance, glue body is easy to peel off, and it is convenient to maintain and replace fault component.

Description

Technical Field

[0001] This utility model relates to the field of power adapters, and in particular to a potting-type highly waterproof power adapter. Background Technology

[0002] As a common power conversion device, power adapters are widely used in various electronic devices. In humid or dusty environments such as outdoors, industry, and bathrooms, stringent requirements are placed on the waterproof and dustproof performance of power adapters.

[0003] In existing technologies, the main way to achieve waterproof power adapters is through an overall potting process, which encapsulates the internal circuitry with materials such as epoxy resin. Although the waterproofing effect is good, the commonly used epoxy resin has poor thermal conductivity, making it difficult for the heat inside the adapter to dissipate, affecting the lifespan of components and conversion efficiency. At the same time, the potting compound is tightly bonded to the outer shell, making the product unrepairable once damaged, and it can only be scrapped as a whole. Utility Model Content

[0004] To overcome the above shortcomings, this utility model provides a potting-type high waterproof power adapter, which aims to improve the problem that the traditional overall potting process in the prior art uses epoxy resin with poor thermal conductivity and the potting glue is tightly bonded to the shell, making the product unrepairable once damaged.

[0005] To achieve the above objectives, the present invention adopts the following technical solution: a potting-type high waterproof power adapter, comprising a housing, a cover plate movably connected to the top of the housing by bolts, a circuit board module installed inside the housing, the interior of the housing being filled with a thermally conductive potting compound, the thermally conductive potting compound being thermally conductive silicone, a sealing ring being installed between the housing and the cover plate, an inner sealing groove being formed on the top surface of the housing, the inner sealing groove being filled with sealant, a compression ring being fixedly connected to the bottom surface of the cover plate, and an auxiliary groove being formed on the bottom surface of the cover plate.

[0006] As a further description of the above technical solution: The top surface of the outer casing is provided with a lower sealing groove, and a sealing ring is movably connected in the lower sealing groove.

[0007] As a further description of the above technical solution: The bottom surface of the cover plate is provided with an upper sealing groove, and the sealing ring is movably connected to the upper sealing groove.

[0008] As a further description of the above technical solution: Both the front and rear parts of the outer casing are connected by sealing rings.

[0009] As a further description of the above technical solution: Multiple heat-conducting strips are fixedly connected to the bottom of the inner wall of the outer casing, and multiple heat-dissipating strips are fixedly connected to the bottom of the outer casing.

[0010] As a further description of the above technical solution: The circuit board module has an output line installed at the front and an input line installed at the rear. The output line and the input line are movably connected to the sealing rings located at the front and rear, respectively.

[0011] This utility model has the following beneficial effects: 1. In this utility model, a highly thermally conductive potting compound is used to completely encapsulate the circuit board module, which can quickly and evenly conduct the heat generated by the components during operation to the entire outer wall of the housing, effectively reducing the internal operating temperature and extending the product's service life. Furthermore, since an elastic thermally conductive silicone material is selected as the potting compound, its adhesion to the components and the housing is moderate. When the product needs repair, the compound is easy to peel off, facilitating the repair and replacement of faulty components.

[0012] 2. In this utility model, by setting heat dissipation strips and heat conduction strips on the outer shell, heat dissipation can be further improved in conjunction with the thermally conductive potting compound, thereby improving heat dissipation efficiency. At the same time, by setting a sealing ring and the thermally conductive potting compound and the sealant in cooperation, a triple sealing structure can be formed, which further improves the waterproof effect of the device and makes it more practical. Attached Figure Description

[0013] Figure 1 This is a schematic diagram of the overall three-dimensional structure of a potting-type high waterproof power adapter proposed in this utility model; Figure 2 This is a partial three-dimensional cross-sectional view of the outer shell and cover plate of a potting-type high waterproof power adapter proposed in this utility model. Figure 3 This is a three-dimensional structural diagram showing the shell and cover of a potting-type high waterproof power adapter proposed in this utility model. Figure 4 This is a three-dimensional structural diagram showing the shell, cover plate, and circuit board module of a potting-type high waterproof power adapter proposed in this utility model. Figure 5 This is a three-dimensional structural diagram of the bottom of the casing of a potting-type highly waterproof power adapter proposed in this utility model. Legend: 1. Outer shell; 2. Cover plate; 3. Output line; 4. Input line; 5. Sealing ring; 6. Thermally conductive potting compound; 7. Circuit board module; 8. Sealant; 11. Lower sealing groove; 12. Inner sealing groove; 13. Sealing ring; 14. Thermal conductive strip; 15. Heat sink strip; 21. Upper sealing groove; 22. Extrusion ring; 23. Auxiliary groove. Detailed Implementation

[0014] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0015] Reference Figures 1-3 This utility model provides an embodiment of a potting-type high waterproof power adapter, including a housing 1. A cover plate 2 is movably connected to the top of the housing 1 by bolts. The housing 1 and the cover plate 2 together form the housing of the power adapter. A circuit board module 7 is installed inside the housing 1, which is the core component of the power adapter. Sealing rings 13 are fixedly connected through the front and rear parts of the housing 1 to ensure the sealing of the connection between the circuit and the housing 1. The connection can be sealed with waterproof glue. An output line 3 is installed at the front of the circuit board module 7, and an input line 4 is installed at the rear of the circuit board module 7. The output line 3 and the input line 4 are movably connected to the sealing rings 13 located at the front and rear, respectively.

