Earphone and smart wearable device

Abstract

The application discloses an earphone and a smart wearable device. The earphone comprises an earphone body, a connecting arm and a damping piece. The earphone body comprises a first shell and a loudspeaker part. The loudspeaker part is arranged in the first shell. The connecting arm comprises a second shell and a microphone. The second shell is connected to the first shell. The microphone is arranged in the second shell. The first shell and / or the second shell is provided with the damping piece. The damping piece is configured to reduce the vibration transmission of the loudspeaker part to the microphone. The earphone and the smart wearable device provided by the application can prevent and reduce the vibration transmission of the loudspeaker part to the microphone, which is conducive to reducing the noise of the earphone, and further conducive to improving the sound effect of the earphone and the auditory sensation of the wearer, and improving the use experience of the wearer.

Description

Technical Field

[0001] This application relates to the field of smart device technology, and more particularly to an earphone and a smart wearable device. Background Technology

[0002] While modern technology and the environment have brought people a more exciting life, they have also made people more exposed to high volumes, potentially harming their hearing health and increasing the number of people with mild hearing loss. Simultaneously, with the increasing aging of the global population, the number of people experiencing gradual hearing loss due to age is also rising. Furthermore, because hearing loss is irreversible, hearing aids are becoming increasingly popular. Hearing aids are sound-enhancing headphones that pick up external sounds through a microphone, amplify them through a speaker, and then transmit them to the ear, allowing people with hearing loss to hear louder sounds. However, because the speaker vibrates when emitting sound, this vibration is transmitted to the microphone, causing noise generated by the microphone. This noise, after amplification, enters the ear, resulting in blurred sound or even feedback, thus affecting the effectiveness of the hearing aid and the auditory experience. Utility Model Content

[0003] This application discloses an earphone and a smart wearable device that can prevent and reduce the vibration transmission of the speaker components to the microphone, which helps to reduce the noise of the earphone, thereby improving the sound effect of the earphone and the hearing experience of the wearer, and enhancing the user experience.

[0004] To achieve the above objectives, in a first aspect, embodiments of this application disclose an earphone, comprising:

[0005] The earphone body includes a first housing and a speaker component, wherein the speaker component is disposed within the first housing;

[0006] A connecting arm, comprising a second housing and a microphone, wherein the second housing is connected to the first housing, and the microphone is disposed within the second housing; and

[0007] A shock absorber is provided in the first housing and / or the second housing, the shock absorber being configured to reduce the transmission of vibrations from the speaker component to the microphone.

[0008] As an optional implementation, the shock absorber is disposed on the vibration transmission path of the speaker component to the microphone.

[0009] As an optional implementation, the shock absorber is disposed at the connection between the first housing and the sound-emitting component;

[0010] And / or,

[0011] The shock absorber is located at the connection between the second housing and the microphone.

[0012] As an optional implementation, the first housing includes a first sub-shell and a second sub-shell, the first sub-shell being connected to the second sub-shell, the first housing being connected to the first sub-shell and the second sub-shell, and the speaker component being disposed inside the second sub-shell;

[0013] The shock absorber is disposed on the outer peripheral surface of the speaker component, and the shock absorber is connected to the inner wall surface of the second sub-shell.

[0014] As an optional implementation, the headphone body further includes a reinforcing member, which is arranged around the outer periphery of the rear sound cavity of the speaker component, and the reinforcing member is connected to the first sub-shell and the second sub-shell;

[0015] The shock absorber is disposed at the connection between the sound-emitting component and the reinforcing component, and / or, the shock absorber is disposed at the connection between the reinforcing component and the first sub-shell and the second sub-shell.

[0016] As an optional implementation, the reinforcing member is integrally formed with the speaker component.

[0017] As an optional implementation, the connecting arm further includes a circuit board disposed inside the second housing, and the microphone is electrically connected to the circuit board;

[0018] The shock-absorbing component is provided at the connection between the circuit board and the second housing.

[0019] As an optional implementation, the circuit board includes a rigid board and a first flexible board connected to the rigid board, the microphone is connected to the second housing and the microphone is electrically connected to the first flexible board, so that the microphone is spaced apart from the rigid board.

[0020] As an optional implementation, the shock absorber is provided in the gap between the microphone and the rigid plate, and the shock absorber is connected to the rigid plate and the microphone.

[0021] As an optional implementation, the earphone further includes a waterproof and sound-permeable membrane and / or a dustproof mesh disposed corresponding to the sound-receiving hole on the second housing, and the waterproof and sound-permeable membrane and / or dustproof mesh is disposed between the first flexible plate and the second housing.

[0022] As an optional implementation, when the earphone includes the waterproof and sound-permeable membrane, the shock-absorbing element is disposed between the first flexible plate and the waterproof and sound-permeable membrane, and / or between the waterproof and sound-permeable membrane and the second housing;

[0023] or,

[0024] When the earphone includes the dustproof mesh, the shock-absorbing element is provided between the first flexible plate and the dustproof mesh, and / or between the dustproof mesh and the second housing;

[0025] or,

[0026] When the earphone includes the waterproof and acoustically permeable membrane and the dustproof mesh, the waterproof and acoustically permeable membrane is connected to the first flexible plate, the dustproof mesh is connected to the waterproof and acoustically permeable membrane and the second housing, and the shock-absorbing element is provided between the first flexible plate and the waterproof and acoustically permeable membrane, and / or between the waterproof and acoustically permeable membrane and the dustproof mesh, and / or between the dustproof mesh and the second housing.

[0027] As an optional implementation, the first flexible board includes a first sub-flexible board and a second sub-flexible board, wherein the first sub-flexible board is connected to one end of the rigid board and the second sub-flexible board is connected to the other end of the rigid board;

[0028] The microphone includes at least two microphones, wherein one microphone is disposed at one end of the rigid board and electrically connected to the first sub-flexible board, and the other microphone is disposed at the other end of the rigid board and electrically connected to the second sub-flexible board.

[0029] As an optional implementation, the second housing includes an inclined section and a straight section, one end of the inclined section being connected to the first housing, and the straight section being connected to the other end of the inclined section;

[0030] The rigid board includes a first sub-rigid board and a second sub-rigid board. The circuit board also includes a second flexible board. The first sub-rigid board is connected to the second sub-rigid board through the second flexible board. The first sub-rigid board is disposed in the inclined section. The first sub-flexible board is disposed on the first sub-rigid board and electrically connected to the first sub-rigid board. The second sub-rigid board is disposed in the straight section. The second sub-flexible board is disposed on the second sub-rigid board and electrically connected to the second sub-rigid board.

[0031] Of the two microphones, one microphone is located at one end of the inclined section near the headphone body, and the other microphone is located at one end of the straight section away from the inclined section.

[0032] As an optional implementation, at least two of the first sub-rigid board, the second sub-rigid board, the first sub-flexible board, the second sub-flexible board, and the second flexible board are integrally disposed.

[0033] As an optional implementation, the earphone further includes a charging connector, which is disposed on the side of the inclined section near the earphone body and is electrically connected to the first sub-hard board;

[0034] And / or,

[0035] The first housing includes a columnar shape, and the earphone further includes a first magnetic member and a second magnetic member. The first magnetic member is disposed inside the first housing and along the extending direction of the first housing. The first magnetic member is disposed at the end of the first housing away from the speaker component. The second magnetic member is disposed on the side of the flat section close to the earphone body and is located inside the flat section.

[0036] As an optional implementation, the second housing includes an inclined section and a straight section, one end of the inclined section is connected to the first housing, and the straight section is connected to the other end of the inclined section, with the straight section and the inclined section arranged at an angle.

[0037] As an alternative implementation, the first housing has a wearing surface and a first surface opposite to the wearing surface, the wearing surface being configured to be close to or in contact with the human ear when the earphone body is worn on the human ear, and the inclined segment having a second surface opposite to the wearing surface, the second surface being set at an angle to the first surface.

[0038] As an optional implementation, the earphone body is cylindrical and extends along the extension direction of the straight segment.

[0039] As an optional implementation, the minimum distance between the outer peripheral surface of the earphone body and the outer peripheral surface of the straight section is 3mm-8mm.

[0040] As an optional implementation, at least two of the first housing, the inclined section, and the straight section are integrally formed.

[0041] As an optional implementation, the earphone further includes a clamping arm connected to the end of the connecting arm away from the first housing. The clamping arm and the connecting arm can form a clamping space with the first housing for clamping onto the human ear, so that the earphone body can be worn on the human ear.

[0042] As an optional implementation, the clamping arm is rotatably connected to the connecting arm, and the clamping arm can rotate relative to the connecting arm to change the opening angle between the clamping arm and the connecting arm.

[0043] As an optional implementation, the earphone further includes a connector that connects the connecting arm and the clamping arm, the connector being configured to allow the clamping arm to rotate relative to the connecting arm to change the opening angle between the clamping arm and the connecting arm.

[0044] As an optional implementation, the connector includes a pivot or an elastic element;

[0045] When the connector includes the elastic element, the elastic element is configured to bend and deform to change the opening angle between the clamping arm and the connecting arm.

[0046] As an optional implementation, the clamping arm has a concave surface on its side surface near the headphone body.

[0047] As an optional implementation, the earphone body further includes a battery disposed within the first housing. The battery is electrically connected to the speaker component. Along the thickness direction of the speaker component, the battery is disposed on the side where the front sound cavity of the speaker component is located. The sound outlet on the first housing is located between the speaker component and the battery.

[0048] Secondly, embodiments of this application also disclose a smart wearable device, including a main body and an earphone as described in the first aspect above, wherein the main body is provided with a receiving position, the receiving position being configured to allow the earphone to be plugged into and detached from the main body.

[0049] As an optional implementation, when the second housing includes the flat section, the earphone body is pluggably connected to the receiving position along the extending direction of the flat section.

