Sealing wire structure, sensor, and electronic device

Abstract

The application discloses a sealing wire connection structure, a sensor and an electronic device. The sealing wire connection structure comprises a shell, the shell has a first wire hole, a first cavity, a second wire hole and a second cavity which are sequentially communicated, sealing glue, the sealing glue is filled in the first cavity and blocks the communication between the first wire hole and the second wire hole, and a wire, the wire sequentially passes through the first wire hole, the sealing glue and the second wire hole and enters the second cavity, and the first wire hole and the second wire hole are spaced apart from the sealing glue along the height direction and located on the same side of the sealing glue. The sealing problem of the sensor is solved by arranging the sealing glue, the metal terminal, the insert injection molding, the waterproof level connector and other structures are cancelled, the structure of the product is simplified, and the cost of the product is reduced.

Description

Technical Field

[0001] This application relates to the field of sealing technology, specifically to a sealed wiring structure, and sensors and electronic devices using the sealed wiring structure. Background Technology

[0002] To enable electrical connection between the circuit board and the external environment in electronic products, metal terminals for electrical connection to the circuit board need to be installed at the assembly end of the housing. This is achieved by inserting the metal terminals into the housing using injection molding. Then, the wiring harness ends are connected to the assembly end of the housing via waterproof connectors and electrically connected to the metal terminals.

[0003] Therefore, the aforementioned sensor products have solved the sealing problem while achieving electrical connection. However, the inclusion of metal terminals, insert injection molding, and waterproof connectors results in a complex product structure and higher cost. Therefore, it is necessary to propose further solutions to address these issues. Utility Model Content

[0004] This application aims to provide a sealed wiring structure, sensor, and electronic device to overcome the shortcomings of the prior art.

[0005] This application provides a sealed wiring structure, which includes: The outer casing has a first wire hole, a first cavity, a second wire hole, and a second cavity that are sequentially connected in series. Sealant; the sealant is filled in the first cavity and blocks the communication between the first wire hole and the second wire hole; The wire passes sequentially through the first wire hole, the sealant, and the second wire hole into the second cavity. The first and second wire holes are both spaced apart from the sealant along the height direction and located on the same side of the sealant.

[0006] In some embodiments, the housing is provided with a sealing portion that extends into the first cavity, and at least a portion of the sealing portion is located within the sealant.

[0007] In some embodiments, the region of the housing opposite to the first cavity extends toward the sealant side to form the sealing portion.

[0008] In some embodiments, the housing is further provided with a potting hole, which is disposed opposite to the first cavity and spaced apart from the sealant along the height direction.

[0009] In some embodiments, the sealing portion includes a first sealing plate and a second sealing plate, the first sealing plate and the second sealing plate being at least partially located within the sealant, the first sealing plate being disposed on the side of the injection hole near the first wire hole and cooperating with the sealant to block the communication between the first cavity and the first wire hole, and the second sealing plate being disposed on the side of the injection hole near the second wire hole and cooperating with the sealant to block the communication between the first cavity and the second wire hole.

[0010] In some embodiments, the housing includes: a first housing and a second housing, wherein the first housing is fitted onto the second housing and is sealed to the second housing.

[0011] In some embodiments, a partition is provided inside the second housing, and the first cavity and the second cavity are located on different sides of the partition; the upper part of the partition is spaced apart from the first housing to form the second wire hole, and the first wire hole is located on the upper part of the first cavity on the side opposite to the second wire hole.

[0012] In some embodiments, the portion of the wire located in the sealant is bent toward the first cavity on the side opposite to the first and second wire holes.

[0013] This application also provides a sensor, which includes: a circuit board and a sealed wiring structure as described above; The circuit board is disposed in the second cavity; the wire is electrically connected to the circuit board.

[0014] This application also provides an electronic device that includes the sealed wiring structure described above or the sensor described above.

[0015] Compared with the prior art, the beneficial effects of this application are: 1) In the sealed wiring structure of this application, the sealing problem of the sensor is solved by setting a sealant, eliminating the need for metal terminals, insert injection molding, waterproof connectors and other structures, simplifying the product structure and reducing the product cost.

