A board warping flattening device for printed circuit board processing

Abstract

The utility model discloses a kind of board warping flattening device for printed circuit board processing, it is related to circuit board processing technical field, the utility model includes device main body, first belt conveyor and second belt conveyor are separately installed in device main body inside, photoelectric switch is installed in device main body both sides, collecting hopper is arranged in device main body inside both sides, and buffering pad is connected in collecting hopper inside.The utility model is provided with first belt conveyor and second belt conveyor, using the structural layout that first belt conveyor length is less than second belt conveyor and is located above it, and the operation direction of two conveyors is opposite, after circuit board substrate is sent to flattening mechanism by first belt conveyor and is flattened, it can naturally drop to the second belt conveyor below;This design does not need staff to check substrate back and forth between front end and rear end of device, whether substrate needs secondary flattening is convenient for staff to judge in time, and the overall efficiency of flattening operation is improved.

Description

Technical Field

[0001] This utility model relates to the field of circuit board processing technology, specifically to a board warping and leveling device for printed circuit board processing. Background Technology

[0002] Circuit boards are core components of electronic devices. They are typically based on an insulating substrate, with conductive lines formed on the surface through etching processes. They are used to enable signal transmission and power supply between electronic components and are widely used in consumer electronics, industrial control, communication equipment, and other fields. Their processing quality and structural stability directly affect the overall operating performance of electronic devices.

[0003] During the production process, circuit board substrates are prone to warping due to the release of internal stress caused by cutting, pressing, temperature changes, or storage environment. This warping can lead to misalignment of subsequent components during soldering, increased assembly difficulty, and even product malfunctions. Therefore, a warping leveling process is necessary to correct the warping. Currently, the mainstream leveling method in the industry is to use leveling rollers in a leveling device to apply uniform pressure to the warped substrate, gradually eliminating the deformation and bringing the substrate to the flatness standard required for subsequent processing.

[0004] Existing circuit board warping leveling devices of the same type mostly rely on a belt conveyor in one direction to transport the board, and several leveling rollers are used to complete a single leveling. However, the board may still have residual warping problems after the single leveling, which requires secondary processing. However, the leveled board is sent to the back of the device by the conveyor, and the staff needs to go back and forth from the input end of the conveyor to the output end to check it. The operation process is time-consuming and cumbersome. If additional staff are arranged to be on duty at the output end in order to improve efficiency, it will increase labor costs. Utility Model Content

[0005] Therefore, the purpose of this utility model is to provide a board warping and leveling device for printed circuit board processing, so as to solve the technical problems mentioned in the background art.

[0006] To achieve the above objectives, the present invention provides the following technical solution: a board warping and leveling device for printed circuit board processing, comprising a device body, wherein a first belt conveyor and a second belt conveyor are respectively installed inside the device body, photoelectric switches are installed on both sides of the device body, and collection hoppers are provided on both sides inside the device body, with buffer pads connected inside the collection hoppers.

[0007] By adopting the above technical solution, the main body of the device is used as the installation carrier, and the first belt conveyor, the second belt conveyor, the photoelectric switch, the collection bucket, and the buffer pad are integrated into a layout to form a complete operation link of leveling, conveying, returning, and receiving. This provides a structural basis for solving the problem of the need for manual back-and-forth handling of the substrate in traditional devices and the risk of bumps and knocks, and initially realizes the convenient handling of the substrate after leveling.

[0008] Further, the length of the first belt conveyor is less than the length of the second belt conveyor, and the first belt conveyor is located above the second belt conveyor.

[0009] By adopting the above technical solution, with the length difference and the vertical positional relationship, the leveled substrate conveyed by the first belt conveyor can naturally fall to the second belt conveyor below at its end, no additional transfer mechanism is required, and meanwhile a space is reserved for the second belt conveyor to convey the substrate back in the reverse direction, ensuring that the substrate can be smoothly transferred from the leveling end to the operation end of the staff.

[0010] Further, the photoelectric switch is located laterally above the second belt conveyor, and the collection hopper is located below the second belt conveyor.

[0011] By adopting the above technical solution, the photoelectric switch on the lateral upper side can accurately detect whether the substrate has been completely transferred from the first belt conveyor to the second belt conveyor, avoiding jamming caused by the premature start of the second belt conveyor due to incomplete transfer of the substrate; the collection hopper below can timely receive the substrate delivered from the end of the second belt conveyor, reducing the situation that the substrate directly falls to the ground.

