Electronic device

Abstract

The application discloses an electronic device, and belongs to the field of electronic devices.The electronic device comprises a circuit board and a frame body, wherein the circuit board comprises an insulating layer and a conductive layer, the conductive layer is arranged on one side of the insulating layer in a laminated mode, and the outermost conductive layer in the circuit board is provided with a avoiding hole on the side away from the insulating layer; the frame body is provided with a protruding structure, the protruding structure abuts against the side of the conductive layer away from the insulating layer, a part of the protruding structure extends into the avoiding hole, and the outer surface of the protruding structure is connected with the conductive layer.

Description

Technical Field

[0001] This application belongs to the field of electronic equipment technology, and specifically relates to an electronic device. Background Technology

[0002] With the continuous development of communication technology, the types of antenna frequency bands are increasing. In order to improve communication quality, electronic devices such as mobile phones usually need to establish a reliable grounding relationship on the circuit board to minimize electromagnetic interference. In related technologies, metal springs are usually set on the circuit board. The elasticity of the springs allows the metal springs to form a stable contact with the motherboard bracket or frame and other metal structures, so that the circuit board can be reliably grounded.

[0003] However, in the above technical solutions, since the metal spring is an additional material and needs to be fixed to the circuit board by welding or other methods, it will have an adverse impact on the cost and processing efficiency of electronic devices. Utility Model Content

[0004] The purpose of this application is to provide an electronic device that addresses the problem that the additional metal springs used in current electronic devices to avoid electromagnetic interference negatively impact the cost and manufacturing efficiency of the electronic devices.

[0005] This application provides an electronic device, which includes a circuit board and a frame, wherein... The circuit board includes an insulating layer and a conductive layer. The conductive layer is stacked on one side of the insulating layer. The outermost conductive layer in the circuit board has a clearance hole on the side facing away from the insulating layer. The frame is provided with a protruding structure, and the protruding structure abuts against the side of the conductive layer away from the insulating layer. A portion of the protruding structure extends into the clearance hole, and the outer surface of the protruding structure is connected to the conductive layer.

[0006] In the electronic device disclosed in this application embodiment, the conductive layer in the circuit board is stacked on one side of the insulating layer, and the outermost conductive layer in the circuit board has a clearance hole on the side away from the insulating layer. Correspondingly, the frame has a protruding structure, and since the protruding structure is formed by the body material of the frame, it will not lead to an increase in the cost of the electronic device.

[0007] Meanwhile, during the assembly process of the electronic device disclosed in this application embodiment, the protruding structure abuts against the side of the conductive layer away from the insulating layer. This allows a portion of the protruding structure to extend into the clearance hole, and makes the outer surface of the protruding structure electrically connected to the conductive layer, ensuring that the frame can form a stable assembly relationship with the circuit board, thereby increasing the grounding stability of the circuit board. Furthermore, since the circuit board is provided with clearance holes, it can avoid the protruding structure, reducing the degree of interference between the protruding structure and the circuit board, thereby reducing the degree of compression of the circuit board and preventing the circuit board from being punctured and damaged by the protruding structure during assembly with the frame and during subsequent use. Attached Figure Description

[0008] Figure 1 This is a cross-sectional structural schematic diagram of an electronic device disclosed in a specific embodiment of this application; Figure 2 This is a cross-sectional structural schematic diagram of an electronic device disclosed in another specific embodiment of this application; Figure 3 yes Figure 2 The diagram shows the structure of the electronic device. Figure 4 This is a schematic diagram of the structure of an electronic device disclosed in another specific embodiment of this application; Figure 5 This is a schematic diagram of the structure of an electronic device disclosed in another specific embodiment of this application; Figure 6 This is a schematic diagram of the structure of an electronic device disclosed in another specific embodiment of this application; Figure 7 yes Figure 5 and Figure 6 A cross-sectional schematic diagram of the structure is shown; Figure 8 This is a schematic diagram of the structure of an electronic device disclosed in another specific embodiment of this application; Figure 9 yes Figure 8 The diagram shows the structure of the electronic device. Figure 10 This is a schematic diagram of the structure of an electronic device disclosed in another specific embodiment of this application.

[0009] The attached diagram is described as follows: 1-Frame, 10-Protruding structure, 101-Arched ring, 102-Dome top, 2-Circuit board, 21-Conductive layer, 211-Allow-through hole, 22-Insulating layer, 23-Support layer, 231-Through hole 3-Screw hole. Detailed Implementation

[0010] The technical solutions of the embodiments of this application will be clearly described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application are within the scope of protection of this application.

