Support structure, electronic component assembly, cabinet assembly, electronic component integrated structure, converter and wind turbine generator system

Abstract

The utility model provides a kind of support structure, electronic component assembly, box assembly, electronic component integrated structure, current transformer and wind turbine generator set.Support structure is used to be installed in box to support electronic component, support structure includes support substrate, support substrate has opposite first surface and second surface, first surface is provided with multiple electronic component mounting areas, first through-hole is opened in electronic component mounting area, so that electronic component can be exposed to the second surface of support substrate by first through-hole after being mounted to electronic component mounting area.Support substrate can be supplied electronic component installation, also can make that electronic component towards the surface of support substrate can also be exposed, in turn can make that electronic component is sufficiently cooled, avoid causing electronic component local temperature excessively high.

Description

Technical Field

[0001] This disclosure relates to the field of wind power generation technology, specifically to a support structure, electronic component assembly, housing assembly, integrated electronic component structure, converter, and wind turbine generator set. Background Technology

[0002] The converter, through power conversion, enables the generator to output constant-frequency electricity and is a crucial component of wind turbine generator sets, playing a key role in their operation. The power module is the core component of the converter, responsible for power conversion. Because the power module contains numerous semiconductor devices, it generates heat during operation, especially the IGBT module, which is the primary heat-generating element. The cooling effect of the converter has a significant impact on the operating efficiency and stability of the wind turbine generator set. Traditional converters typically use surface-mount water-cooled plates for cooling. While this method is effective in heat dissipation to some extent, water-cooling systems often present problems such as potential leakage risks, complex maintenance requirements, and sensitivity to changes in ambient temperature. Utility Model Content

[0003] The main objective of this application is to provide a support structure, electronic component assembly, and immersion cooling system to solve the cooling and heat dissipation problems of electronic components such as converters in related technologies.

[0004] To achieve the above objectives, a first aspect of this disclosure provides a support structure for mounting electronic components in a housing. The support structure includes a support substrate having opposing first and second surfaces. The first surface is provided with a plurality of electronic component mounting areas, and first through holes are provided in the electronic component mounting areas so that after the electronic components are mounted in the electronic component mounting areas, they can be exposed to the second surface of the support substrate through the first through holes.

[0005] In some embodiments, the support substrate is further provided with a first connection hole for mounting electronic components to the support substrate via a connector, the first connection hole being disposed around the outer periphery of the first through hole.

[0006] In some embodiments, the plurality of electronic component mounting areas include a plurality of IGBT module mounting areas for mounting IGBT modules, and each IGBT module mounting area is provided with a first through hole for exposing the substrate side of the IGBT module to a second surface.

[0007] In some embodiments, the first surface includes a first region and a second region arranged side by side in the width direction of the support substrate, and a plurality of IGBT module mounting regions are respectively provided in the first region and the second region. The IGBT module mounting regions provided in the first region and the IGBT module mounting regions provided in the second region are arranged in a triangular pattern.

[0008] In some embodiments, the support substrate is further provided with at least one second through hole, which is disposed between two adjacent electronic component mounting areas.

[0009] In some embodiments, the support substrate is further provided with a second connection hole for mounting the circuit board assembly to the support substrate via a connector. The second connection hole is located on the outside of the IGBT module mounting area.

[0010] In some embodiments, the support structure further includes a connecting portion, the support substrate has a first end and a second end opposite to each other in a first direction, the connecting portion bends from the first end of the support substrate relative to the support substrate and extends a predetermined width, and the connecting portion is provided with a plurality of through holes.

[0011] In some embodiments, the outer peripheral edge of the connecting part is provided with a flange, and the flange is provided with a mounting hole for connecting with the side panel of the housing.

[0012] In some embodiments, the support structure further includes a folded edge, which is bent from the second end of the support substrate and extends a predetermined width relative to the support substrate for connection with the bottom plate of the housing, wherein the connecting portion and the folded edge are disposed at opposite ends of the support substrate.

[0013] A second aspect of this disclosure provides an electronic component assembly, which includes a support structure as described in any of the first aspects of this disclosure and electronic components mounted on the support structure.

