A heat dissipation structure of a power element of a printed circuit board

Abstract

The utility model discloses a kind of heat dissipation structures of printed circuit board power element, comprising: circuit board, one surface is welding surface, another surface is heat dissipation surface, at least one patch area for installing power element is equipped on the welding surface of the circuit board, the patch area is equipped with several pads welded with the surface of power element at place, and the patch area is also equipped with several metallized holes that pass through the circuit board up and down;Heat dissipation platform, the circuit board is located on the heat dissipation platform, the heat dissipation surface of the circuit board is towards the heat dissipation platform setting, and heat-conducting medium is equipped between the surface of the heat dissipation platform and circuit board.In the utility model, through the welding structure design of patch type, and the heat dissipation performance of power element is improved by the heat-conducting structure of pad and metallized hole etc.

Description

Technical Field

[0001] This utility model belongs to the field of heat dissipation technology for power components, and specifically relates to a heat dissipation structure for power components on printed circuit boards. Background Technology

[0002] With the continuous development of automotive electronics, high-power, miniaturized, and lightweight motor control units are the future trend. Many existing motor drive chips use high-power transistors to amplify current and drive the motor. However, the heatsink area and capacity of a single high-power transistor chip are limited, necessitating a heat dissipation structure to eliminate excess heat and quickly dissipate it, thus extending the lifespan of the high-power transistor chip. Consequently, in mass-produced automotive electronic control products, more high-power transistors utilize surface-mount packaging. However, how to solder surface-mount packaged high-power components to non-metallic circuit boards and conduct heat to the heatsink behind the circuit board remains a challenge.

[0003] There are many types of heat dissipation structures for high-power components. There are two common heat dissipation methods: one is to place the power transistor at the edge of the printed circuit board, with the electrical connection pins of the power transistor vertically soldered to the printed circuit board. The power transistor is then pressed onto the housing by a pressure plate, and heat is dissipated through the housing. In this method, the installation position is limited and can only be installed at the edge of the circuit board, which cannot be flexibly arranged according to functional requirements. The other method is to equip the power transistor with an independent heat sink and fix it on the printed circuit board to achieve local heat dissipation. This heat dissipation method is only suitable for power transistors with relatively low heat generation, and has certain limitations. Its heat dissipation performance is relatively low and the heat dissipation speed is slow. Utility Model Content

[0004] The purpose of this invention is to overcome the shortcomings of existing technologies and provide a heat dissipation structure for power components on printed circuit boards. By using a surface-mount soldering structure design and a heat-conducting structure composed of pads and metallized holes, the heat dissipation performance of the power components is improved.

[0005] To solve the above-mentioned technical problems, this utility model provides a heat dissipation structure for power components on a printed circuit board, comprising:

[0006] A circuit board has a soldering surface on one side and a heat dissipation surface on the other side. The soldering surface of the circuit board has at least one surface mount area for mounting power components. The surface mount area has several pads for soldering to the surface of the power components. The surface mount area also has several metallized holes that penetrate the circuit board vertically.

[0007] A heat sink is provided, the circuit board is disposed on the heat sink, the heat dissipation surface of the circuit board faces the heat sink, and a heat-conducting medium is provided between the surface of the heat sink and the circuit board.

[0008] Furthermore, the pads include a plurality of first pads arranged laterally and a plurality of second pads arranged longitudinally.

[0009] Furthermore, the first pads are arranged in two rows on the upper and lower sides of the patch area, and the second pads are distributed along the left and right sides of the patch area and located between the two rows of first pads.

[0010] Furthermore, the patch area, excluding the pads, is provided with a plurality of metallized holes.

[0011] Furthermore, an annular copper plating layer is provided on the outer periphery of the surface mount area, the copper plating layer abuts against the surface of the power component, and the soldering surface of the circuit board is provided with a plurality of third pads located outside the surface mount area and soldered to the pins of the power component, and each third pad is connected to the copper plating layer by a wire.

[0012] Furthermore, the copper plating layer overlaps with at least one row of first pads.

[0013] Furthermore, the metallized hole has a copper plating layer on its wall and is filled with the heat-conducting medium.