[0011] The terms "first," "second," etc., used in the specification and claims of this application are used to distinguish similar objects and not to describe a specific order or sequence. It should be understood that such use of data can be interchanged where appropriate so that embodiments of this application can be implemented in orders other than those illustrated or described herein, and the objects distinguished by "first," "second," etc., are generally of the same class and the number of objects is not limited; for example, a first object can be one or more. Furthermore, in the specification and claims, "and / or" indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship.

[0012] like Figures 1-10 As shown in the illustration, this application discloses an electronic device, which can be a mobile phone or a tablet computer, etc. In this embodiment, the electronic device includes a circuit board 2 and a frame 1. Of course, the electronic device usually also includes components such as a battery and a display screen, which will not be listed here. The frame 1 may only have a grounding function. In other embodiments of this application, the frame 1 may also have other functions, such as serving as a mounting base for other components, or it may also serve as a structural component of the electronic device. For example, the frame 1 may be the frame of the electronic device or the support for the circuit board 2. In other words, in this application, metal components such as the frame and the support for the circuit board 2 can serve as the frame 1 and provide a grounding function. Therefore, in this embodiment, the frame 1 is a metal structural component.

[0013] As described above, in related technologies, additional metal springs are typically configured and fixedly connected to the frame 1 by means of welding or other methods, so that during the assembly of electronic devices, the metal springs and the conductive layer 21 of the circuit board 2 can form an elastic connection relationship, thereby achieving the grounding purpose of the circuit board 2.

[0014] Since the above-mentioned technical solutions in the related technologies will have a significant adverse impact on the cost and processing efficiency of electronic devices, the inventors of this application have creatively proposed a solution that allows the frame 1 itself to contact the conductive layer 21 of the circuit board 2 to form an electrical connection.

[0015] In detail, during the assembly of electronic equipment, screws and other connectors can be used to form a stable assembly relationship between the frame 1 and the circuit board 2. During the assembly process, by making the conductive layer 21 of the frame 1 and the circuit board 2 come into contact with each other, the circuit board 2 can form a conductive connection with the frame 1, thereby enabling the circuit board 2 to achieve the purpose of grounding.

[0016] In response to the above solution, the inventors further discovered that as the electronic device is used for a longer period of time, the screws may loosen to a certain extent, which may lead to unstable or even broken bonding between the conductive layer 21 of the circuit board 2 and the frame 1, resulting in grounding failure of the circuit board 2.

[0017] Based on the above issues, such as Figure 1 As shown, through further inventive work, the inventors proposed a technical solution that uses stamping to form the protruding structure 10 on the frame 1. In this case, after the frame 1 and the circuit board 2 are assembled, the protruding structure 10 and the conductive layer 21 of the circuit board 2 can form a mutually abutting, compression-fitting relationship. In this case, even if the screws loosen after a period of use, the contact fit between the protruding structure 10 and the conductive layer 21 of the circuit board 2 can be kept stable, thereby improving the grounding reliability of the circuit board 2.

[0018] However, the inventors further discovered that during the assembly of electronic devices using the above-mentioned technical solution, in order to ensure the high reliability of the initial assembly between the frame 1 and the circuit board 2, the tightening force of the screws during installation is relatively large. This may cause the frame 1 and the circuit board 2 to squeeze each other, resulting in large local deformation of the circuit board 2. It may even cause the protruding structure 10 to pierce the circuit board 2, resulting in short circuits in the internal wiring of the circuit board 2.

[0019] Based on the above, the inventors of this application have made further creative efforts to make deeper structural improvements to the above technical solution.

[0020] In detail, such as Figure 2 As shown, in the electronic device disclosed in the embodiments of this application, the circuit board 2 includes an insulating layer 22 and a conductive layer 21. The insulating layer 22 is formed of an insulating material, which may specifically include materials such as glass fiber, epoxy resin, polytetrafluoroethylene and polyimide. The conductive layer 21 is usually formed of a metal material. More specifically, the conductive layer 21 may be formed of copper to improve the conductivity of the conductive layer 21.

[0021] During the design and fabrication of circuit board 2, such as Figure 2As shown, the conductive layer 21 is stacked on one side of the insulating layer 22. Optionally, the circuit board 2 is a single-layer board, that is, the circuit board 2 includes only one conductive layer 21, and correspondingly, the conductive layer 21 is located on the outermost side of the entire circuit board 2 (such as the upper or lower surface).