[0014] In some embodiments, the electronic component assembly includes an IGBT module, a first circuit board, and a circuit board assembly. The IGBT module is mounted on a first surface of a support substrate, the circuit board assembly is connected to the first surface of the support substrate, the first circuit board is mounted on the IGBT module, and at least a portion of the first circuit board is located between the IGBT module and the circuit board assembly in the thickness direction of the support substrate.

[0015] In some embodiments, the circuit board assembly includes a second circuit board and a circuit board support, the circuit board support being connected to a first surface of a support substrate, the second circuit board being mounted on the circuit board support, and the circuit board support being spaced apart from the first circuit board by a predetermined gap.

[0016] In some embodiments, the first circuit board is an adapter board and the second circuit board is a driver board.

[0017] In some embodiments, the electronic component assembly further includes a resistor mounted on a support structure.

[0018] A third aspect of this disclosure provides a housing assembly, the housing assembly including a housing and a support structure as described in any of the first aspects of this disclosure, the support structure being installed in the housing.

[0019] A fourth aspect of this disclosure provides an integrated electronic component structure, which includes a housing and electronic component assemblies as described in any of the second aspect embodiments of this disclosure.

[0020] A fifth aspect of this disclosure provides a converter including a cabinet and an electronic component integration structure as described in any of the fourth aspect embodiments of this disclosure, the electronic component integration structure being mounted in the cabinet.

[0021] A sixth aspect of this disclosure provides a wind turbine generator set, which includes a tower, a nacelle mounted on the tower, a hub mounted on one side of the nacelle, and a converter as described in any of the fifth aspect embodiments of this disclosure.

[0022] The support structure provided in this embodiment includes a support substrate for mounting electronic components. A plurality of electronic component mounting areas are provided on the first surface of the support substrate, and electronic components can be mounted in the electronic component mounting areas. A first through hole is provided in the electronic component mounting area so that the electronic component mounted on the support substrate can be exposed to the second surface of the support substrate through the first through hole, thereby allowing the surface of the electronic component facing the support substrate to be exposed as well, thereby enabling the electronic component to be sufficiently cooled and avoiding excessive local temperature of the electronic component. Attached Figure Description

[0023] The above and other objects and features of the present invention will become clearer from the following description, taken in conjunction with the accompanying drawings, which exemplarily illustrate an example, wherein: Figure 1 This is a schematic diagram of the support structure according to an embodiment of this application; Figure 2 This is a schematic diagram of the structure after the support structure and an IGBT module are assembled according to an embodiment of this application; Figure 3 yes Figure 2 A magnified view of a section at point I; Figure 4 This is a schematic diagram of the structure after the support structure and circuit board assembly are assembled according to an embodiment of this application; Figure 5 yes Figure 4 A magnified view of a section at point J; Figure 6 This is a schematic diagram of the assembly of the support structure and the box according to an embodiment of this application; Figure 7 yes Figure 6 A magnified view of a section at point K; Figure 8This is another structural schematic diagram of the assembly of the support structure and the box according to one embodiment of this application; Figure 9 yes Figure 8 A magnified view of the area at point L.

[0024] Explanation of icon numbers: 10 Support structure, 110 Support substrate, 111 First surface, 112 Second surface, 113 First through hole, 114 First connecting hole, 115 Second connecting hole, 116 Second through hole, 120 Connecting part, 121 Connecting hole, 122 Flanged edge, 123 Mounting hole, 130 Folded edge, 20 IGBT module, 30 Circuit board assembly, 310 Circuit board bracket, 320 Second circuit board, 40 Housing, 410 Housing side plate, 411 Reinforcing rib, 420 Bolt, 430 Housing bottom plate, 50 First circuit board. Detailed Implementation

[0025] The following detailed embodiments are provided to aid the reader in gaining a comprehensive understanding of the methods, apparatus, and / or systems described herein. However, various changes, modifications, and equivalents of the methods, apparatus, and / or systems described herein will become apparent upon understanding this disclosure. For example, the order of operations described herein is merely illustrative and is not limited to those orders set forth herein, but may be changed as will become clear upon understanding this disclosure, except for operations that must occur in a specific order. Furthermore, for clarity and conciseness, descriptions of features known in the art may be omitted.

