A power supply circuit and a power supply device

Abstract

The application provides a power supply circuit and a power supply device, which are applied to the technical field of computers and comprise a power supply module, multiple voltage regulating circuits and a controller. The output ends of the power supply module are connected with the input ends of the voltage regulating circuits respectively. The voltage regulating circuits correspond to heating units in a thermal test chip one by one. The output end of each voltage regulating circuit is connected with a heating unit. The controller is connected with the control ends of the voltage regulating circuits respectively. The voltage drops of the voltage regulating circuits are adjusted, and then the actual working voltages of the heating units connected with the voltage regulating circuits are adjusted until the working voltage of the heating unit reaches a target working voltage. The circuit can realize independent power supply for each heating unit. In the test process, the heating power of each heating unit can be flexibly adjusted according to the power distribution of a microprocessor architecture, and then the heating condition of the microprocessor architecture can be accurately simulated, thereby providing a reference basis for the design of the processor architecture.

Description

Technical Field

[0001] This application relates to the field of computer technology, and more specifically, to a power supply circuit and power supply device. Background Technology

[0002] Before tape-out, thermal analysis and evaluation of a microprocessor architecture is performed by simulating its actual heat generation during operation using a thermal test chip. This is one of the widely used testing methods in the field of integrated circuit design.

[0003] The thermal test chip has the same packaging form and packaging material as the real chip. It has multiple heating units inside, and the power supply circuit supplies power to each heating unit in the thermal test chip. The heat generated by each heating unit can simulate the heat generation of the microprocessor architecture.

[0004] However, as the scale of microprocessor architectures increases, the number of heating units integrated in thermal testing chips also increases. Existing technologies can only use a combined power supply method to power each heating unit, that is, to divide the heating units in the thermal testing chip into multiple groups, and power multiple heating units in each group simultaneously. This results in the heat distribution of the thermal testing chip being far from the power distribution of the microprocessor architecture, making it difficult to accurately simulate the heat dissipation of the microprocessor architecture. Utility Model Content

[0005] The purpose of this application is to provide a power supply circuit and power supply device to solve the problem that the existing technology combines the power supply to each heating unit in the thermal test chip, resulting in the heat distribution of the thermal test chip being far from the power distribution of the microprocessor architecture, making it difficult to accurately simulate the heat dissipation of the microprocessor architecture.

[0006] Based on the above, this application provides a power supply circuit, including: The power supply module is used to output the power supply voltage; Multiple voltage regulation circuits, The output terminal of the power supply module is connected to the input terminal of each of the voltage regulation circuits. The output terminal of each voltage regulation circuit is used to connect to a heating unit in the thermal test chip, and the voltage regulation circuit corresponds one-to-one with the heating unit. The controller is connected to the control terminal of each of the voltage regulating circuits and is used to output a first control signal to each of the voltage regulating circuits. The first control signal is used to adjust the voltage drop of the voltage regulating circuit to provide a target operating voltage to the heating unit connected to the voltage regulating circuit.

[0007] The power supply circuit provided in this application includes a power supply module, multiple voltage regulating circuits, and a controller. The output terminal of the power supply module is connected to the input terminal of each voltage regulating circuit. Each voltage regulating circuit corresponds to a heating unit in the thermal test chip, and the output terminal of each voltage regulating circuit is connected to a heating unit. The controller is connected to the control terminal of each voltage regulating circuit to adjust the voltage drop of each voltage regulating circuit, thereby adjusting the actual operating voltage of the heating unit connected to each voltage regulating circuit until the operating voltage of the heating unit reaches the target operating voltage. Thus, the power supply circuit provided in this application can independently power each heating unit in the thermal test chip. During the test, the heating power of each heating unit can be flexibly adjusted according to the power distribution of the microprocessor architecture, thereby accurately simulating the heating situation of the microprocessor architecture and providing a reference for the design of the processor architecture.

[0008] In one optional implementation, the voltage regulating circuit includes: A controllable switch, wherein the input terminal of the controllable switch is connected to the power supply module, and the output terminal of the controllable switch is used to connect to the heating unit; A conversion circuit, wherein the input terminal of the conversion circuit is connected to the controller, and the output terminal of the conversion circuit is connected to the control terminal of the controllable switch; The conversion circuit is used to convert the first control signal into a driving voltage, and the driving voltage is used to adjust the voltage drop of the controllable switch.

[0009] The power supply circuit provided in this application offers an optional implementation of a voltage regulating circuit. The voltage regulating circuit includes a controllable switch and a conversion circuit. The controller is connected to the control terminal of the controllable switch through the conversion circuit. The conversion circuit converts the controller's first control signal into a drive voltage to regulate the voltage drop of the controllable switch, thereby ensuring reliable driving of the controllable switch.