[0022] In other embodiments of this application, the number of conductive layers 21 may be two or more, thereby making the circuit board 2 a double-layer board or a multi-layer board. Of course, in the embodiments of this application, an insulating layer 22 is provided between any two adjacent conductive layers 21 to ensure that the two adjacent conductive layers 21 are insulated from each other in the absence of other structures providing conductivity. At the same time, in the embodiments of this application, at least one conductive layer 21 is provided on the outermost side of the circuit board 2, that is, at least one of the upper surface and the lower surface of the circuit board 2 is a conductive layer 21.

[0023] In this context, to address the problem that the protruding structure 10 of the frame 1 and the circuit board 2 might be damaged due to mutual compression in the aforementioned technical solution, the inventors have proposed the electronic device disclosed in the following embodiments of this application. Wherein, as Figure 2 As shown, the outermost conductive layer 21 of the circuit board 2 has a clearance hole 211 on the side away from the insulating layer 22.

[0024] Specifically, the clearance hole 211 can be a blind hole. In this case, the clearance hole 211 is formed by recessing from the surface of the conductive layer 21 away from the insulating layer 22, thereby reducing the thickness of the area where the clearance hole 211 is located in the conductive layer 21. As a result, when the protrusion structure 10 of the frame 1 is assembled with the circuit board 2, the clearance hole 211 can avoid the protrusion structure 10 to a certain extent, thereby reducing the degree of interference between the protrusion structure 10 and the circuit board 2, reducing the degree of compression of the circuit board 2, and preventing the circuit board 2 from being damaged during assembly with the frame 1 and during subsequent use.

[0025] like Figure 2 As shown, the frame 1 is provided with a protruding structure 10. More specifically, in the electronic device disclosed in the embodiments of this application, the protruding structure 10 is formed by a stamping process, which can reduce the difficulty of forming the protruding structure 10. That is, the protruding structure 10 is formed by the frame 1 itself. Before the protruding structure 10 is formed, the two sides of the corresponding area in the frame 1 are both flat. After the protruding structure 10 is formed, the protruding structure 10 protrudes from one of the aforementioned flat surfaces in the frame 1 and is recessed from the other of the aforementioned flat surfaces.

[0026] Furthermore, in the manufacturing process of electronic devices, the manufacturing processes of components such as the frame 1 and the support of the circuit board 2 typically include stamping processes. Therefore, when adopting the technical solution disclosed in the embodiments of this application, the process of additionally forming a protruding structure 10 on the frame 1 will not have a significant impact on the overall manufacturing difficulty and efficiency of the electronic device.

[0027] During the assembly of electronic devices, the protruding structure 10 abuts against the conductive layer 21 on the side away from the insulating layer 22. Both the frame 1 and the circuit board 2 can be provided with screw holes 3 so that they can be connected by screws or other connectors. A part of the protruding structure 10 can extend into the clearance hole 211. Correspondingly, the outer surface of the protruding structure 10 is connected to the conductive layer 21 so that a conductive relationship is formed between the circuit board 2 and the frame 1.

[0028] More specifically, in the process of forming the protrusion structure 10 and the clearance hole 211, the shape and size of the two need to be designed to ensure that a part of the protrusion structure 10 can extend into the clearance hole 211, and to ensure that after the protrusion structure 10 extends into the clearance hole 211, at least a part of the outer surface of the protrusion structure 10 can be electrically connected to the conductive layer 21.

[0029] In one specific embodiment of this application, the dimensions of the protrusion structure 10 and the clearance hole 211 in the thickness direction of the conductive layer 21 can be limited. For example, in the thickness direction, the size of the protrusion structure 10 can be larger than the size of the clearance hole 211. In this case, the clearance hole 211 can be a blind hole, and when the protrusion structure 10 extends into the clearance hole 211, it can be ensured that the top of the protrusion structure 10 (i.e., the most protruding position of the protrusion structure 10) can form a good contact relationship with the bottom of the clearance hole 211. Furthermore, in this embodiment, since the protrusion structure 10 can be interconnected with the bottom of the clearance hole 211, it is basically unnecessary to consider the dimensional relationship between the protrusion structure 10 and the clearance hole 211 in the direction perpendicular to the aforementioned thickness.

