Circuit board, electronic paper module, and electronic device

Abstract

Circuit board, electronic paper module and electronic device, the circuit board comprises a gold finger part used for connecting external electronic components; the gold finger part comprises a gold finger A part and a gold finger B part; the gold finger in the gold finger A part is in electrical signal communication with the gold finger in the gold finger B part; the gold finger B part is used for connecting a test tool in a production process; and the gold finger B part is used for cutting and separating. An electronic paper module production method comprises an electronic paper display screen and at least one connecting component; the electronic paper display screen comprises an FPL layer and a TFT layer; the connecting component comprises a gold finger part, the gold finger part comprises a gold finger A part and a gold finger B part; the connecting component comprises a TFT layer connecting part; the method comprises the following steps: step A: connecting the TFT layer connecting part of the connecting component with the TFT layer of the electronic paper display screen so as to realize electrical communication between the connecting parts; and step C: cutting and separating the gold finger B part.

Description

Technical Field

[0001] This application belongs to the field of electronic paper manufacturing, and specifically relates to an electronic paper module and method. Background Technology

[0002] Electronic paper (ePaper): A reflective display technology that simulates the visual characteristics of real paper. It relies on ambient light rather than backlight to display content, and features ultra-low power consumption and high readability in sunlight. It consumes no power when maintaining a static image, making it suitable for devices that require long-term display (such as e-books and electronic tags).

[0003] Electronic paper display components generally consist of three layers: a TFT glass substrate, an FPL film, and a PS protective layer.

[0004] TFT glass substrate: driving substrate, containing circuit elements.

[0005] FPL film: Middle display layer, encapsulating electronic ink.

[0006] PS protective layer: A sealed protective layer that covers the edges of the FPL.

[0007] TFT: Thin Film Transistor. Its technological essence is a semiconductor driving technology that precisely controls the on / off state of each pixel through a thin-film transistor array. Its role in electronic paper is as the underlying substrate, carrying the driving circuitry.

[0008] FPL: Front Plane Layer. Functional positioning: The core display medium layer of the electronic paper display module, which directly contains electronic ink microcapsules (electrophoretic particles) and determines the final imaging effect.

[0009] The internal structure of FPL is layered, generally including: a surface protective layer, namely the PS protective layer, located on the outermost layer of FPL, made of plastic or flexible protective film material, used for physical protection (scratch resistance, impact resistance) and environmental sealing.

[0010] Conductive substrate: Typically a polyester film (such as PET) or a glass substrate, with an ITO transparent conductive layer covering the surface, forming the electrode circuit that drives the electronic ink. The flexibility of the substrate determines the bendability of the electronic paper.

[0011] Electronic ink layer, also known as E-Ink layer: microcapsule electrophoretic units embedded inside the substrate, containing color particles with positive / negative charges, which change position in response to changes in electric field to form black and white or color pixels.

[0012] OCA (Optically Clear Adhesive) layer is a solid optical adhesive with high light transmittance and low refractive index. It is mainly used in electronic paper modules to bond different optical layers (such as TFT backplanes, electronic ink films, etc.) while maximizing light transmittance and reducing reflection and scattering at the display interface.

[0013] EPD (Electrophoretic Display) is one of the core display technologies of electronic paper (E-Paper).

[0014] The existing EPD module requires the FPC to be connected to the mainboard via bonding. However, during the EPD module operation, the gold fingers of the FPC are easily contaminated. This contamination can lead to reliability risks and product quality issues during the bonding process. Summary of the Invention

[0015] The technical problem this application aims to solve is to avoid the issue of easy contamination of the gold finger portion in the prior art, which leads to a risk to connection reliability. In this application, the gold finger portion includes gold finger A and gold finger B. Gold finger B is used in the production and testing process, while gold finger A is not used during production and testing, thus reducing the risk of contamination of gold finger A and ensuring good conductivity of gold finger A.

