Assembly of the shell, laser mainframe and laser television

Abstract

The application provides an assembled shell, a laser main machine and a laser television. A first shell, a second shell, a third shell and a fourth shell jointly enclose an assembly chamber. At least one of the first shell, the second shell, the third shell and the fourth shell is made of metal. Therefore, the shell can be used as a "load skeleton". The all-metal shell structure can form a Faraday cage effect. When the main machine is tested for static electricity, the instantaneous electromagnetic field generated by external static discharge can be effectively blocked, and the core components such as laser devices and mainboard chips are protected from interference. The shell has natural conductivity and can provide a low-impedance discharge path for static electricity to avoid charge accumulation. The shell has a strong attenuation effect on high-frequency electromagnetic waves, can suppress the leakage of radiation noise generated by internal circuits (such as laser drive modules and power supplies) to the outside, and easily passes the radiation disturbance test. The shell can also block external electromagnetic waves from invading, ensure that the television signal processing is not disturbed, and improve the stability of data transmission.

Description

Technical Field

[0001] This application relates to the field of laser TV technology, and in particular to the assembly casing, laser host, and laser TV. Background Technology

[0002] A laser TV is an advanced projection device that uses a laser light source and front projection technology to create an image. It is equipped with a dedicated projection screen and can receive broadcast television programs as well as smoothly stream internet content. The structural design of laser TVs mostly adopts a stacked and fixed solution for injection-molded housings. The upper, lower, and rear housings of the entire unit are all injection-molded parts, and are fixed together by screws.

[0003] Therefore, when the pre-existing measures for electrostatic discharge (ESD) and EMC (electromagnetic compatibility) testing are insufficient, temporary measures such as adding new grounding sheet metal parts or electronic optimizations are typically used to achieve the required ESD and EMC performance. This undoubtedly increases the workload and consumes significant human and financial resources. Furthermore, due to limitations in the structural strength and heat dissipation efficiency of the outer plastic components, larger heat dissipation openings are usually required in the outer casing, and a larger internal heat dissipation area is needed. Simultaneously, to enhance the overall internal structural strength and ensure compliance with tests such as mechanical drop tests, structures such as support columns and reinforcing ribs become more complex. Utility Model Content

[0004] Therefore, it is necessary to provide an assembly housing, a laser host, and a laser TV to address at least one of the aforementioned technical problems.

[0005] This application provides an assembly housing for a laser TV, the assembly housing comprising:

[0006] The first housing includes a central region and two side regions. The central region has a light-emitting window, and the two side regions are located on both sides of the central region, and both side regions are inclined relative to the central region.

[0007] The second housing is disposed on one side of the first housing, and the second housing is connected to one side of the central region and the two side regions;

[0008] A third housing is disposed on the other side of the first housing, and the third housing is connected to the other side of the central region and the two side regions;

[0009] A fourth housing, which is connected to the two side regions;

[0010] The first shell, the second shell, the third shell, and the fourth shell together form an assembly chamber, and at least one of the first shell, the second shell, the third shell, and the fourth shell is made of metal.

[0011] In this embodiment, the first, second, third, and fourth housings are made of metal materials such as aluminum profiles or sheet metal, which can act as a "support frame," improving space utilization and component assembly accuracy, and reducing design cycle. This eliminates the need for complex support designs inside the assembly housing, making the support structure within the assembly housing intuitive and simple. The all-metal housing structure creates a Faraday cage effect, effectively blocking the instantaneous electromagnetic field generated by external electrostatic discharge during host electrostatic testing, protecting core components such as laser devices and motherboard chips from interference. It possesses natural conductivity, providing a low-impedance discharge path for electrostatic charges and preventing charge accumulation. For EMC (electromagnetic compatibility) testing, the all-metal housing structure has a strong attenuation effect on high-frequency electromagnetic waves, suppressing the leakage of radiated noise generated by internal circuits (such as laser drive modules and power supplies), easily passing radiated interference tests. It also blocks external electromagnetic wave intrusion, ensuring uninterrupted television signal processing. Furthermore, the metal housing facilitates low-impedance grounding, effectively mitigating common-mode noise, reducing signal distortion, and improving the transmission stability of interfaces such as HDMI / USB.

[0012] The thermal conductivity of the all-metal shell structure can reach 237W / m·K, which is 15 times higher than that of plastic materials. Under the premise of ensuring the same heat dissipation efficiency, the opening area of ​​the heat dissipation openings can be reduced accordingly.