[0030] In another embodiment of this application, the minimum dimension of the inner wall of the clearance hole 211 can be smaller than the maximum dimension of the outer surface of the protrusion structure 10 in the direction perpendicular to the thickness direction of the conductive layer 21. In this case, by aligning the clearance hole 211 and the protrusion structure 10 at the aforementioned positions, the outer surface of the protrusion structure 10 can form a good contact relationship with the sidewall of the clearance hole 211, which can also ensure a good grounding effect for the circuit board 2. Accordingly, in this embodiment, since the protrusion structure 10 can be interconnected with the sidewall of the clearance hole 211, there is basically no need to consider the dimensional relationship between the protrusion structure 10 and the clearance hole 211 in the aforementioned thickness direction, and there are no requirements for whether the clearance hole 211 is a blind hole or a through hole.

[0031] In the electronic device disclosed in this application embodiment, the conductive layer 21 in the circuit board 2 is stacked on one side of the insulating layer 22, and the outermost conductive layer 21 in the circuit board 2 is provided with a clearance hole 211 on the side away from the insulating layer 22. Correspondingly, the frame 1 is provided with a protruding structure 10. Since the protruding structure 10 is formed by the body material of the frame 1, it will not lead to an increase in the cost of the electronic device.

[0032] Meanwhile, during the assembly process of the electronic device disclosed in this application embodiment, the protruding structure 10 abuts against the side of the conductive layer 21 facing away from the insulating layer 22. This allows a portion of the protruding structure 10 to extend into the clearance hole 211, and makes the outer surface of the protruding structure 10 electrically connected to the conductive layer 21, ensuring that the frame 1 can form a stable assembly relationship with the circuit board 2, thereby making the grounding stability of the circuit board 2 higher. Furthermore, since the circuit board is provided with clearance holes, it can avoid the protruding structure, thereby reducing the degree of interference between the protruding structure and the circuit board, thereby reducing the degree of compression of the circuit board, and preventing the circuit board from being punctured and damaged by the protruding structure during assembly with the frame and during subsequent use.

[0033] To maximize the reliability of the connection between the protruding structure 10 and the clearance hole 211, and to appropriately increase the connection area between the protruding structure 10 and the clearance hole 211, in a specific embodiment of this application, such as... Figure 3 , Figure 4 , Figure 5 and Figure 6 As shown, in the direction perpendicular to the thickness direction of the conductive layer 21, the minimum dimension of the sidewall of the clearance hole 211 can be smaller than the maximum dimension of the outer surface of the protrusion structure 10. In this case, when the frame 1 and the circuit board 2 are assembled together, a portion of the protrusion structure 10 extends into the clearance hole 211, allowing the outer surface of the protrusion structure 10 to connect with the sidewall of the clearance hole 211, thereby forming a conductive relationship between the circuit board 2 and the frame 1.

[0034] That is, in this embodiment, in the direction perpendicular to the thickness direction of the conductive layer 21, the size of at least a portion of the structure in the sidewall of the clearance hole 211 is smaller than the size of at least a portion of the structure in the outer surface of the protrusion structure 10. In the design and manufacturing process, by making the larger portion of the protrusion structure 10 and the smaller portion of the sidewall of the clearance hole 211 cooperate with each other, it can be ensured that the outer surface of the protrusion structure 10 can form a contact connection with the sidewall of the clearance hole 211, thereby ensuring that the circuit board 2 can form a reliable and stable grounding relationship through the frame 1.

[0035] Based on the above embodiments, the maximum dimensions of the outer surface of the protrusion structure 10 can be equal or substantially equal in any direction perpendicular to the front and rear thickness direction. Correspondingly, the maximum dimensions of the sidewall of the clearance hole 211 can also be equal or substantially equal in any direction perpendicular to the front and rear thickness direction. In this case, the processing and assembly difficulty of the protrusion structure 10 and the clearance hole 211 can be reduced. Furthermore, in this case, in the circumferential direction of the clearance hole 211, it can be basically guaranteed that any circumferential position of the outer surface of the protrusion structure 10 can form a pressing and fitting relationship with the corresponding circumferential position in the sidewall of the clearance hole 211, thereby ensuring that the grounding reliability between the circuit board 2 and the frame 1 is relatively high.