[0050] As an optional implementation, the smart wearable device further includes a wearable component connected to the main body;

[0051] When the earphone includes the clamping arm and the second housing includes the inclined section, the receiving position includes a first sub-receiving position and a second sub-receiving position. The first sub-receiving position communicates with the second sub-receiving position, and the second sub-receiving position is located between the main body and the wearable component. The earphone body and the inclined section are pluggably connected to the first sub-receiving position, and the straight section and the clamping arm are pluggably connected to the second sub-receiving position.

[0052] Compared with the prior art, the beneficial effects of this application are:

[0053] The headphones and smart wearable device provided in this application embodiment have shock-absorbing components installed in the first and second housings. These components absorb the vibrations generated when the speaker emits sound, thereby reducing the transmission of vibrations from the speaker to the microphone. This helps prevent noise from the microphone due to vibration, thus reducing headphone noise and improving sound quality and the wearer's auditory experience, enhancing the user experience. Furthermore, for headphones with hearing aids, the shock-absorbing components improve noise reduction, reducing noise interference with microphone pickup and making the amplified sound clearer, further improving the headphone's hearing aid performance. Attached Figure Description

[0054] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0055] Figure 1 This is a schematic diagram of the structure of a wireless earphone provided in an embodiment of this application;

[0056] Figure 2 This is a schematic diagram of the structure of a wireless earphone (in a wearing state) provided in an embodiment of this application;

[0057] Figure 3 This is a structural schematic diagram of a wireless earphone worn on a human ear from one perspective, according to an embodiment of this application.

[0058] Figure 4 This is a schematic diagram of the structure of a wireless earphone worn on the human ear from another perspective, according to an embodiment of this application.

[0059] Figure 5 This is a cross-sectional view of a wireless earphone provided in an embodiment of this application;

[0060] Figure 6 yes Figure 5 A magnified view of a section at point A in the middle;

[0061] Figure 7 yes Figure 5 A magnified view of a section at point B in the middle;

[0062] Figure 8 This is a schematic diagram of the circuit board structure of a wireless earphone provided in an embodiment of this application;

[0063] Figure 9 yes Figure 8 A schematic diagram of the unfolded circuit board structure;

[0064] Figure 10 This is a schematic diagram of the structure of a wireless earphone (showing the angle between the inclined segment and the straight segment) provided in an embodiment of this application;

[0065] Figure 11 This is a schematic diagram of the structure of a smart wearable device (wireless earphone plugged into the receiving position) provided in an embodiment of this application;

[0066] Figure 12 This is a schematic diagram of the structure of a smart wearable device (wireless earphone detached from the receiving position) provided in an embodiment of this application;

[0067] Figure 13 This is a partial cross-sectional view of a smart wearable device (wireless earphone plugged into the receiving position) provided in an embodiment of this application;

[0068] Figure 14 yes Figure 13 A magnified view of a section at point C;

[0069] Figure 15 This is a partial cross-sectional view of a smart wearable device (wireless earphone detached from its housing) provided in an embodiment of this application;

[0070] Figure 16 yes Figure 15 A magnified view of a section at point D.

[0071] Explanation of reference numerals in the attached figures:

[0072] 100-Earphone; 1-Earphone body; 11-First shell; 11a-Sound outlet; 111-First sub-shell; 112-Second sub-shell; 12-Speaker component; 12a-Front acoustic cavity; 12b-Rear acoustic cavity; 13-Reinforcing member; 14-Battery; 2-Connecting arm; 21-Second shell; 21a-Sloping section; 21b-Straight section; 22-Microphone; 23-Receiver hole; 24-Circuit board; 241-Rigid board; 2411-First sub-rigid board; 2412-Second sub-rigid board; 242-First flexible board; 2421-First sub-flexible board; 2422-Second sub-flexible board; 243-Second... 3-Soft board; 4-Shock absorber; 5-Waterproof and sound-permeable membrane; 61-Dustproof mesh; 62-Charging connector; 63-First magnetic chuck; 64-Second magnetic chuck; X-Extension direction of the straight section; D-Minimum distance; 7-Clamping arm; 71-Concave surface; α-First included angle; β-Second included angle; θ-Opening angle; P-Wearing surface; M-First surface; N-Second surface; 8-Connector; 81-Hinge; 200-Smart wearable device; 201-Main body; 202-Accommodation position; 2021-First sub-accommodation position; 2022-Second sub-accommodation position; 203-Wearing component; 300-Human ear. Detailed Implementation

[0073] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0074] In this application, the terms "upper," "lower," "top," "bottom," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. These terms are primarily for the purpose of better describing this application and its embodiments, and are not intended to limit the indicated device, element, or component to having a specific orientation, or to be constructed and operated in a specific orientation.

[0075] Furthermore, in addition to indicating location or positional relationship, some of the aforementioned terms may also have other meanings. For example, the term "above" may also be used in some cases to indicate a certain dependency or connection relationship. Those skilled in the art can understand the specific meaning of these terms in this application based on the specific circumstances.

[0076] Furthermore, the terms "set up," "equipped with," "connected," and "connected" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral structure; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium, or an internal connection between two devices, components, or parts. Those skilled in the art can understand the specific meaning of these terms in this application based on the specific circumstances.

[0077] Furthermore, the terms "first," "second," etc., are primarily used to distinguish different devices, elements, or components (which may be the same or different in specific type and construction), and are not intended to indicate or imply the relative importance or quantity of the indicated devices, elements, or components. Unless otherwise stated, "a plurality of" means two or more.

[0078] Before explaining the technical solution of this application, the technical concept of this application will be explained first.

[0079] With the development of technology, modern technology and the environment have brought people a more exciting life, enriching their lifestyles and entertainment. Various smart devices (such as headphones, mobile phones, and smart wearable devices) are ubiquitous in people's work, study, and leisure, offering unique audio-visual experiences. However, while modern technology and the environment bring a more exciting life, they also make people more exposed to high volumes, potentially harming their hearing health and increasing the number of people with mild hearing loss. Furthermore, with the increasing aging of the global population, the number of people experiencing gradual hearing loss due to age is also increasing. Since hearing loss is irreversible, hearing aids are becoming increasingly popular.

[0080] Hearing aid headphones are a type of sound-enhancing headphones that use a microphone to pick up external sounds, amplify them through a speaker, and then transmit them to the user's ear, allowing people with hearing impairments to hear louder sounds. However, because the speaker vibrates when it emits sound, this vibration is transmitted to the microphone, causing noise generated by the microphone. This noise is amplified and enters the user's ear, resulting in blurred sound or even feedback, thus affecting the effectiveness of the hearing aid and the user's auditory experience.

[0081] To address these issues, the inventors attempted to incorporate multiple microphones into the headphones, some of which are dedicated noise-canceling microphones. These microphones pick up noise and adjust it through programming for noise reduction. However, while this method effectively reduces headphone noise, the large number of microphones required, which need to be spaced far apart, results in a bulky headphone that is difficult to miniaturize. This is especially problematic when the headphones are integrated into smart wearable devices such as smartwatches, where a smaller overall footprint is essential.

[0082] In view of this, embodiments of this application provide an earphone and a smart wearable device. The earphone is provided with a shock-absorbing component in the first housing and the second housing. The shock-absorbing component can absorb the vibration generated when the speaker component emits sound, thereby reducing the vibration transmission of the speaker component to the microphone. This helps to avoid the microphone generating noise due to vibration, thereby reducing the noise of the earphone and making the sound amplified by the speaker component clearer, thus improving the auxiliary hearing effect of the earphone.

[0083] The technical solution of this application will be further described below with reference to the embodiments and accompanying drawings.

[0084] Please see Figures 1 to 5 , Figure 1 This is a schematic diagram of the structure of a wireless earphone provided in an embodiment of this application; Figure 2 This is a schematic diagram of the structure of a wireless earphone (in a wearing state) provided in an embodiment of this application; Figure 3 This is a structural schematic diagram of a wireless earphone worn on a human ear from one perspective, according to an embodiment of this application. Figure 4 This is a schematic diagram of the structure of a wireless earphone worn on the human ear from another perspective, according to an embodiment of this application. Figure 5 This is a cross-sectional view of a wireless earphone provided in an embodiment of this application. In a first aspect, this application discloses an earphone 100, which includes an earphone body 1, a connecting arm 2, and a shock absorber 3. The earphone body 1 includes a first housing 11 and a speaker component 12, the speaker component 12 being disposed within the first housing 11. The connecting arm 2 includes a second housing 21 and a microphone 22, the second housing 21 being connected to the first housing 11, and the microphone 22 being disposed within the second housing 21. The first housing 11 and / or the second housing 21 are provided with a shock absorber 3, which is configured to reduce the vibration transmission from the speaker component 12 to the microphone 22.

[0085] The headphones 100 provided in this embodiment have shock-absorbing components 3 installed in the first housing 11 and / or the second housing 21. These shock-absorbing components 3 absorb vibrations generated when the speaker component 12 emits sound, reducing the vibration transmission from the speaker component 12 to the microphone 22. This helps prevent noise from the microphone 22 due to vibration, thereby reducing the noise of the headphones 100 and improving the sound quality and the user's auditory experience. Furthermore, for headphones 100 with auxiliary hearing function, the shock-absorbing components 3 enhance the noise reduction effect, reducing noise interference with the microphone 22's sound pickup. This makes the sound amplified by the speaker component 12 clearer, further improving the auxiliary hearing effect of the headphones 100.

[0086] It is understood that the first housing 11 and / or the second housing 21 are provided with shock-absorbing components 3. This could mean that the first housing 11 is provided with shock-absorbing components 3; or, the second housing 21 is provided with shock-absorbing components 3; or, as... Figure 5 As shown, both the first housing 11 and the second housing 21 are provided with shock-absorbing components 3, but this embodiment is not limited to this. By providing shock-absorbing components 3 separately in the first housing 11 or the second housing 21, the vibration transmission from the speaker component 12 to the microphone 22 can be effectively absorbed, thereby effectively reducing the noise of the headphones 100. Furthermore, by providing shock-absorbing components 3 in both the first housing 11 and the second housing 21, the vibration transmission from the speaker component 12 to the microphone 22 can be further absorbed, thereby further reducing the noise of the headphones 100, which is beneficial to further improving the sound effect of the headphones 100 and the hearing experience of the wearer, thus enhancing the user experience.