[0026] The features described herein may be implemented in different forms and should not be construed as limited to the examples described herein. Rather, the examples described herein are provided only to illustrate some of the many feasible ways of implementing the methods, apparatus and / or systems described herein, many of which will become clear upon understanding the disclosure of this application.

[0027] Although terms such as “first” and “second” may be used herein to describe various components, assemblies, regions, layers, or parts, these components, assemblies, regions, layers, or parts should not be limited by these terms. Rather, these terms are used only to distinguish one component, assembly, region, layer, or part from another. Therefore, without departing from the teaching of the examples described herein, the first component, first assembly, first region, first layer, or first part referred to as the first component, first assembly, first region, first layer, or first part may also be referred to as the second component, second assembly, second region, second layer, or second part.

[0028] In the specification, when an element such as a layer, region, or substrate is described as being "on" another element, "connected to," or "bonded to" another element, the element may be directly "on" another element, directly "connected to," or "bonded to" the other element, or one or more other elements may be present in between. Conversely, when an element is described as being "directly on" another element, "directly connected to," or "directly bonded to" another element, no other elements may be present in between.

[0029] The terminology used herein is for the purpose of describing various examples only and is not intended to limit disclosure. Unless the context clearly indicates otherwise, the singular form is intended to include the plural form as well. The terms “comprising,” “including,” and “having” indicate the presence of the described features, quantities, operations, components, elements, and / or combinations thereof, but do not preclude the presence or addition of one or more other features, quantities, operations, components, elements, and / or combinations thereof. The term “a plurality” represents any quantity of two or more.

[0030] The directional terms such as "upper," "lower," "top," and "bottom" used in this application are all based on the orientation of the product when it is in normal use.

[0031] Unless otherwise defined, all terms used herein, including technical and scientific terms, shall have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains after understanding the invention. Unless expressly defined herein, terms such as those defined in a general dictionary shall be interpreted as having a meaning consistent with their meaning in the context of the relevant field and in this invention, and shall not be interpreted in an idealized or overly formalistic manner.

[0032] Furthermore, in the description of the examples, detailed descriptions of well-known related structures or functions will be omitted when it is believed that such detailed descriptions would lead to a vague interpretation of the present invention.

[0033] With the development of wind power generation technology, the power density and heat flux density of converters have significantly increased. Traditional air-cooling or water-cooling methods may suffer from insufficient heat dissipation efficiency in high-power-density applications. This application introduces phase change evaporative cooling technology, employing an immersion cooling system. The power modules of the converter are housed within a casing, and a cooling medium is placed within the casing, allowing the cooling medium to directly contact the electronic components of the converter. This immersion phase change method removes heat from the converter, thereby improving its heat dissipation efficiency and ensuring stable operation at high power densities. Evaporative cooling is a technology or process that utilizes the endothermic effect of liquid evaporation to lower the temperature. When a liquid (cooling medium) evaporates, it needs to absorb heat from the surrounding environment to overcome the binding forces between liquid molecules, thus transforming into a gaseous state. This process leads to a decrease in the temperature of the surrounding environment because the heat required for liquid evaporation is extracted from the surrounding environment.

[0034] The heat-generating components in a converter mainly include IGBT modules and various semiconductor electronic components such as diodes. During the cooling process using a phase-change cooling medium, the contact area between the cooling medium and the electronic components directly affects the cooling efficiency. Therefore, according to embodiments of this application, in order to maximize the contact between the heat-generating components and the cooling medium and improve heat dissipation efficiency when applying phase-change evaporative cooling technology, this application provides a support structure for supporting electronic components within the enclosure of an immersion cooling system.

[0035] To provide sufficient support for the IGBT module during the phase change evaporative cooling process, this application provides a support structure that maintains structural stability and reliability while achieving efficient heat dissipation, thereby ensuring the long-term stable operation of the wind turbine generator converter. This provides an efficient and reliable heat dissipation solution for the wind turbine generator converter, significantly improving the overall system performance and stability.

[0036] The following will combine Figures 1 to 9 This invention introduces the support structure 10, electronic component assembly, housing assembly, integrated electronic component structure, converter, and wind turbine generator set provided by embodiments of the present invention.