[0036] More intuitively, in the above embodiments of this application, such as Figure 2 and Figure 3 As shown, the outer surface of the protrusion structure 10 can be a hemispherical structure, and the clearance hole 211 can be a cylindrical hole. In this case, the maximum diameter of the outer surface of the protrusion structure 10 is smaller than the diameter of the clearance hole 211. Therefore, during the assembly of electronic equipment, it can be ensured that a portion of the outer surface of the protrusion structure 10 extending into the clearance hole 211 can contact and fit with the sidewall of the clearance hole 211, so that the outer surface of the protrusion structure 10 is connected to the sidewall of the clearance hole 211, ensuring that the circuit board 2 and the frame 1 form a stable conductive connection.

[0037] The hemispherical shape of the outer surface of the protruding structure 10 refers to the requirement that the shape of the outer surface of the stamped protruding structure 10 is hemispherical or approximately hemispherical during the design and processing of the protruding structure 10. Of course, due to the influence of parameters such as processing accuracy, the shape of the outer surface of the stamped protruding structure 10 may not be a regular hemispherical shape, which is also within the scope of protection defined by this application. Similarly, the same applies to the clearance hole 211, which is a cylindrical hole. It is part of the design intent of this application, but due to limitations such as processing, the actual structure formed on the product may not be a regular cylindrical hole, but this is also included within the scope of protection of this application.

[0038] During the assembly of circuit board 2 and frame 1, a certain degree of mutual compression is required between the protruding structure 10 and the clearance hole 211. Therefore, in order to further reduce the degree of interference between the protruding structure 10 and the clearance hole 211, and to minimize the probability of damage to circuit board 2 during assembly, in another embodiment of this application, such as... Figure 4As shown, the outer surface of the protrusion structure 10 can remain hemispherical. At the same time, the structure of the clearance hole 211 can be designed so that the minimum dimension of the sidewall of the clearance hole 211 is smaller than the maximum diameter of the outer surface of the protrusion structure 10 in the direction perpendicular to the thickness direction of the conductive layer 21, and the maximum dimension of the sidewall of the clearance hole 211 is larger than the maximum diameter of the outer surface of the protrusion structure 10.

[0039] Intuitively speaking, such as Figure 4 As shown, the clearance hole 211 can be a cross-shaped hole. In this case, the distance between the two ends of the cross portion in the sidewall is greater than the maximum diameter of the protruding structure 10, while the distance between the structures located between the cross portions in the sidewall is less than the maximum diameter of the protruding structure 10. Of course, the above-mentioned solution is an exemplary structure. In other embodiments of this application, the clearance hole 211 can also be a pentagonal shape, or it can be an irregular shape. This document does not limit the scope of the invention.

[0040] When the above technical solution is adopted, during the assembly of circuit board 2 and frame 1, by pressing the protruding structure 10 into the clearance hole 211 to a certain extent, the clearance hole 211 can be adapted to undergo structural deformation, thereby transferring the conductive material of the smaller part of the clearance hole 211 to the larger part of the clearance hole 211. This further reduces the interference between the protruding structure 10 and the clearance hole 211, while further increasing the contact area between the protruding structure 10 and the clearance hole 211. This not only improves the grounding reliability of circuit board 2, but also further reduces the probability of circuit board 2 being damaged.

[0041] As described above, the protruding structure 10 is formed by stamping. In the above embodiments, the protruding structure 10 is hemispherical, which makes the processing of the protruding structure 10 relatively difficult. Moreover, the dimensions of the protruding structure 10 in the thickness direction (i.e., the height of the protruding structure 10) are easy to get out of control. It is easy for the height of the protruding structure 10 to be too large or too small, which will cause the entire frame 1 to be scrapped. This will also have an adverse impact on the production cost of electronic devices.

[0042] Based on the above, in another embodiment of this application, such as Figures 5-7 As shown, the protrusion structure 10 may also include an arc-shaped ring portion 101 and a dome portion 102, wherein the arc-shaped ring portion 101 extends inwardly along the thickness direction of the conductive layer 21, and the dome portion 102 is connected to one end of the arc-shaped ring portion 101 near the insulating layer 22, and the curvature of the dome portion 102 is less than the curvature of the arc-shaped ring portion 101.

[0043] More intuitively, in this embodiment of the application, the dome 102 is the top structure of the protruding structure 10, and the arc-shaped ring 101 is located between the dome 102 and the body of the frame 1. Of course, in the above embodiment, the dome 102 and the arc-shaped ring 101 are integrally formed during the stamping process. Here, the protruding structure 10 is artificially divided into two parts only to more clearly express the specific structure of the protruding structure 10. In the actual structure, there is basically no clear structural boundary between the dome 102 and the arc-shaped ring 101.