[0087] Optionally, the material of the aforementioned shock absorber 3 may include rubber, silicone, polyurethane, foam, etc., and this embodiment does not limit this. For example, if the shock absorber 3 is made of rubber, because rubber has excellent wear resistance, elasticity, shock absorption performance, and recovery ability, the shock absorber 3 has a long service life, which helps to improve the service life of the headphones 100; at the same time, it can effectively absorb the vibration of the speaker component 12, which helps to reduce the vibration transmission of the speaker component 12 to the microphone 22, thereby helping to reduce the noise of the headphones 100. Alternatively, if the shock absorber 3 is made of silicone, because silicone has good high temperature resistance, aging resistance, elasticity, and flexibility, on the one hand, the shock absorber 3 can effectively absorb the vibration of the speaker component 12, which helps to reduce the vibration transmission of the speaker component 12 to the microphone 22, thereby helping to reduce the noise of the headphones 100; on the other hand, the shock absorber 3 can adapt to different temperature ranges, which allows the headphones 100 to be used in different temperature environments. In addition, the shock absorber 3 has a long service life, which helps to improve the service life of the headphones 100. Alternatively, the shock absorber 3 can be made of polyurethane. Since polyurethane can be formulated with different methods to control its elasticity and hardness, the shock absorber 3 can achieve good shock absorption while maintaining a certain level of hardness to increase its tensile strength and lifespan, thus extending the lifespan of the headphones 100. Alternatively, the shock absorber 3 can be made of foam. Foam has excellent sound insulation, cushioning, and elasticity, allowing it to effectively absorb vibrations from the speaker component 12, thereby improving the noise reduction effect of the headphones 100.

[0088] Optionally, the material of the first housing 11 may include metal, plastic, plexiglass, etc., and this embodiment does not limit this. For example, if the first housing 11 is made of metal, the high mechanical strength and durability of metal allow the first housing 11 to withstand impacts, pressure, and wear, which helps protect the components inside the first housing 11. As another example, if the first housing 11 is made of plastic, the strong corrosion resistance of plastic prevents corrosion damage to the first housing 11 and its internal components; simultaneously, the light weight of plastic reduces the weight of the first housing 11, thus reducing the mass of the earphone 100. Yet another example, if the first housing 11 is made of plexiglass, the strong impact resistance and light weight of plexiglass contribute to the lightweight design of the first housing 11 and allow it to effectively resist impacts without easily breaking.

[0089] It is understood that the materials of the second housing 21 mentioned above also include metal, plastic, plexiglass, etc., and this embodiment will not elaborate on this further.

[0090] It is understood that the materials of the first housing 11 and the second housing 21 may be the same or different, and this embodiment does not limit this.

[0091] Optionally, the shape of the first housing 11 may include columnar, block-shaped, spherical, etc., and this embodiment is not limited thereto. To facilitate the description of the specific structure of the earphone 100, the following description will take the first housing 11 as columnar as an example.

[0092] It is understood that the first housing 11 is generally cylindrical in shape. The first housing 11 has a wearing surface P along its own cylindrical height direction and a first surface M opposite to the wearing surface P. The wearing surface P is configured to be close to or in contact with the human ear 300 when the earphone body 1 is worn on the human ear 300. The outer peripheral surface of the first housing 11, the wearing surface P, and the first surface M together form the outer surface of the first housing 11. When the first housing 11 is cylindrical, the wearing surface P and the first surface M are two end faces along the extension direction of the first housing 11 (i.e., the cylindrical height direction).

[0093] It is understandable that, considering the sound output of the microphone, the headphone body 1 is usually provided with a sound output hole, that is, the sound output hole 11a is provided on the first housing 11.

[0094] Optionally, the sound outlet 11a is disposed on the first surface M or the outer peripheral surface of the first housing 11. This allows the sound emitted by the headphones 100 to be transmitted to the ear canal of the human ear 300 through the sound outlet 11a, thereby achieving sound transmission from the headphones 100. For example, the sound outlet 11a is disposed on the outer peripheral surface of the first housing 11, and when the headphones 100 are worn on the human ear 300, the opening of the sound outlet 11a is at least partially oriented towards the ear canal of the human ear 300. This aligns the sound outlet 11a with the ear canal of the human ear 300, thereby improving the sound output performance of the headphones 100.

[0095] Optionally, a dustproof screen can be installed at the sound outlet 11a. The dustproof screen can effectively block dust and other impurities from the external environment from entering the sound outlet 11a, which helps to prevent the sound outlet 11a from becoming blocked.

[0096] Optionally, the aforementioned speaker component 12 may include, but is not limited to, an electrodynamic speaker, an electromagnetic speaker, a piezoelectric speaker, an electrostatic speaker, etc.

[0097] As an optional implementation method, such as Figure 5As shown, the shock absorber 3 can be disposed on the vibration transmission path of the speaker component 12 to the microphone 22. Thus, the shock absorber 3 can effectively absorb the vibration transmission of the speaker component 12 to the microphone 22 when it emits sound, preventing noise caused by microphone 22 vibration. This helps reduce noise interference with microphone 22 sound pickup, improves microphone 22 pickup quality, and consequently enhances the sound effect of the headphones 100 and the wearer's auditory experience, improving the user experience. Simultaneously, for headphones 100 with auxiliary hearing function, the shock absorber 3 reduces noise, making the sound amplified by the speaker component 12 clearer, thereby improving the auxiliary hearing effect of the headphones 100.

[0098] Optionally, such as Figure 5 As shown, considering that the microphone 22 needs to be powered, the connecting arm 2 also includes a circuit board 24. The circuit board 24 is disposed inside the second housing 21, and the microphone 22 is disposed on the circuit board 24 and electrically connected to the circuit board 24.

[0099] It is understandable that, such as Figure 5 As shown, the vibration transmission path of the speaker component 12 to the microphone 22 includes at least one of the following: the speaker component 12 transmits vibration to the first housing 11 through the connection with the first housing 11; the first housing 11 transmits vibration to the second housing 21 connected thereto; and the second housing 21 transmits vibration to the microphone 22 through the internal circuit board 24.

[0100] Furthermore, when the microphone 22 is connected to the inner wall of the second housing 21, the vibration transmission path of the speaker component 12 to the microphone 22 may also include: the second housing 21 transmitting vibration to the microphone 22 through its connection with the microphone 22.

[0101] Please combine Figure 6 , Figure 6 yes Figure 5 A magnified view of a portion at point A. Optionally, as shown... Figure 5 and Figure 6As shown, the shock absorber 3 is disposed at the connection between the first housing 11 and the speaker component 12. By placing the shock absorber 3 at the connection between the first housing 11 and the speaker component 12, the vibration transmission from the speaker component 12 to the first housing 11 when it emits sound can be effectively absorbed, thereby effectively reducing the vibration transmission from the speaker component 12 to the microphone 22. This helps to reduce noise interference to the microphone 22, improve the sound pickup quality of the microphone 22, and thus improve the sound effect of the headphones 100 and the wearer's auditory experience, enhancing the user experience. Furthermore, since the human ear 300 is relatively sensitive, placing the shock absorber 3 at the connection between the first housing 11 and the speaker component 12 can reduce the vibration transmission from the first housing 11 to the human ear 300, helping to avoid excessive vibration of the speaker component 12 to the human ear 300, and thus improving the wearing comfort of the headphones 100.

[0102] Please combine Figure 7 , Figure 7 yes Figure 5 A magnified view of a portion at point B. Optionally, as shown... Figure 5 and Figure 7 As shown, the shock absorber 3 is disposed at the connection between the second housing 21 and the microphone 22. By placing the shock absorber 3 at the connection between the second housing 21 and the microphone 22, the vibration transmission from the second housing 21 to the microphone 22 can be effectively absorbed, thereby effectively reducing the vibration transmission from the speaker component 12 to the microphone 22. This helps to reduce noise interference with the microphone 22's sound pickup, improves the microphone 22's sound pickup quality, and thus improves the sound effect of the headphones 100 and the wearer's auditory experience, enhancing the user's overall experience. Furthermore, after the speaker component 12 transmits vibration to the first housing 11, the first housing 11 can transmit some of the vibration to the human ear 300, thereby reducing the vibration borne by the speaker component 12 on the second housing 21, and further reducing the vibration transmission from the second housing 21 to the microphone 22.

[0103] Optionally, such as Figures 5 to 7As shown, the shock absorber 3 is disposed at the connection between the first housing 11 and the speaker component 12, and at the connection between the second housing 21 and the microphone 22. That is, there are multiple shock absorbers 3, with some disposed at the connection between the first housing 11 and the speaker component 12, and others disposed at the connection between the second housing 21 and the microphone 22. Compared to separately disposing of shock absorbers 3 at the connection between the first housing 11 and the speaker component 12 or at the connection between the second housing 21 and the microphone 22, this method further reduces the vibration transmission from the speaker component 12 to the microphone 22, thereby further reducing the noise of the headphones 100. This improves the sound quality of the headphones 100 and the user's auditory experience, enhancing the overall user experience.

[0104] The specific configuration of the shock absorber 3 will be further explained below with reference to the embodiments and accompanying drawings.