[0037] like Figure 6 and Figure 8 As shown, a first aspect embodiment of this disclosure provides a support structure 10 for mounting in a housing 40 to support electronic components. The housing 40 is filled with a cooling medium, and the electronic components are fixedly mounted on the support structure 10. This arrangement allows the cooling medium to immerse and directly contact the electronic components, enabling heat exchange between them, improving heat exchange efficiency, and preventing the electronic components from overheating.

[0038] The cooling medium is an insulating cooling medium, such as fluorinated liquid. Fluorinated liquid usually refers to fluorinated organic liquid compounds, including perfluorocarbons, hydrofluoroethers, perfluoropolyethers, etc.

[0039] For the support structure 10, in some embodiments, such as Figure 1 , Figure 2 and Figure 3 As shown, the support structure 10 is a hollow component, which is used to expose the mounting surface of the electronic components facing the support structure 10. This allows the mounting surface of the electronic components facing the support structure 10 to be exposed to the cooling medium, so that the electronic components can receive sufficient cooling and prevent local overheating.

[0040] Furthermore, in some embodiments, such as Figure 1 , Figure 2 and Figure 3 As shown, the support structure 10 includes a support substrate 110, which has a first surface 111 and a second surface 112 facing each other. The first surface 111 is provided with a plurality of electronic component mounting areas, and a first through hole 113 is provided in the electronic component mounting area, so that after the electronic component is mounted in the electronic component mounting area, it can be exposed to the second surface 112 of the support substrate 110 through the first through hole 113. With this configuration, the support substrate 110 can be used to mount electronic components, and the first through hole 113 in the support substrate 110 allows the surface of the electronic component facing the support substrate 110 to also be exposed, thereby allowing the electronic component to fully contact the cooling medium, so that the electronic component is fully cooled, avoiding local overheating of the electronic component, and reducing the risk of failure caused by local overheating of the electronic component.

[0041] In some embodiments, such as Figure 1 , Figure 2 and Figure 4 As shown, the support substrate 110 may also be provided with a second through hole 116. There may be multiple second through holes 116, and one or more second through holes 116 may be provided between two adjacent electronic component mounting areas. The second through holes 116 also allow the cooling medium to pass through the support substrate 110, which is beneficial to the flow of the cooling medium.

[0042] Conversely, if no through-holes are provided in the support substrate 110, the substrate of the electronic component and the support substrate are in direct contact, with no gap or a small gap between them. It is difficult for the liquid cooling medium to directly cool the substrate side of the electronic component. Even if a small amount of liquid enters between the substrate side of the electronic component and the support substrate, the gaseous cooling medium, when vaporized, adheres to the surface of the electronic component, isolating it from the liquid cooling medium and increasing thermal resistance, thus affecting heat exchange efficiency. According to the embodiments of this application, through-holes are provided in the support substrate 110. When the temperature of the electronic component is high and the cooling medium vaporizes, the gaseous cooling medium can also escape through the first through-hole 113 and the second through-hole 116, allowing the liquid cooling medium to replenish the area around the electronic component in a timely manner. This creates flow and exchange of cooling medium around the electronic component, improving heat exchange efficiency and further preventing the electronic component from overheating.

[0043] In some embodiments, such as Figure 1 , Figure 2 , Figure 3 and Figure 4 As shown, the support substrate 110 is also provided with a first connecting hole 114 for mounting electronic components onto the support substrate 110 via connectors. The first connecting hole 114 is arranged around the outer periphery of the first through hole 113. With this arrangement, electronic components can be fixedly mounted onto the support substrate 110 using bolts or other connectors, resulting in a simple and secure connection. Specifically, the electronic component can be provided with a fixing hole for bolts or other connectors to pass through. The position of the fixing hole corresponds to the first connecting hole 114. The bolts or other connectors pass through the fixing hole and the first connecting hole 114 in sequence, and are fixed to the electronic component and the support substrate 110 by a nut and bolt 420 on the other side of the support substrate 110.