[0013] In one embodiment, the assembly housing includes:

[0014] A light source guide, the light source guide having a light source outlet channel, the light source outlet channel including a channel inlet and a channel outlet, wherein the cross-sectional area of ​​the light source outlet channel gradually increases along the direction from the channel inlet to the channel outlet; and / or,

[0015] An adapter, wherein the number of adapters is configured to be one or more, wherein at least one of the second housing and the third housing is connected to the first housing via the adapter; and / or,

[0016] A support member disposed in the fourth housing, wherein the support member is configured to be made of metal and connected to the fourth housing, for assembling at least one of an electronic board and a laser driver board in the assembly chamber.

[0017] In this embodiment, based on the design of the light source extraction channel, the laser beam projected from inside the assembly housing by the laser device can be projected from the channel inlet to the channel outlet. The adapter connects the first, second, third, and fourth housings. The support member is made of metal and connected to the fourth housing, which can promptly discharge the charge on the electronic circuit board to the fourth housing, reducing damage to the electronic circuit board caused by charge accumulation. It also significantly attenuates the high-frequency electromagnetic waves of the electronic circuit board in the entire assembly housing, suppressing the leakage of radiation noise generated by internal circuits (such as the laser drive module and power supply).

[0018] In one embodiment, the fourth housing is provided with a recessed area, which is recessed toward the central area of ​​the first housing, thereby forming a clearance space on the outside of the recessed area.

[0019] In this embodiment, the clearance space formed by the recessed area is mainly used to accommodate the telescopic mechanism. Therefore, when the housing is assembled with the motion mechanism, the volume of the overall structure can be further reduced, achieving a compact design.

[0020] In one embodiment, the first housing, the second housing, the third housing, and the fourth housing are all made of metal; and / or,

[0021] At least one of the first housing, the second housing, the third housing, and the fourth housing is made of aluminum alloy; and / or,

[0022] The central region of the first housing is configured as a top housing, the two side regions of the first housing are configured as two side housings, the second housing is configured as a front housing, the third housing is configured as a front and rear housing, and the fourth housing is configured as a bottom housing.

[0023] This application provides a laser host, the laser host comprising:

[0024] The assembly housing;

[0025] A laser device, wherein the laser device is assembled in the assembly chamber of the assembly housing.

[0026] In one embodiment, the laser host includes:

[0027] A heat dissipation unit, comprising at least one heat dissipation device, is located in the assembly chamber and is assembled to the fourth housing of the assembly housing.

[0028] In this embodiment, the heat dissipation device serves to reduce the temperature in the assembly chamber, thereby achieving a heat dissipation effect.

[0029] In one embodiment, the heat dissipation unit further includes:

[0030] At least one cooling fan is provided, and at least one side area of ​​the first housing is provided with a heat dissipation perforation, and the cooling fan is provided on the inner side of at least one heat dissipation perforation.

[0031] In this embodiment, the air cooling function of the cooling fan can effectively ensure that the laser device and DMD chip operate stably at a lower temperature, thereby improving their service life.

[0032] In one embodiment, the laser host includes:

[0033] A heat-conducting element, wherein the number of heat-conducting elements is configured to be one or more, and at least one of the heat dissipation devices of the heat dissipation unit is connected to at least one of the first housing, the second housing, the third housing and the fourth housing via the heat-conducting element.

[0034] In this embodiment, the heat-conducting element can be made of a material with heat-conducting function, thereby improving heat dissipation efficiency by utilizing the metal materials of the first housing, second housing, third housing and fourth housing.

[0035] This application provides a laser TV, the laser TV comprising:

[0036] The laser host;

[0037] A motion mechanism, which is connected to the laser host and configured to drive the laser host to move in a two-dimensional or three-dimensional space.

[0038] In one embodiment, the motion mechanism includes:

[0039] Basic platform;

[0040] A tilting platform, which is rotatably mounted on the base platform;

[0041] A telescopic mechanism is mounted on the flipping platform and connected to the laser host. Attached Figure Description

[0042] Figure 1 This is a schematic diagram of the structure of a laser TV provided in one embodiment of this application.

[0043] Figure 2 This is a schematic diagram of the structure of a laser TV (with the third housing removed) provided in one embodiment of this application.

[0044] Figure 3 This is a three-dimensional structural diagram of the assembly housing provided in one embodiment of this application.