[0105] Optionally, such as Figure 5 and Figure 6 As shown, the first housing 11 includes a first sub-housing 111 and a second sub-housing 112. The first sub-housing 111 is connected to the second sub-housing 112, and the first housing 11 is connected to both the first sub-housing 111 and the second sub-housing 112. A speaker component 12 is disposed inside the second sub-housing 112, and a vibration damping component 3 is disposed on the outer peripheral surface of the speaker component 12 and connected to the inner wall surface of the second sub-housing 112. By providing a vibration damping component 3 between the outer peripheral surface of the speaker component 12 and the inner wall surface of the second sub-housing 112, the vibration transmission from the speaker component 12 to the second sub-housing 112 can be effectively reduced, thereby effectively reducing the vibration transmission from the speaker component 12 to the microphone 22, which is beneficial for reducing the noise of the headphones 100.

[0106] It is understandable that when the speaker component 12 is connected to the first sub-shell 111, the shock absorber 3 is disposed between the speaker component 12 and the first shell 11 to reduce the vibration transmission of the speaker component 12 to the first sub-shell 111, thereby effectively reducing the vibration transmission of the speaker component 12 to the microphone 22.

[0107] Some alternative implementations, such as Figure 5 and Figure 6 As shown, the headphone body 1 also includes a reinforcing member 13, which is arranged around the outer periphery of the rear sound cavity 12b of the speaker component 12. The reinforcing member 13 is connected to the first sub-shell 111 and the second sub-shell 112. The shock absorber 3 is disposed at the connection between the speaker component 12 and the reinforcing member 13, and / or the shock absorber 3 is disposed at the connection between the reinforcing member 13 and the first sub-shell 111 and the second sub-shell 112.

[0108] As an example, the headphone body 1 also includes a reinforcing member 13, which is arranged around the outer periphery of the rear sound cavity 12b of the speaker component 12. The reinforcing member 13 is connected to the first sub-shell 111 and the second sub-shell 112. The shock absorber 3 is disposed at the connection between the speaker component 12 and the reinforcing member 13.

[0109] In another exemplary embodiment, the headphone body 1 also includes a reinforcing member 13, which is arranged around the outer periphery of the rear sound cavity 12b of the speaker component 12. The reinforcing member 13 is connected to the first sub-shell 111 and the second sub-shell 112, and the shock absorber 3 is disposed at the connection between the reinforcing member 13 and the first sub-shell 111 and the second sub-shell 112.

[0110] Another example, such as Figure 5 and Figure 6 As shown, the headphone body 1 also includes a reinforcing member 13, which is arranged around the outer periphery of the rear sound cavity 12b of the speaker component 12. The reinforcing member 13 is connected to the first sub-shell 111 and the second sub-shell 112. Shock-absorbing members 3 are provided at the connection between the speaker component 12 and the reinforcing member 13, as well as at the connection between the reinforcing member 13 and the first sub-shell 111 and the second sub-shell 112.

[0111] By employing the above-described method, the shock absorber 3 effectively reduces the vibration transmission from the speaker component 12 to the first sub-shell 111 and the second sub-shell 112 via the reinforcing member 13, thereby effectively reducing the vibration transmission from the speaker component 12 to the microphone 22, which helps to reduce the noise of the headphones 100. Furthermore, the reinforcing member 13 strengthens the structure of the second sub-shell 112, improving the headphone body 1's resistance to impact and preventing damage to the second sub-shell 112 caused by accidental drop of the headphones 100 during use. Furthermore, compared to setting the damping element 3 only at the connection between the speaker component 12 and the reinforcing member 13 or at the connection between the reinforcing member 13 and the first sub-shell 111 and the second sub-shell 112, setting the reinforcing member 13 at multiple connection points can further reduce the vibration transmission of the speaker component 12 to the first sub-shell 111 and the second sub-shell 112, thereby further reducing the vibration transmission of the speaker component 12 to the microphone 22. This is beneficial for further reducing the noise of the headphones 100, and thus for further improving the sound effect of the headphones 100 and the hearing experience of the wearer, thereby enhancing the user experience.

[0112] Optionally, the vibration damping member 3 disposed at the connection between the speaker component 12 and the first sub-shell 111 and the second sub-shell 112 may be an integrally disposed vibration damping member 3 at the connection between the speaker component 12 and the first sub-shell 111 and the vibration damping member 3 at the connection between the speaker component 12 and the second sub-shell 112; or it may be, as Figure 5 and Figure 6As shown, the vibration damping component 3 at the connection between the speaker component 12 and the first sub-shell 111 is set separately from the vibration damping component 3 at the connection between the speaker component 12 and the second sub-shell 112. This embodiment does not limit this.

[0113] Optionally, the aforementioned reinforcing component 13 may include, but is not limited to, a metal ring, a plastic ring, etc.

[0114] Optionally, the reinforcing member 13 and the speaker component 12 are integrally formed. This integral form simplifies the assembly of the headphones 100 and reduces the difficulty of assembling them.

[0115] It is understandable that when the reinforcing member 13 is integrally formed with the sound-emitting component 12, and the first sub-shell 111 is provided with a shock-absorbing member 3, the shock-absorbing member 3 is provided at the connection between the reinforcing member 13 and the first sub-shell 111 and the second sub-shell 112.

[0116] The specific configuration of the shock absorber 3 in the second housing 21 will be explained below.

[0117] Some alternative implementations, such as Figure 7 As shown, the connecting arm 2 also includes a circuit board 24, which is disposed inside the second housing 21. The microphone 22 is electrically connected to the circuit board 24, and a shock absorber 3 is provided at the connection between the circuit board 24 and the second housing 21. In this way, on the one hand, by providing the shock absorber 3 between the circuit board 24 and the second housing 21, the vibration transmission from the second housing 21 to the circuit board 24 can be effectively reduced, which helps to reduce the vibration transmission from the speaker component 12 to the microphone 22, thereby reducing the noise of the headphones 100. On the other hand, by utilizing the internal space of the second housing 21 and stacking electronic components such as the circuit board 24 and the microphone 22 within the second housing 21, the space utilization of the connecting arm 2 is improved, which in turn improves the space utilization of the headphones 100. Furthermore, by placing the microphone 22 inside the second housing 21, it can be positioned away from the sound outlet 11a, thereby avoiding interference from the sound output of the speaker component 12 to the microphone 22, which helps to improve the sound pickup effect of the microphone 22.

[0118] Optionally, such as Figure 7As shown, the circuit board 24 includes a rigid board 241 and a first flexible board 242 connected to the rigid board 241. The microphone 22 is connected to the second housing 21 and electrically connected to the first flexible board 242, so that the microphone 22 is spaced apart from the rigid board 241. The rigid-flex circuit board 24 allows for better arrangement of the circuit board 24 and the microphone 22 within the second housing 21, and enables the microphone 22 to be spaced apart from the rigid board 241. This blocks or prevents vibrations transmitted from the second housing 21 to the rigid board 241 from being transmitted to the microphone 22, which helps reduce vibration transmission from the speaker component 12 to the microphone 22, and thus helps reduce noise in the headphones 100.

[0119] Please combine Figure 8 and Figure 9 , Figure 8 This is a schematic diagram of the circuit board structure of a wireless earphone provided in an embodiment of this application; Figure 9 yes Figure 8 A schematic diagram of the unfolded circuit board structure is shown. To prevent the connection between the microphone 22 and the second housing 21 from being unstable, which could lead to the microphone 22 detaching from the second housing 21 during use of the headphones 100, especially when the wearer is exercising, a shock-absorbing component 3 is provided in the gap between the microphone 22 and the rigid plate 241 to support the microphone 22. Specifically, as shown... Figures 7 to 9 As shown, a shock absorber 3 is provided in the gap between the microphone 22 and the rigid plate 241, and the shock absorber 3 is connected to the rigid plate 241 and the microphone 22. In this way, the shock absorber 3 can provide support for the microphone 22, making the connection between the microphone 22 and the second housing 21 more stable and preventing the microphone 22 from shifting position, thereby improving the stability of the headphone 100; at the same time, the shock absorber 3 can absorb the vibration transmitted from the second housing 21 to the microphone 22 through the rigid plate 241, thereby reducing the vibration transmission from the speaker component 12 to the microphone 22, and thus reducing the noise of the headphone 100.

[0120] Since the microphone 22 is connected to the second housing 21 via the rigid-flex circuit board 24, in order to further reduce the vibration transmission from the second housing 21 to the microphone 22, this application also designs a vibration damping scheme between the first flexible circuit board 242 and the second housing 21, and also designs a waterproof and dustproof scheme for the microphone 22, as detailed below:

[0121] Understandably, considering the sound pickup of the microphone 22, the headphone 100 is usually provided with a sound pickup hole 23. In order to avoid the sound pickup of the microphone 22 being affected by the sound output of the speaker component 12, the sound pickup hole 23 is provided on the second housing 21.

[0122] Some alternative implementations, such as Figure 7 As shown, the earphone 100 also includes a waterproof and sound-permeable membrane 4 and / or a dustproof mesh 5 disposed corresponding to the sound-receiving hole 23 on the second housing 21, and the waterproof and sound-permeable membrane 4 and / or dustproof mesh 5 are located between the first flexible plate 242 and the second housing 21. For example, the earphone 100 also includes a waterproof and sound-permeable membrane 4 disposed between the first flexible plate 242 and the second housing 21. Another example is that the earphone 100 also includes a dustproof mesh 5 disposed between the first flexible plate 242 and the second housing 21. Yet another example is that the earphone 100 also includes a waterproof and sound-permeable membrane 4 and a dustproof mesh 5 disposed between the first flexible plate 242 and the second housing 21. When the earphone 100 also includes a waterproof and sound-permeable membrane 4 and a dustproof mesh 5 disposed between the first flexible plate 242 and the second housing 21, the waterproof and sound-permeable membrane 4 is connected to the first flexible plate 242, and the dustproof mesh 5 is connected to the waterproof and sound-permeable membrane 4 and the second housing 21. The waterproof and acoustically permeable membrane 4 prevents liquids from entering the microphone 22 through the sound-receiving hole 23, thus avoiding damage and extending the lifespan of the headphones 100. The dustproof mesh 5 prevents dust and other particles from entering the second housing 21, preventing them from clogging the sound-receiving port on the microphone 22. This improves the microphone's sound pickup, enhancing the sound quality of the headphones 100 and the user's auditory experience, ultimately improving the overall user experience.

