A multi-layer PCB board bonding device for resonator

Abstract

The utility model belongs to crystal oscillator technical field, and disclose a kind of multilayer PCB board laminating device for resonator, including crystal oscillator main part, auxiliary assembly is provided on crystal oscillator main part, the top of crystal oscillator main part is connected with resonator body, the bottom of resonator body is connected with IC fixed glue, the bottom of IC fixed glue is connected with oscillation IC, the surface of oscillation IC is connected with two IC bonding line, the inside of crystal oscillator main part is connected with black glue.The utility model first layer PCB and second layer PCB form two pieces of ultrathin PCB board, and the space containing oscillation IC is formed by the first layer PCB and second layer PCB being laminated with the cooperation of resonator, replace traditional ceramic pedestal, get rid of the dependence on ceramic pedestal supplier, without relying on imported ceramic pedestal, while reducing the raw material cost of crystal oscillator main part, also conducive to avoiding the situation that production stagnates due to the shortage of imported ceramic pedestal.

Description

Technical Field

[0001] This invention belongs to the field of crystal oscillator technology, specifically a multilayer PCB board bonding device for resonators. Background Technology

[0002] A crystal oscillator is a core electronic device that can output a stable oscillation frequency. Its core function is to provide a precise and stable clock signal for electronic devices. It is widely used in electronic fields that require precise timing control. The core components of a crystal oscillator include two key parts: one is a single resonator as the resonant unit, which provides a stable oscillation frequency basis; the other is an oscillator IC as the oscillation generator, which generates and outputs the oscillation signal. In traditional crystal oscillator structures, a ceramic substrate is required to provide a closed space to house the oscillator IC, supporting the assembly of core components such as the oscillator IC and single-unit resonators, and ensuring the stability of signal transmission between components. However, the production of ceramic substrates is mostly controlled by foreign suppliers, and delivery time and price are subject to the suppliers' business strategy considerations. On the one hand, the price of the substrates cannot meet the end-user price demand of crystal oscillators in the market. On the other hand, when supply and demand are out of balance, domestic manufacturers face the risk of supply disruption. Utility Model Content

[0003] To address the problems mentioned in the background art, this utility model provides a multilayer PCB board bonding device for resonators, which has the advantages of eliminating dependence on ceramic base suppliers, reducing import costs, and avoiding raw material supply disruptions.

[0004] To achieve the above objectives, this utility model provides the following technical solution: a multilayer PCB board bonding device for resonators, comprising a crystal oscillator body, an auxiliary component disposed on the crystal oscillator body, a resonator body connected to the top of the crystal oscillator body, an IC fixing adhesive connected to the bottom of the resonator body, an oscillating IC connected to the bottom of the IC fixing adhesive, two IC bonding wires connected to the surface of the oscillating IC, and black glue connected to the inner side of the crystal oscillator body.

[0005] Preferably, the auxiliary component includes two first solder paste layers, both of which are disposed at the bottom end of the resonator body, the bottom ends of both first solder paste layers are connected to a first PCB layer, the bottom ends of both first PCB layers are connected to a second solder paste layer, and the bottom ends of both second solder paste layers are connected to a second PCB layer.

[0006] Preferably, one end of each of the two IC bonding wires is connected to the surface of one of the two second-layer PCBs.

[0007] Preferably, the inner side of the black adhesive is connected to the surfaces of both second-layer PCBs.

[0008] Preferably, the bottom ends of both second-layer PCBs are connected to the inner side of the crystal oscillator body.

[0009] Preferably, the IC fixing adhesive is made of epoxy-based high-temperature die bond adhesive.

[0010] Preferably, the inner side of the black adhesive is connected to the surface of the two IC bonding wires, and the inner side of the black adhesive is connected to the surface of the oscillating IC.

[0011] Preferably, the black adhesive is made of epoxy resin-based sealing black adhesive material.

