Heating plate assembly and heating device

Abstract

The utility model discloses a kind of heating plate assembly and heating device, it is related to heating device technical field.The heating plate assembly includes upper substrate, lower substrate, heating material and electrode, the heating material is clamped between the upper substrate and the lower substrate, the electrode is electrically connected with the heating material, for power supply to the heating material, the heat generated by the heating material can pass through the upper substrate and / or the lower substrate.Heating material is clamped between upper substrate and lower substrate, electrode is electrically connected with heating material, the heat generated by heating material can pass through substrate, the independent replacement of heating material and substrate is realized by separable structure design, with the advantage that component can be individually replaced to reduce waste and maintenance cost, while improving the flexibility of heating material selection.

Description

Technical Field

[0001] This utility model belongs to the technical field of heating devices, and in particular relates to a heating plate assembly and a heating device. Background Technology

[0002] Traditional heating plate assemblies typically employ a paste printing process to coat the heating material onto a lower substrate, which is then dried and cured to form a fixed connection. This structure has a significant drawback: when the heating material or the lower substrate is damaged and needs replacement, because the heating material and the lower substrate are cured together, individual components cannot be replaced; the entire assembly must be replaced. This not only wastes intact heating material or the substrate but also significantly increases maintenance costs. Furthermore, this fixed connection method limits the selection of heating materials, hindering the flexible configuration of heating materials according to different heating requirements. Therefore, existing technologies urgently need improvement to address these issues. Summary of the Invention

[0003] The purpose of this application is to provide a heating plate assembly and heating device, which has the advantages of individually replaceable components to reduce waste and maintenance costs, while improving the flexibility of selecting heating materials.

[0004] This application provides a heating plate assembly, the technical solution of which is as follows: A heating plate assembly includes an upper substrate, a lower substrate, a heating material, and electrodes. The heating material is sandwiched between the upper substrate and the lower substrate. The electrodes are electrically connected to the heating material and are used to supply power to the heating material. The heat generated by the heating material can pass through the upper substrate and / or the lower substrate.

[0005] Furthermore, this application also proposes that the heating material be adhered to the upper or lower substrate by an adhesive.

[0006] Furthermore, this application also proposes that the adhesive is an organic adhesive or an inorganic adhesive.

[0007] Furthermore, this application also proposes that the upper substrate and the lower substrate be encapsulated by an adhesive.

[0008] Furthermore, this application also proposes that the upper substrate and the lower substrate are sintered by high-temperature melting.

[0009] Furthermore, this application also proposes that the heating material be woven carbon fiber, metal foil, carbon nanotube film, graphene film, or montmorillonite glass fiber.

[0010] Furthermore, this application also proposes that the electrode is a metal fiber or a metal foil.

[0011] Furthermore, this application also proposes that the electrodes and heating materials are connected by weaving or welding.

[0012] Furthermore, this application also proposes that both the upper substrate and the lower substrate are glass substrates or ceramic substrates.

[0013] Furthermore, this application also proposes a heating device including the aforementioned heating plate assembly.

[0014] As can be seen from the above, the heating plate assembly and heating device provided in this application have a heating material sandwiched between an upper substrate and a lower substrate, an electrode electrically connected to the heating material, and the heat generated by the heating material can pass through the substrate. The heating material and the substrate can be replaced independently through a detachable structural design. This has the advantages of allowing individual replacement of parts to reduce waste and maintenance costs, while improving the flexibility of heating material selection. Attached Figure Description

[0015] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the description of the embodiments of this utility model will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0016] Figure 1 This is a schematic diagram of the structure of a heating plate assembly provided in one embodiment of the present invention; Figure 2 This is a schematic diagram of the heating material and electrodes of a heating plate assembly provided in one embodiment of the present invention.