[0123] In some alternative embodiments, when the earphone 100 includes a waterproof and acoustically permeable membrane 4, a shock-absorbing element 3 is provided between the first flexible plate 242 and the waterproof and acoustically permeable membrane 4, and / or between the waterproof and acoustically permeable membrane 4 and the second housing 21.

[0124] In one exemplary case, when the earphone 100 includes a waterproof and acoustically permeable membrane 4, a shock-absorbing element 3 is disposed between the first flexible plate 242 and the waterproof and acoustically permeable membrane 4.

[0125] In another exemplary embodiment, when the earphone 100 includes a waterproof and acoustically permeable membrane 4, a shock-absorbing element 3 is disposed between the waterproof and acoustically permeable membrane 4 and the second housing 21.

[0126] In another exemplary case, when the earphone 100 includes a waterproof and acoustically permeable membrane 4, shock-absorbing components 3 are provided between the first flexible plate 242 and the waterproof and acoustically permeable membrane 4, and between the waterproof and acoustically permeable membrane 4 and the second housing 21.

[0127] In some alternative embodiments, when the earphone 100 includes a dustproof mesh 5, a shock-absorbing element 3 is provided between the first flexible plate 242 and the dustproof mesh 5, and / or between the dustproof mesh 5 and the second housing 21.

[0128] For example, when the earphone 100 includes a dustproof mesh 5, a shock-absorbing element 3 is provided between the first flexible plate 242 and the dustproof mesh 5.

[0129] For example, when the earphone 100 includes a dustproof mesh 5, a shock-absorbing element 3 is provided between the dustproof mesh 5 and the second housing 21.

[0130] For example, when the earphone 100 includes a dustproof mesh 5, shock-absorbing components 3 are provided between the first flexible plate 242 and the dustproof mesh 5, and between the dustproof mesh 5 and the second housing 21.

[0131] Some alternative implementations, such as Figure 7 As shown, when the earphone 100 includes a waterproof and sound-permeable membrane 4 and a dustproof mesh 5, the waterproof and sound-permeable membrane 4 is connected to the first flexible plate 242, the dustproof mesh 5 is connected to the waterproof and sound-permeable membrane 4 and the second housing 21, and a shock-absorbing element 3 is provided between the first flexible plate 242 and the waterproof and sound-permeable membrane 4, and / or between the waterproof and sound-permeable membrane 4 and the dustproof mesh 5, and / or between the dustproof mesh 5 and the second housing 21.

[0132] In one example, when the earphone 100 includes a waterproof and acoustically permeable membrane 4 and a dustproof mesh 5, the waterproof and acoustically permeable membrane 4 is connected to a first flexible plate 242, the dustproof mesh 5 is connected to the waterproof and acoustically permeable membrane 4 and a second housing 21, and a shock-absorbing member 3 is provided between the first flexible plate 242 and the waterproof and acoustically permeable membrane 4.

[0133] In another exemplary embodiment, when the earphone 100 includes a waterproof and acoustically permeable membrane 4 and a dustproof mesh 5, the waterproof and acoustically permeable membrane 4 is connected to a first flexible plate 242, the dustproof mesh 5 is connected to the waterproof and acoustically permeable membrane 4 and the second housing 21, and a shock-absorbing element 3 is provided between the waterproof and acoustically permeable membrane 4 and the dustproof mesh 5.

[0134] In another exemplary embodiment, when the earphone 100 includes a waterproof and acoustically permeable membrane 4 and a dustproof mesh 5, the waterproof and acoustically permeable membrane 4 is connected to a first flexible plate 242, the dustproof mesh 5 is connected to the waterproof and acoustically permeable membrane 4 and the second housing 21, and a shock-absorbing member 3 is provided between the dustproof mesh 5 and the second housing 21.

[0135] In another exemplary embodiment, when the earphone 100 includes a waterproof and acoustically permeable membrane 4 and a dustproof mesh 5, the waterproof and acoustically permeable membrane 4 is connected to a first flexible plate 242, the dustproof mesh 5 is connected to the waterproof and acoustically permeable membrane 4 and the second housing 21, and shock-absorbing components 3 are provided between the first flexible plate 242 and the waterproof and acoustically permeable membrane 4, and between the waterproof and acoustically permeable membrane 4 and the dustproof mesh 5.

[0136] In another exemplary embodiment, when the earphone 100 includes a waterproof and acoustically permeable membrane 4 and a dustproof mesh 5, the waterproof and acoustically permeable membrane 4 is connected to a first flexible plate 242, the dustproof mesh 5 is connected to the waterproof and acoustically permeable membrane 4 and the second housing 21, and shock-absorbing components 3 are provided between the first flexible plate 242 and the waterproof and acoustically permeable membrane 4, and between the dustproof mesh 5 and the second housing 21.

[0137] In another exemplary embodiment, when the earphone 100 includes a waterproof and acoustically permeable membrane 4 and a dustproof mesh 5, the waterproof and acoustically permeable membrane 4 is connected to the first flexible plate 242, the dustproof mesh 5 is connected to the waterproof and acoustically permeable membrane 4 and the second housing 21, and shock-absorbing components 3 are provided between the waterproof and acoustically permeable membrane 4 and the dustproof mesh 5, and between the dustproof mesh 5 and the second housing 21.

[0138] Another example, such as Figure 7 and Figure 8 As shown, when the earphone 100 includes a waterproof and sound-permeable membrane 4 and a dustproof mesh 5, the waterproof and sound-permeable membrane 4 is connected to the first flexible plate 242, and the dustproof mesh 5 is connected to the waterproof and sound-permeable membrane 4 and the second shell 21. Shock-absorbing components 3 are provided between the first flexible plate 242 and the waterproof and sound-permeable membrane 4, between the waterproof and sound-permeable membrane 4 and the dustproof mesh 5, and between the dustproof mesh 5 and the second shell 21.

[0139] By adopting the above method, the vibration transmission from the second housing 21 to the microphone 22 can be effectively reduced by the shock absorber 3, which helps to reduce the vibration transmission from the speaker component 12 to the microphone 22, and thus helps to reduce the noise of the headphones 100.

[0140] As an optional implementation method, such as Figures 7 to 10 As shown, the first flexible circuit board 242 includes a first sub-flexible circuit board 2421 and a second sub-flexible circuit board 2422. The first sub-flexible circuit board 2421 is connected to one end of the rigid circuit board 241, and the second sub-flexible circuit board 2422 is connected to the other end of the rigid circuit board 241. The microphone 22 includes at least two microphones. Of the at least two microphones 22, one microphone 22 is disposed at one end of the rigid circuit board 241 and electrically connected to the first sub-flexible circuit board 2421, and the other microphone 22 is disposed at the other end of the rigid circuit board 241 and electrically connected to the second sub-flexible circuit board 2422. In this way, on the one hand, the connection of the two microphones 22 can be realized through the first sub-flexible board 2421 and the second sub-flexible board 2422; on the other hand, by setting the two microphones 22 at the two ends of the rigid board 241 respectively, the sound wave intensity of the microphones 22 at different positions can be different, thereby improving the noise reduction effect of the headset 100 through the two microphones 22; and by setting the microphones 22 far apart from each other, the signal interference between the microphones 22 can be reduced, which is beneficial to improving the sound pickup effect of the microphones 22, thereby improving the call effect or hearing aid effect of the headset 100.

[0141] As an optional implementation method, such as Figures 7 to 10As shown, the second housing 21 includes an inclined section 21a and a straight section 21b. One end of the inclined section 21a is connected to the first housing 11, and the straight section 21b is connected to the other end of the inclined section 21a. The rigid board 241 includes a first sub-rigid board 2411 and a second sub-rigid board 2412. The circuit board 24 also includes a second flexible board 243. The first sub-rigid board 2411 is connected to the second sub-rigid board 2412 through the second flexible board 243. The first sub-rigid board 2411 is disposed within the inclined section 21a. A flexible sub-board 2421 is mounted on and electrically connected to a first rigid sub-board 2411. A second rigid sub-board 2412 is mounted within a straight section 21b, and a flexible sub-board 2422 is mounted on and electrically connected to the second rigid sub-board 2412. Of the two microphones 22, one microphone 22 is located within an inclined section 21a near the headphone body 1, and the other microphone 22 is located within a straight section 21b away from the inclined section 21a. By positioning the two microphones 22 at opposite ends of the inclined and straight sections 21b, respectively, signal interference between the microphones 22 can be further reduced, thus improving the sound pickup performance of the microphones 22. Furthermore, by using the first sub-rigid board 2411, the second flexible board 243, and the second sub-rigid board 2412, the circuit board 24 and the microphone 22 can be better arranged in the inclined section 21a and the straight section 21b of the second housing 21, which is conducive to further improving the space utilization of the connecting arm 2, thereby further improving the space utilization of the headphone 100.

[0142] In some embodiments, to facilitate the assembly of the earphone 100, at least two of the first sub-rigid board 2411, the second sub-rigid board 2412, the first sub-flexible board 2421, the second sub-flexible board 2422, and the second flexible board 243 can be integrally configured.

[0143] One example is that the first sub-rigid board 2411 and the first sub-flexible board 2421 are integrated into one unit.

[0144] Another example is that the second sub-flexible board 2422 and the second sub-rigid board 2412 are integrated into one unit.

[0145] In another exemplary embodiment, the first rigid sub-board 2411 and the second flexible sub-board 243 are integrated into one unit.

[0146] In another exemplary configuration, the second rigid board 2412 and the second flexible board 243 are integrated into one unit.