[0044] According to embodiments of this application, a first circuit board 150 can also be provided on the chip side of the IGBT module. The first circuit board 150 can be mounted on the first surface of the support substrate 110, spaced apart from the IGBT module by a certain gap. As an example, the first circuit board 150 can also be mounted on the IGBT module, for example, on the frame of the IGBT module. The first circuit board 150 can be an adapter board. The main function of the adapter board of the IGBT module is to control the conduction and cutoff of the IGBT, provide current amplification and isolation functions, and implement protection functions. Specifically, the adapter board controls the conduction and cutoff of the IGBT by providing appropriate drive signals. When the IGBT needs to be turned on, sufficient voltage and current are provided; when it needs to be turned off, the drive signal is changed to disconnect the conduction of the IGBT. Providing current amplification and isolation functions: The adapter board can convert the low current signal of the control system into a sufficient current drive signal to realize current amplification. At the same time, the adapter board can also realize logic isolation, electrically isolating the control system from the power module to ensure the safety of the system. The adapter board has multiple protection functions, such as over-temperature protection, over-current protection, over-voltage protection, and short-circuit protection. These protection functions ensure the safe and stable operation of the system.

[0045] In some embodiments, such as Figure 1 , Figure 2 , Figure 4 and Figure 5 As shown, the support substrate 110 is also provided with a second connection hole 115, which is used to mount the circuit board assembly 30 onto the support substrate 110 via connectors. The second connection hole 115 is located on the outer side of the IGBT module mounting area. With this configuration, the circuit board assembly 30 and the support substrate 110 can be fixedly connected by bolts or other connectors, resulting in a simple and secure connection. Specifically, the circuit board assembly 30 is provided with fixing holes for bolts or other connectors to pass through. The positions of the fixing holes correspond to the second connection hole 115. Bolts or other connectors pass through the fixing holes and the second connection hole 115 in sequence, and the electronic components and the support substrate 110 are fixed on the other side of the support substrate 110 by nuts and bolts.

[0046] Furthermore, such as Figure 4 and Figure 5 As shown, the circuit board assembly 30 may include a second circuit board 320 and a circuit board support 310. The circuit board support 310 is an insulating board, disposed between the second circuit board 320 and the support substrate 110 to isolate the second circuit board 320 and the support substrate 110, thus insulating them. The second circuit board 320 and the circuit board support 310 can be connected by snap-fit. As an example, plastic snap-fit ​​can be optionally used, which has the advantages of good insulation and low cost.

[0047] Furthermore, such asFigure 4 and Figure 5 As shown, long bolts can be used to connect the support substrate 110 and the circuit board assembly 30, leaving a certain space between the support substrate 110 and the second circuit board 320 for mounting electronic components. Further, the following explanation uses an IGBT module 20 as an example of an electronic component.

[0048] like Figure 1 , Figure 2 and Figure 3 As shown, the multiple electronic component mounting areas include multiple IGBT module mounting areas. The electronic components include IGBT modules 20, which are mounted in the IGBT module mounting areas. Each IGBT module mounting area has a first through-hole 113, allowing the substrate side of the IGBT module 20 to be exposed to the second surface 112. This arrangement ensures that both the chip side and the substrate side of the IGBT module 20 are exposed to the cooling medium, resulting in sufficient cooling of the IGBT module 20, preventing excessively high local temperatures, and reducing the risk of failure due to localized overheating.

[0049] Furthermore, such as Figure 1 , Figure 2 and Figure 3 As shown, the first surface 111 includes a first region and a second region arranged side by side in the width direction of the support substrate 110. Multiple IGBT module mounting areas are respectively provided in the first region and the second region. The IGBT module mounting areas in the first region and the IGBT module mounting areas in the second region are arranged in a triangular pattern.

[0050] This arrangement, by placing the IGBT modules 20 in the first region and the second region in a triangular pattern, allows the IGBT modules 20 and diodes to be packaged together according to a specific circuit topology. This topology provides advantages such as integration, improved reliability, optimized performance, and simplified application of electronic components. It reduces external wiring, integrates multiple power devices within the same module 20, shortens the connection length between devices, and reduces parasitic inductance and resistance, thereby reducing switching losses and electromagnetic interference. Furthermore, this application arranges the IGBT module mounting areas on the support substrate 110 according to the topological arrangement, which facilitates the formation of the topology after the IGBT modules 20 are mounted on the support substrate 110.