[0045] Figure 4 This is an exploded perspective view of the assembly housing provided in one embodiment of this application.

[0046] Figure 5 This is a top view of the assembled housing provided in one embodiment of this application.

[0047] Figure 6 For example Figure 5 The AA section view of the assembled housing is shown.

[0048] Figure 7 This is a schematic diagram of the internal assembly structure of the housing provided in one embodiment of this application.

[0049] Figure 8 For example Figure 7 The side view of the assembled housing shown.

[0050] Icon labels:

[0051] 1000, Assembly casing; 2000, Heat dissipation unit; 3000, Motion mechanism; 4000, Electronic circuit board; 5000, Laser driver board;

[0052] 1100, First housing; 1200, Second housing; 1300, Third housing; 1400, Fourth housing; 1500, Assembly chamber; 1600, Light source guide; 1700, Adapter; 1800, Support component;

[0053] 1110, Central area; 1111, Light-emitting window; 1120, Side area; 1410, Recessed area;

[0054] 2100, Heat dissipation device; 2200, Cooling fan; 2300, Thermal conductive element;

[0055] 3100, Basic platform; 3200, Tilting platform; 3300, Telescopic mechanism. Detailed Implementation

[0056] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0057] In the description of this application, it should be understood that if terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" appear, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0058] Furthermore, where the terms "first" and "second" appear, these terms are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, where the term "multiple" appears, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0059] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0060] In this application, unless otherwise expressly specified and limited, the use of descriptions such as "above" or "below" the second feature indicates that the first and second features are in direct contact or indirect contact via an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. Similarly, "below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0061] It should be noted that if an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. If an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. If so, the terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this application are for illustrative purposes only and do not represent the only possible implementation.

[0062] See Figure 1 and Figure 2 As shown, this application provides a laser television, which includes a laser host and a motion mechanism 3000. The motion mechanism 3000 is connected to the laser host and has the function of driving the laser host to move in a preset manner, thereby being configured to drive the laser host to move in two-dimensional or three-dimensional space. The motion mechanism 3000 can adopt various structural designs. For example, in one embodiment, the motion mechanism 3000 may include a base platform 3100, a flipping platform 3200, and a telescopic mechanism 3300. The flipping platform 3200 is rotatably mounted on the base platform 3100, and the telescopic mechanism 3300 is mounted on the flipping platform 3200 and connected to the laser host. The flipping platform 3200 can be flipped by rotating devices such as motors, and the telescopic mechanism 3300 can be a lead screw mechanism, a slide rail slider mechanism, or other mechanisms that can achieve linear reciprocating motion, as required, without limitation.

[0063] Therefore, the flipping platform 3200 can rotate relative to the base platform 3100 along a predetermined axis of rotation, thereby achieving its own flipping. At the same time, the telescopic mechanism 3300 is connected to the laser host drive, thereby enabling the laser host to perform linear reciprocating motion. Since the laser host and the telescopic mechanism 3300 are located on the flipping platform 3200, the flipping of the flipping platform 3200 will also synchronously drive the laser host to flip. Thus, the motion mechanism 3000 can be used to realize the flipping action of the laser host in three-dimensional space and the linear reciprocating motion in two-dimensional space.

[0064] The aforementioned laser host may include an assembly housing 1000 and a laser device. The laser device is assembled in the assembly chamber 1500 of the assembly housing 1000, thus the laser device can be assembled and protected through the assembly housing 1000. Since existing assembly housings 1000 mostly adopt a stacking and fixing scheme of injection molded housings, there are a series of problems in electromagnetic compatibility testing and heat dissipation. This application improves the assembly housing 1000 to address these issues.

[0065] Continue reading Figures 3 to 6 As shown, in one embodiment of this application, for example Figure 3 and Figure 4 As shown, the assembly housing 1000 may include a first housing 1100, a second housing 1200, a third housing 1300, and a fourth housing 1400. The first housing 1100, second housing 1200, third housing 1300, and fourth housing 1400 can all be designed as plate structures of various shapes according to requirements. Thus, after the first housing 1100, second housing 1200, third housing 1300, and fourth housing 1400 are assembled together, an assembly chamber 1500 for assembling various devices and structures such as laser devices can be formed based on the first housing 1100, second housing 1200, third housing 1300, and fourth housing 1400. Furthermore, the assembly chamber 1500 can be constructed into a matching shape according to the requirements of assembling various devices. Therefore, those skilled in the art can construct the assembly housing 1000 and the assembly chamber 1500 according to actual needs, without limitation.