[0010] In one optional implementation, the voltage regulating circuit further includes: A voltage amplifier circuit, wherein the input terminal of the voltage amplifier circuit is connected to the output terminal of the conversion circuit, and the output terminal of the voltage amplifier circuit is connected to the control terminal of the controllable switch; The voltage amplifier circuit is used to amplify the amplitude of the driving voltage.

[0011] In the power supply circuit provided in this application, the voltage regulation circuit also includes a voltage amplification circuit. The voltage amplification circuit amplifies the amplitude of the driving voltage output by the conversion circuit, ensuring that the driving voltage finally output to the controllable switch meets the driving requirements of the controllable switch. This reduces the driving performance requirements of the controller and reduces the cost of hardware, especially the processor, while effectively driving the controllable switch.

[0012] In one optional implementation, the first control signal includes a PWM signal; The conversion circuit includes a filter circuit, and the filter circuit includes a filter resistor and a filter capacitor connected in series.

[0013] The power supply circuit provided in this application, when the first control signal is a PWM signal, uses a filter circuit to convert the PWM signal into a drive voltage. Since the filter circuit includes passive components such as filter resistors and filter capacitors, it has stable operation, strong anti-electromagnetic interference performance, and can ensure the stability of the output drive voltage. Moreover, the circuit structure is simple and the cost is low.

[0014] In one optional implementation, the voltage regulating circuit further includes: The sampling circuit is used to collect electrical parameters when the voltage regulating circuit provides the target operating voltage to the connected heating unit; The controller is connected to the sampling circuit and is used to output the first control signal according to the electrical parameters.

[0015] In the power supply circuit provided in this application, the voltage regulating circuit is equipped with a sampling circuit. The sampling circuit collects the electrical parameters when the voltage regulating circuit provides the target working voltage to the connected heating unit. Based on the obtained electrical parameters, the controller outputs a first control signal to adjust the voltage drop of the voltage regulating circuit, thereby realizing closed-loop control of the voltage drop of the voltage regulating circuit, ensuring that the corresponding heating unit works at the target working voltage, improving the control accuracy of the heating unit, and realizing precise adjustment of the heating power.

[0016] In one optional implementation, the sampling circuit includes: A sampling resistor, one end of which is connected to the output terminal of the controllable switch, and the other end of which is used to connect to the heating unit; An analog-to-digital converter module, wherein the input terminal of the analog-to-digital converter module is connected to the sampling resistor, and the output terminal of the analog-to-digital converter module is connected to the controller; The sampling resistor is used to convert the power supply current when the power supply module supplies power to the heating unit into a sampling voltage. The analog-to-digital converter module is used to convert the sampled voltage into a sampled voltage that the controller can recognize.

[0017] In the power supply circuit provided in this application, the sampling circuit includes a sampling resistor and an analog-to-digital converter module. Electrical parameters are acquired by connecting the sampling resistor in series between the controllable switch and the heating unit, that is, the current of the heating unit is converted into a sampling voltage, and the sampling voltage is further converted into a digital quantity by the analog-to-digital converter module and sent to the controller to ensure that the controller can effectively identify the sampling voltage. The sampling process is simple and easy to implement, and the impact of the sampling process on the operation of the heating unit is minimized. Under the premise of ensuring that the heating unit effectively simulates the heat generation of the microprocessor architecture, closed-loop control is achieved.

[0018] In one optional implementation, the controller is also connected to the control terminal of the power supply module; The controller is also configured to output a second control signal, which is used to adjust the power supply voltage output by the power supply module so that the power supply voltage is greater than the target operating voltage of any of the heating units.

[0019] In the power supply circuit provided in this application, the controller is connected to the control terminal of the power supply module and controls the power supply voltage output by the power supply module so that the power supply voltage is greater than the target operating voltage of any heating unit. This setting can ensure that each heating unit can operate normally, thereby effectively simulating the heat generation of the microprocessor architecture.

[0020] Secondly, this application provides a power supply device, comprising: a substrate and a power supply circuit provided in any of the foregoing embodiments, wherein... The power supply circuit and the thermal test chip are both disposed on the substrate. The power supply circuit is connected to each heating unit in the thermal test chip.