[0051] It is understandable that the IGBT module mounting area of ​​the support substrate 110 forms multiple triangular shapes, such as three triangular shapes, that is, three IGBT modules 20 are mounted in the first area and six IGBT modules 20 are mounted in the second area, forming a three-level three-parallel topology; or, the IGBT module mounting area of ​​the support substrate 110 forms four triangular shapes, that is, four IGBT modules 20 are mounted in the first area and eight IGBT modules 20 are mounted in the second area, forming a three-level four-parallel topology, etc.

[0052] The support structure 10 is used to support electronic components such as power modules within the enclosure 40 of the immersion cooling system. To connect the support structure 10 to the enclosure 40, in some embodiments, such as... Figure 6 , Figure 7 , Figure 8 and Figure 9 As shown, the support structure 10 also includes a connecting portion 120, which bends and extends a predetermined width relative to the support substrate 110 from a first end in the longitudinal direction of the support substrate 110. This configuration allows the connecting portion 120 to connect to the wall of the housing 40, thereby fixing the support structure 10 within the housing 40. The connecting portion 120 maintains a certain distance between the support substrate 110 and the wall of the housing 40, creating space for the electronic components and the circuit board assembly 30. Furthermore, the connecting portion 120 is provided with multiple through holes 121, which also allow cooling medium to pass through, facilitating the flow of cooling medium. In some embodiments, the connecting portion 120 may also be bent from the first end in the width direction of the support substrate 110.

[0053] Furthermore, in some embodiments, such as Figure 6 and Figure 7 As shown, the outer periphery of the connecting part 120 is provided with a flange 122, and the flange 122 is provided with a mounting hole 123 for connecting with the side panel 410 of the box body 40. With this configuration, the box wall of the box body 40 includes the side panel 410, the outer periphery of the connecting part 120 is provided with a flange 122, the flange 122 fits against the side panel 410, and screws or bolts 420 pass through the mounting hole 123 of the flange 122 and are locked to the side panel 410, thereby realizing the connection between the connecting part 120 and the side panel 410.

[0054] Furthermore, as an example, the housing 40 may optionally include a reinforcing rib 411, which is fixed to the side plate 410 of the housing and can improve the structural strength of the side plate 410 of the housing and prevent the housing 40 from deforming. The flange 122 is attached to the reinforcing rib 411 and the flange 122 is connected to the reinforcing rib 411 by screws or bolts 420, etc.

[0055] Furthermore, in some embodiments, such as Figure 8 andFigure 9 As shown, the support structure 10 also includes a folded edge 130, which is bent from the second end of the support substrate 110 along its length and extends a predetermined width relative to the support substrate 110 for connection with the bottom plate 430 of the housing 40. The connecting portion 120 and the folded edge 130 are located at opposite ends of the support substrate 110. With this configuration, the housing wall of the housing 40 also includes the bottom plate 430, and the folded edge 130 fits against the bottom plate 430. Screws or bolts 420 pass through the mounting holes 123 of the folded edge 130 and are locked to the bottom plate 430, thus achieving the connection between the connecting portion 120 and the bottom plate 430. In some embodiments, the folded edge 130 may also be bent from the second end of the support substrate 110 along its width.

[0056] Furthermore, such as Figure 8 and Figure 9 As shown, the folded edge 130 can also be used to install other electronic components, such as resistors, so that resistors, IGBT modules 20, circuit board assemblies 30 and other electronic components can be integrated into the support structure 10 and installed together in the housing 40.

[0057] Furthermore, as an example, the housing 40 may optionally include a support base, which is fixed to the bottom plate 430 of the housing, and the flange 130 is fitted with the support base, and the flange 130 is connected to the support base by screws or bolts 420, etc.

[0058] A second aspect of this disclosure provides an electronic component assembly, which includes a support structure 10 as described in any of the first aspects of this disclosure and electronic components mounted on the support structure 10.

[0059] The electronic component assembly provided in this embodiment has all the beneficial effects of the support structure 10 provided in any embodiment of the first aspect, which will not be listed here.