[0016] 2) In the sealing wiring structure of this application, both the first wire hole and the second wire hole are spaced apart from the sealant along the height direction and located on the same side of the sealant. This arrangement prevents the sealant from reaching the first wire hole and the second wire hole, thereby helping to overcome the problem of sealant overflow. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is a three-dimensional schematic diagram of the sealed wiring structure in Embodiment 1 of this utility model; Figure 2 This is a three-dimensional exploded view of the sealing wiring structure in Embodiment 1 of this utility model; Figure 3 This is a cross-sectional view of the sealing wiring structure in Embodiment 1 of this utility model; Figure 4 yes Figure 3 Enlarged view of a local structure in the middle; Figure 5 This is a schematic diagram of the sealing state when the height difference is small in Embodiment 1 of this utility model; Figure 6 This is a schematic diagram of the sealing state when the sealing part is independently set in Embodiment 1 of this utility model; Figure 7 This is a three-dimensional schematic diagram of the sealed wiring structure in Embodiment 2 of this utility model; Figure 8 This is a three-dimensional exploded view of the sealed wiring structure in Embodiment 2 of this utility model; Figure 9 This is a schematic diagram of the sealing state when the height difference is small in Embodiment 1 of this utility model; Figure 10 This is a cross-sectional view of the sealing wiring structure in Embodiment 2 of this utility model; Figure 11 This is a three-dimensional exploded view of the sealing wiring structure in Embodiment 3 of this utility model; Figure 12 This is a three-dimensional exploded view of the sealing wiring structure in Embodiment 4 of this utility model; Figure 13 This is a three-dimensional schematic diagram of the first housing in Embodiment 4 of this utility model; Figure 14 This is a cross-sectional view of the sealing wiring structure in Embodiment 4 of this utility model; Figure 15 This is a three-dimensional exploded view of the sensor in Embodiment 5 of this utility model; Figure 16 This is a schematic diagram of the modules of the electronic device in Embodiment Six of this utility model.

[0019] Explanation of reference numerals in the attached figures: Example 1 Sealed wiring structure 100; 11. Outer casing; 12. Sealant; 13. Wire. First wire hole 111, first cavity 112, second wire hole 113, second cavity 114; Partition 115, inner wall of outer shell 1123, bottom surface of outer shell 1121, top surface of outer shell 1122; Sealing part 116, first sealing plate 1161, second sealing plate 1162; Circuit board 51; Height difference between the first wire hole and the sealant H1 The height difference between the second wire hole and the sealant H2 .

[0020] Example 2 Sealed wiring structure 200; 21 outer casing, 22 sealant; Glue filling hole 211, first cavity 212, sealing part 213, first wire hole 214, second wire hole 215.

[0021] Example 3 Sealed wiring structure 300; Casing 31; First housing 311, second housing 312; first cavity 313, partition 314, first wire hole 315, second wire hole 316, second cavity 317; Flanged edge 3111, assembly end 321.

[0022] Example 4 Sealed wiring structure 400; Wire 41, first cavity 42, first wire hole 43, second cavity 44, outer shell 45, potting hole 46; The wire is located at the bend 411 within the sealant; 451 protrusion, 452 first housing, 453 second housing, and 454 downward extension of the outer shell.

[0023] Example 5 Sensor 500; Circuit board 51, sealed wiring structure 52, wire 53, housing 55, connection terminal 54; Second cavity 521; Positioning post 5211.

[0024] Example 6 Electronic equipment 600; Sensor 61. Detailed Implementation

[0025] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0026] In the description of this application, it should be understood that if terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" appear, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0027] Furthermore, where the terms "first" and "second" appear, these terms are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, where the term "multiple" appears, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0028] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0029] In this application, unless otherwise expressly specified and limited, the use of descriptions such as "above" or "below" the second feature indicates that the first and second features are in direct contact or indirect contact via an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. Similarly, "below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0030] It should be noted that if an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. If an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. If so, the terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this application are for illustrative purposes only and do not represent the only possible implementation.

