A control circuit board resistant to deformation
Patent Information
- Application Number
- CN202522516113.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-11-27
- Publication Date
- 2026-10-30
- Estimated Expiration
- 2035-11-27
AI Technical Summary
[0004]本实用新型的目的在于提供一种抗变形的控制电路板,以解决上述背景技术中提出的现有的电路板不能很好的兼顾抗变形和散热的问题
[0016]通过设计的支撑架,能够对主板体的背面进行支撑,从而提升主板体的抗变形能力,而支撑架上的散热抵持块和主板体的背面相贴合,铝合金的散热抵持块具备良好的导热性能,因此接触贴合位置的热量会传递到散热抵持块上,并向外部进行散热,在上述结构的配合下,不但能够对主板体进行支撑,而且具备良好的散热功能,很好的兼顾了电路板的抗变形和散热这两个问题。
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Figure CN224923933U_ABST
Abstract
Description
Technical Field
[0001] This utility model belongs to the field of circuit board technology, specifically relating to a deformation-resistant control circuit board. Background Technology
[0002] A circuit board (PCB) is a support and connection platform for electronic components, consisting of an insulating substrate and conductive lines. It holds components such as chips, resistors, and capacitors, and achieves electrical connections through copper foil. PCBs enable miniaturization, weight reduction, and high reliability of circuits, and are widely used in mobile phones, computers, home appliances, automotive electronics, and other fields. When installing PCBs, a common method is to fix the four corners, leaving the center suspended. This ensures heat dissipation and prevents scratches between the back of the PCB and the mounting surface.
[0003] However, because the middle is suspended, the overall resistance to deformation of the circuit board is poor. To solve this problem, the current common practice is to directly thicken the board or install a support frame on the back of the circuit board. However, this design will have an adverse effect on the heat dissipation of the back of the circuit board. The heat at the contact point between the support frame and the board cannot be dissipated in time, and it cannot effectively balance the two problems of resistance to deformation and heat dissipation. Therefore, a new type of circuit board needs to be designed to solve this problem. Utility Model Content
[0004] The purpose of this invention is to provide a deformation-resistant control circuit board to solve the problem mentioned in the background art that existing circuit boards cannot effectively balance deformation resistance and heat dissipation.
[0005] To achieve the above objectives, this utility model provides the following technical solution: a deformation-resistant control circuit board, comprising...
[0006] Motherboard body;
[0007] The support components include an X-shaped support bracket mounted on the back of the motherboard, through slots evenly spaced on the surface of the support bracket, and heat dissipation support blocks fixedly installed inside the through slots;
[0008] Both ends of the heat dissipation support block extend out of the through slot, and one end of the heat dissipation support block is attached to the back of the motherboard.
[0009] Preferably, the support component further includes a silicone grease layer, which is filled between the heat dissipation support block and the back of the motherboard.
[0010] Preferably, each of the four corners of the support frame is fixed with a plug-in post, and the four corners of the main body are provided with circular grooves through which the plug-in posts are installed.
[0011] Preferably, the surface of the plug is provided with a snap-fit groove, which snaps into the circular groove.
[0012] Preferably, the support component further includes a chamfer, which is formed at the outer edge of the top of the plug.
[0013] Preferably, the bottom end of the plug extends to the bottom of the support frame, and auxiliary support bars are fixed between the support frames.
[0014] Preferably, the thickness of the auxiliary support strip is half the thickness of the support frame, and the auxiliary support strip is located away from the back of the main board.
[0015] Compared with the prior art, the beneficial effects of this utility model are:
[0016] The designed support frame can support the back of the motherboard, thereby improving the motherboard's resistance to deformation. The heat dissipation support block on the support frame is in contact with the back of the motherboard. The aluminum alloy heat dissipation support block has good thermal conductivity, so the heat at the contact point will be transferred to the heat dissipation support block and dissipated to the outside. With the cooperation of the above structure, not only can the motherboard be supported, but it also has a good heat dissipation function, which well balances the two problems of circuit board resistance to deformation and heat dissipation. Attached Figure Description
[0017] Figure 1 This is a three-dimensional schematic diagram of the back of the present invention;
[0018] Figure 2 This is a three-dimensional view of the front of the present utility model;
[0019] Figure 3 This is a cross-sectional view of the splice joint of this utility model;
[0020] Figure 4 This utility model Figure 1 Enlarged view of area A in the middle;
[0021] In the diagram: 100, mainboard body; 200, support component; 201, support frame; 202, plug-in pin; 203, through slot; 204, heat dissipation support block; 205, snap-fit slot; 206, chamfer; 207, auxiliary support bar; 208, thermal paste layer; 300, circular groove. Detailed Implementation
[0022] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.
