Thermoelectrically separated PCB substrate

Abstract

The utility model discloses a kind of thermoelectric separation PCB substrate, including radiator, heat interface material layer being arranged on the surface of the radiator, PCB substrate being arranged on the heat interface material layer, and copper block embedded in the PCB substrate, the PCB substrate includes sequentially stacked metal base layer, prepreg and circuit layer from bottom to top, through slot hole is opened in the PCB substrate, the copper block is embedded in the slot hole, and the gap between the slot hole and the copper block is formed by fusing prepreg when pressing together Insulating layer.The thermoelectric separation PCB substrate of the utility model, by embedding copper block in PCB substrate, as vertical downward heat conduction channel, the heat generated by circuit board is efficiently and quickly conducted to radiator, improve the heat dissipation performance of PCB substrate.

Description

Technical Field

[0001] This utility model relates to the field of circuit board technology, specifically to a thermoelectric separation PCB substrate. Background Technology

[0002] Metal substrates are composite materials that combine metal materials and insulating layers through a special process. They possess the high thermal conductivity of metals and the electrical insulation properties of insulating materials, and are widely used in electronics, communications, power and other fields.

[0003] Currently, PCBs in the industry, such as copper / aluminum glue-coated aluminum substrates, copper substrates, and other composite substrates, are designed to meet the requirements of electrical conductivity wiring. However, the heat generated by the devices during operation is blocked by the insulating adhesive underneath, preventing it from being effectively conducted to the heat sink below. This affects the heat dissipation performance of the PCB, thus impacting its application in high-power-density electronic devices (such as communication power supplies and automotive electronics).

[0004] Therefore, the purpose of this utility model is to provide a thermoelectric separation PCB substrate to solve the problem of its poor heat dissipation performance. Summary of the Invention

[0005] The technical problem to be solved by this utility model is to provide a thermoelectric separation PCB substrate to improve the heat dissipation performance of the PCB substrate.

[0006] The technical solution of this utility model is: A thermoelectric separation PCB substrate includes a heat sink, a thermal interface material layer disposed on the surface of the heat sink, a PCB substrate disposed on the thermal interface material layer, and a copper block embedded in the PCB substrate. The PCB substrate includes a metal base layer, a prepreg, and a circuit layer stacked sequentially from bottom to top. A through slot is formed on the PCB substrate, and the copper block is embedded in the slot. The gap between the slot and the copper block is formed by melting the prepreg during pressing to form an insulating layer.

[0007] Furthermore, the thermal interface material layer is a copper foil layer or a graphite layer with a thickness of 0.1-1.0 mm.

[0008] Furthermore, the metal substrate is an aluminum substrate.

[0009] Furthermore, the thickness of the prepreg is 1-1.2 mm.

[0010] Furthermore, the distance between the copper block and the sidewall of the slot is 100±10um.

[0011] Furthermore, there are multiple slots and copper blocks, and they correspond one-to-one.

[0012] Furthermore, the distance between two adjacent copper blocks is greater than 3mm.

[0013] Compared with the prior art, the thermoelectric separation PCB substrate provided by this utility model has the following advantages: I. The thermoelectric separation PCB substrate provided by this utility model has a slot in the PCB substrate and a copper block embedded in the slot as a vertically downward heat conduction channel, which efficiently and quickly conducts the heat generated by the circuit board to the heat sink, thereby improving the heat dissipation performance of the PCB substrate; by increasing the heat conduction channel, the mutual interference between electrical conduction and thermal conduction is avoided, and the thermoelectric performance is ensured to be balanced.

[0014] II. The thermoelectric separation PCB substrate provided by this utility model has a thermal interface material layer between the heat sink and the PCB substrate for heat conduction, thereby further improving the heat conduction efficiency. Attached Figure Description

[0015] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0016] Figure 1 This is a schematic diagram of the thermoelectric separation PCB substrate of this utility model. Detailed Implementation

[0017] To enable those skilled in the art to better understand the technical solutions in the embodiments of this utility model, and to make the above-mentioned objectives, features and advantages of this utility model more apparent and understandable, the specific embodiments of this utility model will be further described below.

[0018] The endpoints and any values ​​of the ranges disclosed herein are not limited to the precise ranges or values, and these ranges or values ​​should be understood to include values ​​close to these ranges or values. For numerical ranges, the endpoint values ​​of the various ranges, the endpoint values ​​of the various ranges and individual point values, and individual point values ​​can be combined with each other to obtain one or more new numerical ranges, which should be considered as specifically disclosed herein.