[0021] The power supply device provided in this application includes a substrate and a power supply circuit provided in any of the aforementioned embodiments. The power supply circuit and the thermal test chip are both disposed on the substrate. The power supply circuit is connected to each heating unit in the thermal test chip. The power supply circuit can independently supply power to each heating unit in the thermal test chip. Thus, during the test, the heating power of each heating unit can be flexibly adjusted according to the power distribution of the microprocessor architecture, thereby accurately simulating the heating situation of the microprocessor architecture and providing a reference for the design of the processor architecture.

[0022] In one optional embodiment, the power supply device provided in the second aspect of this application further includes: a base disposed on the substrate; The base is detachably connected to the thermal testing chip; The power supply circuit is electrically connected to each heating unit in the thermal test chip via the base.

[0023] In the power supply device provided in this application, a base is provided on the substrate, and the thermal test chip is detachably connected through the base, which can realize the flexible installation and removal of the thermal test chip, thereby adapting to different thermal test chips and meeting the power supply requirements of different thermal test chips.

[0024] In one optional embodiment, the substrate includes a power supply substrate and a test substrate; The power supply device further includes a first connector and a second connector, wherein... The power supply circuit and the first connector are disposed on the power supply substrate, and the power supply circuit is connected to the first connector. The base and the second connector are disposed on the test substrate, and the base is connected to the second connector; When the first connector and the second connector are connected, each voltage regulating circuit in the power supply circuit can be electrically connected to one of the heating units through the base.

[0025] In the power supply device provided in this application, the substrate is divided into a test substrate and a power supply substrate. The power supply device also includes a first connector and a second connector. The test substrate and the power supply substrate are connected through the connector. The power supply substrate can supply power to different test substrates through the connector, which helps to improve the flexibility of the power supply device in use. Attached Figure Description

[0026] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments of this application will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0027] Figure 1 This is a schematic diagram of the TTC power supply method provided by related technologies.

[0028] Figure 2 This is a structural block diagram of a power supply circuit provided in an embodiment of this application.

[0029] Figure 3 This is a structural block diagram of a voltage regulation circuit provided in an embodiment of this application.

[0030] Figure 4 This is a structural block diagram of another voltage regulation circuit provided in the embodiments of this application.

[0031] Figure 5 This is a structural block diagram of another voltage regulation circuit provided in the embodiments of this application.

[0032] Figure 6This is a structural block diagram of a charging device provided in an embodiment of this application.

[0033] Figure 7 This is a structural block diagram of another charging device provided in the embodiments of this application. Detailed Implementation

[0034] The technical solutions of the embodiments of this application will now be described with reference to the accompanying drawings. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the scope of protection of this application.

[0035] As mentioned earlier, the thermal test chip has the same packaging form and packaging material as the real chip. It has multiple heating units inside, and the power supply circuit supplies power to each heating unit in the thermal test chip. The heat generated by each heating unit simulates the heat generation of the microprocessor architecture.

[0036] However, with the increasing scale of microprocessor architectures, the number of heating units integrated within thermal testing chips is also increasing. Current technology can only power each heating unit using a combined power supply method. (See [link to relevant documentation]). Figure 1 As shown, the existing technology provides L power supply modules and divides the heating units in the thermal test chip into L groups. Each power supply module simultaneously supplies power to multiple heating units within the same group, so that... Figure 1 Taking the power supply module 1 shown as an example, it is connected to heating unit 1, heating unit 2 and heating unit 3 in the thermal test chip respectively, and supplies power to the heating units connected to it. Although the existing technology can solve the power supply problem of the thermal test chip, as the number of heating units in the thermal test chip increases, the number of heating units powered by the same power supply module at the same time also increases. The power supply control of the heating units becomes more and more coarse, resulting in the heat distribution of the thermal test chip being far from the power distribution of the microprocessor architecture, making it difficult to accurately simulate the heat dissipation of the microprocessor architecture.

[0037] To address the aforementioned issues, this application provides a power supply circuit that can independently power each heating unit in the thermal test chip. This allows for flexible adjustment of the heating power of each heating unit according to the power distribution of the microprocessor architecture during testing, thereby accurately simulating the heating conditions of the microprocessor architecture and providing a reference for processor architecture design.

[0038] Based on the above, see Figure 2 The power supply circuit provided in this application embodiment includes: a power supply module 10, a controller 20, and multiple voltage regulation circuits. In this embodiment, n voltage regulation circuits are shown, where n is the number of heating units in the thermal test chip.