[0014] Furthermore, the heat dissipation surface of the circuit board has a thermally conductive copper plating at the location corresponding to the patch area.

[0015] Furthermore, the heat dissipation surface of the circuit board is provided with a plurality of fourth pads located outside the copper-clad surface. The outer side of the fourth pads abuts against the surface of the heat sink to separate the circuit board and the heat sink.

[0016] Furthermore, the thermally conductive medium is thermally conductive silicone grease.

[0017] Furthermore, the circuit board is fixed to the heat sink by screws.

[0018] This utility model has the following beneficial effects:

[0019] In this invention, by setting several pads and metallized holes in the surface mount area, two things are achieved: first, the pads are used to weld the heat dissipation parts of the power components to form a surface mount welding and mounting structure; second, the heat from the power components can be dissipated from the pads on the welding surface and conducted to the heat dissipation surface of the circuit board through the metallized holes, and then conducted to the heat-conducting medium and heat sink for heat dissipation. This heat dissipation structure has good heat dissipation performance and can effectively improve the overall performance of the printed circuit board. Moreover, through the heat conduction structure of the pads and metallized holes, the mounting position of the power components can be flexibly arranged. That is, the power components do not need to be limited to the edge of the circuit board, and the arrangement of various functional areas on the circuit board is no longer limited by the heat dissipation requirements of the devices. The layout of the printed circuit board is more flexible, and after the circuit board is soldered, there are no weak points in the device mounting, which is also very convenient for assembly.

[0020] Secondly, a ring-shaped copper layer is set on the outer periphery of the surface mount area. This copper layer abuts against the surface of the power component and serves as part of the heat conduction structure to collect and transfer the heat generated by the power component. This increases the contact area between the heat conduction structure and the power component, thereby improving the heat conduction speed and heat dissipation performance. The third pad, which is soldered to the pin of the power component, is connected to the copper layer through a wire, thereby conducting the heat generated at the pin of the power component to the copper layer, and then to the pads and metallized holes in the surface mount area, so as to conduct it downward to the heat sink on the heat dissipation surface of the circuit board for heat dissipation, further improving the heat dissipation performance.

[0021] In addition, a copper-clad surface is provided on the heat dissipation surface of the circuit board at the position corresponding to the surface mount area. This distributes the heat transferred from the metallized holes to the entire copper-clad surface before conducting it to the heat sink for heat dissipation, thereby increasing the heat conduction area and efficiency, and thus improving the heat dissipation efficiency and effect. Several fourth pads are provided on the heat dissipation surface of the circuit board that abut against the surface of the heat sink. These pads serve two purposes: first, they conduct the heat transferred from the soldering surface to the heat sink; second, they support the circuit board and separate the heat dissipation surface of the circuit board from the heat sink, forming an electrical isolation gap to ensure the reliability of the insulation between the circuit board and the heat sink.

[0022] Additional aspects and advantages of this invention will be set forth in part in the description which follows, and will become apparent from the description or may be learned by practice of the invention. Attached Figure Description

[0023] The accompanying drawings, which are included to provide a further understanding of the present invention and form part of this application, do not constitute an undue limitation of the present invention. In the drawings:

[0024] Figure 1 This is a schematic diagram of the heat dissipation structure of the power components on the printed circuit board in the embodiment;

[0025] Figure 2This is a side view of the heat dissipation structure of the power components on the printed circuit board in the embodiment;

[0026] Figure 3 This is a partial schematic diagram showing the soldering surface of the circuit board located in the patch area in the embodiment;

[0027] Figure 4 This is a partial schematic diagram of the heat dissipation surface of the circuit board located in the patch area in the embodiment;

[0028] Figure 5 This is a partial schematic diagram of the fourth pad after the circuit board and heat sink are combined in the embodiment. Detailed Implementation

[0029] To better understand the technical content of this utility model, the following will further introduce and explain this utility model in conjunction with the accompanying drawings and specific embodiments. It should be noted that if there are descriptions such as "first" and "second" in the text, they are used to distinguish different components, etc., and do not represent the order of priority, nor do they limit "first" and "second" to be different types.