[0060] In some embodiments, such as Figure 4 and Figure 5 As shown, the electronic component assembly includes an IGBT module 20 and a first circuit board 150. The IGBT module 20 is mounted on the first surface 111 of the support substrate 110, and the first circuit board 150 can be directly mounted on the support substrate 110 or mounted on the IGBT module 20.

[0061] Furthermore, such as Figure 4 and Figure 5 As shown, only in Figure 5The diagram illustrates an IGBT module 20 and a first circuit board 150. The electronic component assembly may further include a circuit board assembly 30. The circuit board assembly 30 is connected to the first surface 111 of the support substrate 110. The first circuit board 150 is mounted on the IGBT module 20, and at least a portion of the first circuit board 150 is located between the IGBT module 20 and the circuit board assembly 30 in the thickness direction of the support substrate 110. This arrangement allows the first circuit board 150 and the circuit board assembly 30 to be stacked, making efficient use of space. The first circuit board 150 can be an adapter board, the second circuit board 320 can be a driver board, and the circuit board support 310 is an insulating board. The circuit board support 310 is disposed between the second circuit board 320 and the first circuit board 150 to isolate them and provide insulation.

[0062] In some embodiments, the electronic component assembly further includes a resistor mounted to the support structure 10. Figure 8 and Figure 9 As shown, the resistor is connected to the folded edge 130 of the support structure 10, so that the resistor, IGBT module 20, circuit board assembly 30, first circuit board 150 and other electronic components can be integrated into the support structure 10 and installed together in the housing 40.

[0063] A third aspect of this disclosure provides a housing assembly including a housing 40 and a support structure 10 as described in any of the first aspects of this disclosure, the support structure 10 being installed in the housing 40.

[0064] The housing assembly provided in this embodiment has all the beneficial effects of the support structure 10 provided in any embodiment of the first aspect, which will not be listed here.

[0065] Furthermore, the enclosure 40 is a sealed enclosure that can be filled with cooling medium. The support structure 10 is immersed in the cooling medium, so that the electronic components installed on the support structure 10 are immersed in the cooling medium and come into direct contact with the cooling medium, thereby improving the heat dissipation effect on the electronic components.

[0066] A fourth aspect of this disclosure provides an electronic component integration structure, the electronic component integration structure including a housing 40 and electronic component assemblies as described in any of the second aspect embodiments of this disclosure.

[0067] The electronic component integration structure provided in this embodiment has all the beneficial effects of the immersion cooling system provided in any embodiment of the third aspect, which will not be listed here.

[0068] A fifth aspect of this disclosure provides a converter including a cabinet and an electronic component integration structure as described in any of the fourth aspect embodiments of this disclosure, the electronic component integration structure being mounted in the cabinet.

[0069] The converter provided in this embodiment has all the beneficial effects of the electronic component integration structure provided in any embodiment of the fourth aspect, which are not listed here.

[0070] Furthermore, as an example, optionally, the converter is provided with an integrated structure of multiple electronic components, and multiple housings 40 can be stacked vertically and / or arranged side by side horizontally.

[0071] A sixth aspect of this disclosure provides a wind turbine generator set, which includes a tower, a nacelle mounted on the tower, a hub mounted on one side of the nacelle, and a converter as described in any of the fifth aspect embodiments of this disclosure. The converter may be installed in the tower, the nacelle, or the hub.

[0072] The wind turbine generator provided in this embodiment has all the beneficial effects of the converter provided in any embodiment of the fifth aspect, which will not be listed here.

[0073] While the embodiments of the present invention have been described in detail above, those skilled in the art can make various modifications and variations to the embodiments of the present invention without departing from the spirit and scope thereof. It should be understood that, to those skilled in the art, these modifications and variations will still fall within the spirit and scope of the embodiments of the present invention as defined in the claims.

Claims

1. A support structure, characterized in that, The support structure (10) is used to install in the housing (40) to support electronic components. The support structure (10) includes a support substrate (110). The support substrate (110) has a first surface (111) and a second surface (112) opposite to each other. The first surface (111) is provided with a plurality of electronic component mounting areas. A first through hole (113) is provided in the electronic component mounting area so that after the electronic component is installed in the electronic component mounting area, it can be exposed to the second surface (112) of the support substrate (110) through the first through hole (113).