[0023] Example
[0024] Please see Figures 1 to 4 This embodiment of the present invention provides a technical solution: a deformation-resistant control circuit board, comprising...
[0025] Motherboard body 100;
[0026] The support assembly 200 includes an X-shaped support frame 201 mounted on the back of the motherboard body 100, through slots 203 evenly spaced on the surface of the support frame 201, and a heat dissipation support block 204 fixedly mounted inside the through slots 203. Both ends of the heat dissipation support block 204 extend out of the through slots 203, and one end of the heat dissipation support block 204 is in contact with the back of the motherboard body 100. Both the support frame 201 and the heat dissipation support block 204 are made of aluminum alloy. Aluminum alloy has good rigidity and thermal conductivity, and can take into account both deformation resistance and heat dissipation function. The heat dissipation support block 204 is anodized. After the treatment, a dense aluminum oxide film can be formed on the surface of the heat dissipation support block 204, which has insulating properties and prevents short circuits from occurring when the heat dissipation support block 204 comes into contact with conductive parts (solder joints, traces, copper foil) on the back of the circuit board.
[0027] In this embodiment, preferably, the support component 200 further includes a silicone grease layer 208, which fills the space between the heat dissipation support block 204 and the back of the motherboard body 100 to improve the heat conduction effect.
[0028] In this embodiment, preferably, each of the four corners of the support frame 201 is fixed with a plug pin 202, and the four corners of the main body 100 are provided with a circular groove 300 through which the plug pin 202 is installed, thereby completing the positioning and installation between the main body 100 and the support frame 201.
[0029] In this embodiment, preferably, the surface of the plug 202 is provided with a snap-fit groove 205, which snaps into the circular groove 300 to ensure the stability of the plug connection between the plug 202 and the circular groove 300.
[0030] In this embodiment, preferably, the support component 200 further includes a chamfer 206, which is formed on the outer edge of the top of the plug 202. When positioning and installing the support frame 201 and the main board body 100, the chamfer 206 facilitates the insertion of the circular groove 300 and the plug 202.
[0031] In this embodiment, preferably, the bottom end of the plug 202 extends to the bottom of the support frame 201, and an auxiliary support bar 207 is fixed between the support frames 201, which further improves the support effect of the support frame 201 on the main body 100.
[0032] In this embodiment, preferably, the thickness of the auxiliary support strip 207 is half the thickness of the support frame 201, and the auxiliary support strip 207 is far away from the back of the motherboard body 100 to avoid the auxiliary support strip 207 from contacting the motherboard body 100 and thus affecting the heat dissipation effect.
[0033] Although embodiments of the present invention have been shown and described (see the detailed description above), it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.
Claims
1. A deformation-resistant control circuit board, characterized in that: include Mainboard body (100); The support assembly (200) includes an X-shaped support frame (201) mounted on the back of the motherboard body (100), through slots (203) evenly spaced on the surface of the support frame (201), and a heat dissipation support block (204) fixedly mounted inside the through slots (203). Both ends of the heat dissipation support block (204) extend out of the through groove (203), and one end of the heat dissipation support block (204) is attached to the back of the main board body (100).
2. The anti-deformation control circuit board according to claim 1, characterized in that: The support assembly (200) also includes a thermal paste layer (208) that fills the space between the heat dissipation support block (204) and the back of the motherboard body (100).
3. The anti-deformation control circuit board according to claim 2, characterized in that: The support frame (201) is fixed with plug pins (202) at each of its four corners, and the main body (100) has circular grooves (300) through its four corners, with the plug pins (202) installed inside the circular grooves (300).
4. The anti-deformation control circuit board according to claim 3, characterized in that: The surface of the plug (202) is provided with a snap-fit groove (205), which snaps into the circular groove (300).
5. The anti-deformation control circuit board according to claim 4, characterized in that: The support assembly (200) also includes a chamfer (206) formed at the top outer edge of the plug (202).
6. The deformation-resistant control circuit board according to claim 5, characterized in that: The bottom end of the plug (202) extends to the bottom of the support frame (201), and auxiliary support bars (207) are fixed between the support frames (201).
7. The deformation-resistant control circuit board according to claim 6, characterized in that: The thickness of the auxiliary support bar (207) is half the thickness of the support frame (201), and the auxiliary support bar (207) is away from the back of the main body (100).