Circuit board structure, heat dissipation device and energy storage device
Patent Information
- Application Number
- CN202521858907.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-08-29
- Publication Date
- 2026-10-30
- Estimated Expiration
- 2035-08-29
AI Technical Summary
[0003]本申请的发明人发现,现有的电源模块需要在外壳上设计特定的结构,或者需要定制结构来固定风扇等散热组件,其制造难度大,开模成本高,装配过程也比较复杂
[0015]本申请实施例的有益效果是:电路板结构的固定件可相对电路板本体拆卸,并且固定件与风扇连接之后可构成插接件,与电路板本体上的插接槽插接连接,制造结构简单,装配难度小,可以降低生产成本。
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Figure CN224924038U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of heat dissipation technology for electronic devices, and in particular to a circuit board structure, heat dissipation device, and energy storage device. Background Technology
[0002] Modern power modules are constantly pursuing high power density and low cost design, which leads to further compression of the number of power devices and their layout space. To design good heat dissipation conditions, not only are there extremely high requirements for the layout of power flow and space utilization, but also the design of air ducts and the placement of fans cannot be underestimated.
[0003] The inventors of this application have discovered that existing power modules require specific structures to be designed on the casing, or require customized structures to fix heat dissipation components such as fans, which are difficult to manufacture, have high mold opening costs, and are also relatively complicated in the assembly process. Utility Model Content
[0004] This application provides a circuit board structure, a heat dissipation device, and an energy storage device. The fixing component of the circuit board structure can be detached from the circuit board body, and the fixing component can be connected with the fan to form a connector, which can be plugged into the connector slot on the circuit board body. The manufacturing structure is simple, the assembly is easy, and the production cost can be reduced.
[0005] In a first aspect, embodiments of this application provide a circuit board structure, including a circuit board body and a fixing member. The circuit board body is provided with a insertion slot; the fixing member is integrally connected to the circuit board body, the fixing member is configured to be detachable relative to the circuit board body, and is installed in the insertion slot, the fixing member and the circuit board body forming an installation area.
[0006] In some embodiments, there are multiple fasteners, which are spaced apart at the edges of the circuit board body. There are also multiple insertion slots, which are spaced apart in a first direction and / or in a second direction. Each insertion slot can accommodate at least one fastener. The first and second directions are perpendicular to each other and both are perpendicular to the thickness direction of the circuit board body.
[0007] In some embodiments, along the first direction, the closest distance L1 between two adjacent plug slots satisfies: 0mm≤L1≤40mm, and the farthest distance L2 between two adjacent plug slots satisfies: 40mm<L2≤120mm; and / or, along the second direction, the distance L3 between two adjacent plug slots satisfies: 16mm≤L3≤25mm; or, the distance L4 between two intermittent plug slots satisfies: 16mm≤L4≤25mm.
[0008] In some embodiments, the fastener includes a main body and a connecting portion, the connecting portion connecting the main body and the circuit board body, wherein at least a portion of the thickness of the connecting portion is less than the thickness of the circuit board body along the thickness direction of the circuit board body, and the connecting portion is configured to be separable relative to the circuit board body; when the connecting portion is inserted into the insertion slot, the main body protrudes from the circuit board body in the thickness direction of the circuit board body.
[0009] In some embodiments, the main body portion is provided with a first fixing portion, which is configured to connect to the fan to be assembled.
[0010] Secondly, embodiments of this application provide a heat dissipation device, including a fan and the aforementioned circuit board structure; the fixing member is inserted into the insertion slot of the circuit board body, the fan is disposed in the mounting area, and the housing of the fan abuts against the fixing member.
[0011] In some embodiments, the fastener has a first fixing part, the fan has a second fixing part, the first fixing part is connected to the second fixing part, and the fan is fixed to the circuit board body.