[0030] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of the present utility model.

[0031] Example

[0032] like Figures 1 to 5 As shown in the figure, the heat dissipation structure of a power component on a printed circuit board in this embodiment includes a circuit board 1 and a heat sink 2. One surface of the circuit board 1 is a soldering surface and the other surface is a heat dissipation surface. The soldering surface of the circuit board 1 is provided with at least one surface mount area 10 for mounting a power component 3. The surface mount area 10 is provided with several pads that are soldered to the surface of the power component 3. The surface mount area 10 is also provided with several metallized holes 11 that penetrate the circuit board 1 vertically. That is, the hole walls of the metallized holes 11 are provided with copper plating layers for conducting heat vertically. The heat dissipation surface of the circuit board 1 is provided with a thermally conductive copper plating surface 12 at the position corresponding to the surface mount area 10, and the copper plating layer in the metallized holes 11 is connected to the copper plating surface 12. The circuit board 1 is placed on the heat sink 2 with the heat dissipation surface of the circuit board 1 facing the heat sink 2. A thermally conductive medium 4 is provided between the surface of the heat sink 2 and the circuit board 1. During installation, the thermally conductive medium 4 fills the metallized holes 11 to improve the thermal conductivity of the metallized holes 11.

[0033] In the above-mentioned configuration, several pads and metallized holes are provided in the surface mount area. Firstly, the pads are used to solder the heat dissipation parts of the power components, forming a surface mount soldering structure. Secondly, the heat from the power components can be dissipated through the pads on the soldering surface and conducted to the heat dissipation surface of the circuit board through the metallized holes, and then further conducted to the heat-conducting medium and heat sink for heat dissipation. This heat dissipation structure has good heat dissipation performance, effectively improving the overall performance of the printed circuit board. Furthermore, the heat-conducting structure of the pads and metallized holes allows for flexible placement of the power components. The power components do not need to be limited to the edges of the circuit board, and the arrangement of functional areas on the circuit board is no longer restricted by the heat dissipation requirements of the devices. The layout of the printed circuit board is more flexible, and after soldering, there are no weak points in device installation, making assembly very convenient.

[0034] In one embodiment, such as Figure 3 As shown, the pads include a plurality of first pads 13 arranged in a transverse direction and a plurality of second pads 14 arranged in a longitudinal direction.

[0035] Preferably, such as Figure 3 As shown, there are four first pads 13, which are arranged in two rows at intervals on the upper and lower sides of the surface mount area 10, with two first pads 13 in each row at intervals; there are three second pads 14, which are arranged at intervals along the left and right sides of the surface mount area and located between the two rows of first pads 13. Thus, by using seven pads and their distribution, they can be soldered to various areas on the surface of the power component 3 as much as possible, thereby improving the thermal contact area and heat dissipation effect.

[0036] In one embodiment, such as Figure 3 As shown, an annular copper layer 15 is provided around the outer periphery of the surface mount area 10. The copper layer 15 abuts against the surface of the power component 3. This copper layer abuts against the surface of the power component as part of the heat conduction structure to collect and transfer the heat generated by the power component, thereby increasing the contact area between the heat conduction structure and the power component, and thus improving the heat conduction speed and heat dissipation performance. The soldering surface of the circuit board 1 is provided with a plurality of third pads 16 located outside the surface mount area and soldered to the pins 31 of the power component 3. Each third pad 16 is connected to the copper layer 15 by a wire 17, thereby conducting the heat generated at the pins of the power component to the copper layer, and then to the pads and metallized holes in the surface mount area, so as to conduct it downward to the heat dissipation platform at the heat dissipation surface of the circuit board for heat dissipation, further improving the heat dissipation performance.

[0037] In one embodiment, such as Figure 3 As shown, the copper layer 15 overlaps with at least one row of first pads 13.

[0038] In one embodiment, a plurality of metallized holes are provided in the area of ​​the patch area other than the pads, that is, a plurality of metallized holes are distributed in the area between the copper layer 15 and the first pad and the second pad.