[0031] Example 1 This embodiment provides a sealed wiring structure that can be applied to sensor products to achieve sealing and isolation between the wiring hole and the internal cavity.

[0032] like Figure 1 As shown, the sealed wiring structure 100 of this embodiment includes: a housing 11, a sealant 12, and a wire 13.

[0033] like Figure 2 As shown, the outer casing 11 has a first wire hole 111, a first cavity 112, a second wire hole 113, and a second cavity 114 that are sequentially connected.

[0034] Specifically, the first wire hole 111 is used for the routing of the wire 13. It is located on the surface of the housing 11 and communicates with the outside. In this way, the wire 13 can extend into the interior of the housing 11 through the first wire hole 111.

[0035] like Figure 3 , 4 As shown, the first cavity 112 connects to the first wire hole 111 and the second wire hole 113, and also serves to fill with sealant 12. Thus, the sealant 12 filling the first cavity 112 blocks the connection between the first wire hole 111 and the second cavity 114, achieving a seal between the internal cavity and the external environment of the sensor. Compared to existing technologies, the sealing problem of the sensor is solved by using sealant 12, eliminating the need for metal terminals, insert injection molding, waterproof connectors, and other structures found in existing sensors, simplifying the product structure and reducing costs.

[0036] To form the first cavity 112, the first cavity 112 is defined by a partition 115 disposed in the outer shell 11 and the inner surface of the outer shell 11. At this time, the partition 115 extends from the inner sidewall 1123 of the outer shell 11 at the end where the first wire hole 111 is provided, so that the partition 115, the bottom surface 1121, the top surface 1122 and the inner sidewall 1123 of the outer shell 11 together form the first cavity 112.

[0037] The second wire hole 113 is used for routing the wire 13. It is located inside the housing 11 and communicates with the second cavity 114. Both the first wire hole 111 and the second wire hole 113 are spaced apart from the sealant 12 along the height direction and are located on the same side of the sealant 12. That is, there is a height difference between the first wire hole 111 and the second wire hole 113 and at least a portion of the sealant surface 120. H1 , H2 And height difference H1 , H2 This refers to the distance between the lowest points of the first wire hole 111 and the second wire hole 113 and the sealant surface 120. Thus, the first wire hole 111 and the second wire hole 113 maintain a certain preset distance from the top surface 1122 of the sealant 12. This height difference prevents the sealant 12 from reaching the first wire hole 111 and the second wire hole 113, thereby helping to overcome the problem of sealant overflow.

[0038] Height difference H1 With height difference H2 They can be equal, meaning the first wire hole 111 and the second wire hole 113 are set at the same height; height difference H1 With height difference H2 They can also be unequal, that is, the first wire hole 111 and the second wire hole 113 are set out in a staggered manner.

[0039] In one embodiment, when the first cavity 112 is formed by the partition 115 and the bottom surface 1121, top surface 1122, and inner sidewall 1123 of the outer shell 11, the first wire hole 111 and the second wire hole 113 are located on both sides above the first cavity 112. Thus, the design of the two wire holes on both sides above takes into account the routing of the wire 13 and the predetermined height difference between them and the sealant 12 below.

[0040] Furthermore, when the sealant 12 blocks the communication between the first wire hole 111 and the second cavity 114, the sealant 12 cooperates with the top surface 1122 of the outer shell 11.

[0041] like Figure 5As shown, when the height difference is relatively small, the sealant 12 can directly mate with the top surface 1122 of the housing 11. At this time, there is a height difference between the first wire hole 111 and the second wire hole 113 and a portion of the sealant 12. That is, the local adhesive surface of the sealant 12 is slightly higher than the edge adhesive surface.