[0147] In another example, the first sub-rigid board 2411, the first sub-flexible board 2421, and the second flexible board 243 are integrated into one unit.

[0148] In another example, the second sub-rigid board 2412, the second sub-flexible board 2422, and the second flexible board 243 are integrated into one unit.

[0149] In another example, the first sub-rigid board 2411, the second sub-rigid board 2412, and the second flexible board 243 are integrated into one unit.

[0150] In another example, the first sub-rigid board 2411, the second sub-rigid board 2412, the first sub-flexible board 2421, and the second flexible board 243 are integrated into one unit.

[0151] In another example, the first sub-rigid board 2411, the second sub-rigid board 2412, the second sub-flexible board 2422, and the second flexible board 243 are integrated into one unit.

[0152] Another example, such as Figure 9 and Figure 10 As shown, the first sub-rigid board 2411, the second sub-rigid board 2412, the first sub-flexible board 2421, the second sub-flexible board 2422, and the second flexible board 243 are integrally arranged.

[0153] The integrated arrangement of the first sub-rigid board 2411, the second sub-rigid board 2412, the first sub-flexible board 2421, the second sub-flexible board 2422, and the second flexible board 243 simplifies the assembly of the earphone 100 and helps to reduce the assembly difficulty of the earphone 100.

[0154] As an optional implementation, the earphone 100 also includes a charging connector 61, which is disposed on the side of the inclined section 21a near the earphone body 1 and is electrically connected to the first sub-rigid plate 2411. The charging connector 61 on the inclined section 21a enables charging of the earphone 100. Furthermore, compared to placing the charging connector 61 on the straight section 21b, it avoids friction between the charging connector 61 and the inner wall of the charging case when the earphone 100 is stored inside, thus preventing damage to the charging connector 61 and extending the lifespan of the earphone 100.

[0155] It is understandable that when the earphone 100 is stored in the charging case, in order to prevent the earphone 100 from falling out, a magnetic component can be provided to make the earphone 100 adhere to the charging case. The magnetic component may include one or more, and this embodiment does not limit it.

[0156] Optionally, when there are multiple magnetic components, there can be 1, 2, 3, 4, etc., and this embodiment does not limit this.

[0157] Please see Figure 10 , Figure 10This is a structural schematic diagram of a wireless earphone (showing the angle between the inclined section and the straight section) provided in an embodiment of this application. Optionally, when there are two magnetic components, the two magnetic components can provide attraction in the same direction or in different directions; this embodiment does not limit this. For example, as... Figure 10 As shown, the first housing 11 is cylindrical, and the earphone 100 further includes a first magnetic member 62 and a second magnetic member 63. The first magnetic member 62 is disposed inside the first housing 11 and along the extending direction of the first housing 11, the first magnetic member 62 is disposed at the end of the first housing 11 away from the speaker component 12. The second magnetic member 63 is disposed on the side of the flat section 21b near the earphone body 1, and the second magnetic member 63 is located inside the flat section 21b. Through the first magnetic member 62 and the second magnetic member 63, when the earphone 100 is stored in the charging case, it can provide better suction force, which helps to prevent the earphone 100 from falling out of the charging case during activities. In particular, when the earphone 100 is plugged into a smart wearable device, the first magnetic member 62 and the second magnetic member 63 can provide suction force in different directions, which helps to firmly attach the earphone 100 to the receiving position of the smart wearable device.

[0158] Optionally, such as Figure 10 As shown, the second housing 21 includes an inclined section 21a and a straight section 21b. One end of the inclined section 21a is connected to the first housing 11, and the straight section 21b is connected to the other end of the inclined section 21a. The straight section 21b and the inclined section 21a are set at an angle. Considering that the inclined section 21a will sag slightly under the influence of gravity after the earphone 100 is worn, this application further sets the inclined section 21a and the straight section 21b at an angle, so that the inclined section 21a can be closer to the human ear 300 and fit more snugly with the human ear 300 when the inclined section 21a sags. This makes the space formed by the inclined section 21a and the straight section 21b have a better wrapping effect on the human ear 300, thereby preventing the earphone body 1 from becoming loose when worn, which is conducive to improving the wearing comfort of the earphone 100 and improving the user experience.

[0159] Optionally, such as Figure 10 As shown, at the connection between the straight section 21b and the inclined section 21a, a first included angle α is formed between the straight section 21b and the inclined section 21a, with the first included angle α being 90°-180°. Through the obtuse first included angle α, when the earphone body 1 is worn on the human ear 300, the straight section 21b and the inclined section 21a can be closer to the human ear 300. This allows the space formed by the inclined section 21a, the straight section 21b, and the clamping arm 7 to have a better wrapping effect on the human ear 300, thereby preventing the earphone body 1 from becoming loose during wear. This improves the wearing comfort of the earphone 100 and enhances the user experience.

[0160] It is understood that the first included angle α mentioned above is 90°-180°, and can be, for example, 95°, 100°, 105°, 110°, 115°, 120°, 125°, 130°, 135°, 140°, 145°, 150°, 155°, 160°, 165°, 170°, 175°, 180°, 185°, etc. This embodiment does not limit this.

[0161] Optionally, the first included angle α, which is 90°-180°, can be: 90°-180°; 95°-180°; 100°-180°; 105°-180°; 110°-180°; 115°-180°; 120°-180°; 125°-180°; 130°-180°; 135°-180°; 140°-180°; 140°-175°; or 140°-170°. Alternatively, the first included angle α is 140°-165°. Alternatively, the first included angle α is 140°-160°. Alternatively, the first included angle α is 145°-160°. Alternatively, the first included angle α is 145°-155°. Alternatively, the first included angle α is 145°-150°, etc., and this embodiment does not limit this.

[0162] Optionally, such as Figure 10 As shown, the first housing 11 has a wearing surface P and a first surface M opposite to the wearing surface P. The wearing surface P is configured to be close to or in contact with the human ear 300 when the earphone body 1 is worn on the human ear 300. The inclined segment 21a has a second surface N opposite to the wearing surface P, and the second surface N is set at an angle to the first surface M. By setting the second surface N of the inclined segment 21a at an angle to the first surface M of the earphone body 1, the inclined segment 21a can be closer to the human ear 300 when the earphone body 1 is worn on the human ear 300. Furthermore, the inclined segment 21a can fit more snugly to the human ear 300 when the straight segment 21b is slightly lowered. This results in a better wrapping effect of the space formed by the inclined segment 21a, the straight segment 21b, and the clamping arm 7 on the human ear 300, thereby preventing the earphone body 1 from becoming loose during wear. This improves the wearing comfort of the earphone 100 and enhances the user experience.

[0163] Optionally, such as Figure 10As shown, a second included angle β is formed between the first surface M and the second surface N (for ease of labeling, the reference numerals for the second included angle β in the figures of this application are all shown at their apex angles), and the supplementary angle of the second included angle β is an acute angle. By setting the second included angle β as an obtuse angle, the inclined segment 21a and the straight segment 21b can better conform to the contour of the human ear 300, thereby providing a better wrapping effect on the human ear 300 within the space formed by the inclined segment 21a, the straight segment 21b, and the clamping arm 7. This is beneficial for improving the wearing stability of the earphone 100, and thus for improving the wearing comfort of the earphone 100 and the user experience.

[0164] Optionally, the supplementary angle of the second included angle β can be 20°-90°. In this way, the space formed by the inclined segment 21a and the straight segment 21b can be further improved to enhance the wrapping effect of the human ear 300, which is conducive to further improving the wearing stability of the earphone 100, and thus further improving the wearing comfort of the earphone 100 and the user experience.

[0165] It is understood that the supplementary angle of the second included angle β is 20°-90°, and can be, for example, 20°, 25°, 30°, 35°, 40°, 45°, 50°, 55°, 60°, 65°, 70°, 75°, 80°, 85°, etc. This embodiment does not limit this.

[0166] Optionally, the supplementary angle of the second included angle β is 20°-90°, which can be: 20°-90°; 25°-90°; 30°-90°; 35°-90°; 40°-90°; 45°-90°; 45°-85°; 45°-80°; 45°-75°; 45°-70°; 45°-65°; or 45°-60°. Alternatively, the supplementary angle of the second included angle β is 45°-55°. Alternatively, the supplementary angle of the second included angle β is 45°-50°, etc., but this embodiment does not limit it.

[0167] As an optional implementation method, such as Figure 10As shown, the earphone body 1 is cylindrical and extends along the extension direction X of the straight section 21b. This allows the earphone 100 to be directly inserted into the charging case along the extension direction X of the straight section 21b when stored inside, facilitating storage and saving space in the charging case while improving its space utilization. In particular, when the earphone 100 is plugged into a smart wearable device, it contributes to the miniaturization of the smart wearable device.

[0168] Optionally, such as Figure 10 As shown, the minimum distance D between the outer peripheral surface of the earphone body 1 and the outer peripheral surface of the straight section 21b is 3mm-8mm. By setting the range of the minimum distance D between the outer peripheral surface of the earphone body 1 and the outer peripheral surface of the straight section 21b, the straight section 21b can be made closer to the human ear 300 when worn. This further improves the wrapping effect of the space formed by the inclined section 21a, the straight section 21b, and the clamping arm 7 on the human ear 300, which is conducive to further improving the wearing stability of the earphone 100, and thus further improving the wearing comfort of the earphone 100 and the user experience.

[0169] Optionally, the minimum distance D between the outer peripheral surface of the earphone body 1 and the outer peripheral surface of the straight section 21b is 3mm-8mm, and can be, for example, 3mm, 3.5mm, 4mm, 4.5mm, 5mm, 5.5mm, 6mm, 6.5mm, 7mm, 7.5mm, 8mm, etc. This application embodiment does not limit this.