[0012] Further, the collection hopper and the cushion pad are arranged in an inclined manner, and the cushion pad is made of a rubber material.

[0013] By adopting the above technical solution, gravity can be utilized to guide the substrate to smoothly fall into the interior of the collection hopper, reducing the accumulation of substrates at the inlet of the collection hopper; the rubber cushion pad can absorb the impact force when the substrate falls through its own elasticity, reducing direct collision between the substrate and the inner wall of the collection hopper, and lowering the probability of substrate surface damage.

[0014] Further, a leveling mechanism is mounted on the upper part inside the apparatus main body, and the leveling mechanism consists of three leveling rollers which are distributed in a triangular shape, the uppermost leveling roller is supported by a manual vertical sliding table, the manual vertical sliding table is composed of a handwheel, a lead screw, a slide rail, and a bearing seat provided with a lead screw nut and a sliding block, and support legs are connected to both sides of the bottom of the apparatus main body.

[0015] By adopting the above technical solution, the three leveling rollers distributed in a triangular shape can apply uniform pressure to the substrate from the vertical direction, effectively releasing the internal stress of the substrate to correct board warpage; the manual vertical sliding table can drive the lead screw to rotate by turning the handwheel, so that the sliding block moves up and down along the slide rail, thereby adjusting the height of the uppermost leveling roller to adapt to circuit board substrates of different thicknesses.

[0016] Further, a control cabinet is mounted on one side of the apparatus main body, and the first belt conveyor, the second belt conveyor and the photoelectric switch are all electrically connected with the control cabinet.

[0017] By adopting the above technical solution, the control cabinet, as the core control unit, can centrally realize the feeding start and stop of the first belt conveyor, the return control of the second belt conveyor, and the signal reception and response of the photoelectric switch. There is no need for manual operation of each component, which improves the convenience of device operation and the coordination of operation of each link, and reduces human operation error.

[0018] Furthermore, a support block is fixed to the outer surface of the support foot, and mounting sleeves are fixed to both sides of the back of the collection hopper, with bolts passing through both sides of the mounting sleeves.

[0019] By adopting the above technical solution, the support block provides a stable installation support point for the mounting sleeve, and the mounting sleeve forms a connection base with the support block through the through bolts, ensuring that the collection bucket can be firmly installed under the second belt conveyor and preventing the collection bucket from shifting position due to force during the process of receiving the substrate.

[0020] Furthermore, the mounting sleeve is detachably connected to the support block by bolts, and the buffer pad is fixedly connected to the collection hopper by adhesive.

[0021] By adopting the above technical solution, the detachable connection of the bolts makes it easy to quickly unscrew the bolts to separate the mounting sleeve and support block when the buffer pad is damaged or the collection hopper needs maintenance, so as to realize the overall disassembly and replacement of the collection hopper and the buffer pad; the adhesively fixed buffer pad can fit tightly against the inner wall of the collection hopper, preventing the buffer pad from shifting under the impact of the base plate and ensuring the stability of the buffering effect.

[0022] Furthermore, the photoelectric switch is an Omron through-beam photoelectric sensor from the EE-SPW series.

[0023] By adopting the above technical solutions, Omron's EE-SPW series through-beam photoelectric sensors have high detection sensitivity and anti-interference capabilities. They can accurately identify whether the substrate is blocking the light beam, reduce false detections caused by ambient light or dust, and ensure that the second belt conveyor is only triggered after the substrate has been completely transferred to it, thereby improving the stability of the substrate transfer process.

[0024] In summary, the present invention has the following main advantages: 1. This utility model, through the arrangement of a first belt conveyor and a second belt conveyor, utilizes the structural layout where the first belt conveyor is shorter than the second belt conveyor and is located above it, as well as the opposite operating directions of the two conveyors. After the circuit board substrate is conveyed to the leveling mechanism by the first belt conveyor and leveled, it can naturally fall to the second belt conveyor below, and the second belt conveyor will send the substrate back to the worker's standing position. This design eliminates the need for workers to travel back and forth between the front and rear of the device to inspect the substrate, making it easier for workers to determine in a timely manner whether the substrate needs secondary leveling, thus improving the overall efficiency of the leveling operation. 2. This utility model, through the setting of a collection hopper and a buffer pad, places the collection hopper at an angle below the second belt conveyor, which can receive the circuit board substrate sent out by the second belt conveyor, reducing the situation where the substrate falls directly to the ground; at the same time, the buffer pad is made of rubber material, which can play a buffering role when the substrate falls into the collection hopper, reducing the collision between the substrate and the collection hopper; reducing the probability of damage to the substrate caused by falling from the end of the conveyor. 3. This utility model utilizes a photoelectric switch installed above the second belt conveyor. When the circuit board substrate is completely transferred from the first belt conveyor to the second belt conveyor, the substrate changes from an inclined state to a horizontal state, thus blocking the beam emitted by the photoelectric switch. At this time, the photoelectric switch sends an electrical signal to the control cabinet, which, in conjunction with the time relay inside the control cabinet, controls the second belt conveyor to start for five to ten seconds. This triggering logic ensures that the second belt conveyor only operates after the substrate has been completely transferred, reducing the possibility of jamming or flipping during substrate transfer due to the reverse operation of the two conveyors. If there is no need to optimize the transfer effect, the photoelectric switch can be omitted without affecting the realization of the core leveling and return functions of the device. This optional optimization improves the performance. Attached Figure Description