[0017] The reference numerals in the accompanying drawings are as follows: 100. Heating plate assembly; 110. Upper substrate; 120. Lower substrate; 130. Heating material; 140. Electrode. Detailed Implementation

[0018] To make the technical problems solved, technical solutions, and beneficial effects of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present utility model and are not intended to limit the present utility model.

[0019] In the description of this utility model, it should be understood that the terms "longitudinal," "radial," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. In the description of this utility model, unless otherwise stated, "a plurality of" means two or more.

[0020] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0021] In existing technologies, conventional heating plate assemblies 100 typically use a paste printing process to fix the heating material 130 to the surface of a substrate, forming a non-removable connection structure through drying and curing. When the substrate or the heating material 130 is damaged and needs to be replaced, the two cannot be separated due to the bonded and cured structure, requiring replacement of the entire assembly, resulting in material waste and increased maintenance costs. For example, in industrial ovens or domestic heating equipment, frequent replacement of heating units can significantly increase operating costs.

[0022] To address the aforementioned issues, researchers discovered that the fixed connection between the heating material 130 and the substrate in traditional processes is the core factor leading to maintenance difficulties. By analyzing the relationship between the material's heat conduction path and mechanical structure, they proposed designing the heating material 130 and the substrate as a detachable clamping structure, making them physically isolated independent components. This approach breaks through the limitations of traditional printing processes on material fixing methods and provides feasibility for modular replacement.

[0023] Therefore, as Figure 1 and Figure 2 As shown, this application proposes a heating plate assembly 100, including an upper substrate 110, a lower substrate 120, a heating material 130, and an electrode 140. The heating material 130 is sandwiched between the upper substrate 110 and the lower substrate 120. The electrode 140 is electrically connected to the heating material 130 to supply power. Heat can pass through the upper substrate 110 or the lower substrate 120.

[0024] The upper substrate 110 is a heat-conducting layer covering the heating material 130, which can be made of glass or ceramic materials and is used to uniformly transfer heat to the external environment. The lower substrate 120 is a support layer that supports the heating material 130, which can be made of the same or different materials as the upper substrate 110; for example, a ceramic substrate can improve structural stability. The heating material 130 is a conductor that can convert electrical energy into heat energy, which can be made of woven carbon fiber or graphene film, and the heating efficiency can be controlled by adjusting the material density. The electrode 140 is a conductive component that connects to an external power source, which can be made of metal foil or metal fiber, and forms a stable electrical contact with the heating material 130 through welding or weaving.

[0025] Specifically, the upper substrate 110 and the lower substrate 120 are encapsulated with adhesive or sintered at high temperature to form a closed sandwich structure, and the heating material 130 is fixed inside the sandwich. The electrode 140 extends from the edge of the sandwich to the external circuit. When energized, the heating material 130 generates heat, which diffuses outward through the thermal conduction of the substrate material. When it is necessary to replace the heating material 130, the heating material 130 can be directly removed from the sandwich by separating the upper and lower substrates 120 without damaging the substrate structure.

[0026] Compared to existing technologies, in traditional processes, the heating material 130 and the substrate form an irreversible bond due to curing and bonding. This solution, however, achieves physical isolation through a sandwich structure, making the heating material 130 and the substrate independent and replaceable modules. Existing technologies require discarding the substrate during replacement, while this solution allows for the separate replacement of either the heating material 130 or the substrate, significantly reducing material waste.

[0027] Through the above technical solution, this application reduces the maintenance cost of the heating plate assembly 100, extends the service life of the substrate, and improves the operational efficiency of replacing the heating material 130. In equipment maintenance scenarios, operators can choose to replace either the heating material 130 or the substrate individually, depending on the type of fault, thus avoiding resource waste.

[0028] This application further proposes that the heating material 130 be adhered to the upper substrate 110 or the lower substrate 120 by means of an adhesive.