2. The support structure according to claim 1, characterized in that, The support substrate (110) is also provided with a first connection hole (114) for mounting the electronic component to the support substrate (110) via a connector. The first connection hole (114) is provided around the outer periphery of the first through hole (113).

3. The support structure according to claim 1, characterized in that, The plurality of electronic component mounting areas include a plurality of IGBT module mounting areas for mounting IGBT modules (20), and each IGBT module mounting area is provided with a first through hole (113) for exposing the substrate side of the IGBT module (20) to the second surface (112).

4. The support structure according to claim 3, characterized in that, The first surface (111) includes a first region and a second region arranged side by side in the width direction of the support substrate (110). A plurality of IGBT module mounting areas are respectively provided in the first region and the second region. The IGBT module mounting areas provided in the first region and the IGBT module mounting areas provided in the second region are arranged in a triangular pattern.

5. The support structure according to claim 1, characterized in that, The support substrate (110) is also provided with at least one second through hole (116), which is disposed between two adjacent electronic component mounting areas.

6. The support structure according to claim 3, characterized in that, The support substrate (110) is also provided with a second connection hole (115) for mounting the circuit board assembly (30) to the support substrate (110) via a connector. The second connection hole (115) is located on the outside of the IGBT module mounting area.

7. The support structure according to any one of claims 1 to 6, characterized in that, The support structure (10) further includes a connecting portion (120), the support substrate has a first end and a second end opposite to each other in a first direction, the connecting portion (120) bends from the first end of the support substrate (110) relative to the support substrate (110) and extends a predetermined width, and the connecting portion (120) is provided with a plurality of connecting holes (121).

8. The support structure according to claim 7, characterized in that, The outer periphery of the connecting part (120) is provided with a flange (122), and the flange (122) is provided with a mounting hole (123) for connecting with the box side plate (410) of the box body (40).

9. The support structure according to claim 7, characterized in that, The support structure (10) further includes a folded edge (130), which is bent from the second end of the support substrate (110) relative to the support substrate (110) and extends a predetermined width for connection with the bottom plate (430) of the housing (40), wherein the connecting part (120) and the folded edge (130) are disposed at opposite ends of the support substrate (110).

10. An electronic component assembly, characterized in that, The electronic component assembly includes a support structure (10) as claimed in any one of claims 1 to 9 and electronic components mounted on the support structure (10).

11. The electronic component assembly according to claim 10, characterized in that, The electronic component assembly includes an IGBT module (20), a first circuit board (150), and a circuit board assembly (30). The IGBT module (20) is mounted on a first surface (111) of the support substrate (110). The circuit board assembly (30) is connected to the first surface (111) of the support substrate (110). The first circuit board (150) is mounted on the IGBT module (20), and at least a portion of the first circuit board (150) is located between the IGBT module (20) and the circuit board assembly (30) in the thickness direction of the support substrate (110).

12. The electronic component assembly according to claim 11, characterized in that, The circuit board assembly includes a second circuit board (320) and a circuit board bracket (310). The circuit board bracket (310) is connected to a first surface (111) of the support substrate (110). The second circuit board (320) is mounted on the circuit board bracket (310). The circuit board bracket (310) is separated from the first circuit board (150) by a predetermined gap.

13. The electronic component assembly according to claim 12, characterized in that, The first circuit board (150) is an adapter board, and the second circuit board (320) is a driver board.

14. The electronic component assembly according to claim 10, characterized in that, The electronic component assembly also includes a resistor mounted on the support structure (10).

15. A housing assembly, characterized in that, The housing (40) assembly includes a housing (40) and a support structure (10) as claimed in any one of claims 1 to 9, the support structure (10) being installed in the housing (40).

16. An integrated structure for electronic components, characterized in that, The integrated electronic component structure includes a housing (40) and an electronic component assembly as described in any one of claims 10-14, mounted in the housing (40).

17. A converter, characterized in that, The converter includes a cabinet and an integrated electronic component structure as described in claim 16, the integrated electronic component structure being installed in the cabinet.

18. A wind turbine generator set, characterized in that, The wind turbine generator set includes a tower, a nacelle mounted on the tower, a hub mounted on one side of the nacelle, and a converter as described in claim 17.

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