[0039] The power supply module 10 is used to output the power supply voltage. The input terminal of the power supply module 10 is connected to a power supply (not shown in the figure), converting the power supply voltage provided by the power supply into a power supply voltage that meets the operating requirements of each heating unit in the thermal test chip. It is understood that in practical applications, there are multiple options for the specific implementation of the power supply module 10. In one optional implementation, the power supply connected to the power supply module is an AC power supply, and the power supply module 10 includes a rectifier circuit to convert the AC voltage into a DC power supply voltage. Further, it may also include a DC / DC converter circuit, such as a BUCK circuit, to convert the higher DC voltage into a power supply voltage required for testing. In another optional implementation, the power supply is a DC power supply. In this case, rectification is no longer required, and the power supply module 10 may only include a DC / DC converter circuit to step down the higher amplitude DC voltage provided by the power supply, thereby providing the power supply voltage to each heating unit. The specific implementation of the aforementioned rectifier circuit and DC / DC converter circuit can be found in relevant technologies and will not be detailed here.

[0040] based on Figure 2 As can be seen from the connection relationship shown, as an optional implementation, multiple power supply modules 10 can be set, each power supply module 10 is connected to at least one voltage regulating circuit, and each power supply module 10 outputs a power supply voltage. This setting can reduce the power supply requirements of a single power supply module, thereby reducing the performance requirements of the electronic components of the power supply module itself, which helps to reduce the overall cost of the power supply circuit. Of course, increasing the number of power supply modules will also increase the overall size of the power supply circuit. In practical applications, the number of power supply modules needs to be determined based on the specific application scenario. This application does not make any specific limitation in this regard.

[0041] The output terminal of the power supply module 10 is connected to the input terminal of each voltage regulation circuit. Each voltage regulation circuit corresponds one-to-one with a heating unit in the thermal test chip. The output terminal of each voltage regulation circuit is used to connect to one heating unit. Figure 2 As shown, the output terminal of voltage regulating circuit 1 is connected to heating unit 1, the output terminal of heating unit 2 is connected to heating unit 2, and so on, with the output terminal of voltage regulating circuit n connected to heating unit n.

[0042] In the power supply circuit provided in this embodiment, the structures of each voltage regulating circuit are identical. Furthermore, during thermal testing of the microprocessor architecture, the voltage drop across any voltage regulating circuit is adjustable. It can be understood that the power supply module 10, the voltage regulating circuit, and the heating unit are connected in series. Given a fixed supply voltage provided by the power supply module 10, the actual operating voltage obtained by the heating unit is equal to the difference between the supply voltage output by the power supply module 10 and the voltage drop across the voltage regulating circuit it is connected to. In other words, adjusting the voltage drop of the voltage regulating circuit can adjust the actual operating voltage output to the corresponding heating unit. The specific implementation of the voltage regulating circuit will be detailed in subsequent embodiments and will not be elaborated here.

[0043] The controller 20 is connected to the control terminals of each voltage regulating circuit, and can output a first control signal to each voltage regulating circuit. The voltage drop of the voltage regulating circuit is adjusted by the first control signal. Of course, in practical applications, the first control signals received by each voltage regulating circuit can be different, thus resulting in different voltage drops for each voltage regulating circuit. It should be noted that, to achieve independent control of each voltage regulating circuit, the controller 20 can be set with n output terminals, each output terminal connected to the control terminal of a voltage regulating circuit; that is, the control terminals of the controller 20 correspond one-to-one with the voltage regulating circuits. In practical applications, the controller 20 can be implemented based on an FPGA (Field Programmable Gate Array) module, fully utilizing the modular construction, configurable control logic, and rich input / output ports of the FPGA module to achieve independent control of each voltage regulating circuit.

[0044] As mentioned earlier, the actual operating voltage of the heating unit is equal to the difference between the supply voltage of the power supply module 10 and the voltage drop of the connected voltage regulating circuit. When the voltage drop of the voltage regulating circuit equals the supply voltage of the power supply module, the operating voltage of the heating unit is 0V, and the heating unit is in a powered-off state. Of course, in practical applications, the voltage regulating circuit can also be controlled to be in an open-circuit state, which also makes the heating unit powered-off. When the voltage drop of the voltage regulating circuit is less than the supply voltage, the operating voltage of the heating unit is the difference between the supply voltage and the voltage drop of the voltage regulating circuit. In practical applications, by adjusting the voltage drop of the voltage regulating circuit, it can be ensured that the actual operating voltage of each heating unit is the target operating voltage, and each heating unit operates under the drive of the target operating voltage, simulating the power distribution during the operation of the microprocessor architecture. Furthermore, since the voltage regulating circuit corresponds one-to-one with the heating unit, and the voltage drop of each voltage regulating circuit is independently adjustable, it is possible to adjust the heating power of each heating unit according to the power distribution of the microprocessor architecture.