[0042] like Figure 4 As shown, when the height difference is relatively large, a sealing portion 116 is provided in the outer casing 11. The sealing portion 116 extends into the first cavity 112 to compensate for the distance between the top surface 1122 of the outer casing 11 and the sealant 12, thereby allowing the sealant 12 to engage with the sealing portion 116 and block the communication between the first wire hole 111 and the second cavity 114. At this time, there is a height difference between the first wire hole 111 and the second wire hole 113 and the sealant 12. Furthermore, at least a portion of the sealing portion 116 is located within the sealant 12. This ensures a good sealing contact between the two.

[0043] In one embodiment, the sealing portion 116 may be integrally formed with the outer casing 11. In this case, the area of ​​the outer casing 11 opposite to the first cavity 112 extends toward the sealant 12 to form the sealing portion 116. For example, the area of ​​the outer casing 11 opposite to the first cavity 112 may be recessed to form the sealing portion. Alternatively, a portion of the outer casing 11 may extend downward to form the sealing portion. This partially extended sealing portion may be a baffle, a barrier, or a block, etc.

[0044] Furthermore, the sealing portion 116 includes a first sealing plate 1161 and a second sealing plate 1162. Here, the first sealing plate 1161 and the second sealing plate 1162 extend integrally from the top position of the inner surface of the housing 11, and are arranged laterally facing the adjacent wire hole to form a seal between the first wire hole 111 and the first cavity 112, and between the first cavity 112 and the second wire hole 113.

[0045] Specifically, the first sealing plate 1161 and the second sealing plate 1162 are at least partially located within the sealant 12. The first sealing plate 1161 is disposed on the side of the injection hole near the first wire hole 111 and cooperates with the sealant 12 to block the communication between the first cavity 112 and the first wire hole 111. The second sealing plate 1162 is disposed on the side of the injection hole near the second wire hole 113 and cooperates with the sealant 12 to block the communication between the first cavity 112 and the second wire hole 113.

[0046] like Figure 6As shown, in another embodiment, the sealing part 116 can also be provided independently. That is, a component with a sealing function is provided and disposed between the housing 11 and the sealant 12. For example, the sealing part 116 can be a rubber / plastic sealing strip, a rubber / plastic sealing baffle, or a rubber / plastic sealing block, etc., bonded to the top surface 1122 of the housing 11.

[0047] like Figure 2 As shown, the second cavity 114 is used to house the circuit board 51 of the sensor and is located inside the housing 11. Thus, the wire 13 can pass sequentially through the first wire hole 111, the sealant 12, and the second wire hole 113 into the second cavity 114 to electrically connect with the circuit board 51 in the second cavity 114.

[0048] Example 2 This embodiment provides a sealed wiring structure. Based on Embodiment 1, this embodiment focuses on the technical solution of providing a potting hole on the outer casing. Other technical details regarding the sealed wiring structure are described in Embodiment 1 and will not be repeated here.

[0049] like Figure 7 , 8 As shown, in the sealing wiring structure 200 of this embodiment, the outer shell 21 is also provided with a potting hole 211. The potting hole 211 is disposed opposite to the first cavity 212 and is spaced apart from the sealant 22 along the height direction. This facilitates the convenient potting of sealant into the first cavity 212 through the potting hole 211 to form the aforementioned sealant.

[0050] like Figure 9 As shown in Embodiment 1, when the height difference is relatively small, the local adhesive surface of the sealant 22 is slightly higher than the edge adhesive surface. Therefore, when the sealant is injected through the injection hole 211, the local adhesive surface of the injected sealant 22 reaches the top surface of the interior of the outer casing 21.

[0051] like Figure 10 As shown, when the height difference is relatively large, the lower end of the sealing part 213 extends into the first cavity 212. At this time, when the sealant is injected through the injection hole 211, the surface of the injected sealant 22 is lower than the first wire hole 214 and the second wire hole 215, and it matches the lower end of the sealing part 213.

[0052] Furthermore, as described in Embodiment 1, when the outer shell 21 and the sealing portion 213 are integrally formed, the area of ​​the outer shell 21 opposite to the first cavity 212 extends downward. In this case, the downwardly extending portion can be designed in conjunction with the arrangement of the potting hole 211.