[0016] The technical solution of this application to solve the above-mentioned technical problems is a circuit board, including a gold finger section, which is used to connect external electronic components; the gold finger section includes a gold finger A section and a gold finger B section; the gold fingers in the gold finger A section and the gold fingers in the gold finger B section are electrically connected; the gold finger B section is used for connection to test fixtures during the production process; the gold finger B section is used for cutting and separation.

[0017] It also includes a protective film that covers part A of the gold finger to prevent part A of the gold finger from being contaminated during the production process.

[0018] The protective film is a high-temperature resistant protective film.

[0019] The circuit board is an FPC flexible circuit board.

[0020] An electronic paper module includes an electronic paper display screen, at least one connecting component, and at least one electronic paper driver chip; the electronic paper display screen includes an FPL layer and a TFT layer; the connecting component is electrically connected to the circuit on the TFT layer; the connecting component is electrically connected to the electronic paper driver chip; the connecting component is the aforementioned FPC flexible circuit board.

[0021] At least one of the electronic paper driver chips is disposed on the FPC flexible circuit board.

[0022] An electronic device comprising the aforementioned electronic paper module or circuit board.

[0023] A method for manufacturing an electronic paper module includes an electronic paper display screen and at least one connecting component; gold fingers in gold finger A and gold fingers in gold finger B are electrically connected; the electronic paper display screen includes an FPL layer and a TFT layer; the connecting component includes a gold finger portion, the gold finger portion including gold finger A and gold finger B; the connecting component includes a TFT layer connecting portion; the method includes: Step A: connecting the TFT layer connecting portion of the connecting component to the TFT layer of the electronic paper display screen, so that the connecting portion is electrically connected; Step C: cutting and separating the gold finger B portion.

[0024] Before step C, step B is also included: the electronic paper module is connected to the test fixture via the gold finger B part, and the electronic paper module is driven to display the test pattern.

[0025] Before step A, step D is also included: a protective film is attached above part A of the gold finger, and the protective film covers part A of the gold finger.

[0026] One of the beneficial effects of the technical solution in this application is that the gold finger part includes gold finger A part and gold finger B part. Part B part is used in the production and testing process, while gold finger A part is not used in the production and testing process, thereby reducing the risk of gold finger A part being contaminated and ensuring that the conductivity of gold finger A part is good.

[0027] One of the beneficial effects of the technical solution in this application is that the protective film covers the gold finger A portion, preventing contamination of the gold finger A portion during the production process, further reducing the risk of contamination of the gold finger A portion, and ensuring good conductivity of the gold finger A portion. The protective film can be removed before use.

[0028] One of the beneficial effects of the technical solution in this application is that the protective film is a high-temperature protective film, which can play a protective role at high temperatures. In high-temperature process operations, it reduces the risk of contamination of the gold finger A part and ensures good conductivity of the gold finger A part.

[0029] One of the beneficial effects of the technical solution in this application is that the circuit board is an FPC flexible circuit board, which facilitates connection with the outside.

[0030] One of the beneficial effects of the technical solution in this application is that by setting the above-mentioned circuit board in the electronic paper module, the connection reliability of the gold fingers can be ensured when the electronic paper module is used.

[0031] One of the beneficial effects of the technical solution in this application is that the electronic paper driver chip is set on the FPC flexible circuit board, which facilitates bonding and saves bonding process.

[0032] One of the beneficial effects of the technical solution in this application is that in the electronic paper module production method, the used gold finger B part is cut off after use, and only the gold finger A part is retained, which can maintain the good electrical connection characteristics of the gold finger A part.

[0033] One of the beneficial effects of the technical solution in this application is that before cutting and removing the gold finger B part, the electronic paper module is connected to the test fixture via the gold finger B part to conduct tests during the production process, ensuring that the gold finger A part is not used and its electrical connection characteristics remain good. Attached Figure Description

[0034] Figure 1 This is a schematic diagram of the circuit board; Figure 2 This is a schematic diagram of the circuit board; Figure 3 This is a schematic diagram of the circuit board; Figure 4 This is a schematic diagram of an electronic paper module and circuit board; Figure 5 This is a schematic diagram of a circuit board in the prior art; Figure 6 This is a schematic diagram of an electronic paper module in the existing technology. Detailed Implementation

[0035] The embodiments of this application will be further described in detail below with reference to the accompanying drawings.