[0025] Figure 1 This is a schematic diagram of the structure of this utility model; Figure 2 This is a side view of the present invention. Figure 3 This is a side sectional view of the present invention. Figure 4 This is a schematic diagram of the back structure of the collection hopper of this utility model; Figure 5 This is a schematic diagram of the explosion structure of the collection bucket of this utility model.

[0026] In the diagram: 1. Main body of the device; 2. Control cabinet; 3. Leveling mechanism; 4. First belt conveyor; 5. Second belt conveyor; 6. Photoelectric switch; 7. Collection hopper; 8. Buffer pad; 9. Support foot; 10. Support block; 11. Mounting sleeve; 12. Bolt. Detailed Implementation

[0027] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention.

[0028] The embodiments of this utility model will be described below based on its overall structure.

[0029] Example 1: A board warping and leveling device for printed circuit board processing, such as Figures 1-5 As shown, the device includes a main body 1, inside which a first belt conveyor 4 and a second belt conveyor 5 are respectively installed. The length of the first belt conveyor 4 is shorter than the length of the second belt conveyor 5. The first belt conveyor 4 is located above the second belt conveyor 5. The leveled substrate continues to be conveyed backward with the first belt conveyor 4. Since the length of the first belt conveyor 4 is shorter than the second belt conveyor 5 and it is located directly above the second belt conveyor 5, the substrate can be conveyed towards the input end of the first belt conveyor 4 where the worker stands, making it convenient for the worker to directly check the flatness of the substrate and determine whether secondary leveling is needed without having to travel back and forth between the front and rear ends of the device. Photoelectric switches 6 are installed on both sides of the main body 1. The photoelectric switches 6 are located above and to the side of the second belt conveyor 5. If the photoelectric switches 6 are configured, when the circuit board substrate is completely transferred from the first belt conveyor 4 to the second belt conveyor 5, the photoelectric switches 6 will activate. The circuit board substrate changes from an inclined state to a horizontal state, thereby blocking the beam emitted by the photoelectric switch 6. The photoelectric switch 6 transmits an electrical signal to the control cabinet 2. The control cabinet 2, in conjunction with the time relay inside the control cabinet 2, controls the second belt conveyor 5 to start and run continuously for five to ten seconds, reducing the occurrence of jamming or flipping of the substrate during the transfer process caused by the reverse operation of the two conveyors. If the photoelectric switch 6 is not configured, the second belt conveyor 5 can be started through the preset program of the control cabinet 2 or manually controlled. There are collection hoppers 7 on both sides inside the main body 1 of the device. The collection hoppers 7 are located below the second belt conveyor 5. The collection hoppers 7 are connected to the buffer pads 8 inside. The collection hoppers 7 and the buffer pads 8 are inclined. The buffer pads 8 are made of rubber material. When the substrate is transported to the end by the second belt conveyor 5, it will fall into the collection hoppers 7. The rubber material buffer pads 8 can absorb the impact force when the substrate comes into contact with the collection hoppers 7, reducing the damage to the substrate surface.