[0045] As an optional implementation, the controller 20 is also connected to the control terminal of the power supply module 10. The controller 20 is also used to output a second control signal to adjust the power supply voltage output by the power supply module 10, so as to ensure that the power supply voltage passed by the power supply module 10 is greater than the target operating voltage of any heating unit, thereby effectively ensuring the normal operation of each heating unit.

[0046] In summary, the power supply circuit provided in this application embodiment has a one-to-one correspondence between the voltage regulation circuit and the heating unit in the thermal test chip. The output terminal of each voltage regulation circuit is connected to a heating unit, and the voltage drop of each voltage regulation circuit is adjustable. This allows for independent power supply to each heating unit in the thermal test chip. During the test, the heating power of each heating unit can be flexibly adjusted according to the power distribution of the microprocessor architecture, thereby accurately simulating the heating situation of the microprocessor architecture and providing a reference for the design of the processor architecture.

[0047] Furthermore, since each heating unit can be powered independently, it can meet the testing requirements of different power distributions in actual testing, adapt to different thermal testing chips, effectively solve the problem of needing to customize a power supply scheme for each thermal testing chip in related technologies, effectively improve testing efficiency and reduce testing costs.

[0048] It should be noted that, Figure 2 The control operations of the controller on each voltage regulation circuit and power supply module described in the illustrated embodiments and subsequent embodiments can all be implemented based on related technologies. This application does not limit the specific implementation of the control logic loaded on the controller. For example, when the controller is implemented based on an FPGA, control logic for the power supply module can be loaded in the controller. This control logic can respond to the user's control commands to control the start and stop of the power supply module, and adjust the power supply voltage output by the power supply module according to the predetermined power distribution of the thermal test chip. Furthermore, when the power distribution of the thermal test chip is determined, the thermal power of each heating unit is also determined. Based on this, the voltage drop of each voltage regulation circuit can be determined. The controller outputs a corresponding first control signal to adjust the voltage drop of the voltage regulation circuit, thereby meeting the power supply requirements of each heating unit. This process can be fully realized using related technologies. The key improvement of this application is that it provides the hardware architecture shown in the embodiments. In other words, this application provides a hardware foundation. Different control effects can be achieved by incorporating different control logics. The specific implementation of the control logic can be implemented based on related technologies, as long as it meets the actual operating requirements of the hardware architecture provided in this application.

[0049] The optional implementation methods of the voltage regulation circuit are described in detail below. As mentioned above, the voltage regulation circuits in the power supply circuit provided in this application have the same structure. Based on this, in the following embodiments, any one voltage regulation circuit will be used as an example for explanation.

[0050] See Figure 3 As shown, the voltage regulation circuit provided in this application embodiment includes a controllable switch 310 and a conversion circuit 320.

[0051] Specifically, the input terminal of the controllable switch 310 is connected to the output terminal of the power supply module 10, and the output terminal of the controllable switch 310 is used to connect to the heating unit, that is, the controllable switch 310 is connected in series between the power supply module 10 and the heating unit. In practical applications, the controllable switch 310 can be implemented in various ways. For example, it can be implemented using a MOS (Metal-Oxide Semiconductor) transistor or an IGBT (Insulated Gate Bipolar Transistor). Of course, it can also be other controllable switching transistors with adjustable voltage drop, which will not be listed here. As long as they do not exceed the core concept of this application, they also fall within the scope of protection of this application.

[0052] Taking an NMOS transistor as an example, the drain of the NMOS transistor is connected to the output terminal of the power supply module 10, the source of the NMOS transistor is connected to the heating unit, and the gate of the NMOS transistor serves as the control terminal of the controllable switch. Based on the operating characteristics of the NMOS transistor, it can be known that the voltage drop between the drain and source of the NMOS transistor can be adjusted by adjusting the gate voltage of the NMOS transistor.

[0053] Furthermore, the input terminal of the conversion circuit 320 is connected to the controller 20, and the output terminal of the conversion circuit 320 is connected to the control terminal of the controllable switch. The conversion circuit 320 is used to convert the first control signal output by the controller 20 into a drive voltage, thereby adjusting the voltage drop of the controllable switch.