[0036] It should be noted that the following description of preferred embodiments of this application does not constitute any limitation on this application. The description of preferred embodiments is merely an illustration of the general principles of this application. The embodiments described in this application are only some embodiments of this application, and not all embodiments. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0037] In the description of this application, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," and "counterclockwise," etc., indicating orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the equipment or component referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on this application. Furthermore, the terms "first," "second," and technical features numbered with Arabic numerals 1, 2, 3, etc., and designations such as "A" and "B," are used for descriptive purposes only, for ease of explanation, and do not represent a temporal or spatial order; they should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, features defined with "first," "second," and numbered with Arabic numerals 1, 2, 3, etc., may explicitly or implicitly include one or more of that feature. In the description of this application, "several" means two or more, unless otherwise expressly and specifically defined.

[0038] like Figure 5 and Figure 6 The diagram shows a schematic of a circuit board and electronic paper module in the prior art. There is only a single gold finger area, and the gold finger area used for bonding the electronic paper module to the customer is exposed. This leads to contamination of the gold finger during EPD module operation, posing a reliability risk during the overall bonding process and causing customer complaints.

[0039] In this application, the gold finger portion includes gold finger A portion and gold finger B portion. Gold finger B portion is used in the production and testing process. Gold finger A portion is not used in the production and testing process to reduce the risk of gold finger A portion being contaminated and to ensure that the conductivity of gold finger A portion is good.

[0040] like Figures 1 to 3 A circuit board includes a gold finger section for connecting external electronic components. The gold finger section includes a gold finger A section and a gold finger B section. The gold fingers in gold finger A section and the gold fingers in gold finger B section are electrically connected. Gold finger B section is used for connecting to testing fixtures during the production process and for cutting and separating the gold fingers. A cutting section is provided before gold finger A section and gold finger B section. The cutting section maintains the electrical signal connection between the gold fingers in gold finger A section and gold finger B section while facilitating the separation of gold finger A section and gold finger B section.

[0041] The gold finger section includes gold finger A and gold finger B. Gold finger B is used in the production and testing process. Gold finger A is not used in the production and testing process to reduce the risk of contamination of gold finger A and ensure good conductivity of gold finger A.

[0042] like Figure 3 A circuit board further includes a protective film covering the gold finger A portion to prevent contamination of the gold finger A portion during production. The protective film is a high-temperature resistant protective film.

[0043] A protective film covers part A of the gold finger to prevent contamination during the production process, further reducing the risk of contamination and ensuring good conductivity. The protective film can be removed before use.

[0044] The protective film is a high-temperature protective film that can protect against high temperatures. During high-temperature processes, it reduces the risk of contamination of the gold finger A part and ensures good conductivity of the gold finger A part.

[0045] like Figures 1 to 3 The circuit board is an FPC flexible circuit board. The FPC flexible circuit board facilitates external connections.

[0046] like Figure 4 An electronic paper module includes an electronic paper display screen, at least one connecting component, and at least one electronic paper driver chip. The electronic paper display screen includes an FPL layer and a TFT layer. The connecting component is electrically connected to a circuit on the TFT layer and electrically connected to the electronic paper driver chip. The connecting component is the aforementioned FPC flexible circuit board. At least one electronic paper driver chip is disposed on the FPC flexible circuit board. Multiple electronic paper driver chips may also be disposed.

[0047] The circuit board described above is incorporated into the electronic paper module to ensure the reliability of the gold finger connection during application. The electronic paper driver chip is mounted on the FPC flexible circuit board, facilitating bonding and reducing bonding process complexity.