[0029] The adhesive refers to the material that can bond the substrate and the heating material 130 together. Specifically, it can be an organic or inorganic adhesive. Organic adhesives include epoxy resin or polyurethane, while inorganic adhesives include silicates or phosphates. The adhesive serves as a detachable connection in the technical solution, creating a non-permanent fixation between the heating material 130 and the substrate, facilitating the individual replacement of the heating material 130 or the substrate during subsequent maintenance.

[0030] Specifically, the heating material 130 contacts the surface of the upper substrate 110 or the lower substrate 120 by coating with an adhesive layer, forming an adhesive interface after the adhesive cures. When the heating material 130 needs to be replaced, it can be separated from the substrate by physical peeling or solvent dissolution of the adhesive without damaging the substrate structure; similarly, if the substrate is damaged, the heating material 130 can be transferred to a new substrate by removing the adhesive.

[0031] Compared to existing technologies, where the heating material 130 is printed and cured in paste form to form an irreversible bond with the substrate, the entire material must be discarded upon replacement. This solution, however, utilizes the controllable bonding properties of the adhesive to achieve non-permanent fixation of the heating material 130 to the substrate, thus avoiding resource waste.

[0032] Through the above technical solution, this application solves the problem of high replacement cost caused by the inability to separate the heating material 130 from the substrate in the prior art, so that the heating material 130 or the substrate can be disassembled and replaced separately, reducing maintenance costs.

[0033] This application further proposes that the adhesive be an organic adhesive or an inorganic adhesive.

[0034] Organic adhesives are bonding materials whose main components are organic polymers, such as epoxy resins, polyurethanes, or acrylates. They form adhesive force through physical adsorption or chemical bonding between molecular chains. Inorganic adhesives are bonding materials whose main components are inorganic compounds, such as silicates, phosphates, or alumina colloids. They form high-strength adhesive interfaces through ionic or covalent bonds.

[0035] Specifically, when the heating material 130 is adhered to the upper substrate 110 or the lower substrate 120 using an adhesive, the choice between organic and inorganic adhesives directly affects the temperature resistance, peel strength, and reversibility of the adhesive layer. For example, in scenarios requiring removability and replacement, an organic adhesive with moderate peel strength and some elasticity after curing can be used, ensuring that the heating material 130 is stably fixed to the substrate and can be physically separated when needed. In scenarios requiring high temperature or long-term stable use, an inorganic adhesive with higher heat resistance can be used to ensure that the adhesive layer does not degrade or fail under high temperature conditions.

[0036] Compared to existing technologies, which use a paste printing and curing method to directly adhere the heating material 130 to the substrate, resulting in an irreversible rigid bond between the heating material 130 and the substrate, requiring the entire assembly to be discarded upon replacement. This solution, however, through the selection of adhesive type, creates a controllable bonding interface between the heating material 130 and the substrate, satisfying both stability requirements during use and allowing for individual replacement of the heating material 130 or the substrate during maintenance.

[0037] Through the above technical solution, this application solves the problem of resource waste caused by the inseparability of the heating material 130 and the substrate in the prior art, and reduces maintenance costs. For example, when the substrate is damaged, the substrate can be replaced separately by dissolving or peeling off the adhesive, without having to discard the intact heating material 130; conversely, when the heating material 130 ages, only the heating material 130 can be replaced and the substrate can be retained for reuse.

[0038] This application further proposes that the upper substrate 110 and the lower substrate 120 be encapsulated by adhesive.

[0039] The adhesive refers to the organic or inorganic bonding material used to bond the edges of the substrates. Specifically, it can be an organic adhesive such as epoxy resin or polyurethane, or an inorganic adhesive such as silicate. During the encapsulation process, it is formed by coating and then curing under pressure to form an adhesive layer. Encapsulation refers to bonding and closing the edge areas of the upper substrate 110 and the lower substrate 120 to form a sealed structure. Specifically, it can be achieved by applying adhesive to the periphery of the substrates and then applying pressure to bring the two substrates together. This method can maintain a fixed gap between the substrates and prevent the intrusion of external contaminants.