[0054] In one optional implementation, the first control signal is a PWM signal. In this case, the PWM signal needs to be converted into a drive voltage. Adjusting the duty cycle of the PWM signal adjusts the specific amplitude of the drive voltage. Based on this, the conversion circuit can use a filter circuit, which includes a filter resistor and a filter capacitor connected in series. That is, an RC filter circuit is used to convert the PWM signal into a drive voltage. It can be understood that when the duty cycle of the PWM signal is zero, the drive voltage output by the conversion circuit is 0V, and the controllable switch is in the off state. Since the filter resistor and filter capacitor are both passive components, their operation is stable, and their anti-electromagnetic interference performance is strong, ensuring the stability of the output drive voltage. Moreover, the circuit structure is simple and the cost is low. As for the specific circuit topology of the RC filter circuit, it can be implemented with reference to relevant technologies, and will not be detailed here.

[0055] It is understandable that in practical applications, the control of the conduction state of the controllable switch and the adjustment of its own voltage drop require a certain amplitude of the aforementioned driving voltage, and there may be situations where the driving voltage output by the conversion circuit is difficult to effectively drive the controllable switch.

[0056] To solve the above problems, this application also provides another voltage regulation circuit, see [link to relevant documentation]. Figure 4 As shown, the voltage regulation circuit provided in this embodiment includes a controllable switch 310, a conversion circuit 320, and a voltage amplifier circuit 330.

[0057] The input terminal of the controllable switch 310 is connected to the output terminal of the power supply module 10, the output terminal of the controllable switch 310 is connected to the heating unit, the input terminal of the voltage amplifier circuit 330 is connected to the output terminal of the conversion circuit 320, and the output terminal of the voltage amplifier circuit 330 is connected to the control terminal of the controllable switch 310.

[0058] In conjunction with the relevant content of the foregoing embodiments, the conversion circuit 320 converts the first control signal provided by the controller 20 into a driving voltage, and the voltage amplification circuit 330 is used to amplify the amplitude of the driving voltage output by the conversion circuit 320, so that the amplified driving voltage can effectively drive the conduction state of the controllable switch 310 and adjust the voltage drop of the controllable switch 310.

[0059] In practical applications, the voltage amplifier circuit 330 can be implemented based on an operational amplifier. It can not only utilize the voltage amplification function, but also take advantage of its high input impedance to reduce the impact on the controllable switch 310. Of course, it can also be implemented in other ways, such as a boost circuit, etc., which will not be detailed here. For specific implementation, please refer to the relevant technologies.

[0060] Furthermore, embodiments of this application also provide another voltage regulation circuit, see [link to relevant documentation]. Figure 5 As shown, the voltage regulating circuit provided in this application embodiment includes a sampling circuit 340. The sampling circuit 340 is used to collect electrical parameters when the voltage regulating circuit provides the target working voltage to the connected heating unit. The output terminal of the sampling circuit 340 is connected to the sampling terminal of the controller 20, and the obtained electrical parameters are fed back to the controller 20. The controller 20 outputs a first control signal according to the obtained electrical parameters.

[0061] Specifically, the sampling circuit 340 includes a sampling resistor Rs and an ADC (Analogue-to-Digital Conversion) module.

[0062] Specifically, one end of the sampling resistor Rs is connected to the output terminal of the controllable switch 310, the other end of the sampling resistor Rs is connected to the heating unit, the input terminal of the ADC is connected to the sampling resistor Rs, and the output terminal of the ADC is connected to the sampling terminal of the controller 20.

[0063] After the controller 20 controls the controllable switch 310 to turn on via the first control signal, the power supply module 10 supplies power to the corresponding heating unit. The supply current flows through the sampling resistor Rs, which converts the supply current of the power supply module 10 to the heating unit into a sampling voltage and outputs it to the ADC. The ADC converts the obtained analog sampling voltage into a digital sampling voltage that the controller 20 can recognize. The controller 20 outputs a first control signal based on the obtained digital sampling voltage and adjusts the voltage drop of the voltage regulation circuit through the first control signal until the working voltage output to the heating unit is the target working voltage.

[0064] Understandably, for a given thermal testing scenario, the target operating voltage required by each heating unit in the thermal testing chip and the resistance value of the heating unit itself are known. Based on the relationship between voltage, resistance, and current, the required supply current for each heating unit can be determined. Therefore, the sampling resistor Rs is connected in series in the power supply path of the heating unit, and the resistance value of the sampling resistor Rs is also known. Thus, the sampling voltage fed back by the sampling resistor Rs is directly related to the supply current of the heating unit, that is, it is related to the actual operating voltage obtained by the heating unit. Given that the supply voltage of the power supply module 10 and the target operating voltage of the heating unit are determined, the adjustment... The overall voltage drop of the voltage regulation circuit can be determined and defined as the target voltage drop. Furthermore, given the target operating voltage, the target sampling voltage fed back by the sampling resistor Rs is also determined. Based on this, the ADC feeds back the sampling voltage to the controller 20. The controller 20 can adjust the duty cycle of the output PWM signal based on the relationship between the target sampling voltage and the obtained sampling voltage, thereby adjusting the voltage drop across the controllable switch 310 and thus adjusting the voltage drop of the voltage regulation circuit. This achieves closed-loop control of the voltage drop of the voltage regulation circuit, ensuring that the corresponding heating unit operates at the target operating voltage, improving the control accuracy of the heating unit, and achieving precise adjustment of the heating power.

