A cover film single-PCS bonding design structure for improving the height difference of a rigid-flex printed circuit board
Patent Information
- Application Number
- CN202522030702.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-09-22
- Publication Date
- 2026-10-30
- Estimated Expiration
- 2035-09-22
AI Technical Summary
如果没有覆盖膜，柔性电路板很容易因外界影响而失效；而软硬结合板由于产品特性，目前的作业方法为废料区整板贴合覆盖膜，导致PCS外废料区比PCS内产品区整体厚度高，从而影响客户打件，导致打件不良
[0006]本实用新型的技术效果和优点：本结构通过改变覆盖膜设计，局部贴合，只贴SET内PCS软板区，废料区不贴合的方式生产，降低废料区高度。通过局部覆盖膜贴合的方式，减少废料区覆盖膜多余高度的影响，从而降低高低差，通过此办法，解决客户打件过程中板面不平的问题，提高产品品质。
Smart Images
Figure CN224923922U_ABST
Abstract
Description
Technical Field
[0001] This utility model belongs to the technical field of improving the height difference of rigid-flex PCBs, and specifically relates to a single PCS bonding design structure for a cover film to improve the height difference of rigid-flex PCBs. Background Technology
[0002] With the increasing miniaturization, lightweighting, and high reliability of electronic products, flexible PCBs have been widely used in automotive, medical devices, and consumer electronics. Among these applications, the cover film is crucial for ensuring the reliability of flexible PCBs—it provides insulation protection for conductive lines, preventing environmental corrosion and mechanical damage. Without the cover film, flexible PCBs are easily susceptible to failure due to external influences. Furthermore, due to the characteristics of rigid-flex PCBs, current manufacturing methods involve laminating the cover film onto the entire board in the waste area, resulting in a higher overall thickness in the waste area outside the PCS compared to the product area inside, thus affecting customer assembly and leading to defects. To address these issues, a single-PCS cover film lamination design structure is proposed to improve the height difference in rigid-flex PCBs. Utility Model Content
[0003] The purpose of this invention is to provide a single-PCS bonding design structure for a cover film that improves the height difference between rigid and flexible bonding plates, so as to solve the problems mentioned in the background art.
[0004] To achieve the above objectives, this utility model provides the following technical solution: a cover film single PCS bonding design structure for improving the height difference of rigid-flexible bonding plates, including a rigid-flexible bonding plate whole plate and a waste area outside the PCS. The waste area outside the PCS is disposed on the rigid-flexible bonding plate whole plate. The rigid-flexible bonding plate whole plate is provided with multiple rigid-flexible modules. Each rigid-flexible module is composed of a product area inside the PCS and a rigid area. The product area inside the PCS and the rigid area are electrically connected.
[0005] Preferably, the outer waste area of the PCS is provided with multiple solder resist points, and the inner product area of the PCS is covered with a cover film.
[0006] The technical effects and advantages of this utility model are as follows: This structure reduces the height of the waste area by modifying the cover film design and using partial lamination, applying the cover film only to the PCS flexible board area within the SET and leaving the waste area unattached. This partial lamination method reduces the impact of excess cover film height in the waste area, thereby reducing height differences. This solution addresses the issue of uneven board surfaces during the customer's component manufacturing process and improves product quality. Attached Figure Description
[0007] Figure 1 This is a schematic diagram of the overall structure of the rigid-flexible composite board of this utility model; Figure 2 This is a schematic diagram of a traditional cover film bonding structure; Figure 3 This is a schematic diagram of the cover film bonding structure of this utility model.
[0008] In the diagram: 101, rigid-flex PCB; 102, waste area outside PCS; 103, product area inside PCS; 104, rigid area. Detailed Implementation
[0009] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.
[0010] This utility model provides, for example Figure 1-3 The diagram shows a single PCS lamination design structure for a cover film to improve the height difference of a rigid-flex plate, including a rigid-flex plate 101 and a waste area 102 outside the PCS. Specifically, the PCS external waste area 102 is located on the rigid-flex board 101. The rigid-flex board 101 is provided with multiple rigid-flex modules. Each rigid-flex module is composed of the PCS internal product area 103 and the rigid area 104. The PCS internal product area 103 and the rigid area 104 are electrically connected.
[0011] Specifically, the outer waste area 102 of the PCS is provided with multiple solder resist points, and the inner product area 103 of the PCS is covered with a cover film. Example
[0012] Traditional cover film coverage areas include 102 and 103. The entire 101 panel except for area 104 is coated. The traditional method involves applying the cover film to the entire waste area, resulting in the waste area outside the PCS being thicker than the product area inside, affecting customer assembly and causing defects. The optimized method involves changing the cover film design to partial application, applying the film only to the flexible board area of the PCS within the SET, leaving the waste area uncoated. This reduces the height of the waste area. By partially applying the cover film, the impact of the excess height in the waste area is reduced, thus minimizing height differences. This solution addresses the issue of uneven board surfaces during assembly and improves product quality.
[0013] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.
Claims
1. A cover film single PCS bonding design structure for improving the height difference of rigid-flex PCBs, comprising a rigid-flex PCB whole plate (101) and a PCS waste area (102), characterized in that: The PCS external waste area (102) is located on the rigid-flex board (101). The rigid-flex board (101) is provided with multiple rigid-flex modules. Each rigid-flex module is composed of the PCS internal product area (103) and the rigid area (104). The PCS internal product area (103) and the rigid area (104) are electrically connected.
2. The single-PCS bonding design structure for a cover film to improve the height difference of a rigid-flexible bonded plate according to claim 1, characterized in that: The PCS outer waste area (102) is provided with multiple solder resist points, and the PCS inner product area (103) is covered with a cover film.