[0053] Specifically, the area of ​​the outer shell 21 opposite to the first cavity 212 is recessed; the glue-filling hole 211 is located at the bottom of the recessed portion. This recessed design facilitates the rapid filling of the sealant into the area of ​​the first cavity 212 that needs sealing, and also helps to reduce the amount of sealant used.

[0054] The reason for this is that the recessed design of the outer shell 21 lowers the position of the potting hole 211. As a result, the sealant, under the influence of gravity, will naturally flow from the bottom upwards and from the inside out to fill the area, effectively expelling air and preventing the formation of air bubbles, thus quickly and completely filling the area that needs to be sealed. At the same time, the recessed area limits the main flow and filling range of the sealant, preventing the sealant from spreading to large areas that do not need to be sealed, thereby saving the amount of sealant used.

[0055] Furthermore, the glue-filling hole 211 located at the bottom has a preset size. This compensates for the increased material usage due to the recessed design of the outer casing 21, thereby further reducing product costs. The appropriately sized glue-filling hole 211 also facilitates control of the glue flow rate and speed, resulting in smooth and uniform glue filling. For example, the area of ​​the glue-filling hole 211 occupies 1 / 4 to 1 / 2 of the area of ​​the recessed portion.

[0056] Example 3 This embodiment provides a sealed wiring structure. Based on Embodiment 1 and / or Embodiment 2, this embodiment focuses on the technical solution of having a separate outer casing. Other technical details regarding the sealed wiring structure can be found in Embodiment 1 and / or Embodiment 2, and will not be repeated here.

[0057] like Figure 11 As shown, in the sealed wiring structure 300 of this embodiment, the outer casing 31 includes a first casing 311 and a second casing 312. The first casing 311 is assembled onto the second casing 312 and is sealed to the second casing 312, so that the first casing 311 can be used as a top cover. Thus, the installation and fixation of the internal structure is facilitated before the first casing 311 and the second casing 312 are assembled.

[0058] Specifically, before assembly, the first housing 311 can be completely separated, creating an open operating space inside the second housing 312, which facilitates the positioning, installation, and fixation of internal components. This includes tasks such as wire connection and module debugging. After all internal structures are installed and confirmed to be correct, the first housing 311 is precisely assembled onto the second housing 312, quickly completing the encapsulation of the internal structure and simplifying the assembly process.

[0059] The first housing 311 has a flange 3111 at its edge, which covers the mounting end 321 of the second housing 312. This helps to further ensure the overall sealing effect of the housing 31. In one embodiment, the flange 3111 is a structure that extends vertically integrally from the edge of the first housing 311. Thus, after the first housing 311 is assembled onto the second housing 312, the flange 3111 can cooperate with the outer side wall of the mounting end 321 of the second housing 312, thereby increasing the area between the two and further improving the sealing effect.

[0060] In addition, in order to achieve a secure assembly of the first housing 311 and the second housing 312, the assembly ends 321 of the first housing 311 and the second housing 312 are connected by laser welding.

[0061] As described in Embodiment 1, the first cavity 313 is defined by a partition disposed in the outer shell 31 and the inner surface of the outer shell 31. Based on this, the partition 314 can be formed on the first shell 311 or the second shell 312. In one embodiment, the partition 314 is disposed within the second shell 312, and the first cavity 313 and the second cavity 317 are located on different sides of the partition 314. In this case, the upper part of the partition 314 is spaced apart from the first shell 311 to form a second wire hole 316, and the first wire hole 315 is disposed on the upper part of the side of the first cavity 313 opposite to the second wire hole 316.

[0062] Thus, in the case of the separate housing 31, the position of the partition 314 can be flexibly set so that while forming the first cavity 313, it can also cooperate with the first housing 311 and the second housing 312 to form the aforementioned second wire hole 316.

[0063] Example 4 This embodiment provides a sealed wiring structure. Based on Embodiment 1 and / or Embodiment 2 and / or Embodiment 3, this embodiment focuses on describing the technical solution for wire routing. Other technical details regarding the sealed wiring structure can be found in Embodiment 1 and / or Embodiment 2 and / or Embodiment 3, and will not be repeated here.

