Aluminum substrate circuit board with insulating buffer layer

Abstract

The utility model relates to circuit board technical field especially an aluminum substrate circuit board with insulating buffer layer, including corresponding circuit layer and aluminum substrate layer, circuit layer and aluminum substrate layer parallel, the utility model has the advantages of: this aluminum substrate circuit board inserts heat conduction layer through the insulating buffer layer bottom embeddedly, and adopts the first bonding layer and second bonding layer of heat conducting adhesive material quality, and the heat dissipation performance is effectively guaranteed. The heat generated by circuit layer work can be passed to the insulating buffer layer through the first bonding layer, and then is conducted to the aluminum substrate layer quickly through the heat conduction layer. The graphene heat dissipation protrusion of heat conduction layer top increases the heat dissipation area, and accelerates the heat emission. At the same time, the aluminum substrate layer itself has good thermal conductivity, and cooperates the bonding layer of heat conducting adhesive material, so that the heat can spread quickly, even if the insulating buffer layer is increased, the overall heat dissipation effect will not be affected, the circuit board is ensured to maintain the appropriate temperature in the operation process, and the service life is prolonged.

Description

Technical Field

[0001] This utility model relates to the field of circuit board technology, and in particular to an aluminum substrate circuit board with an insulating buffer layer. Background Technology

[0002] Aluminum-based circuit boards with insulating buffer layers are key components in the field of electronic circuits, used to support electronic components and realize circuit functions. They are defined as composite circuit board structures with an aluminum substrate as the base, formed by adding an insulating buffer layer between the aluminum substrate and the circuit layers, providing electrical insulation, mechanical buffering, and heat dissipation. This circuit board typically consists of an aluminum substrate layer, an insulating buffer layer, circuit layers, and a surface protective layer. The aluminum substrate layer, with its excellent thermal conductivity and mechanical strength, provides stable support and a foundation for heat dissipation. The insulating buffer layer, made of materials with excellent insulating properties, such as modified epoxy resin, isolates the aluminum substrate from the circuit layers, preventing short-circuit risks and buffering the effects of external impacts and vibrations on the circuit. The circuit layers, formed through processes such as printing and etching, create conductive lines to achieve electrical connections between electronic components.

[0003] Currently, to improve the electrical insulation and mechanical protection capabilities of aluminum-based circuit boards, the industry commonly adopts a design scheme that adds an insulating buffer layer between the aluminum substrate and the circuit layer. While this structure can effectively isolate the circuit from the metal substrate, reduce the risk of short circuits, and buffer external impacts to some extent, it significantly affects the heat dissipation of the circuit board in practical applications, forming a thermal resistance barrier in the heat transfer path. When electronic components on the circuit layer generate heat, the heat must first penetrate the insulating buffer layer before it can be conducted to the aluminum substrate for dissipation. However, the low thermal conductivity of the insulating buffer layer makes it difficult for heat to be transferred quickly, resulting in a large accumulation of heat near the circuit layer. When high-power electronic devices are running, excessively high temperatures can lead to a decline in the performance and lifespan of electronic components, and even cause malfunctions. Utility Model Content

[0004] The purpose of this invention is to at least solve one of the aforementioned technical defects.

[0005] Therefore, one objective of this utility model is to provide an aluminum substrate circuit board with an insulating buffer layer to solve the problems mentioned in the background art and overcome the shortcomings of the prior art.

[0006] To achieve the above objectives, one embodiment of this utility model provides an aluminum substrate circuit board with an insulating buffer layer, comprising an upper and lower corresponding circuit layer and an aluminum substrate layer, wherein the circuit layer and the aluminum substrate layer are parallel, and an insulating buffer layer is disposed between the circuit layer and the aluminum substrate layer. A thermally conductive layer is embedded and bonded to the bottom of the insulating buffer layer, and the bottom surfaces of the insulating buffer layer and the thermally conductive layer are on the same horizontal plane. A first adhesive layer and a second adhesive layer are respectively bonded to the top and bottom surfaces of the insulating buffer layer. The top surface of the first adhesive layer is bonded to the bottom of the circuit layer, and the bottom surface of the second adhesive layer is bonded to the top of the aluminum substrate layer. Two symmetrically arranged U-shaped frames are bonded to the outer surface of the aluminum substrate layer with adhesive. Two symmetrically arranged clips are fixedly connected to the inner wall of each U-shaped frame, and several clips are snapped into the circuit layer.

[0007] Preferably, in any of the above solutions, the first adhesive layer and the second adhesive layer are both made of thermally conductive adhesive, and the first adhesive layer, the second adhesive layer, and the insulating buffer layer are all located inside the two U-shaped frames.