[0012] Compared with the prior art, the beneficial effects of this utility model are as follows: This invention uses a first-layer PCB and a second-layer PCB to form two ultra-thin PCB boards. The space for accommodating the oscillating IC is formed by bonding the resonator body, the first-layer PCB, and the second-layer PCB together, replacing the traditional ceramic base. This eliminates the dependence on ceramic base suppliers and does not require imported ceramic bases. While helping to reduce the raw material cost of the crystal oscillator body, it also helps to avoid production stoppages caused by the shortage of imported ceramic bases. In addition, the structure is simple and facilitates rapid prototyping. Attached Figure Description

[0013] Figure 1 This is a schematic diagram of the overall structure of this utility model; Figure 2 This is a cross-sectional structural diagram of the present invention; Figure 3 This is one of the partial structural schematic diagrams of this utility model; Figure 4 This is the second partial structural schematic diagram of this utility model.

[0014] In the picture: 1. Main body of the crystal oscillator; 2. Auxiliary components; 21. First solder paste layer; 22. First PCB layer; 23. Second solder paste layer; 24. Second PCB layer; 3. Resonator body; 4. IC fixing adhesive; 5. Oscillating IC; 6. IC bonding wire; 7. Black glue. Detailed Implementation

[0015] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0016] like Figures 1 to 4 As shown, this utility model provides a multilayer PCB board bonding device for resonators, including a crystal oscillator body 1, an auxiliary component 2 on the crystal oscillator body 1, a resonator body 3 connected to the top of the crystal oscillator body 1, the resonator body 3 facilitating the provision of core resonance function, an IC fixing adhesive 4 connected to the bottom of the resonator body 3, the IC fixing adhesive 4 facilitating the secure assembly of the oscillating IC 5, the bottom of the IC fixing adhesive 4 connected to the oscillating IC 5, two IC bonding wires 6 connected to the surface of the oscillating IC 5, the IC bonding wires 6 realizing reliable electrical connection between the oscillating IC 5 and other components, and black glue 7 connected to the inner side of the crystal oscillator body 1, the black glue 7 facilitating the sealing and protection of the oscillating IC 5 and the IC bonding wires 6.

[0017] Specifically, the auxiliary component 2 includes two first solder paste layers 21, both of which are disposed at the bottom of the resonator body 3. The bottom of each of the two first solder paste layers 21 is connected to a first PCB 22, the bottom of each of the two first PCBs 22 is connected to a second solder paste layer 23, and the bottom of each of the two second solder paste layers 23 is connected to a second PCB 24.

[0018] Furthermore, one end of each of the two IC bonding lines 6 is connected to the surface of the two second-layer PCBs 24, which facilitates the establishment of a stable signal and current transmission path between the oscillating IC 5 and the second-layer PCB 24, thereby providing reliable electrical connection support.

[0019] Furthermore, the inner side of the black adhesive 7 is connected to the surfaces of both second-layer PCBs 24, which facilitates the formation of a fixed-position sealing structure of the black adhesive 7 inside the crystal oscillator body 1, providing continuous protection for the internal components.

[0020] It is worth noting that the bottom ends of both second-layer PCBs 24 are connected to the inside of the crystal oscillator body 1, which helps to prevent the auxiliary component 2 from shifting during operation.

[0021] It is worth noting that the IC fixing adhesive 4 is made of epoxy-based high-temperature die bond adhesive, which has good high-temperature resistance and bonding strength. This helps to ensure that the oscillating IC5 is firmly fixed at the bottom of the resonator body 3, and prevents the oscillating IC5 from shifting and affecting the overall oscillation function.

[0022] It is worth mentioning that the inside of the black adhesive 7 is connected to the surface of the two IC bonding wires 6, which makes it easy to wrap and seal the IC bonding wires 6 and the oscillating IC5, effectively preventing the corrosion of external dust, moisture and other impurities, and extending the service life of the device.

[0023] It is worth emphasizing that the black glue 7 is made of epoxy resin-based sealing black glue material, which has excellent sealing performance and temperature resistance, and is conducive to long-term stable protection of the oscillator IC5 and IC bonding line 6 inside the crystal oscillator body 1.