[0044] The arc-shaped ring portion 101 is generally a closed ring structure, and in the protruding direction of the protruding structure 10, the arc-shaped ring portion 101 gradually extends from the surface of the frame 1. At the same time, as the arc-shaped ring portion 101 extends in the protruding direction, it also gradually bends and extends towards its own central axis (which is also the central axis of the protruding structure 10). More intuitively, in the electronic device disclosed in the embodiments of this application, the specific structure of the arc-shaped ring portion 101 can be similar to the part remaining after the top of a hemispherical structure has been cut off.

[0045] Furthermore, in this embodiment, by making the curvature of the dome 102 less than the curvature of the arc-shaped ring 101, the top region of the protruding structure 10 is relatively flat. In this case, the compressive performance of the protruding structure 10 on the circuit board 2 can be reduced, and the protruding structure 10 can be prevented from "piercing" the conductive layer 21 of the circuit board 2 as much as possible. In addition, since the height control of the hemispherical protruding structure 10 formed by the stamping process is relatively easy, if the height of the formed hemispherical protruding structure 10 is large, the height of the protruding structure 10 can be reduced by appropriately tapping or squeezing the top of the hemispherical protruding structure 10, and the structure of the protruding structure 10 in the electronic device disclosed in this embodiment can be formed to meet the height design of the protruding structure 10, so as to minimize the scrap rate of the frame 1.

[0046] In the above embodiments, the dimensions of the arc-shaped ring portion 101 and the dome portion 102 in the protruding structure 10 can be equal or substantially equal in any direction perpendicular to the thickness direction. To further reduce the processing difficulty of the protruding structure 10 described above, such as... Figure 5 and Figure 6 As shown, the dimension of the protrusion 10 in the first direction can be larger than the dimension of the protrusion 10 in the second direction. A preset angle exists between the first and second directions, which can be α. In one optional embodiment, the preset angle can be set to a range of 0° < α ≤ 90°, and both the first and second directions are perpendicular to the thickness direction. In a specific embodiment of this application, the first and second directions can be made perpendicular to each other. More intuitively, the first direction can be... Figure 5In the direction X, the second direction can be Figure 5 in the direction Y.

[0047] That is, in the above embodiments, the protruding structure 10 can be a long track-shaped structure. In this case, by making the top of the protruding structure 10 a relatively flat dome 102, it is easier to control the overall height of the protruding structure 10, thereby greatly reducing the processing difficulty of the protruding structure 10 and relatively easier to reduce the processing cost of the frame 1 and the entire electronic device.

[0048] As described above, the clearance hole 211 can be a blind hole or a through hole. In order to prevent the protrusion structure 10 from piercing the conductive layer 21 of the circuit board 2, in this application, regardless of whether the clearance hole 211 is a blind hole or a through hole, the size of the protrusion structure 10 in the thickness direction cannot be too large. Quantitatively speaking, in the electronic device disclosed in the embodiments of this application, the size of the protrusion structure 10 in the thickness direction of the conductive layer 21 can be less than or equal to 6 times the thickness of the conductive layer 21, so that during the assembly of the electronic device, under the clearance action of the clearance hole 211, after the protrusion structure 10 and the circuit board 2 are pressed against each other, the circuit board 2 can still maintain the required structural performance.

[0049] Furthermore, under ideal conditions, as long as the protrusion 10 protrudes from the surface of the frame 1, after the frame 1 and the circuit board 2 are assembled, a portion of the protrusion 10 can extend into the clearance hole 211. By designing the dimensions of the protrusion 10 and the clearance hole 211 in the direction perpendicular to the aforementioned thickness direction, the outer surface of the protrusion 10 can contact the sidewall of the clearance hole 211, thereby enabling the circuit board 2 and the frame 1 to form a conductive relationship.

[0050] However, due to the influence of processing and assembly precision, if the size of the protrusion structure 10 in the thickness direction is too small, the protrusion structure 10 may not be able to form a reliable connection with the clearance hole 211 due to factors such as the assembly gap between the frame 1 and the circuit board 2. Based on this, in order to more intuitively describe the above technical solution, optionally, in the electronic device disclosed in the embodiments of this application, the size of the protrusion structure 10 in the thickness direction of the conductive layer 21 can be greater than or equal to three times the thickness of the conductive layer 21. In this case, it can be basically guaranteed that the protrusion structure 10 and the conductive layer 21 form a good conductive relationship. At the same time, in this case, the aspect ratio of the protrusion structure 10 is relatively small, which can also appropriately reduce the processing difficulty of the stamped protrusion structure 10. Here, the width of the protrusion structure 10 refers to the size of the protrusion structure 10 in the direction perpendicular to the aforementioned thickness direction, and correspondingly, the height of the protrusion structure 10 refers to the size of the protrusion structure 10 in the aforementioned thickness direction.