[0040] Specifically, during assembly, the heating material 130 is first placed on the surface of the lower substrate 120. Then, the edge of the upper substrate 110, coated with adhesive, is aligned with the edge of the lower substrate 120. Pressure is applied to evenly distribute the adhesive on the contact surface. The cured adhesive forms a continuous, closed annular adhesive band, creating a stable clamping structure between the two substrates. When maintenance is required, the adhesive layer can be broken by physical cutting or solvent dissolution to separate the substrates for individual replacement of damaged components.

[0041] Compared to existing technologies, which use high-temperature melting and sintering or slurry curing to permanently bond the substrate and heating material 130, requiring the entire substrate assembly to be replaced during maintenance, this solution uses a reversible adhesive encapsulation method to create a separable structure between the substrate and heating material 130, reducing maintenance costs while ensuring structural stability.

[0042] Through the above technical solution, this application realizes the detachable maintenance function of the substrate assembly. When the heating material 130 or the substrate is damaged, the target component can be replaced separately, avoiding the overall scrapping problem caused by sintering and solidification, and effectively reducing material waste and maintenance costs.

[0043] This application further proposes that the upper substrate 110 and the lower substrate 120 are sintered by high-temperature melting.

[0044] High-temperature melting sintering refers to the process of heating substrate materials above their melting point to melt their surfaces and then bonding them together. This can be achieved using electric furnace sintering or laser sintering. This process forms a bonding layer through the melting of the materials themselves, achieving hermetic encapsulation between substrates without the need for adhesives. Glass or ceramic substrates are preferred materials due to their high-temperature stability, which allows them to maintain structural integrity during sintering.

[0045] Specifically, after the upper substrate 110 and the lower substrate 120 are stacked, they are placed in a high-temperature environment, and the temperature is controlled to generate a molten substance at the substrate contact surface. When the temperature decreases, the molten substance recrystallizes to form a continuous bonding interface, constituting an adhesive-free encapsulation structure. During this process, the heat-generating material 130 is completely enclosed in the sealed space formed by the substrate, ensuring both heat conduction efficiency and preventing seal failure caused by adhesive aging.

[0046] Compared to existing technologies, traditional adhesive encapsulation methods require bonding and fixing the heating material 130 to the substrate, necessitating complete removal when replacing components. However, the substrate bonding structure formed by high-temperature melting and sintering allows for individual disassembly of damaged components during maintenance, preserving the undamaged substrate or heating material 130, thus enabling component-level repair.

[0047] Through the above technical solution, this application effectively solves the problem of non-separable components caused by traditional adhesive encapsulation. The substrate and the heating material 130 can be replaced independently, reducing material loss during maintenance. At the same time, the inorganic bonding interface formed by sintering has high-temperature resistance, avoiding the performance degradation problem of adhesives under long-term high-temperature conditions.

[0048] This application further proposes that the heating material 130 is woven carbon fiber, metal foil, carbon nanotube film, graphene film or styrene glass fiber.

[0049] Among them, woven carbon fiber refers to a mesh structure material formed by weaving carbon fiber monofilaments, specifically using plain weave or twill weave processes. It possesses high thermal conductivity and structural flexibility, enabling detachable contact with the substrate. Metal foil refers to thin metal sheets with thicknesses ranging from micrometers to millimeters, specifically made of copper, nickel, or aluminum foil. It exhibits uniform conductivity and ductility, and can be bonded to the substrate via mechanical pressing. Carbon nanotube film refers to a continuous film formed by the oriented arrangement of carbon nanotubes, specifically prepared using chemical vapor deposition. It possesses high in-plane thermal conductivity and a low coefficient of thermal expansion. Graphene film refers to a sheet-like material formed by stacking single or multiple layers of graphene, specifically prepared using chemical exfoliation or epitaxial growth methods. It possesses ultra-high thermal and electrical conductivity. Montmorillonite glass fiber refers to a high-temperature resistant material formed by combining glass fiber and montmorillonite, specifically achieved using impregnation and sintering processes. It possesses excellent insulation and thermal shock resistance.