[0024] The first-layer PCB22, the second-layer PCB24, the resonator body 3, and the oscillation IC5 are existing technologies and will not be described in detail. Additionally, this utility model also includes a power supply, controller, and switch, which are not the main technical points of this patent and will not be described in detail. The "front, back, left, and right" perspectives of this device are... Figure 1 The direction shown in the diagram is the reference.

[0025] Working principle: First, the second PCB 24 is placed in the designated position inside the crystal oscillator body 1. A second solder paste layer 23 is applied to the top of the second PCB 24. Then, the first PCB 22 is placed over the second solder paste layer 23 of the second PCB 24. Using existing solder paste curing technology, the first PCB 22 and the second PCB 24 are bonded and fixed together through the second solder paste layer 23. This achieves multi-layer PCB bonding. When it is necessary to bond the resonator body 3 to the first PCB 22, a first solder paste layer 21 is applied to the first PCB 22. The white portion of the bottom of the resonator body 3 is then placed face down over the first solder paste layer 21 and the first PCB 22. Similarly, using existing solder paste curing technology, the resonator body 3 is bonded and fixed to the first PCB 22 through the first solder paste layer 21. The first PCB 22 is bonded together, and then the oscillator IC5 is installed and sealed. For installation, the oscillator IC5 is fixed to the bottom of the resonator body 3 using IC fixing adhesive 4, that is, in the space formed by the multi-layer PCB board between the first PCB 22 and the second PCB 24. Two IC bonding wires 6 are used to connect the oscillator IC5 and the second PCB 24. Finally, black glue 7 is poured into the bottom recessed area of ​​the second PCB 24 and the crystal oscillator body 1 to achieve the effect of sealing the oscillator IC5 and the IC bonding wires 6. The space for accommodating the oscillator IC5 is formed by the bonding of the resonator body 3, the first PCB 22 and the second PCB 24, which replaces the traditional ceramic base and eliminates the dependence on ceramic base suppliers. It does not need to rely on imported ceramic bases, which helps to reduce the overall raw material cost of the crystal oscillator body 1, and also helps to avoid the situation where the production is stopped due to the shortage of imported ceramic bases.

[0026] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0027] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A multilayer PCB board bonding device for resonators, comprising a crystal oscillator body (1), characterized in that: The crystal oscillator body (1) is provided with an auxiliary component (2). The top of the crystal oscillator body (1) is connected to a resonator body (3). The bottom of the resonator body (3) is connected to an IC fixing adhesive (4). The bottom of the IC fixing adhesive (4) is connected to an oscillating IC (5). The surface of the oscillating IC (5) is connected to two IC bonding wires (6). The inside of the crystal oscillator body (1) is connected to black glue (7).

2. The multilayer PCB board bonding device for resonators according to claim 1, characterized in that: The auxiliary component (2) includes two first solder paste layers (21), both of which are disposed at the bottom end of the resonator body (3). The bottom ends of the two first solder paste layers (21) are connected to a first PCB (22), the bottom ends of the two first PCBs (22) are connected to a second solder paste layer (23), and the bottom ends of the two second solder paste layers (23) are connected to a second PCB (24).

3. The multilayer PCB board bonding device for resonators according to claim 2, characterized in that: One end of each of the two IC bonding lines (6) is connected to the surface of each of the two second-layer PCBs (24).

4. The multilayer PCB board bonding device for resonators according to claim 2, characterized in that: The inner side of the black adhesive (7) is connected to the surfaces of both second-layer PCBs (24).

5. A multilayer PCB board bonding device for resonators according to claim 2, characterized in that: The bottom ends of the two second-layer PCBs (24) are connected to the inside of the crystal oscillator body (1).

6. The multilayer PCB board bonding device for resonators according to claim 1, characterized in that: The IC fixing adhesive (4) is made of epoxy-based high-temperature die bond material.

7. The multilayer PCB board bonding device for resonators according to claim 1, characterized in that: The inner side of the black adhesive (7) is connected to the surface of the two IC bonding lines (6), and the inner side of the black adhesive (7) is connected to the surface of the oscillating IC (5).

8. The multilayer PCB board bonding device for resonators according to claim 1, characterized in that: The black glue (7) is made of epoxy resin-based sealing black glue material.

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