[0051] In one specific embodiment of this application, the size of the protrusion structure 10 in the thickness direction can be between 0.10 and 0.15 mm (inclusive), and the size of the conductive layer 21 can be between 0.025 mm and 0.035 mm (inclusive). Based on this, in order to improve the reliability of the circuit board 2, the size of the insulating layer 22 can be between 0.02 mm and 0.06 mm (inclusive). Furthermore, in the embodiment where the protrusion structure 10 adopts the above-described configuration including the arc-shaped ring portion 101 and the dome portion 102, the size of the protrusion structure 10 in the thickness direction can be further reduced, typically reducing the maximum size of the protrusion structure 10 to below 0.10 mm (inclusive). Moreover, the maximum size of the protrusion structure 10 in the direction perpendicular to the thickness direction can typically be between 0.2 mm and 0.3 mm (inclusive).

[0052] As described above, the clearance hole 211 can be a cylindrical hole or a cross-shaped hole. In the above embodiments, the sidewalls of the clearance hole 211 are all straight walls, that is, the sidewalls of the clearance hole 211 extend along the thickness direction of the conductive layer 21. In order to further increase the contact area between the sidewall of the clearance hole 211 and the outer surface of the protrusion structure 10, in another embodiment of this application, such as Figure 7 , Figure 8 and Figure 10 As shown, the sidewall of the clearance hole 211 can be flared, with the flared sidewall facing the side where the frame 1 is located. In this case, when the protrusion 10 extends into the clearance hole 211, the portion of the clearance hole 211 further away from the insulating layer 22 has a larger dimension in the direction perpendicular to the thickness direction. This makes the shape of the clearance hole 211 more compatible with the shape of the protrusion 10, thereby increasing the contact area between the two and further reducing the degree of interference between the protrusion 10 and the clearance hole 211. This can further improve the reliability of the circuit board 2.

[0053] In the above embodiments, the clearance hole 211 can be a blind via. To further reduce the processing difficulty of electronic devices, in another embodiment of this application, the clearance hole 211 is disposed through the conductive layer 21 along the thickness direction of the conductive layer 21. That is, in this embodiment of the application, the clearance hole 211 is a through hole formed on the conductive layer 21. More specifically, during the processing of the circuit board 2, the conductive layer 21 without the clearance hole 211 can be formed normally first, and then the clearance hole 211 can be formed on the conductive layer 21 by laser ablation or chemical etching. Of course, in other embodiments of this application, the conductive layer 21 with the clearance hole 211 can also be formed directly during the formation of the conductive layer 21.

[0054] Furthermore, when the clearance hole 211 is a through hole, the above-mentioned technical solution is further adopted so that the clearance hole 211 can provide a larger clearance space for the protrusion structure 10 in the thickness direction. Therefore, even if any position in the side wall of the clearance hole 211 along the circumference of the clearance hole 211 is pressed against the outer surface of the protrusion structure 10, the circuit board 2 will basically not be damaged by excessive pressure.

[0055] As described above, during the assembly of the electronic device, the frame 1 and the circuit board 2 can be assembled together using screws. During this process, the frame 1 may compress the circuit board 2 to a certain extent. In order to further prevent the circuit board 2 from being damaged by excessive compression by the frame 1 during the assembly process, in this embodiment, the electronic device may also include a support layer 23. During the assembly process, the support layer 23 is located on the side of the conductive layer 21 away from the insulating layer 22, and the frame 1 is supported on the side of the support layer 23 away from the conductive layer 21. The support layer 23 is provided with a through hole 231, and the protruding structure 10 passes through the through hole 231 and contacts the clearance hole 211.

[0056] Specifically, the support layer 23 can be formed using insulating solder resist ink or screen printing ink, or it can be formed using conductive solder. Of course, to ensure that the support layer 23 does not significantly affect the overall thickness of the electronic device, in this embodiment, the dimension of the support layer 23 in the thickness direction of the conductive layer 21 can be between 0.01 and 0.05 mm (inclusive).