[0066] In one embodiment, see [reference] Figure 3 As shown, the first housing 1100 may include a central region 1110 and two side regions 1120. For example, a U-shaped plate structure may be used as the first housing 1100, with the central portion of the U-shaped plate serving as the central region 1110, and the other two sides serving as the two side regions 1120. The central region 1110 has a light-emitting window 1111. When the laser device is assembled in the assembly chamber 1500, the laser light projected by the laser device can be projected outward through the light-emitting window 1111. The two side regions 1120 are located on either side of the central region 1110, and both side regions 1120 are inclined relative to the central region 1110. This inclination can be vertical or a suitable inclination angle selected between, for example, 60 degrees and 120 degrees. Those skilled in the art can design according to actual needs, and no limitation is made here.

[0067] Continue reading Figure 3 and Figure 4 As shown, simultaneously, the second housing 1200 is disposed on one side of the first housing 1100, and the second housing 1200 is connected to one side of the central region 1110 and the two side regions 1120. The third housing 1300 is disposed on the other side of the first housing 1100, and the third housing 1300 is connected to the other side of the central region 1110 and the two side regions 1120. (See reference...) Figure 3 and Figure 4As shown, the second shell 1200 and the third shell 1300 are actually disposed on different sides of the first shell 1100. Since the two sides of the first shell 1100 are sealed, the fourth shell 1400 is finally connected to the two side regions 1120, thereby sealing the remaining unsealed side of the first shell 1100, the second shell 1200, and the third shell 1300. To better understand the structural design of the first shell 1100, the second shell 1200, the third shell 1300, and the fourth shell 1400, in one embodiment, if the assembly shell 1000 is limited to six directions (up, down, left, right, front, and back), then the central region 1110 of the first shell 1100 can be considered as the top shell, the two side regions 1120 of the first shell 1100 as the two side shells, the second shell 1200 as the front shell, the third shell 1300 as both the front and rear shells, and the fourth shell 1400 as the bottom shell.

[0068] In one embodiment, the first housing 1100, the second housing 1200, the third housing 1300, and the fourth housing 1400 together enclose the assembly chamber 1500, and at least one of the first housing 1100, the second housing 1200, the third housing 1300, and the fourth housing 1400 is made of metal. For example, any one, any two, any three, or all of the first housing 1100, the second housing 1200, the third housing 1300, and the fourth housing 1400 may be made of metal as needed. Regarding the metal material, in one embodiment, at least one of the first housing 1100, the second housing 1200, the third housing 1300, and the fourth housing 1400 is made of aluminum alloy. In addition, those skilled in the art may choose other metal materials according to actual needs, and no limitation is made here.

[0069] Since the first housing 1100, the second housing 1200, the third housing 1300 and the fourth housing 1400 in the assembly housing 1000 provided in this application are made of metal materials such as aluminum profiles or sheet metal, they can serve as a "load-bearing skeleton" while meeting product size requirements. This improves space utilization and component assembly accuracy, and reduces the design cycle. As a result, there is no need to design complex support structures inside the assembly housing 1000, making the support structure in the assembly housing 1000 intuitive and simple.

[0070] When the first housing 1100, the second housing 1200, the third housing 1300 and the fourth housing 1400 are all made of metal materials such as aluminum profiles or sheet metal, the all-metal shell structure can form a Faraday cage effect. During the host electrostatic test, it can effectively block the instantaneous electromagnetic field generated by external electrostatic discharge and protect core components such as laser devices and motherboard chips from interference.

[0071] The all-metal casing structure possesses natural conductivity, providing a low-impedance discharge path for static electricity and preventing charge accumulation. Compared to plastic casings, the metal material quickly conducts static electricity into the grounding system, significantly reducing the risk of electrostatic discharge damaging internal circuitry. For EMC (electromagnetic compatibility) testing, the all-metal casing structure offers strong attenuation of high-frequency electromagnetic waves, suppressing the leakage of radiated noise generated by internal circuitry (such as laser drive modules and power supplies), easily passing radiated interference tests.

[0072] Meanwhile, the fully enclosed metal structure can also block the intrusion of external electromagnetic waves, ensuring that the TV signal processing is not interfered with. In addition, the metal shell facilitates low-impedance grounding, which can effectively divert common-mode noise, reduce signal distortion, and improve the transmission stability of interfaces such as HDMI / USB.