[0039] In another embodiment, metallized holes can also be provided at the positions of the first pad and the second pad, which can facilitate the downward conduction of heat from the pads. The metallized holes here can be filled with a heat-conducting medium or solder used for soldering.

[0040] In one embodiment, such as Figures 4 to 5 As shown, the heat dissipation surface of the circuit board 1 is provided with several fourth pads 18 located outside the copper cladding surface 12. That is, the fourth pads are located outside the surface mount area. The outer side of the fourth pads 18 abuts against the surface of the heat sink. This serves two purposes: first, to conduct the heat from the soldering surface to the heat sink; and second, to support the circuit board, thereby separating the heat dissipation surface of the circuit board from the heat sink, forming an electrical isolation gap, and ensuring the reliability of the insulation between the circuit board and the heat sink.

[0041] Preferably, there are six fourth pads 18, arranged in two rows on the left and right sides of the copper-clad surface 12, with three vertical fourth pads in each row.

[0042] In one embodiment, such as Figures 1 to 2 As shown, circuit board 1 is fixed to heat sink 2 by screws 5.

[0043] In one embodiment, the thermally conductive medium is thermally conductive silicone grease.

[0044] In other embodiments, the heat sink can be part of a metal heat sink housing or a separate metal heat sink.

[0045] The technical solutions provided by the embodiments of this utility model have been described in detail above. Specific examples have been used to illustrate the principles and implementation methods of the embodiments of this utility model. The description of the above embodiments is only for helping to understand the principles of the embodiments of this utility model. At the same time, for those skilled in the art, there will be changes in the specific implementation methods and application scope based on the embodiments of this utility model. Therefore, the content of this specification should not be construed as a limitation of this utility model.

Claims

1. A heat dissipation structure for a power component on a printed circuit board, characterized in that, include: A circuit board has a soldering surface on one side and a heat dissipation surface on the other side. The soldering surface of the circuit board has at least one surface mount area for mounting power components. The surface mount area has several pads for soldering to the surface of the power components. The surface mount area also has several metallized holes that penetrate the circuit board vertically. A heat sink is provided, the circuit board is disposed on the heat sink, the heat dissipation surface of the circuit board faces the heat sink, and a heat-conducting medium is provided between the surface of the heat sink and the circuit board.

2. The heat dissipation structure for printed circuit board power components as described in claim 1, characterized in that, The pads include a plurality of first pads arranged laterally and a plurality of second pads arranged longitudinally.

3. The heat dissipation structure for printed circuit board power components as described in claim 2, characterized in that, The first pads are arranged in two rows on the upper and lower sides of the patch area, and the second pads are distributed along the left and right sides of the patch area and located between the two rows of first pads.

4. The heat dissipation structure for printed circuit board power components as described in claim 3, characterized in that, The patch area, excluding the pads, has several metallized holes.

5. The heat dissipation structure for printed circuit board power components as described in claim 4, characterized in that, The outer periphery of the surface mount area is provided with an annular copper layer, which abuts against the surface of the power component. The soldering surface of the circuit board is provided with a plurality of third pads located outside the surface mount area and soldered to the pins of the power component, and each third pad is connected to the copper layer by a wire.

6. The heat dissipation structure for printed circuit board power components as described in claim 5, characterized in that, The copper plating layer overlaps at least one of the first pads in the row.

7. The heat dissipation structure for printed circuit board power components as described in claim 6, characterized in that, The metallized hole has a copper plating layer on its wall and is filled with the heat-conducting medium.

8. The heat dissipation structure for a printed circuit board power component as described in any one of claims 1-7, characterized in that, The heat dissipation surface of the circuit board has a thermally conductive copper plating at the corresponding patch area.

9. The heat dissipation structure for a printed circuit board power component as described in claim 8, characterized in that, The heat dissipation surface of the circuit board is provided with a plurality of fourth pads located outside the copper-clad surface. The outer side of the fourth pads abuts against the surface of the heat sink to separate the circuit board and the heat sink.

10. The heat dissipation structure for a printed circuit board power component as described in claim 9, characterized in that, The thermally conductive medium is thermally conductive silicone grease, and the circuit board is fixed to the heat sink by screws.

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