[0057] When adopting the technical solution disclosed in the embodiments of this application, since the support layer 23 has a certain thickness, the height of the protruding structure 10 can be partially suspended by the support layer 23, while ensuring that a portion of the protruding structure 10 still extends normally into the clearance hole 211. This ensures that the protruding structure 10 and the sidewall of the clearance hole 211 remain in contact to achieve grounding. Simultaneously, since the protruding structure 10 is partially suspended by the support layer 23, the interference between the protruding structure 10 and the clearance hole 211 can be further reduced, thereby further reducing the probability of damage to the circuit board 2.

[0058] Furthermore, in practical applications, such as Figure 9 As shown, the support layer 23 can cover the surface of the conductive layer 21 away from the insulating layer 22 as much as possible, and the through hole 231 can be used to make way for the avoidance hole 211, so that the avoidance hole 211 is exposed; or, it is not necessary to cover the conductive layer 21 with the support layer 23, but only to provide a support layer 23 on the outer periphery of the avoidance hole 211 to provide local support, and its size is based on providing a reliable support function.

[0059] It should be noted that, in this document, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes that element. Furthermore, it should be noted that the scope of the methods and apparatuses in the embodiments of this application is not limited to performing functions in the order shown or discussed, but may also include performing functions substantially simultaneously or in the reverse order, depending on the functions involved. For example, the described methods may be performed in a different order than described, and various steps may be added, omitted, or combined. Additionally, features described with reference to certain examples may be combined in other examples.

[0060] The embodiments of this application have been described above with reference to the accompanying drawings. However, this application is not limited to the above-described embodiments. The above-described embodiments are merely illustrative and not restrictive. Those skilled in the art can make many other forms under the guidance of this application without departing from the spirit and scope of the claims, and all of these forms are within the protection scope of this application.

Claims

1. An electronic device, characterized in that, Includes circuit boards and frame, among which, The circuit board includes an insulating layer and a conductive layer. The conductive layer is stacked on one side of the insulating layer. The outermost conductive layer in the circuit board has a clearance hole on the side facing away from the insulating layer. The frame is provided with a protruding structure, and the protruding structure abuts against the side of the conductive layer away from the insulating layer. A portion of the protruding structure extends into the clearance hole, and the outer surface of the protruding structure abuts against the conductive layer.

2. The electronic device according to claim 1, characterized in that, In a direction perpendicular to the thickness direction of the conductive layer, the minimum dimension of the sidewall of the clearance hole is smaller than the maximum dimension of the outer surface of the protrusion structure, and the outer surface of the protrusion structure abuts against the sidewall of the clearance hole.

3. The electronic device according to claim 2, characterized in that, The outer surface of the protrusion is hemispherical, and the clearance hole is cylindrical. The maximum diameter of the outer surface of the protrusion is greater than the diameter of the clearance hole.

4. The electronic device according to claim 2, characterized in that, The outer surface of the protrusion structure is a hemispherical structure, and in the direction perpendicular to the thickness direction of the conductive layer, the maximum dimension of the sidewall of the clearance hole is greater than the maximum diameter of the outer surface of the protrusion structure.

5. The electronic device according to claim 2, characterized in that, The protruding structure includes an arc-shaped ring and a dome, and the arc-shaped ring extends inward along the thickness direction of the conductive layer; The dome is connected to one end of the arc-shaped ring near the insulating layer, and the curvature of the dome is less than the curvature of the arc-shaped ring.

6. The electronic device according to claim 5, characterized in that, The protrusion structure has a larger dimension in the first direction than in the second direction; wherein the first direction and the second direction have a preset angle, and both the first direction and the second direction are perpendicular to the thickness direction.

7. The electronic device according to claim 2, characterized in that, In the thickness direction of the conductive layer, the size of the protrusion structure is greater than or equal to three times the size of the conductive layer, and the size of the protrusion structure is less than or equal to six times the size of the conductive layer.

8. The electronic device according to claim 2, characterized in that, The sidewall of the clearance hole has a flared structure, and the flared sidewall faces the side where the frame is located.

9. The electronic device according to claim 2, characterized in that, The clearance hole is provided to penetrate the conductive layer along the thickness direction of the conductive layer.

10. The electronic device according to claim 2, characterized in that, The electronic device further includes a support layer located on the side of the conductive layer away from the insulating layer. The frame is supported on the side of the support layer away from the conductive layer. The support layer has a through hole, and the protruding structure passes through the through hole and contacts the clearance hole.

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