[0008] Preferably, the top of the thermal conductive layer is fixedly connected with a plurality of linear array heat dissipation protrusions, and the material of the plurality of heat dissipation protrusions and the thermal conductive layer is graphene.

[0009] Preferably, in any of the above schemes, two symmetrically arranged slots are provided on both the left and right sides of the circuit layer, and several of the card plates are engaged with the circuit layer through the slots.

[0010] Preferably, the insulating buffer layer is made of modified epoxy resin, as described in any of the above embodiments.

[0011] Preferably, in any of the above solutions, two symmetrically arranged positioning plates are fixedly connected to the inner wall of each U-shaped frame, and two symmetrically arranged positioning grooves are opened on both the front and rear sides of the aluminum substrate layer, and the positioning plates are engaged with the aluminum substrate layer through the positioning grooves.

[0012] Compared with the prior art, the advantages and beneficial effects of this utility model are as follows: 1. This aluminum-based circuit board effectively ensures heat dissipation performance by embedding a thermally conductive layer at the bottom of the insulating buffer layer and using a first and second adhesive layer made of thermally conductive adhesive. Heat generated during circuit operation can be transferred to the insulating buffer layer through the first adhesive layer, and then quickly conducted to the aluminum substrate layer via the thermally conductive layer. The graphene heat dissipation protrusions on the top of the thermally conductive layer increase the heat dissipation area and accelerate heat dissipation. Simultaneously, the aluminum substrate layer itself has good thermal conductivity, which, combined with the thermally conductive adhesive layer, allows heat to dissipate rapidly. Even with the addition of the insulating buffer layer, the overall heat dissipation effect is not affected, ensuring that the circuit board maintains a suitable temperature during operation and extending its service life.

[0013] 2. During installation, first align the positioning plate with the positioning slot on the aluminum substrate layer and insert it to initially fix the U-shaped frame to the outer surface of the aluminum substrate layer. Next, place the component with the insulating buffer layer, thermal conductive layer, and first and second adhesive layers on the aluminum substrate layer and fix it by bonding with the second adhesive layer. Finally, place the circuit layer on top of the component, insert the retaining plate into the slot of the circuit layer, and simultaneously use the first adhesive layer to complete the bonding of the circuit layer. In this design, the U-shaped frame, together with the retaining plate, positioning plate, circuit layer, and aluminum substrate layer, forms a multi-layer fixing structure, effectively preventing displacement or separation between the layers. When subjected to external impact or vibration, the dual fixing methods of retaining and bonding can work together to improve the overall structural stability of the circuit board. Attached Figure Description

[0014] Figure 1 This is a structural schematic diagram of the assembly of this utility model; Figure 2 This is a cross-sectional structural diagram of the assembly of this utility model; Figure 3 This is a schematic diagram of the guarantee structure of the assembly of this utility model; Figure 4 This is a schematic diagram of the aluminum substrate layer of this utility model; Figure 5 This is a schematic diagram of the structure at point A of this utility model.

[0015] In the diagram: 1-Circuit layer, 2-Aluminum substrate layer, 3-Insulating buffer layer, 4-Heat-conducting layer, 5-First adhesive layer, 6-Second adhesive layer, 7-U-shaped frame, 8-Heat dissipation protrusion, 9-Card slot, 10-Positioning plate, 11-Positioning groove, 12-Card plate. Detailed Implementation

[0016] The present invention will be further described below with reference to the accompanying drawings, but the scope of protection of the present invention is not limited thereto.

[0017] like Figures 1 to 5 As shown, an aluminum substrate circuit board with an insulating buffer layer includes an upper and lower corresponding circuit layer 1 and an aluminum substrate layer 2. The circuit layer 1 and the aluminum substrate layer 2 are parallel. An insulating buffer layer 3 is disposed between the circuit layer 1 and the aluminum substrate layer 2. A thermally conductive layer 4 is embedded and bonded to the bottom of the insulating buffer layer 3. The bottom surfaces of the insulating buffer layer 3 and the thermally conductive layer 4 are on the same horizontal plane. A first adhesive layer 5 and a second adhesive layer 6 are respectively bonded to the top and bottom surfaces of the insulating buffer layer 3. The top surface of the first adhesive layer 5 is bonded to the bottom of the circuit layer 1, and the bottom surface of the second adhesive layer 6 is bonded to the top of the aluminum substrate layer 2. Two symmetrically arranged U-shaped frames 7 are bonded to the outer surface of the aluminum substrate layer 2 with adhesive. Two symmetrically arranged clamping plates 12 are fixedly connected to the inner wall of each U-shaped frame 7. Several clamping plates 12 are all clamped to the circuit layer 1.