[0170] Optionally, the minimum distance D between the outer peripheral surface of the earphone body 1 and the outer peripheral surface of the straight section 21b is 3mm-8mm. Specifically, it can be 3.5mm-8mm, 4mm-8mm, 4mm-7.5mm, 4mm-7mm, 4mm-6.5mm, or 4mm-6mm. Alternatively, the minimum distance D between the outer peripheral surface of the earphone body 1 and the outer peripheral surface of the straight section 21b may be 4mm-5.5mm. Alternatively, the minimum distance D between the outer peripheral surface of the earphone body 1 and the outer peripheral surface of the straight section 21b may be 4mm-5mm. Alternatively, the minimum distance D between the outer peripheral surface of the earphone body 1 and the outer peripheral surface of the straight section 21b may be 4mm-4.5mm, etc., and this embodiment does not limit this.

[0171] As an alternative implementation, the first housing 11 and the inclined section 21a are integrally formed.

[0172] Optionally, the inclined section 21a and the straight section 21b are integrated.

[0173] Optionally, the first housing 11, the inclined section 21a, and the straight section 21b are integrally formed.

[0174] The above-mentioned method of integrating the first housing 11, the inclined section 21a, and the straight section 21b can simplify the assembly process between the first housing 11, the inclined section 21a, and the straight section 21b, making it easier to assemble the earphone 100, thereby improving the assembly efficiency of the earphone 100 and thus improving the production efficiency of the earphone 100.

[0175] Understandably, in order to facilitate the installation of components such as the speaker component 12, battery 14, circuit board 24, and microphone 22, the inclined section 21a may include a bottom shell and a top shell that are connected and form an installation space inside, and the straight section 21b may also include a bottom shell and a top shell that are connected and form an installation space inside. The bottom shell of the inclined section 21a and the bottom shell of the straight section 21b are integrally formed with the first sub-shell 111, and the top shell of the inclined section 21a and the top shell of the straight section 21b are integrally formed with the second sub-shell 112.

[0176] As an optional implementation method, such as Figure 10 As shown, the earphone 100 also includes a clamping arm 7, which is connected to the end of the connecting arm 2 away from the first housing 11. The clamping arm 7 and the connecting arm 2 can form a clamping space with the first housing 11 for clamping onto the human ear 300, so that the earphone body 1 can be worn on the human ear 300. Since the clamping arm 7 and the connecting arm 2 can form a clamping space with the first housing 11 for clamping onto the human ear 300, the earphone body 1 can be worn through the clamping arm 7.

[0177] Optionally, such as Figure 10 As shown, the clamping arm 7 is rotatably connected to the connecting arm 2. The clamping arm 7 can rotate relative to the connecting arm 2 to change the opening angle θ between the clamping arm 7 and the connecting arm 2. Because the clamping arm 7 can rotate relative to the connecting arm 2 to adjust the opening angle θ between the clamping arm 7 and the connecting arm 2, the wearer can adjust the appropriate opening angle θ between the clamping arm 7 and the connecting arm 2 according to their own ear shape. This avoids the occurrence of excessive or insufficient clamping force of the earphone 100, which helps to reduce the discomfort such as foreign body sensation and pain when wearing the earphone 100. This helps to increase the wearing enthusiasm of wearers, especially the elderly who have a resistance to wearing the earphone 100.

[0178] Optionally, such as Figure 10 As shown, the earphone 100 also includes a connector 8, which connects the connecting arm 2 and the clamping arm 7. The connector 8 is configured to allow the clamping arm 7 to rotate relative to the connecting arm 2, thereby changing the opening angle θ between the clamping arm 7 and the connecting arm 2. Through the connector 8, on the one hand, the clamping arm 7 can be rotatably connected to the connecting arm 2; on the other hand, the opening angle θ between the clamping arm 7 and the connecting arm 2 can be maintained, so that the earphone body 1 can be worn on the human ear 300.

[0179] Optionally, the connector 8 includes a pivot 81 or an elastic element. When the connector 8 includes an elastic element, the elastic element is configured to bend and deform to change the opening angle θ between the clamping arm 7 and the connecting arm 2. In this way, the clamping arm 7 can be rotatably connected to the connecting arm 2 via the pivot 81 or the elastic element. Furthermore, the pivot 81 allows for better rotation of the clamping arm 7, thereby adjusting the opening angle θ between the clamping arm 7 and the connecting arm 2.

[0180] Optionally, the aforementioned rotating shaft 81 includes a single-cell structure damping rotating shaft 81, a spring-loaded damping rotating shaft 81, an overlapping damping rotating shaft 81, etc., and this embodiment does not limit this. By setting the rotating shaft 81 as a damping rotating shaft 81, both the rotation of the clamping arm 7 relative to the connecting arm 2 and the maintenance of the angle between the clamping arm 7 and the connecting arm 2 can be achieved. In addition, the use of a damping rotating shaft 81 simplifies the way the clamping arm 7 can rotate relative to the connecting arm 2, which helps to simplify the manufacturing process of the earphone 100 and thus improve the production efficiency of the earphone 100.

[0181] Optionally, the above-mentioned elastic element includes shape memory metal sheet, soft rubber sheet, spring sheet, etc., and this embodiment does not limit it.

[0182] As an optional implementation method, such as Figure 10 As shown, a concave surface 71 is provided on the side surface of the clamping arm 7 near the headphone body 1. The concave surface 71 on the side surface of the clamping arm 7 can increase the rotation angle of the clamping arm 7 relative to the connecting arm 2, which is beneficial to increasing the angle range between the clamping arm 7 and the connecting arm 2. This allows the distance between the end of the clamping arm 7 away from the connecting arm 2 and the wearing surface P of the headphone body 1 to be smaller, thereby enabling the headphone 100 to adapt to the ear contour size of more people and improving the applicability of the headphone 100 to different groups of people.

[0183] Optionally, such as Figure 10 As shown, the angle at which the clamping arm 7 can rotate relative to the connecting arm 2 is 0°-160°, that is, the opening and closing angle θ between the clamping arm 7 and the connecting arm 2 is 0°-160°. By setting the range of the angle at which the clamping arm 7 can rotate relative to the connecting arm 2, the distance between the end of the clamping arm 7 away from the connecting arm 2 and the wearing surface P of the earphone body 1 can be smaller, thereby enabling the earphone 100 to adapt to the ear contour size of more people and improving the applicability of the earphone 100 to different groups of people.

[0184] It is understood that the angle at which the clamping arm 7 can rotate relative to the connecting arm 2 is 0°-160°, and can be, for example, 0°, 5°, 10°, 15°, 20°, 25°, 30°, 35°, 40°, 45°, 50°, 55°, 60°, 65°, 70°, 75°, 80°, 85°, 90°, 95°, 100°, 105°, 110°, 115°, 120°, 125°, 130°, 135°, 140°, 145°, 150°, 155°, 160°, etc. This embodiment does not limit this.

[0185] As an optional implementation method, such as Figure 10As shown, the headphone body 1 also includes a battery 14, which is disposed inside the first housing 11. The battery 14 is electrically connected to the speaker component 12. Along the thickness direction of the speaker component 12, the battery 14 is disposed on the side where the front sound cavity 12a of the speaker component 12 is located. The sound outlet 11a on the first housing 11 is located between the speaker component 12 and the battery 14. In this way, when the headphone 100 is worn on the human ear 300, the battery 14 is closer to the wearing surface P. On the one hand, this makes the center of gravity of the headphone 100 closer to the human ear 300, which can prevent the headphone 100 from flipping outward due to the gravity on the side away from the human ear 300 when worn, thus improving the wearing stability of the headphone 100. On the other hand, it allows the sound outlet 11a to be better aligned with the ear canal of the human ear 300 when the headphone 100 is worn, thereby improving the sound output effect of the headphone 100. Furthermore, compared to placing the speaker component 12 closer to the wearing surface P, this method allows the speaker component 12 to be placed away from the auricle of the human ear 300, thus freeing it from the limitations of the auricle size. This allows for the selection of a larger speaker component 12, which in turn provides better sound quality and improves the sound quality of the headphones 100.

[0186] Please see Figures 11 to 12 , Figure 11 This is a schematic diagram of the structure of a smart wearable device (earphone plugged into the receiving position) provided in an embodiment of this application; Figure 12 This is a structural schematic diagram of a smart wearable device (earphone detached from its housing) provided in an embodiment of this application. In a second aspect, this application also provides a smart wearable device 200, including a main body 201 and earphones 100 as described in the first aspect above. The main body 201 is provided with a housing 202, which is configured to allow the earphones 100 to be pluggably connected to the main body 201. By providing installation space for the earphones 100 through the housing 202 on the smart wearable device 200, a separate charging case for the earphones 100 is eliminated, making it convenient to carry the earphones 100.

[0187] Optionally, the aforementioned smart wearable device 200 includes, but is not limited to, watches, bracelets, smart jewelry, and glasses. To facilitate the description of the specific structure of the smart wearable device 200, a watch will be used as an example below.

[0188] Please combine Figures 13 to 16 , Figure 13 This is a partial cross-sectional view of a smart wearable device (wireless earphone plugged into the receiving position) provided in an embodiment of this application; Figure 14 yes Figure 13 A magnified view of a section at point C; Figure 15This is a partial cross-sectional view of a smart wearable device (wireless earphone detached from its housing) provided in an embodiment of this application; Figure 16 yes Figure 15 A magnified view of a portion at point D. As an alternative implementation, such as... Figures 12 to 15 As shown, when the second housing 21 includes a straight section 21b, the earphone body 1 is pluggably connected to the receiving position 202 along the extending direction X of the straight section 21b. This approach facilitates the plugging and unplugging of the earphone 100, simplifying the plugging and unplugging process and improving the user experience. Furthermore, it reduces the installation space required for the earphone 100, saving space in the main body 201 of the smart wearable device 200, thus improving the space utilization of the smart wearable device 200 and facilitating its miniaturization.