[0073] Furthermore, regarding the heat dissipation issue of laser TVs, heat dissipation not only affects the efficiency of laser devices and lens emission, and in severe cases can even cause fires, but the fan noise also has a certain impact on the user experience. The all-metal casing structure provided in this application, such as aluminum, has a thermal conductivity of up to 237 W / m·K, which is 15 times more efficient in heat dissipation than plastic. While maintaining the same heat dissipation efficiency, the area of ​​the required heat dissipation vents can be reduced accordingly. This also allows the laser devices to operate stably below 45°C, extending their lifespan, ensuring long-term normal operation of the laser TV, reducing fan noise, and effectively improving the user experience.

[0074] In addition, the unibody design, crafted from aluminum alloy, features a brushed and frosted finish for a sophisticated matte texture, seamlessly integrating with modern homes and commercial spaces. In one embodiment, the inner surface of the first housing 1100 is press-fitted with screw posts to secure the second housing 1200. The assembly of the first and second housings 1100 is pre-installed onto the fourth housing 1400 via positioning posts. The third housing 1300 is also pre-installed via positioning posts and fixed to the first housing 1100. Finally, countersunk screws are used to secure the first, second, third, and fourth housings 1400 together. This design, using countersunk screws to connect the unibody metal design, achieves a "screwless" appearance on the assembled housing 1000, creating a seamless and unified product feel.

[0075] Continue reading Figures 3 to 5 As shown, in one embodiment, the aforementioned assembly housing 1000 may include, for example: Figure 5The light source guide 1600 shown has a light source outlet channel, which includes an inlet and an outlet. The cross-sectional area of ​​the light source outlet channel gradually increases from the inlet to the outlet. The structure of this light source outlet channel can be a gradually expanding circular channel, an elliptical channel, or a square channel. Those skilled in the art can design the structure of the light source outlet channel according to the actual needs of light source projection, and no limitation is made here. Based on the design of the light source outlet channel, the laser beam projected from inside the assembly housing 1000 by the laser device can be projected from the inlet to the outlet.

[0076] The aforementioned housing 1000 may also be designed with one or more adapters 1700. The adapters 1700 are used to connect the first housing 1100, the second housing 1200, the third housing 1300, and the fourth housing 1400, for example, see [reference needed]. Figure 3 and Figure 4 As shown, at least one of the second housing 1200 and the third housing 1300 can be connected to the first housing 1100 via the adapter 1700. Therefore, the adapter 1700 can be a suitable shape such as columnar or sheet-like, and is not limited here.

[0077] The aforementioned assembly housing 1000 may also be equipped with a support member 1800. The support member 1800 may be designed in a frame shape and is disposed in the fourth housing 1400, that is, in the bottom of the assembly chamber 1500. The support member 1800 is made of metal and connected to the fourth housing 1400, and is used to assemble at least one of the electronic board 4000 and the laser driver board 5000 in the assembly chamber 1500. Therefore, the charge on the electronic board 4000 can be promptly discharged to the fourth housing 1400, reducing damage to the electronic board 4000 caused by charge accumulation. Furthermore, it significantly attenuates the high-frequency electromagnetic waves of the electronic board 4000 within the entire assembly housing 1000, suppressing the leakage of radiated noise generated by internal circuits (such as the laser driver module and power supply).

[0078] See Figure 3 and Figure 4As shown, in one embodiment, the fourth housing 1400 has a recessed region 1410. The recessed region 1410 is recessed towards the central region 1110 of the first housing 1100, thereby creating a clearance space on the outside of the recessed region 1410. The recessed region 1410 in the fourth housing 1400 can be designed as an integral or separate structure with other regions. For example, the recessed region 1410 in the fourth housing 1400 can be separated into housing structures of different shapes and fixed together by screws and welding. The clearance space formed by the recessed region 1410 is mainly used to accommodate the telescopic mechanism 3300. Therefore, when the housing 1000 is assembled with the motion mechanism 3000, the overall structure volume can be further reduced, achieving a compact design.

[0079] See Figure 7 and Figure 8 As shown, in one embodiment, the laser host may further include a heat dissipation unit 2000, which includes at least one heat dissipation device 2100. The heat dissipation unit 2000 is located in the assembly chamber 1500 and is assembled to the fourth housing 1400 of the assembly housing 1000. The function of the heat dissipation device 2100 is to reduce the temperature in the assembly chamber 1500 and achieve a heat dissipation effect.