[0018] As an optional technical solution of this utility model, the first adhesive layer 5 and the second adhesive layer 6 are both made of thermally conductive adhesive. The first adhesive layer 5, the second adhesive layer 6, and the insulating buffer layer 3 are all located inside the two U-shaped frames 7. Placing the first adhesive layer 5, the second adhesive layer 6, and the insulating buffer layer 3 inside the two U-shaped frames 7 provides physical protection, preventing external impacts from directly affecting the structure of each layer and preventing the adhesive layers from falling off or the insulating buffer layer from being damaged due to external forces. At the same time, the U-shaped frames 7 restrict the lateral displacement of each layer, enhance the stability of the overall circuit board structure, and ensure that the layers can still fit tightly together and maintain good electrical insulation and heat dissipation performance even in complex operating environments.

[0019] As an optional technical solution of this utility model, a plurality of linearly arrayed heat dissipation protrusions 8 are fixedly connected to the top of the heat-conducting layer 4. Both the heat dissipation protrusions 8 and the heat-conducting layer 4 are made of graphene. The numerous heat dissipation protrusions 8 significantly increase the heat dissipation surface area of ​​the heat-conducting layer 4, enabling it to quickly absorb heat transferred from the circuit layer 1 and evenly distribute the heat. Compared to traditional planar heat-conducting layers, the heat dissipation protrusions 8 significantly improve the efficiency of heat conduction and dissipation, breaking through the thermal resistance barrier caused by the insulating buffer layer and effectively solving the heat dissipation problem caused by the presence of the insulating buffer layer. Furthermore, the graphene heat dissipation protrusions 8 are integrally formed with the heat-conducting layer 4, ensuring structural stability and preventing them from easily falling off or being damaged during use, thus continuously ensuring efficient heat dissipation for the circuit board.

[0020] As an optional technical solution of this utility model, two symmetrically arranged slots 9 are provided on both the left and right sides of the circuit layer 1. Several locking plates 12 are engaged with the circuit layer 1 through the slots 9. During installation, simply aligning the locking plates 12 with the slots 9 and inserting them can quickly complete the positioning and fixing of the circuit layer 1 without complicated tools and operating procedures, thus improving production and assembly efficiency. During the use of the circuit board, the locking plates 12 and the slots 9 fit tightly together, which can effectively prevent the circuit layer 1 from shifting due to vibration, external impact, or other factors, ensuring that the circuit layer 1, the insulating buffer layer 3, and the aluminum substrate layer 2 always maintain a stable relative position, thereby maintaining the reliability of the electrical performance of the circuit board.

[0021] As an optional technical solution of this utility model, the insulating buffer layer 3 is made of modified epoxy resin. Modified epoxy resin also has good mechanical toughness and buffering performance. When the circuit board is subjected to external impact or vibration, it can effectively absorb energy and protect the electronic components on the circuit layer from damage. In addition, this material has strong chemical stability and good corrosion resistance, and can adapt to complex environments such as high temperature and humidity, extending the service life of the circuit board. Furthermore, it has good compatibility with the first adhesive layer 5 and the second adhesive layer 6 of the thermally conductive adhesive material, ensuring that the layers are tightly bonded and work together.

[0022] As an optional technical solution of this utility model, two symmetrically arranged positioning plates 10 are fixedly connected to the inner wall of each U-shaped frame 7. Two symmetrically arranged positioning slots 11 are opened on both the front and rear sides of the aluminum substrate layer 2. The positioning plates 10 are engaged with the aluminum substrate layer 2 through the positioning slots 11. During circuit board assembly, the positioning plates 10 can be quickly inserted into the positioning slots 11 to guide the U-shaped frame 7 to be accurately installed in the predetermined position, avoiding installation deviation. This allows the subsequent clamping plate 12 to smoothly connect with the slot 9 of the circuit layer 1, improving the accuracy and efficiency of the overall assembly. The engagement of the positioning plates 10 and the positioning slots 11 also enhances the connection strength between the U-shaped frame 7 and the aluminum substrate layer 2, preventing the U-shaped frame 7 from loosening or shifting during use. Working in conjunction with the engagement structure of the clamping plate 12 and the slot 9, the circuit board layers are fixed from multiple directions, greatly improving the overall stability and reliability of the circuit board.

[0023] An aluminum substrate circuit board with an insulating buffer layer operates on the following principle: 1): Align the positioning plate 10 with the positioning groove 11 of the aluminum substrate layer 2 and insert it to initially fix the U-shaped frame 7 on the outer surface of the aluminum substrate layer 2.

[0024] 2): Next, the assembly with insulating buffer layer 3, thermal conductive layer 4, first adhesive layer 5, and second adhesive layer 6 is placed on aluminum substrate layer 2 and fixed by adhesive layer 6.