[0019] Please see Figure 1 This is a schematic diagram of the structure of the thermoelectric separation PCB substrate of this utility model. The thermoelectric separation PCB substrate of this utility model includes a heat sink 1, a thermal interface material layer 2 disposed on the surface of the heat sink, a PCB substrate 3 disposed on the thermal interface material layer, and a copper block 4 embedded in the PCB substrate.

[0020] A thermal interface material layer 2 and a PCB substrate 3 are sequentially stacked on the heat sink. The thermal interface material layer 2 is used to conduct heat generated by the PCB substrate to the heat sink. A copper block 4 is embedded in the PCB substrate, acting as a high-efficiency heat conduit, establishing a low thermal resistance vertical path between the PCB substrate and the heat sink, allowing the heat generated by the PCB substrate to be quickly and efficiently conducted to the heat sink. At the same time, the embedded copper block 4 has a large cross-sectional area and low DC resistance, which can be used to transmit large currents without generating excessive heat. Furthermore, the copper block provides a large-area, high-heat-capacity soldering platform. For power devices that need to be soldered onto the copper block, the huge heat capacity makes the reflow soldering process more stable in temperature, which helps to form high-quality, low-void solder joints.

[0021] In this embodiment, the thermal interface material layer 2 is a copper foil layer or a graphite layer. Copper foil and graphite are highly thermally conductive materials to ensure rapid heat transfer. The thickness of the thermal interface material layer 2 is 0.1-1.0 mm.

[0022] The PCB substrate 3 includes a metal base layer 31, a prepreg 32 and a circuit layer 33 stacked sequentially from bottom to top. A through slot (not labeled) is opened on the PCB substrate. A copper block 4 is embedded in the slot. The gap between the slot and the copper block 4 is formed by melting the prepreg during pressing to form an insulating layer 5. The insulating layer 5 is used to fix the copper block.

[0023] In this embodiment, the metal base layer 31 is an aluminum substrate, and the prepreg 32 is made of PP material with a thickness of 1-1.2 mm. The distance between the copper block and the sidewall of the slot is 100±10 μm, that is, the width of one side of the insulating layer 5 is 100±10 μm.

[0024] The thermoelectric separation PCB substrate of this utility model has multiple slots and copper blocks 4, and the two correspond one-to-one to provide multiple vertical heat-conducting pillars to improve the heat conduction effect. In this embodiment, the distance between two adjacent copper blocks is greater than 3mm.

[0025] The thermoelectric separation PCB substrate of this invention has good thermal conductivity and can be applied to high-power LED lighting, power modules, automotive electronics, communication base stations and other fields.

[0026] The embodiments of this utility model have been described in detail above, but this utility model is not limited to the described embodiments. For those skilled in the art, various changes, modifications, substitutions, and variations made to these embodiments without departing from the principles and spirit of this utility model still fall within the protection scope of this utility model.

Claims

1. A thermoelectric separation PCB substrate, characterized in that, The device includes a heat sink, a thermal interface material layer disposed on the surface of the heat sink, a PCB substrate disposed on the thermal interface material layer, and a copper block embedded in the PCB substrate. The PCB substrate includes a metal base layer, a prepreg, and a circuit layer stacked sequentially from bottom to top. A through slot is formed on the PCB substrate, and the copper block is embedded in the slot. The gap between the slot and the copper block is formed by melting the prepreg during pressing to form an insulating layer.

2. The thermoelectric separation PCB substrate according to claim 1, characterized in that, The thermal interface material layer is a copper foil layer or a graphite layer with a thickness of 0.1-1.0 mm.

3. The thermoelectric separation PCB substrate according to claim 1, characterized in that, The metal base layer is an aluminum substrate.

4. The thermoelectric separation PCB substrate according to claim 1, characterized in that, The thickness of the prepreg is 1-1.2 mm.

5. The thermoelectric separation PCB substrate according to claim 1, characterized in that, The distance between the copper block and the sidewall of the slot is 100±10um.

6. The thermoelectrically separated PCB substrate according to any one of claims 1-5, characterized in that, There are multiple slots and copper blocks, and they correspond one-to-one.

7. The thermoelectric separation PCB substrate according to claim 6, characterized in that, The distance between two adjacent copper blocks is greater than 3mm.

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