[0030] See Figures 1-3, in the above embodiment, a leveling mechanism 3 is installed at the upper part inside the device main body 1, the leveling mechanism 3 consists of three leveling rollers, the three leveling rollers are distributed in a triangular "pin" shape, the uppermost leveling roller is supported by a manual vertical slide table, and the manual vertical slide table is composed of a handwheel, a lead screw, a slide rail, and a bearing seat with a lead screw nut and a slider. According to the thickness of the circuit board substrate to be leveled, the staff rotates the handwheel of the manual vertical slide table connected to the uppermost leveling roller in the leveling mechanism 3, the handwheel drives the lead screw to rotate, the lead screw nut and the slider move up and down synchronously along the slide rail, thereby adjusting the distance between the uppermost leveling roller and the two lower leveling rollers, so that the leveling rollers can apply appropriate leveling pressure to substrates of different thicknesses; both sides of the bottom of the device main body 1 are connected with supporting feet 9, and the whole device is stably supported on the ground through the supporting feet 9; a control cabinet 2 is installed on one side of the device main body 1, the first belt conveyor 4, the second belt conveyor 5 and the photoelectric switch 6 are all electrically connected to the control cabinet 2. The staff starts the first belt conveyor 4 and the photoelectric switch 6 through the control cabinet 2, then places the circuit board substrate to be leveled on the first belt conveyor 4, the first belt conveyor runs towards the direction of the leveling mechanism 3, and stably conveys the substrate between the three leveling rollers distributed in a triangular shape. The leveling rollers apply uniform pressure to the surface of the substrate during the rotation process affected by friction force to complete the leveling operation.

[0031] Embodiment 2: On the basis of the above Embodiment 1, the following arrangement is now adopted for ease of maintenance.

[0032] Refer to Figure 4 and Figure 5 , in the above embodiment, a support block 10 is fixed on the outer surface of the supporting foot 9, mounting sleeves 11 are fixed on both sides of the back of the collecting hopper 7, bolts 12 penetrate through both sides of the mounting sleeve 11, the mounting sleeve 11 is detachably connected to the support block 10 through the bolts 12, and the buffer pad 8 is fixedly connected to the collecting hopper 7 by bonding. If the buffer pad 8 is damaged after long-term use or the collecting hopper 7 needs maintenance, the staff can unscrew the bolts 12 to separate the mounting sleeve 11 from the support block 10, then remove and replace the collecting hopper 7 together with the buffer pad 8 as a whole, and after replacement, reposition the mounting sleeve 11 and the support block 10 through the bolts 12 to quickly restore the collecting function.

[0033] Embodiment 3: On the basis of the above Embodiment 1, the following arrangement is now adopted to facilitate the inspection of the circuit board substrate.

[0034] Refer to Figure 1 and Figure 2In the above embodiment, the photoelectric switch 6 is an Omron through-beam photoelectric sensor EE-SPW series. If the device is equipped with an Omron through-beam EE-SPW series photoelectric switch 6, after the circuit board substrate is completely transferred from the first belt conveyor 4 to the second belt conveyor 5, the circuit board substrate will change from an inclined state to a horizontal state, thereby blocking the light beam emitted by the photoelectric switch 6. The photoelectric switch 6 will transmit an electrical signal to the control cabinet 2. The control cabinet 2, in conjunction with the time relay inside the control cabinet 2, controls the second belt conveyor 5 to start and run continuously for five to ten seconds, reducing the occurrence of jamming or flipping during the transfer of the substrate caused by the reverse operation of the two conveyors.

[0035] The implementation principle of this utility model is as follows: First, the device is stably supported on the ground by the support foot 9; according to the thickness of the circuit board substrate to be leveled, the operator rotates the manual vertical slide handwheel connected to the uppermost leveling roller in the leveling mechanism 3. The handwheel drives the lead screw to rotate, and the lead screw nut and the slider move up and down synchronously along the slide rail, thereby adjusting the distance between the uppermost leveling roller and the two lower leveling rollers, so that the leveling roller can apply appropriate leveling pressure to substrates of different thicknesses. Subsequently, the staff started the first belt conveyor 4 and photoelectric switch 6 through the control cabinet 2, and then placed the circuit board substrate to be leveled on the first belt conveyor 4. The first belt conveyor 4 moved in the direction of the leveling mechanism 3, and smoothly transported the substrate between the three leveling rollers distributed in a triangular pattern. The leveling rollers applied uniform pressure to the surface of the substrate during the rotation under the influence of friction to complete the leveling operation. The leveled substrate continues to be conveyed backward by the first belt conveyor 4. Since the length of the first belt conveyor 4 is less than that of the second belt conveyor 5 and it is located directly above the second belt conveyor 5, the substrate naturally falls from the end of the first belt conveyor 4 to the top of the second belt conveyor 5 below. At this time, if the device is equipped with an Omron through-beam EE-SPW series photoelectric switch 6, after the circuit board substrate is completely transferred from the first belt conveyor 4 to the second belt conveyor 5, the circuit board substrate will change from an inclined state to a horizontal state, thereby blocking the beam emitted by the photoelectric switch 6. The photoelectric switch 6 will then transmit the beam to the control cabinet. 2. Transmit electrical signals. Control cabinet 2, in conjunction with the time relay inside control cabinet 2, controls the second belt conveyor 5 to start and run continuously for five to ten seconds, reducing the occurrence of jamming or flipping during substrate transfer caused by the reverse operation of the two conveyors. If photoelectric switch 6 is not configured, the second belt conveyor 5 can be started through the preset program of control cabinet 2 or manually controlled, and its running direction is always opposite to that of the first belt conveyor 4. It can transport the substrate towards the input end of the first belt conveyor 4 where the worker stands, making it convenient for the worker to directly check the flatness of the substrate and determine whether secondary leveling is required, without having to go back and forth between the front and back ends of the device.