[0064] like Figure 12 As shown, in the sealed wiring structure 400 of this embodiment, the portion of the wire 41 located in the sealant is bent towards the side of the first cavity 42 that faces away from the first and second wire holes. This not only facilitates the routing of the wire 41 itself, but also allows the wire 41 to cooperate with the sealant to achieve a seal between the first wire hole 43 and the second cavity 44.

[0065] Specifically, the portion 411 of the conductor 41 within the sealant is bent towards the bottom of the first cavity 42, forming a U-shaped or arc-shaped wiring configuration. This bend provides the conductor 41 with greater flexibility, adapting to the layout requirements of the internal space and preventing damage due to excessive tension, thus facilitating smooth wiring. Furthermore, when the sealant is applied, it fully covers this bent portion of the conductor 41, utilizing the sealant's adhesive and sealing properties to ensure a tight bond between the conductor 41 and the sealant, achieving proper shaping of the conductor 41 after wiring.

[0066] Cooperate Figure 13 As shown, in order to maintain the curved shape of the wire 41 during routing, the inner surface of the housing 45 is further provided with a protrusion 451; the protrusion 451 is in contact with the curved wire 41 or has a distance from it.

[0067] Thus, after the first housing 452 and the second housing 453 are assembled, the protrusion 451 can act on the wire 41, maintaining its curved routing shape. After potting, the sealant fully wraps around this curved part of the wire 41, allowing the wire 41 to bond tightly with the sealant, thus achieving the shaping of the wire 41 after routing. Furthermore, due to the effect of the sealant on the wire 41, the protrusion 451 may separate from the wire 41, meaning the final state is that the protrusion 451 is in contact with the curved wire 41 or has a gap between it and the wire 41.

[0068] Cooperate Figure 14 As shown in Embodiment 1, when the outer shell 45 and the sealing part are integrally formed, the area of ​​the outer shell 45 opposite to the first cavity 42 extends downward. At this time, the downwardly extending portion 454 can be designed in conjunction with the protrusion 451.

[0069] In one embodiment, a protrusion 451 is disposed on the surface of the downwardly extending portion 454. For example, the protrusion 451 may be a set of opposing limiting plates, the lower ends of which, after the first housing 452 and the second housing 453 are assembled, maintain a preset distance from the bottom surface of the first cavity 42, and this distance forms the routing space for the wire 41.

[0070] As described in Embodiment 2, the glue-filling hole 46 is located at the bottom of the recessed portion. Based on this, to avoid interference, limiting plates are distributed on both sides of the glue-filling hole. The spacing between the two limiting plates can be adaptively designed according to the routing distance of the wire 41. Based on the same technical concept, the protrusion 451 can also be a limiting protrusion, or a number of spaced-apart limiting posts, etc.

[0071] Furthermore, the limiting plate referred to in this embodiment is also the first sealing plate 1161 and the second sealing plate 1162 described in Embodiment 1. Thus, the limiting plate serves both as a routing path for the auxiliary wire 41 and as a sealant in conjunction with the sealant.

[0072] Example 5 This embodiment provides a sensor that can utilize at least one of the sealed wiring structures described in Embodiments 1 to 4 above. Therefore, for technical details regarding the sealed wiring structure, please refer to Embodiment 1 and / or Embodiment 2 and / or Embodiment 3 and / or Embodiment 4, and will not be repeated in this embodiment.

[0073] The sensors in this example can be the following sensors with sealing requirements: temperature sensor, pressure sensor, acceleration sensor, vibration sensor, liquid level sensor, weighing sensor, torque sensor, force sensor, humidity sensor, gas sensor, etc.

[0074] like Figure 15 As shown, the sensor 500 of this embodiment includes a circuit board 51 and a sealed wiring structure 52. The circuit board 51 is disposed within the second cavity 521, and the wire 53 is electrically connected to the circuit board 51. Thus, by providing the sealed wiring structure 52, good sealing of the internal electronic components of the sensor 500 is achieved at a relatively low cost.