[0050] Specifically, the heating material 130 is sandwiched between the upper substrate 110 and the lower substrate 120 in an independent structure. For example, a woven carbon fiber mesh is laid flat on the surface of the lower substrate 120 and then covered with the upper substrate 110, or a metal foil is embedded between the two substrates through lamination. The electrode 140 is connected to the edge of the heating material 130 by welding or weaving. When powered, the current is evenly distributed along the plane of the heating material 130, and the generated heat is conducted outward through the substrate. Since the heating material 130 is not cured and bonded to the substrate, when replacement is needed, the two substrates can be directly separated and the material can be removed without damaging the substrate structure.

[0051] Compared to existing technologies, the heating layer formed by traditional paste printing forms an irreversible bond with the substrate after curing, requiring the entire substrate to be discarded when the material is replaced. In contrast, the materials such as woven carbon fiber in this solution have independent physical forms. For example, metal foil can be completely removed through a peeling operation, and carbon nanotube films can be rolled up and pulled out from the gaps between the substrates, thereby achieving separate maintenance of the heating material 130 from the substrate.

[0052] Through the above technical solution, this application solves the problem of resource waste caused by the inability to replace the heating material 130 and the substrate separately. For example, when the metal foil is locally oxidized and damaged, only the foil needs to be replaced while the intact glass substrate is preserved, reducing material replacement costs. At the same time, the high thermal conductivity of materials such as woven carbon fiber can reduce heat loss at the substrate interface and improve thermal energy utilization.

[0053] This application further proposes that the electrode 140 is a metal fiber or a metal foil.

[0054] Among them, metal fiber refers to a fibrous conductor made of metal material through a wire drawing process. Specifically, it can be made of copper fiber or nickel-chromium alloy fiber. Its flexibility is conducive to forming a close contact with the heating material 130.

[0055] Among them, metal foil refers to sheet-shaped metal conductors formed by rolling process, specifically aluminum foil or copper foil, whose ductility can adapt to the assembly deformation between the substrate and the heating material 130.

[0056] Specifically, when metal fibers or metal foils are used as electrodes 140, they can be physically connected to the heating material 130 through weaving or welding. For example, copper fibers can be inserted into the surface of the carbon fiber braided layer to form a conductive path, or copper foil can be welded to the edge of the graphene film as a current input terminal. This connection method allows for a separable structure between the electrode 140 and the heating material 130, eliminating the need for a fixed connection formed by slurry curing.

[0057] Compared to existing technologies, where the electrode 140 is formed by paste printing, the electrode 140 and the heating material 130 form a non-removable integral structure after curing, requiring replacement of the entire assembly during maintenance. In contrast, this solution uses detachable metal fibers or metal foils as the electrode 140, allowing it to be replaced independently of the substrate and heating material 130, thus avoiding complete scrapping due to localized damage.

[0058] Through the above technical solution, this application achieves a detachable connection between the electrode 140 and the heating material 130. When the electrode 140 ages or has poor contact, only the electrode 140 component needs to be replaced, effectively reducing maintenance costs. At the same time, the conductivity of metal fibers or metal foil is superior to that of traditional slurry electrodes 140, improving current transmission efficiency and connection stability.

[0059] This application further proposes that the electrode 140 and the heating material 130 be connected by weaving or welding.

[0060] The weaving process involves mechanically interlacing metal fibers and carbon fibers to form a mesh structure. This can be achieved by alternating the interlacing of metal and carbon fibers, resulting in a tight structural bond between the electrode 140 and the heating material 130. The welding process involves using high temperature or laser to fuse the metal foil to the carbon nanotube film or graphene film. This can be achieved using spot welding or continuous welding processes, ensuring a stable conductive path between the electrode 140 and the heating material 130.