[0080] In one embodiment, the laser host also includes a heat-conducting element 2300. The heat-conducting element 2300 can be made of a material with thermal conductivity and can also be designed as a pad or other structure. The number of heat-conducting elements 2300 can be configured to be one or more, so that at least one heat dissipation device 2100 of the heat dissipation unit 2000 can be connected to at least one of the first housing 1100, the second housing 1200, the third housing 1300, and the fourth housing 1400 through the heat-conducting element 2300. Thus, the heat dissipation efficiency can be improved by utilizing the metal material of the first housing 1100, the second housing 1200, the third housing 1300, and the fourth housing 1400.

[0081] In addition, the heat dissipation unit 2000 may also include at least one cooling fan 2200, see further. Figure 6 As shown, at least one side region 1120 of the first housing 1100 is provided with a heat dissipation perforation, and refer to Figure 8 As shown, at least one heat dissipation perforation is provided with a cooling fan 2200 on the inner side. Therefore, the air cooling function of the cooling fan 2200 can effectively ensure the stable operation of the laser device and DMD chip at a lower temperature, thereby improving their service life.

[0082] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0083] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. An assembly housing for a laser TV, characterized in that, The assembly housing includes: The first housing includes a central region and two side regions. The central region has a light-emitting window, and the two side regions are located on both sides of the central region, and both side regions are inclined relative to the central region. The second housing is disposed on one side of the first housing, and the second housing is connected to one side of the central region and the two side regions; A third housing is disposed on the other side of the first housing, and the third housing is connected to the other side of the central region and the two side regions; A fourth housing, which is connected to the two side regions; The first shell, the second shell, the third shell, and the fourth shell together form an assembly chamber, and at least one of the first shell, the second shell, the third shell, and the fourth shell is made of metal.

2. The assembly housing according to claim 1, characterized in that, The assembly housing includes: A light source guide, the light source guide having a light source outlet channel, the light source outlet channel including a channel inlet and a channel outlet, wherein the cross-sectional area of ​​the light source outlet channel gradually increases along the direction from the channel inlet to the channel outlet; and / or, An adapter, wherein the number of adapters is configured to be one or more, wherein at least one of the second housing and the third housing is connected to the first housing via the adapter; and / or, A support member disposed in the fourth housing, wherein the support member is configured to be made of metal and connected to the fourth housing, for assembling at least one of an electronic board and a laser driver board in the assembly chamber.

3. The assembly housing according to claim 1, characterized in that, The fourth housing has a recessed area, which is recessed toward the central area of ​​the first housing, thereby creating a clearance space on the outside of the recessed area.

4. The assembly housing according to claim 1, characterized in that, The first housing, the second housing, the third housing, and the fourth housing are all made of metal; and / or, At least one of the first housing, the second housing, the third housing, and the fourth housing is made of aluminum alloy; and / or, The central region of the first housing is configured as a top housing, the two side regions of the first housing are configured as two side housings, the second housing is configured as a front housing, the third housing is configured as a front and rear housing, and the fourth housing is configured as a bottom housing.

5. A laser host, characterized in that, The laser host includes: The assembly housing as described in any one of claims 1-4; A laser device, wherein the laser device is assembled in the assembly chamber of the assembly housing.

6. The laser host according to claim 5, characterized in that, The laser host includes: A heat dissipation unit, comprising at least one heat dissipation device, is located in the assembly chamber and is assembled to the fourth housing of the assembly housing.

7. The laser host according to claim 6, characterized in that, The heat dissipation unit also includes: At least one cooling fan is provided, and at least one side area of ​​the first housing is provided with a heat dissipation perforation, and the cooling fan is provided on the inner side of at least one heat dissipation perforation.

8. The laser host according to claim 6, characterized in that, The laser host includes: A heat-conducting element, wherein the number of heat-conducting elements is configured to be one or more, and at least one of the heat dissipation devices of the heat dissipation unit is connected to at least one of the first housing, the second housing, the third housing and the fourth housing via the heat-conducting element.

9. A laser television, characterized in that, The laser TV includes: The laser host as described in any one of claims 5-8; A motion mechanism, which is connected to the laser host and configured to drive the laser host to move in a two-dimensional or three-dimensional space.

10. The laser television according to claim 9, characterized in that, The motion mechanism includes: Basic platform; A tilting platform, which is rotatably mounted on the base platform; A telescopic mechanism is mounted on the flipping platform and connected to the laser host.

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