[0036] When the substrate is conveyed to the end by the second belt conveyor 5, it will fall into the collection hopper 7. The rubber buffer pad 8 can absorb the impact force when the substrate comes into contact with the collection hopper 7, reducing the damage to the substrate surface. If the buffer pad 8 is damaged after long-term use or the collection hopper 7 needs maintenance, the operator can unscrew the bolt 12 to separate the mounting sleeve 11 from the support block 10, and then remove and replace the collection hopper 7 along with the buffer pad 8. After replacement, the mounting sleeve 11 and the support block 10 can be repositioned by the bolt 12 to quickly restore the collection function.

[0037] Although embodiments of the present invention have been shown and described, these specific embodiments are merely explanations of the present invention and are not intended to limit the invention. The specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. After reading this specification, those skilled in the art may make modifications, substitutions, and variations to the embodiments as needed without departing from the principles and spirit of the present invention, provided that such modifications, substitutions, and variations are within the scope of the claims of the present invention and are protected by patent law.

Claims

1. A board warping and leveling device for printed circuit board processing, comprising a device body (1), characterized in that: A first belt conveyor (4) and a second belt conveyor (5) are respectively installed inside the device main body (1), photoelectric switches (6) are installed on both sides of the device main body (1), collecting hoppers (7) are arranged on both inner sides of the device main body (1), and a buffer pad (8) is connected inside the collecting hopper (7).

2. The board warping and leveling device for printed circuit board processing according to claim 1, characterized in that: The length of the first belt conveyor (4) is less than the length of the second belt conveyor (5), and the first belt conveyor (4) is located above the second belt conveyor (5).

3. The board warping and leveling device for printed circuit board processing according to claim 2, characterized in that: The photoelectric switch (6) is located laterally above the second belt conveyor (5), and the collecting hopper (7) is located below the second belt conveyor (5).

4. The board warping and leveling device for printed circuit board processing according to claim 3, characterized in that: The collecting hopper (7) and the buffer pad (8) are arranged in an inclined manner, and the buffer pad (8) is made of a rubber material.

5. The board warping and leveling device for printed circuit board processing according to claim 1, characterized in that: A leveling mechanism (3) is installed at the upper inner part of the device main body (1), the leveling mechanism (3) consists of three leveling rollers distributed in a triangular arrangement, the uppermost leveling roller is supported by a manual vertical sliding table, the manual vertical sliding table is composed of a handwheel, a lead screw, a sliding rail, and a bearing seat with a lead screw nut and a sliding block, and supporting feet (9) are connected to both sides of the bottom of the device main body (1).

6. The board warping and leveling device for printed circuit board processing according to claim 5, characterized in that: A control cabinet (2) is installed on one side of the device main body (1), and the first belt conveyor (4), the second belt conveyor (5) and the photoelectric switch (6) are all electrically connected to the control cabinet (2).

7. The board warping and leveling device for printed circuit board processing according to claim 5, characterized in that: Support blocks (10) are fixed on the outer surfaces of the supporting feet (9), mounting sleeves (11) are fixed on both sides of the back of the collecting hopper (7), and bolts (12) penetrate through both sides of the mounting sleeve (11).

8. The board warping and leveling device for printed circuit board processing according to claim 7, characterized in that: The mounting sleeve (11) is detachably connected to the support block (10) via the bolt (12), and the buffer pad (8) is fixedly connected to the collecting hopper (7) by means of adhesion.

9. The board warping and leveling device for printed circuit board processing according to claim 3, characterized in that: The photoelectric switch (6) is an Omron through-beam photoelectric sensor of the EE-SPW series.

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