[0012] In some embodiments, the first fixing part includes a through hole or a screw hole, the second fixing part includes a screw hole, and the heat dissipation device further includes a locking member, which passes through the first fixing part and is screwed to the second fixing part.
[0013] In some embodiments, the fastener has a first welding portion, the circuit board body has a second welding portion, and the first welding portion and the second welding portion are welded together.
[0014] Thirdly, embodiments of this application provide an energy storage device, including the aforementioned heat dissipation device.
[0015] The beneficial effects of the embodiments of this application are: the fixing component of the circuit board structure can be disassembled relative to the circuit board body, and the fixing component can form a plug-in component after being connected with the fan, which can be plugged into the plug-in slot on the circuit board body. The manufacturing structure is simple, the assembly difficulty is small, and the production cost can be reduced. Attached Figure Description
[0016] To more clearly illustrate the technical solutions in the specific embodiments of this application, the accompanying drawings used in the description of the specific embodiments will be briefly introduced below. In all the drawings, similar elements or parts are generally identified by similar reference numerals. In the drawings, the elements or parts are not necessarily drawn to scale.
[0017] Figure 1 This is a schematic diagram of the circuit board structure according to an embodiment of this application; Figure 2 yes Figure 1 A magnified view of part A in the image; Figure 3 This is a partial schematic diagram of the circuit board structure according to an embodiment of this application; Figure 4 This is an exploded view of the assembly of the fastener and fan in the circuit board structure of an embodiment of this application; Figure 5 This is an exploded view of the heat dissipation device according to an embodiment of this application. Detailed Implementation
[0018] To facilitate understanding of this application, a more detailed description is provided below with reference to the accompanying drawings and specific embodiments. It should be noted that when an element is described as "fixed to" another element, it can be directly on the other element, or one or more intermediate elements may exist between them. When an element is described as "connected" to another element, it can be directly connected to the other element, or one or more intermediate elements may exist between them. The terms "upper," "lower," "inner," "outer," "vertical," "horizontal," etc., used in this specification indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. Furthermore, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance.
[0019] Unless otherwise defined, all technical and scientific terms used in this specification have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in this specification is for the purpose of describing particular embodiments only and is not intended to limit the scope of the application. The term "and / or" as used in this specification includes any and all combinations of one or more of the associated listed items.
[0020] Furthermore, the technical features involved in the different embodiments of this application described below can be combined with each other as long as they do not conflict with each other.
[0021] Please see Figure 1 and Figure 2 This application provides a circuit board structure 100, which includes a circuit board body 10 and a fixing member 20. The circuit board body 10 is provided with a plug-in slot 11; the fixing member 20 is integrally connected to the circuit board body 10, the fixing member 20 is configured to be detachable relative to the circuit board body 10, and is installed in the plug-in slot 11. The fixing member 20 and the circuit board body 10 form a mounting area 12, which is used to install a heat dissipation structure.
[0022] The circuit board structure 100 of this application embodiment is designed to have two parts: a circuit board body 10 and a fixing member 20. The circuit board body 10 has a insertion slot 11. When the fixing member 20 is detached from the circuit board body 10, it can be inserted into the insertion slot 11. Thus, the fixing member 20 and the circuit board body 10 form a mounting area 12 for placing the fan 200. Compared to setting specific structures on the housing or customizing special fixing structures, the circuit board structure 100 of this application embodiment, through its ingenious design and assembly to fix the fan 200, is simpler and has lower manufacturing costs. For an example, please refer to... Figure 1 The initial circuit board is cut and processed according to a preset structure to obtain the circuit board structure 100 described in this application embodiment.
[0023] In some embodiments, please refer to Figure 1 and Figure 2 The number of insertion slots 11 is multiple, and the multiple insertion slots 11 are spaced apart in the first direction X and / or spaced apart in the second direction Y. Each insertion slot 11 can be inserted into at least one fixing member 20. The first direction X and the second direction Y are perpendicular to each other and are both perpendicular to the thickness direction Z of the circuit board body 10.