[0065] It should be noted that the controller 20 can be configured with n sampling terminals, each corresponding to a voltage regulation circuit. Each sampling terminal is connected to a voltage regulation circuit, thereby achieving closed-loop control of the voltage drop of each voltage regulation circuit. As for the specific implementation process of the controller outputting the first control signal (adjusting the duty cycle of the PWM signal) based on the relationship between the obtained sampled voltage and the target sampled voltage, it can be implemented with reference to relevant technologies. This application has not made any improvements in this regard, and will not be described in detail here.

[0066] This application also provides a power supply device, including the power supply circuit and substrate provided in any of the foregoing embodiments. See [link to previous document]. Figure 6 As shown, with Figure 2Taking the power supply circuit provided in the illustrated embodiment as an example, both the power supply circuit and the thermal test chip are mounted on the substrate. The power supply circuit is connected to each heating unit in the thermal test chip. The power supply circuit can independently power each heating unit in the thermal test chip, thereby flexibly adjusting the heating power of each heating unit according to the power distribution of the microprocessor architecture during the test, thus accurately simulating the heating situation of the microprocessor architecture and providing a reference for the design of the processor architecture.

[0067] In one alternative implementation, a base can be provided on the substrate, and the thermal test chip is detachably connected to the base. The power supply circuit is electrically connected to each heating unit in the thermal test chip through the base. The detachable connection of the thermal test chip through the base allows for flexible installation and removal of the thermal test chip, thus adapting to different thermal test chips and meeting their power supply requirements. It is understood that without the base, the thermal test chip can be directly soldered onto the substrate, and the connection between the heating unit and the power supply circuit is established through metal wires laid on the substrate.

[0068] This application embodiment also provides another power supply device, combined with Figure 7 As shown, the substrate is divided into a power supply substrate and a test substrate. Furthermore, the power supply device provided in this embodiment also includes a base, a first connector, and a second connector.

[0069] Specifically, the power supply circuit and the first connector are disposed on the power supply substrate, and the power supply circuit is connected to the first connector. As mentioned above, the power supply circuit includes n voltage regulation circuits, which can independently supply power to the n heating units in the thermal test chip. Therefore, the output terminal of each voltage regulation circuit is connected to one pin of the first connector.

[0070] The base and the second connector are mounted on the test substrate and connected to each other. In practical applications, the base and the thermal test chip are detachably connected. When the thermal test chip is mounted on the base, the pins of each heating unit in the thermal test chip are connected to the insertion pins of the base. The second connector is electrically connected to each heating unit in the thermal test chip through the base.

[0071] The first connector and the second connector are compatible. When the two are connected, each voltage regulating circuit in the power supply circuit can be electrically connected to a heating unit through the base, so that each heating unit can be powered independently.

[0072] The power supply device provided in this embodiment splits the substrate into a test substrate and a power supply substrate, and provides a first connector and a second connector. The test substrate and the power supply substrate are connected through the connector. The power supply substrate can supply power to different test substrates through the connector, which helps to improve the flexibility of the power supply device during use.

[0073] Those skilled in the art will understand that the contents disclosed herein can be varied and modified in many ways. For example, the various devices or components described above can be implemented in hardware, or in software, firmware, or a combination of some or all of the three.

[0074] Furthermore, while this disclosure makes various references to certain elements of systems according to embodiments of this disclosure, any number of different elements may be used and operated on clients and / or servers. Elements are merely illustrative, and different aspects of the system and method may use different elements.

[0075] Those skilled in the art will understand that all or part of the steps in the above methods can be executed by a computer program requesting relevant hardware, and the program can be stored in a computer-readable storage medium, such as a read-only memory. Optionally, all or part of the steps in the above embodiments can also be implemented using one or more integrated circuits. Accordingly, each module / unit in the above embodiments can be implemented in hardware or as a software functional module. This disclosure is not limited to any particular combination of hardware and software.

[0076] Unless otherwise defined, all terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure pertains. It should also be understood that terms such as those defined in a common dictionary should be interpreted as having a meaning consistent with their meaning in the context of the relevant art, and not as having an idealized or highly formalized meaning, unless expressly defined herein.