[0061] Specifically, when the electrode 140 is made of metal fiber, the metal fiber and woven carbon fiber form an integrated structure through a weaving process. The electrode 140 is directly embedded inside the heating material 130, and the current is uniformly conducted through the fiber contact surface. When the electrode 140 is made of metal foil, the edge of the metal foil is fused to the surface of the graphene film or graphene glass fiber through a welding process, forming a continuous and gapless contact interface, avoiding overheating caused by poor local contact. Thus, the connection method between the electrode 140 and the heating material 130 can be flexibly selected according to the material properties, while ensuring that the connection structure remains stable during the heating process.

[0062] Compared to existing technologies, where the electrode 140 and heating material 130 are fixed with adhesive, the adhesive layer is prone to aging at high temperatures, leading to increased contact resistance. Furthermore, disassembly requires damaging the adhesive layer, rendering the component unusable. In contrast, this solution forms a physical connection through weaving or welding, eliminating the need for adhesives. It maintains stable conductivity even at high temperatures, and the electrode 140 and heating material 130 can be disassembled and replaced separately.

[0063] Through the above technical solution, this application solves the problem of components being unable to be disassembled due to adhesive curing in the prior art, allowing the electrode 140 or heating material 130 to be replaced individually when damaged, avoiding overall scrapping and significantly reducing maintenance costs. At the same time, the direct conductive structure formed by weaving or welding reduces energy loss from the intermediate layer and improves heating efficiency.

[0064] This application further proposes a heating plate assembly 100, including an upper substrate 110, a lower substrate 120, a heating material 130, and an electrode 140. The heating material 130 is sandwiched between the upper substrate 110 and the lower substrate 120. The electrode 140 is electrically connected to the heating material 130 and is used to supply power to the heating material 130. The heat generated by the heating material 130 can pass through the upper substrate 110 and / or the lower substrate 120. Both the upper substrate 110 and the lower substrate 120 are glass substrates or ceramic substrates.

[0065] The glass substrate refers to a flat structure made primarily of glass, specifically tempered glass or borosilicate glass, which features high temperature resistance, light transmittance, and high surface flatness. In the heating plate assembly 100, the glass substrate provides a stable support interface while allowing heat to diffuse evenly to the outside.

[0066] The ceramic substrate refers to a flat plate structure made of ceramic material, specifically alumina ceramic or aluminum nitride ceramic, which features high thermal conductivity, corrosion resistance, and high mechanical strength. In the heating plate assembly 100, the ceramic substrate can effectively transfer the heat generated by the heating material 130, while resisting deformation under long-term high-temperature conditions.

[0067] Specifically, the upper substrate 110 and the lower substrate 120 form a rigid clamping structure using glass or ceramic materials, and the heating material 130 is fixed between the two substrates. When the electrode 140 is energized, the heating material 130 generates heat and transfers it outward through the substrate. Because the glass or ceramic substrate itself possesses high thermal stability, it can maintain structural integrity even under high-temperature conditions, avoiding interface separation problems caused by differences in thermal expansion. For example, when using an alumina ceramic substrate, its high thermal conductivity allows for rapid heat transfer to the heating surface.

[0068] In some specific embodiments, the glass substrate can be encapsulated with the lower substrate 120 through a high-temperature melting process to form a sealed sandwich structure; the ceramic substrate can be processed into a preset shape through a sintering process, and grooves can be provided on the surface to accommodate the wiring of the electrode 140.

[0069] Compared to existing technologies, where the heat-generating material 130 printed with paste forms a non-removable adhesive structure with the substrate after curing, the entire material must be discarded for replacement. In this solution, the glass or ceramic substrate and the heat-generating material 130 are fixed together by physical clamping or a peelable adhesive. When maintenance is required, only the substrate needs to be separated to replace either the heat-generating material 130 or the substrate individually, reducing resource waste.