[0024] By providing multiple insertion slots 11 on the circuit board body 10, with at least one fixing member 20 on each insertion slot 11, the fan 200 can be fixed in different positions, ensuring the fan 200's sturdiness. Furthermore, the fan 200 can be installed and fixed in different positions on the circuit board body 10 according to actual needs, offering high adjustability. In addition, multiple insertion slots 11 also facilitate the installation of fans 200 of different specifications and sizes on the circuit board body 10, resulting in a flexible structure and strong compatibility.
[0025] In some embodiments, please refer to Figure 1 and Figure 2 There are multiple fasteners 20, which are spaced apart along the edge of the circuit board body 10. These fasteners 20 can be plugged into multiple insertion slots 11, improving the securing effect on the fan 200. The placement of the multiple fasteners 20 along the edge of the circuit board body 10 also facilitates manufacturing and disassembly.
[0026] For example, there can be two fasteners 20, positioned opposite each other on both sides of the fan 200; or there can be three fasteners 20, positioned adjacent to each other on the side of the fan 200; or four fasteners 20 can be positioned at the four corners of the fan 200. Of course, five, six, or more fasteners 20 can also be provided. Using multiple fasteners 20 not only further enhances the securing effect on the fan 200 but also allows for some redundant fasteners 20, which can be promptly replaced if a fastener 20 connected to the fan 200 is lost or malfunctions.
[0027] In some embodiments, please refer to Figure 1 and Figure 3 Along the first direction X, the closest distance L1 between two adjacent socket slots 11 satisfies: 0mm ≤ L1 ≤ 40mm, and the farthest distance L2 between two adjacent socket slots satisfies: 40mm < L2 ≤ 120mm. It is worth noting that when L1 is 0mm, it indicates that the two socket slots 11 are connected. By limiting the dimensions of two adjacent socket slots 11 to the above range, it is convenient to install fans 200 of different sizes in the socket slots 11.
[0028] As examples, the conventional length of the fan 200 in the first direction X is generally 40mm, 60mm, 80mm, 120mm, etc. Therefore, this application designs the closest distance L1 between two adjacent insertion slots 11 to be no more than 40mm, so that fans 200 with a length of 40mm or more can be directly installed, avoiding the need to develop new sizes of fans 200. In one embodiment, the closest distance L1 is 40mm and the farthest distance L2 is 120mm.
[0029] In some embodiments, please refer to Figure 1 and Figure 3 Along the second direction Y, the distance L3 between two adjacent plug slots 11 satisfies: 16mm≤L3≤25mm; or, the distance L4 between two spaced plug slots 11 satisfies: 16mm≤L4≤25mm.
[0030] As examples, the conventional thickness of the fan 200 in the second direction Y is generally 16mm, 25mm, etc. Therefore, this application sets the distance between two adjacent or spaced-apart plug slots 11 within the above-mentioned range, which can accommodate existing sizes of fan 200 and avoid the need to develop new sizes of fan 200. In one embodiment, the distance L3 between two adjacent plug slots 11 is 16mm, and the distance L4 between two spaced-apart plug slots 11 is 25mm.
[0031] In some embodiments, please refer to Figure 2The fastener 20 includes a main body 21 and a connecting portion 22, the connecting portion 22 connecting the main body 21 and the circuit board body 10. Along the thickness direction Z of the circuit board body 10, at least a portion of the thickness of the connecting portion 22 is less than the thickness of the circuit board body 10, and the connecting portion 22 is configured to be separable relative to the circuit board body 10. When the connecting portion 22 is inserted into the insertion slot 11, the main body 21 protrudes from the circuit board body 10 in the thickness direction Z.