[0075] To facilitate the installation and fixation of the circuit board 51, a positioning post 5211 is also provided in the second cavity 521. Correspondingly, the circuit board 51 has corresponding positioning holes, and the positioning post 5211 is fitted into the corresponding positioning holes to assist in fixing the circuit board 51 in the second cavity 521. In one embodiment, the positioning holes are located in the non-working area of ​​the upper edge of the circuit board 51. For example, they are located at both ends of the circuit board 51 and on one side of the circuit board 51.

[0076] Furthermore, to facilitate the installation of the sensor 500, a connection end 54 is provided at one end. Specifically, this connection end 54 is located on the side of the housing 55 and is hollow inside. Thus, the wire 53 can extend into the interior of the sensor 500 from the connection end 54 to make an electrical connection with the circuit board 51. Correspondingly, a first wire hole is formed at a corresponding position on the inner sidewall of the connection end 54.

[0077] Example 6 This embodiment provides an electronic device that can utilize the sensor described in Embodiment Six above. Therefore, for technical details regarding the sensor, please refer to Embodiment Five, and it will not be repeated here.

[0078] like Figure 16As shown, the electronic device 600 in this example can specifically be a wearable device, medical device, automobile, automation equipment, chemical equipment, etc. Therefore, the electronic device 600 in this example can acquire corresponding sensing signals using a sealed wiring structure or sensor 61, and further perform corresponding functions based on the sensing signals. Using the aforementioned well-sealed sensor can meet its functional or grade requirements.

[0079] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

[0080] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A sealed wiring structure, characterized in that, The sealed wiring structure includes: The outer casing has a first wire hole, a first cavity, a second wire hole, and a second cavity that are sequentially connected in series. Sealant; the sealant is filled in the first cavity and blocks the communication between the first wire hole and the second wire hole; The wire passes sequentially through the first wire hole, the sealant, and the second wire hole into the second cavity. The first and second wire holes are both spaced apart from the sealant along the height direction and located on the same side of the sealant.

2. The sealed wiring structure according to claim 1, characterized in that, The outer casing is provided with a sealing portion that extends into the first cavity, and at least a portion of the sealing portion is located within the sealant.

3. The sealed wiring structure according to claim 2, characterized in that, The area of ​​the outer shell opposite to the first cavity extends toward the sealant side to form the sealing portion.

4. The sealed wiring structure according to claim 2, characterized in that, The outer shell is also provided with a glue-filling hole, which is disposed opposite to the first cavity and spaced apart from the sealant along the height direction.

5. The sealed wiring structure according to claim 4, characterized in that, The sealing part includes a first sealing plate and a second sealing plate. The first sealing plate and the second sealing plate are at least partially located within the sealant. The first sealing plate is disposed on the side of the injection hole near the first wire hole and cooperates with the sealant to block the communication between the first cavity and the first wire hole. The second sealing plate is disposed on the side of the injection hole near the second wire hole and cooperates with the sealant to block the communication between the first cavity and the second wire hole.

6. The sealed wiring structure according to claim 1, characterized in that, The outer casing includes: a first housing and a second housing, wherein the first housing is assembled onto the second housing and is sealed to the second housing.

7. The sealed wiring structure according to claim 6, characterized in that, The second housing is provided with a partition, and the first cavity and the second cavity are located on different sides of the partition; the upper part of the partition is spaced apart from the first housing to form the second wire hole, and the first wire hole is located on the upper part of the side of the first cavity opposite to the second wire hole.

8. The sealed wiring structure according to claim 1, characterized in that, The portion of the wire located in the sealant is bent toward the first cavity on the side opposite to the first and second wire holes.

9. A sensor, characterized in that, The sensor includes: a circuit board and a sealed wiring structure as described in any one of claims 1 to 8; The circuit board is disposed in the second cavity; the wire is electrically connected to the circuit board.

10. An electronic device, characterized in that, The electronic device includes the sealed wiring structure as described in any one of claims 1 to 8 or the sensor as described in claim 9.

Images