[0025] 3): Place the circuit layer 1 on top of the component, so that the card plate 12 is inserted into the card slot 9 of the circuit layer 1, and at the same time, use the first adhesive layer 5 to complete the bonding of the circuit layer 1.

[0026] In summary, this aluminum substrate circuit board with an insulating buffer layer effectively ensures heat dissipation performance by embedding a thermally conductive layer 4 at the bottom of the insulating buffer layer 3, and using a first adhesive layer 5 and a second adhesive layer 6 made of thermally conductive adhesive. The heat generated by the circuit layer 1 during operation can be transferred to the insulating buffer layer 3 through the first adhesive layer 5, and then quickly conducted to the aluminum substrate layer 2 via the thermally conductive layer 4. The graphene heat dissipation protrusions 8 on the top of the thermally conductive layer 4 increase the heat dissipation area and accelerate heat dissipation. Meanwhile, the aluminum substrate layer 2 itself has good thermal conductivity. Combined with the thermally conductive adhesive layer, heat can be rapidly dissipated. Even with the addition of the insulating buffer layer 3, the overall heat dissipation effect will not be affected, ensuring that the circuit board maintains a suitable temperature during operation and extending its service life. During installation, firstly, the positioning plate 10 is aligned with the positioning groove 11 of the aluminum substrate layer 2 and inserted, so that the U-shaped frame 7 is initially fixed to the outer surface of the aluminum substrate layer 2. Next, the component with the insulating buffer layer 3, the thermally conductive layer 4, and the first adhesive layer 5 and the second adhesive layer 6 are placed on the aluminum substrate layer 2 and fixed by the second adhesive layer 6. Finally, the circuit layer 1 is placed on top of the component, so that the clip 12 is inserted into the slot 9 of the circuit layer 1, and the first adhesive layer 5 is used to complete the bonding of the circuit layer 1. In this design, the U-shaped frame 7, together with the clip 12, the positioning plate 10, the circuit layer 1, and the aluminum substrate layer 2, form a multi-fixed structure, effectively preventing displacement or separation between the layers. When subjected to external impact or vibration, the clipping and bonding dual fixing methods can work together to improve the overall structural stability of the circuit board.

Claims

1. An aluminum substrate circuit board with an insulating buffer layer, characterized in that: The system includes a circuit layer (1) and an aluminum substrate layer (2) that are corresponding to each other. The circuit layer (1) and the aluminum substrate layer (2) are parallel. An insulating buffer layer (3) is provided between the circuit layer (1) and the aluminum substrate layer (2). A heat-conducting layer (4) is embedded and bonded to the bottom of the insulating buffer layer (3). The bottom surfaces of the insulating buffer layer (3) and the heat-conducting layer (4) are on the same horizontal plane. A first adhesive layer (5) and a second adhesive layer (6) are bonded to the top and bottom surfaces of the insulating buffer layer (3), respectively. The top surface of the first adhesive layer (5) is bonded to the bottom of the circuit layer (1), and the bottom surface of the second adhesive layer (6) is bonded to the top of the aluminum substrate layer (2). Two symmetrically arranged U-shaped frames (7) are bonded to the outer surface of the aluminum substrate layer (2) with glue. Two symmetrically arranged clips (12) are fixedly connected to the inner wall of each U-shaped frame (7). Several clips (12) are clipped to the circuit layer (1).

2. The aluminum substrate circuit board with an insulating buffer layer according to claim 1, characterized in that: The first adhesive layer (5) and the second adhesive layer (6) are both made of thermally conductive adhesive. The first adhesive layer (5), the second adhesive layer (6) and the insulating buffer layer (3) are all located inside the two U-shaped frames (7).

3. The aluminum substrate circuit board with an insulating buffer layer according to claim 2, characterized in that: The top of the heat-conducting layer (4) is fixedly connected with a number of linear array heat dissipation protrusions (8), and the heat dissipation protrusions (8) and the heat-conducting layer (4) are all made of graphene.

4. The aluminum substrate circuit board with an insulating buffer layer according to claim 3, characterized in that: Two symmetrical slots (9) are provided on both the left and right sides of the circuit layer (1), and several of the card plates (12) are connected to the circuit layer (1) through the slots (9).

5. An aluminum substrate circuit board with an insulating buffer layer according to claim 4, characterized in that: The insulating buffer layer (3) is made of modified epoxy resin.

6. An aluminum substrate circuit board with an insulating buffer layer according to claim 5, characterized in that: Each of the U-shaped frame (7) has two symmetrically arranged positioning plates (10) fixedly connected to its inner wall. The aluminum substrate layer (2) has two symmetrically arranged positioning grooves (11) on both the front and rear sides. The positioning plates (10) are engaged with the aluminum substrate layer (2) through the positioning grooves (11).

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