[0032] By providing a connecting portion 22 on the fastener 20, and by making the thickness of the connecting portion 22 smaller in certain areas, it is easier to remove the fastener 20 from the circuit board body 10. Furthermore, when the connecting portion 22 is inserted into the insertion slot 11, the main body 21 remains protruding, thereby limiting and fixing the fan 200. As an example, during the initial circuit board processing, a portion of the connecting portion 22 can be thinned using a milling cutter, making it easier for assembly workers or automated robotic arms to break off the fastener 20 at the connecting portion 22, thus separating the fastener 20 from the circuit board body 10. This reduces the difficulty of disassembly and also helps to make the end face at the disassembly point smoother, reducing burrs and sharp edges.
[0033] In a further embodiment, a separation groove 222 can be made at the connection between the connecting part 22 and the circuit board body 10 by cutting. The remaining thickness of the separation groove 222 is less than the thickness of the circuit board body 10, so as to make it easier to break off the connecting part 22 and the main body 21.
[0034] In some embodiments, please refer to Figure 2 The main body 21 is provided with a first fixing part 211, which is configured to connect with the fan 200 to be assembled. By providing the first fixing part 211 on the main body 21, it is easier to further fix the fan 200 to the circuit board body 10, thereby enhancing the firmness.
[0035] Please see Figure 4 and Figure 5 This application further provides an embodiment of a heat dissipation device 1000, which includes a fan 200 and the aforementioned circuit board structure 100. The fan 200 and the circuit board structure 100 can be assembled in various ways. As a first example, after removing the fixing member 20 from the circuit board body 10, the fixing member 20 is inserted into the insertion slot 11 of the circuit board body 10 to form a mounting area 12. The fan 200 is then placed in the mounting area 12, and the fan 200 and the fixing member 20 are connected and fixed. As a second example, after removing the fixing member 20 from the circuit board body 10, the fixing member 20 is fixedly connected to the fan 200. In this case, the fan 200 can form a connector, and the fan 200 connector is then inserted into the insertion slot 11, thus fixing the fan 200 to the circuit board body 10.
[0036] It is understandable that the fastener 20 can be fixedly connected to the fan 200 by non-removable means such as adhesive bonding, or it can be fixedly connected to the fan 200 by detachable means such as screw connection or snap connection.
[0037] In some embodiments, please refer to Figure 4 The fixing member 20 is provided with a first fixing part 211, and the fan 200 is provided with a second fixing part 201. When the first fixing part 211 is connected to the second fixing part 201, the fan 200 is fixed to the circuit board body 10. With the above structure, the fan 200 can be further fixed to the circuit board body 10.
[0038] As an example, the first fixing part 211 includes a through hole or a screw hole, the second fixing part 201 includes a screw hole, and the heat dissipation device 1000 also includes a locking member 30. The locking member 30 can be a bolt or a screw. After passing through the first fixing part 211, the locking member 30 is screwed to the second fixing part 201. In this way, the fixing member 20 can be fixed on the housing of the fan 200. At this time, the fan 200 can constitute a plug-in component.
[0039] Specifically, the main body 21 of the fastener 20 is provided with the aforementioned first fastening portion 211. When the main body 21 is fixed to the outer casing of the fan 200, the connecting portion 22 of the fastener 20 protrudes from the outer casing of the fan 200, forming a pin-like structure (e.g., Figure 5 As shown), this facilitates the connection between the assembly of the fastener 20 and the fan 200 and the circuit board body 10.
[0040] It is understood that in some embodiments, the fastener 20 can be inserted into the socket 11 via an interference fit between the connecting portion 22 and the insertion slot 11. In other embodiments, please refer to... Figure 2 The fastener 20 has a first welding part 221 on its connecting part 22 and a second welding part 13 on its circuit board body 10. The first welding part 221 and the second welding part 13 are fixedly connected by wave soldering. Furthermore, the second welding part 13 is disposed adjacent to the insertion slot 11.