[0189] Optionally, such as Figures 13 to 16 As shown, the smart wearable device 200 also includes a wearable component 203, which is connected to the main body 201. When the earphone 100 includes a clamping arm 7 and the second housing 21 includes a tilting section 21a, the receiving position 202 includes a first sub-receiving position 2021 and a second sub-receiving position 2022. The first sub-receiving position 2021 and the second sub-receiving position 2022 are connected, and the second sub-receiving position 2022 is disposed between the main body 201 and the wearable component 203. The earphone body 1 and the tilting section 21a are pluggably connected to the first sub-receiving position 2021, and the straight section 21b and the clamping arm 7 are pluggably connected to the second sub-receiving position 2022. Utilizing the space between the wearable component 203 and the main body 201 to set up the second sub-receiving position 202 further saves space in the main body 201 of the smart wearable device 200, thereby improving the space utilization rate of the smart wearable device 200 and facilitating the miniaturization design of the smart wearable device 200. Furthermore, when the smart wearable device 200 is a watch, the tilted section 21a is positioned to fit the transition shape between the wearable component 203 and the side surface of the main body 201 where the receiving position 202 is provided, which helps to improve the aesthetics of the smart wearable device.

[0190] It is understood that when the aforementioned smart wearable device 200 is a watch, the wearing component 203 is a watch strap. When the aforementioned smart wearable device 200 is glasses, the wearing component 203 is a temple, and so on. This embodiment does not limit this.

[0191] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. An earphone, characterized in that, include: The earphone body includes a first housing and a speaker component, wherein the speaker component is disposed within the first housing; A connecting arm, the connecting arm including a second housing and a microphone, the second housing being connected to the first housing, and the microphone being disposed within the second housing; as well as A shock absorber is provided in the first housing and / or the second housing, the shock absorber being configured to reduce the transmission of vibrations from the speaker component to the microphone.

2. The earphone according to claim 1, characterized in that, The shock absorber is disposed on the vibration transmission path of the speaker component to the microphone.

3. The headphones according to claim 1 or 2, characterized in that, The shock absorber is disposed at the connection between the first housing and the sound-emitting component; And / or, The shock absorber is located at the connection between the second housing and the microphone.

4. The headphones according to claim 1 or 2, characterized in that, The first housing includes a first sub-shell and a second sub-shell, the first sub-shell is connected to the second sub-shell, the first housing is connected to the first sub-shell and the second sub-shell, and the speaker component is disposed inside the second sub-shell; The shock absorber is disposed on the outer peripheral surface of the speaker component, and the shock absorber is connected to the inner wall surface of the second sub-shell.

5. The earphone according to claim 4, characterized in that, The headphone body also includes a reinforcing member, which is arranged around the outer periphery of the rear sound cavity of the speaker component, and the reinforcing member is connected to the first sub-shell and the second sub-shell; The shock absorber is disposed at the connection between the sound-emitting component and the reinforcing component, and / or, the shock absorber is disposed at the connection between the reinforcing component and the first sub-shell and the second sub-shell.

6. The earphone according to claim 5, characterized in that, The reinforcing member is integrally formed with the speaker component.

7. The headphones according to claim 1 or 2, characterized in that, The connecting arm also includes a circuit board, which is disposed inside the second housing, and the microphone is electrically connected to the circuit board; The shock-absorbing component is provided at the connection between the circuit board and the second housing.

8. The earphone according to claim 7, characterized in that, The circuit board includes a rigid board and a first flexible board connected to the rigid board. The microphone is connected to the second housing and electrically connected to the first flexible board, so that the microphone is spaced apart from the rigid board.

9. The earphone according to claim 8, characterized in that, The shock absorber is provided in the gap between the microphone and the rigid plate, and the shock absorber is connected to the rigid plate and the microphone.

10. The earphone according to claim 8, characterized in that, The earphone also includes a waterproof and sound-permeable membrane and / or a dustproof mesh disposed corresponding to the sound-receiving hole on the second housing, and the waterproof and sound-permeable membrane and / or dustproof mesh is located between the first flexible plate and the second housing.

11. The earphone according to claim 10, characterized in that, When the earphone includes the waterproof and sound-permeable membrane, the shock-absorbing element is provided between the first flexible plate and the waterproof and sound-permeable membrane, and / or between the waterproof and sound-permeable membrane and the second housing; or, When the earphone includes the dustproof mesh, the shock-absorbing element is provided between the first flexible plate and the dustproof mesh, and / or between the dustproof mesh and the second housing; or, When the earphone includes the waterproof and acoustically permeable membrane and the dustproof mesh, the waterproof and acoustically permeable membrane is connected to the first flexible plate, the dustproof mesh is connected to the waterproof and acoustically permeable membrane and the second housing, and the shock-absorbing element is provided between the first flexible plate and the waterproof and acoustically permeable membrane, and / or between the waterproof and acoustically permeable membrane and the dustproof mesh, and / or between the dustproof mesh and the second housing.

12. The earphone according to claim 8, characterized in that, The first flexible board includes a first sub-flexible board and a second sub-flexible board, the first sub-flexible board being connected to one end of the rigid board, and the second sub-flexible board being connected to the other end of the rigid board; The microphone includes at least two microphones, wherein one microphone is disposed at one end of the rigid board and electrically connected to the first sub-flexible board, and the other microphone is disposed at the other end of the rigid board and electrically connected to the second sub-flexible board.

13. The earphone according to claim 12, characterized in that, The second housing includes an inclined section and a straight section, one end of the inclined section is connected to the first housing, and the straight section is connected to the other end of the inclined section; The rigid board includes a first sub-rigid board and a second sub-rigid board. The circuit board also includes a second flexible board. The first sub-rigid board is connected to the second sub-rigid board through the second flexible board. The first sub-rigid board is disposed in the inclined section. The first sub-flexible board is disposed on the first sub-rigid board and electrically connected to the first sub-rigid board. The second sub-rigid board is disposed in the straight section. The second sub-flexible board is disposed on the second sub-rigid board and electrically connected to the second sub-rigid board. Of the two microphones, one microphone is located at one end of the inclined section near the headphone body, and the other microphone is located at one end of the straight section away from the inclined section.

14. The earphone according to claim 13, characterized in that, At least two of the first sub-rigid board, the second sub-rigid board, the first sub-flexible board, the second sub-flexible board, and the second flexible board are integrally configured.

15. The earphone according to claim 13, characterized in that, The earphone also includes a charging connector, which is disposed on the side of the inclined section near the earphone body and is electrically connected to the first sub-hard board; And / or, The first housing includes a columnar shape, and the earphone further includes a first magnetic member and a second magnetic member. The first magnetic member is disposed inside the first housing and along the extending direction of the first housing. The first magnetic member is disposed at the end of the first housing away from the speaker component. The second magnetic member is disposed on the side of the flat section close to the earphone body and is located inside the flat section.

16. The headphones according to claim 1 or 2, characterized in that, The second housing includes an inclined section and a straight section. One end of the inclined section is connected to the first housing, and the straight section is connected to the other end of the inclined section. The straight section and the inclined section are arranged at an angle.

17. The earphone according to claim 16, characterized in that, The first housing has a wearing surface and a first surface opposite to the wearing surface, the wearing surface being configured to be close to or in contact with the human ear when the earphone body is worn on the human ear, and the inclined segment has a second surface opposite to the wearing surface, the second surface being set at an angle to the first surface.

18. The headphones according to claim 16, characterized in that, The earphone body is cylindrical and extends along the extension direction of the straight section.

19. The headphones according to claim 18, characterized in that, The minimum distance between the outer peripheral surface of the earphone body and the outer peripheral surface of the straight section is 3mm-8mm.

20. The earphone according to claim 16, characterized in that, At least two of the first housing, the inclined section, and the straight section are integrally formed.

21. The headphones according to claim 1 or 2, characterized in that, The earphone also includes a clamping arm connected to the end of the connecting arm away from the first housing. The clamping arm and the connecting arm can form a clamping space with the first housing for clamping the earphone body to be worn on the ear.

22. The earphone according to claim 21, characterized in that, The clamping arm is rotatably connected to the connecting arm, and the clamping arm can rotate relative to the connecting arm to change the opening angle between the clamping arm and the connecting arm.

23. The earphone according to claim 22, characterized in that, The earphone also includes a connector that connects the connecting arm and the clamping arm. The connector is configured to allow the clamping arm to rotate relative to the connecting arm to change the opening angle between the clamping arm and the connecting arm.

24. The headphones according to claim 23, characterized in that, The connecting component includes a pivot or an elastic element; When the connector includes the elastic element, the elastic element is configured to bend and deform to change the opening angle between the clamping arm and the connecting arm.

25. The earphone according to claim 21, characterized in that, The clamping arm has a concave surface on its side surface near the headphone body.

26. The earphone according to claim 1 or 2, characterized in that, The earphone body also includes a battery, which is disposed inside the first housing and electrically connected to the speaker component. Along the thickness direction of the speaker component, the battery is disposed on the side where the front sound cavity of the speaker component is located, and the sound outlet on the first housing is located between the speaker component and the battery.

27. A smart wearable device, characterized in that, The device includes a main unit and an earphone as described in any one of claims 1-26, wherein the main unit has a receiving position configured for the earphone to be pluggably connected to the main unit.

28. The smart wearable device according to claim 27, characterized in that, When the second housing includes the flat section, the earphone body is pluggably connected to the receiving position along the extending direction of the flat section.

29. The smart wearable device according to claim 28, characterized in that, The smart wearable device also includes a wearable component, which is connected to the main unit. When the earphone includes the clamping arm and the second housing includes the inclined section, the receiving position includes a first sub-receiving position and a second sub-receiving position. The first sub-receiving position communicates with the second sub-receiving position, and the second sub-receiving position is located between the main body and the wearable component. The earphone body and the inclined section are pluggably connected to the first sub-receiving position, and the straight section and the clamping arm are pluggably connected to the second sub-receiving position.

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