[0048] An electronic paper module manufacturing method includes an electronic paper display screen and at least one connecting component; gold fingers in gold finger A section and gold fingers in gold finger B section are electrically connected; the electronic paper display screen includes an FPL layer and a TFT layer; the connecting component includes a gold finger section, the gold finger section includes gold finger A section and gold finger B section; the connecting component includes a TFT layer connecting section.

[0049] A method for producing an electronic paper module includes the following steps: before step A, step D is included: a protective film is attached above the gold finger A portion, the protective film covering the gold finger A portion.

[0050] Step A: Connect the TFT layer connection part of the connecting component to the TFT layer of the electronic paper display screen to make the connection part electrically connected.

[0051] Before step C, step B is also included: Step B: The electronic paper module is connected to the test fixture via the gold finger B part, and the electronic paper module is driven to display the test pattern.

[0052] Step C: Cut and separate the gold finger part B.

[0053] Before step A, step D is also included: a protective film is attached above part A of the gold finger, and the protective film covers part A of the gold finger.

[0054] In the production method of electronic paper modules, the used gold finger B part is cut off after use, leaving only the gold finger A part, which can maintain the good electrical connection characteristics of the gold finger A part.

[0055] Before cutting and removing the gold finger B part, the electronic paper module is connected to the test fixture via the gold finger B part to conduct a test during the production process to ensure that the gold finger A part is not used and its electrical connection characteristics remain good.

[0056] This application addresses the contamination problem caused by exposed gold finger areas.

[0057] In this FPC design, the FPC gold fingers are elongated, and the area for the gold fingers used by the client is attached with high-temperature adhesive (blue filled area), leaving only the area for the gold fingers used in the EPD module manufacturing process exposed (within the red dotted box). This avoids contamination of the client-side gold finger area during the EPD module manufacturing process. After the EPD process is completed, the gold finger area used in the EPD module manufacturing process is punched or cut off, and then the high-temperature adhesive tape is removed, eliminating customer complaints caused by gold finger contamination.

[0058] After optimizing the FPC design, the FPC gold fingers were lengthened and divided into two parts: Gold Finger A and Gold Finger B. The area used by the client, Gold Finger A, was attached with high-temperature tape to avoid FPC contamination during operation. The part used by the EPD module factory, Gold Finger B, was removed with a punching or cutting knife before shipment, and then the high-temperature tape was removed.

[0059] This solution can improve the situation where EPD modules cause contamination of the FPC gold fingers during operation, leading to customer complaints during the assembly of the complete machine.

[0060] As shown in the accompanying drawings, the above are merely embodiments of this application and do not limit the patent scope of this application. Any equivalent structural or procedural transformations made using the content of the application specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this application.

Claims

1. A circuit board, characterized in that, Includes a gold finger portion, which is used to connect to external electronic components; The gold finger portion includes gold finger A and gold finger B; The gold fingers in part A and part B are electrically connected; The gold finger part B is used for connecting test fixtures during the production process; The gold finger part B is used for cutting and separation.

2. The circuit board according to claim 1, characterized in that, It also includes a protective film that covers part A of the gold finger to prevent part A of the gold finger from being contaminated during the production process.

3. The circuit board according to claim 2, characterized in that, The protective film is a high-temperature resistant protective film.

4. The circuit board according to any one of claims 1 to 3, characterized in that, The circuit board is an FPC flexible circuit board.

5. An electronic paper module, characterized in that, Includes an electronic paper display, at least one connecting component, and at least one electronic paper driver chip; The electronic paper display screen includes an FPL layer and a TFT layer; The connecting component is connected to the circuit electrical signal on the TFT layer; The connecting component is electrically connected to the electronic paper driver chip; The connecting component is the FPC flexible circuit board as described in claim 4.

6. The electronic paper module according to claim 5, characterized in that, At least one of the electronic paper driver chips is disposed on the FPC flexible circuit board.

7. An electronic device, characterized in that, It includes the circuit board according to any one of claims 1 to 4, or the electronic paper module according to any one of claims 5 to 6.

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