[0016] like Figures 4-5 As shown, multiple heat-conducting strips 14 are fixedly connected to the bottom of the inner wall of the outer casing 1, and multiple heat dissipation strips 15 are fixedly connected to the bottom of the outer casing 1 to assist in heat dissipation.

[0017] Please see Figures 2-4 The interior of the outer shell 1 is filled with a thermally conductive potting compound 6, which can completely encapsulate the circuit board module 7. The thermally conductive potting compound 6 is thermally conductive silicone, which has thermal conductivity and waterproof properties and moderate adhesion. A sealing ring 5, which can be made of silicone, is installed between the outer shell 1 and the cover plate 2. An inner sealing groove 12 is opened on the top surface of the outer shell 1, and the inner sealing groove 12 is filled with sealant 8 to seal the connection between the outer shell 1 and the cover plate 2. An extrusion ring 22 is fixedly connected to the bottom surface of the cover plate 2 to extrude the sealant 8 in the inner sealing groove 12, so that the extruded sealant 8 can fill the auxiliary groove 23 to improve the sealing between the outer shell 1 and the cover plate 2. An auxiliary groove 23 is opened on the bottom surface of the cover plate 2. A lower sealing groove 11 is opened on the top surface of the outer shell 1, and a sealing ring 5 is movably connected in the lower sealing groove 11. An upper sealing groove 21 is opened on the bottom surface of the cover plate 2, and the sealing ring 5 is movably connected to the upper sealing groove 21 to seal between the cover plate 2 and the outer shell 1.

[0018] Working principle: During assembly, first place the sealing ring 5 in the lower sealing groove 11, then put the circuit board module 7 into the housing 1, then inject an appropriate amount of thermally conductive potting compound 6 into the housing 1, and then inject sealant 8 into the inner sealing groove 12. Close the cover plate 2 and use bolts to fix the housing 1 and the cover plate 2. At this time, the sealing ring 5 will be inserted into the upper sealing groove 21 and squeezed to form the first seal. The extrusion ring 22 will squeeze the sealant 8 in the inner sealing groove 12. The extruded sealant 8 will fill the auxiliary groove 23 between the housing 1 and the cover plate 2 and finally cure to form the second internal seal. Then, apply waterproof glue to the outlet of the output line 3 and the input line 4 for sealing.

[0019] When repair is needed, the screws can be unscrewed, and the outer shell 1 and cover plate 2 can be carefully separated. Since the thermally conductive potting compound 6 is elastic, it can be removed from the outer shell 1 as a whole with the circuit board module 7. Then, the compound can be carefully peeled off to expose the components for testing and replacement. After the repair is completed, new compound can be refilled to restore the product.

[0020] Additionally, it should be noted that components not described in detail in this article are existing technologies.

[0021] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A potting-type highly waterproof power adapter, comprising a housing (1), characterized in that: The top of the outer shell (1) is movably connected to a cover plate (2) by bolts. A circuit board module (7) is installed inside the outer shell (1). The interior of the outer shell (1) is filled with a thermally conductive potting compound (6), which is thermally conductive silicone. A sealing ring (5) is installed between the outer shell (1) and the cover plate (2). An inner sealing groove (12) is opened on the top surface of the outer shell (1). The inner sealing groove (12) is filled with sealant (8). An extrusion ring (22) is fixedly connected to the bottom surface of the cover plate (2). An auxiliary groove (23) is opened on the bottom surface of the cover plate (2).

2. The potting-type high waterproof power adapter according to claim 1, characterized in that: The top surface of the outer shell (1) is provided with a lower sealing groove (11), and a sealing ring (5) is movably connected in the lower sealing groove (11).

3. A potting-type high waterproof power adapter according to claim 2, characterized in that: The bottom surface of the cover plate (2) is provided with an upper sealing groove (21), and the sealing ring (5) is movably connected to the upper sealing groove (21).

4. A potting-type high waterproof power adapter according to claim 1, characterized in that: The front and rear parts of the outer shell (1) are both connected by sealing rings (13).

5. A potting-type high waterproof power adapter according to claim 1, characterized in that: The bottom of the inner wall of the outer shell (1) is fixedly connected with multiple heat-conducting strips (14), and the bottom of the outer shell (1) is fixedly connected with multiple heat-dissipating strips (15).

6. A potting-type high waterproof power adapter according to claim 4, characterized in that: The circuit board module (7) has an output line (3) installed at the front and an input line (4) installed at the rear. The output line (3) and the input line (4) are respectively movably connected to the sealing ring (13) located at the front and rear.

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