[0070] Through the above technical solution, this application solves the problem of high replacement cost caused by the bonding and curing of the substrate and the heating material 130 in the prior art. By using a detachable glass or ceramic substrate structure, the heating material 130 and the substrate can be replaced independently, reducing maintenance costs and improving the durability and heat transfer efficiency of the heating component.

[0071] This application further proposes a heating device, including a heating plate assembly 100. The heating plate assembly 100 has an upper substrate 110, a lower substrate 120, a heating material 130, and an electrode 140. The heating material 130 is sandwiched between the upper substrate 110 and the lower substrate 120. The electrode 140 is electrically connected to the heating material 130 and supplies power to the heating material 130. The heat generated by the heating material 130 can pass through the upper substrate 110 and / or the lower substrate 120.

[0072] The heating plate assembly 100 refers to a heating unit composed of multiple layers. Specifically, a glass substrate or a ceramic substrate can be used as the upper substrate 110 and the lower substrate 120. The substrates are fixed together by adhesive encapsulation or high-temperature melting and sintering, thereby forming a stable clamping structure to protect the internal heating material 130.

[0073] Among them, the heating material 130 refers to a conductive material that can convert electrical energy into heat energy. Specifically, it can be woven carbon fiber, metal foil, carbon nanotube film, graphene film or styrene glass fiber, which is attached to the surface of the substrate by adhesive and connected to the electrode 140 made of metal fiber or metal foil by weaving or welding, thereby realizing the controllability of electrical energy input and heat output.

[0074] Specifically, the heating device encapsulates the heating material 130 between the upper substrate 110 and the lower substrate 120, forming a separable clamping structure between the heating material 130 and the substrate. When maintenance or replacement is required, the substrate can be disassembled individually without damaging the heating material 130, or the heating material 130 can be removed individually without affecting the integrity of the substrate. The electrode 140 is connected to the heating material 130 by braiding or welding, ensuring power supply stability while avoiding irreversible adhesion caused by adhesive curing.

[0075] Compared to existing technologies, where the heating material 130 forms a non-removable adhesive structure with the substrate after being cured by paste printing, the entire substrate must be discarded during replacement. In this solution, the heating material 130 and the substrate are fixed by clamping or detachable means, allowing the heating material 130 or the substrate to be replaced independently, reducing resource waste.

[0076] Through the above technical solution, this application solves the problem of high replacement cost caused by the curing adhesion between the heating material 130 and the substrate in the prior art. The modular structure design enables independent maintenance of the heating material 130 and the substrate, reducing maintenance costs and improving resource utilization.

[0077] The above-described embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit it. Although this utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this utility model, and should all be included within the protection scope of this utility model.

Claims

1. A heating plate assembly, characterized in that, The device includes an upper substrate, a lower substrate, a heating material, and electrodes. The heating material is sandwiched between the upper substrate and the lower substrate. The electrodes are electrically connected to the heating material and are used to supply power to the heating material. The heat generated by the heating material can pass through the upper substrate and / or the lower substrate. The upper substrate and the lower substrate are sintered by high-temperature melting; The heating material is woven carbon fiber, metal foil, carbon nanotube film, graphene film, or styrene glass fiber; The electrode is a metal fiber or a metal foil; The electrodes and the heating material are connected by weaving or welding.

2. The heating plate assembly according to claim 1, characterized in that, The heating material is attached to the upper substrate or the lower substrate by an adhesive.

3. The heating plate assembly according to claim 2, characterized in that, The adhesive is an organic adhesive or an inorganic adhesive.

4. The heating plate assembly according to claim 1, characterized in that, The upper substrate and the lower substrate are encapsulated with adhesive.

5. The heating plate assembly according to claim 1, characterized in that, Both the upper substrate and the lower substrate are glass substrates or ceramic substrates.

6. A heating device, characterized in that, Includes the heating plate assembly as described in any one of claims 1 to 5.

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