[0077] The foregoing description is intended to illustrate the present disclosure and should not be construed as limiting it. While several exemplary embodiments of the present disclosure have been described, those skilled in the art will readily understand that many modifications may be made to the exemplary embodiments without departing from the novel teachings and advantages of the present disclosure. Therefore, all such modifications are intended to be included within the scope of the present disclosure as defined by the claims. It should be understood that the foregoing description is intended to illustrate the present disclosure and should not be construed as limiting it to the specific embodiments disclosed, and modifications to the disclosed embodiments and other embodiments are intended to be included within the scope of the appended claims. The present disclosure is defined by the claims and their equivalents.

Claims

1. A power supply circuit, characterized in that, include: The power supply module is used to output the power supply voltage; Multiple voltage regulation circuits, The output terminal of the power supply module is connected to the input terminal of each of the voltage regulation circuits. The output terminal of each voltage regulation circuit is used to connect to a heating unit in the thermal test chip, and the voltage regulation circuit corresponds one-to-one with the heating unit. The controller is connected to the control terminal of each of the voltage regulating circuits and is used to output a first control signal to each of the voltage regulating circuits. The first control signal is used to adjust the voltage drop of the voltage regulating circuit to provide a target operating voltage to the heating unit connected to the voltage regulating circuit.

2. The power supply circuit according to claim 1, characterized in that, The voltage regulation circuit includes: A controllable switch, wherein the input terminal of the controllable switch is connected to the power supply module, and the output terminal of the controllable switch is used to connect to the heating unit; A conversion circuit, wherein the input terminal of the conversion circuit is connected to the controller, and the output terminal of the conversion circuit is connected to the control terminal of the controllable switch; The conversion circuit is used to convert the first control signal into a driving voltage, and the driving voltage is used to adjust the voltage drop of the controllable switch.

3. The power supply circuit according to claim 2, characterized in that, The voltage regulation circuit also includes: A voltage amplifier circuit, wherein the input terminal of the voltage amplifier circuit is connected to the output terminal of the conversion circuit, and the output terminal of the voltage amplifier circuit is connected to the control terminal of the controllable switch; The voltage amplifier circuit is used to amplify the amplitude of the driving voltage.

4. The power supply circuit according to claim 2, characterized in that, The first control signal includes a PWM signal; The conversion circuit includes a filter circuit, and the filter circuit includes a filter resistor and a filter capacitor connected in series.

5. The power supply circuit according to any one of claims 2 to 4, characterized in that, The voltage regulation circuit also includes: The sampling circuit is used to collect electrical parameters when the voltage regulating circuit provides the target operating voltage to the connected heating unit; The controller is connected to the sampling circuit and is used to output the first control signal according to the electrical parameters.

6. The power supply circuit according to claim 5, characterized in that, The sampling circuit includes: A sampling resistor, one end of which is connected to the output terminal of the controllable switch, and the other end of which is used to connect to the heating unit; An analog-to-digital converter module, wherein the input terminal of the analog-to-digital converter module is connected to the sampling resistor, and the output terminal of the analog-to-digital converter module is connected to the controller; The sampling resistor is used to convert the power supply current when the power supply module supplies power to the heating unit into a sampling voltage. The analog-to-digital converter module is used to convert the sampled voltage into a sampled voltage that the controller can recognize.

7. The power supply circuit according to claim 1, characterized in that, The controller is also connected to the control terminal of the power supply module; The controller is also configured to output a second control signal, which is used to adjust the power supply voltage output by the power supply module so that the power supply voltage is greater than the target operating voltage of any of the heating units.

8. A power supply device, characterized in that, include: The substrate and the power supply circuit as described in any one of claims 1 to 7, wherein, The power supply circuit and the thermal test chip are both disposed on the substrate. The power supply circuit is connected to each heating unit in the thermal test chip.

9. The power supply device according to claim 8, characterized in that, Also includes: A base disposed on the substrate; The base is detachably connected to the thermal testing chip; The power supply circuit is electrically connected to each heating unit in the thermal test chip via the base.

10. The power supply device according to claim 9, characterized in that, The substrate includes a power supply substrate and a test substrate; The power supply device further includes a first connector and a second connector, wherein... The power supply circuit and the first connector are disposed on the power supply substrate, and the power supply circuit is connected to the first connector. The base and the second connector are disposed on the test substrate, and the base is connected to the second connector; When the first connector and the second connector are connected, each voltage regulating circuit in the power supply circuit can be electrically connected to one of the heating units through the base.

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