[0041] As an example, such as Figure 1 As shown, the initial circuit board is first processed according to the preset structure to obtain the circuit board structure 100. The circuit board structure 100 first undergoes SMT surface mount technology (SMT) to solder the required surface mount components onto the circuit board body 10 via reflow soldering. Then, DIP connector soldering is performed to insert the required connectors onto the circuit board body 10 (e.g., ...). Figure 5 (As shown), and remove the fastener 20 from the circuit board body 10, and fix the fastener 20 to the housing of the fan 200 with screws (as shown). Figure 4 As shown), to form a connector, and insert the connector into the connector slot 11 of the circuit board body 10 (as shown). Figure 5As shown), other connectors are plugged into other corresponding areas of the circuit board body 10. Then, the first solder part 221 and the second solder part 13 are fixedly connected by wave soldering to fix the other DIP connectors and the fan 200 together on the circuit board body 10, thus completing the assembly of the heat dissipation device 1000.
[0042] This application also provides an embodiment of an energy storage device, which includes the aforementioned heat dissipation device 1000. For the specific structure and function of the heat dissipation device 1000, please refer to the above embodiments, which will not be repeated here.
[0043] The above description is merely an embodiment of this application and does not limit the patent scope of this application. Any equivalent structural or procedural transformations made using the content of this application's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this application.
Claims
1. A circuit board structure, characterized in that, include: The circuit board body is equipped with a connector slot; A fastener is integrally connected to the circuit board body, the fastener is configured to be detachable relative to the circuit board body and is installed in the insertion slot, the fastener and the circuit board body forming an installation area; The fastener includes a main body and a connecting part, the connecting part connecting the main body and the circuit board body, and at least a portion of the thickness of the connecting part is less than the thickness of the circuit board body along the thickness direction of the circuit board body. The connecting part is configured to be separable relative to the circuit board body. When the connecting part is inserted into the insertion slot, the main body protrudes from the circuit board body in the thickness direction of the circuit board body.
2. The circuit board structure according to claim 1, characterized in that, The number of the fasteners is multiple, and the multiple fasteners are spaced apart on the edge of the circuit board body; The number of the insertion slots is multiple, and the multiple insertion slots are spaced apart in a first direction and / or spaced apart in a second direction. Each insertion slot can be inserted into at least one of the fixing members. The first direction and the second direction are perpendicular to each other and are both perpendicular to the thickness direction of the circuit board body.
3. The circuit board structure according to claim 2, characterized in that, Along the first direction, the closest distance L1 between two adjacent plug slots satisfies: 0mm≤L1≤40mm, and the farthest distance L2 between two adjacent plug slots satisfies: 40mm<L2≤120mm.
4. The circuit board structure according to claim 2, characterized in that, Along the second direction, the distance L3 between two adjacent or spaced-apart plug slots satisfies: 16mm≤L3≤25mm, or the distance L4 between two spaced-apart plug slots satisfies: 16mm≤L4≤25mm.
5. The circuit board structure according to claim 1, characterized in that, The main body is provided with a first fixing part, which is configured to connect with the fan to be assembled.
6. A heat dissipation device, characterized in that, Includes a fan and the circuit board structure as described in claim 1 or 2; The fastener is inserted into the insertion slot of the circuit board body, the fan is disposed in the mounting area, and the housing of the fan abuts against the fastener.
7. The heat dissipation device according to claim 6, characterized in that, The fastener has a first fixing part, and the fan has a second fixing part. The first fixing part is connected to the second fixing part, and the fan is fixed to the circuit board body.
8. The heat dissipation device according to claim 7, characterized in that, The first fixing part includes a through hole or a screw hole, the second fixing part includes a screw hole, and the heat dissipation device further includes a locking member, which passes through the first fixing part and is screwed to the second fixing part.
9. The heat dissipation device according to claim 6, characterized in that, The fastener has a first welding part, and the circuit board body has a second welding part. The first welding part and the second welding part are welded together.
10. An energy storage device, characterized in that, Includes the heat dissipation device as described in any one of claims 6-9.