A heat dissipation structure

Abstract

The utility model provides a kind of heat dissipation structure, it is related to the field of circuit board heat dissipation.The heat dissipation structure is used to immerse in coolant;The heat dissipation structure includes circuit board and turbine, turbine is set on the board surface of one side of circuit board, and electrically connected to circuit board;Turbine is used to drive coolant to flow through circuit board;Turbine has import for sucking in coolant and outlet for discharging coolant, the orientation of import and outlet is parallel to the board surface of circuit board, to make coolant flow along the direction parallel to the board surface of circuit board, and flow through the board surface of circuit board.The utility model changes the heat dissipation mode of traditional dependence external circulating pump or piezoelectric fan by integrating turbine in circuit board and driving coolant directional flow.And by the import and outlet of turbine orientation design is parallel to the board surface of circuit board, coolant can form adhering flow along circuit board surface, intensifies the scouring of component dense area, makes heat exchange more direct and efficient.

Description

Technical Field

[0001] This utility model belongs to the field of circuit board heat dissipation technology, and in particular relates to a heat dissipation structure. Background Technology

[0002] Immersion liquid cooling technology is becoming increasingly common in data centers. This technology places servers in liquid-cooled cabinets filled with coolant, using external circulation pumps to drive the coolant flow. Compared to air cooling, it achieves a more efficient heat dissipation effect. Current immersion liquid cooling solutions typically house multiple liquid-cooled servers within a liquid-cooled cabinet (TANK). An external cooling distribution unit (CDU) is connected to the TANK, and the CDU is equipped with a circulation pump that circulates the coolant within the TANK, thus removing heat from the servers. However, the complex internal structure of servers and high flow resistance mean that a significant amount of coolant bypasses the server, making it difficult to guarantee the effective heat dissipation of the liquid-cooled servers.

[0003] In existing technologies, piezoelectric fans are installed on the server's circuit boards to enhance the flow of coolant inside the server. The core structure of this piezoelectric fan is a cantilever beam, where one end is fixed (as a fulcrum), while the other end is suspended freely. When an alternating voltage is applied to the piezoelectric fan, its periodic elongation and contraction cause the entire cantilever beam to bend and vibrate. At this time, the free end will oscillate back and forth at a fixed frequency (similar to "swinging"), which can then impact the circuit board or cause it to vibrate. This vibration can not only lead to loose solder joints and poor contact on the circuit board, but may also accelerate fatigue damage to the circuit board itself, reducing the server's operational stability and lifespan. Utility Model Content

[0004] In view of this, the present invention provides a heat dissipation structure, which aims to solve the problems of low flow efficiency of coolant inside the server and damage to the circuit board caused by vibration in the existing immersion liquid cooling technology, so as to improve the heat dissipation effect while avoiding mechanical damage to the circuit board.

[0005] The technical solution of this utility model is implemented as follows:

[0006] This utility model provides a heat dissipation structure for immersion in coolant; the heat dissipation structure includes a circuit board and a turbine, the turbine being disposed on one side of the circuit board and electrically connected to the circuit board; the turbine is used to drive the coolant to flow through the circuit board, the turbine having an inlet for drawing in coolant and an outlet for discharging coolant, the inlet and the outlet being oriented parallel to the surface of the circuit board, so that the coolant flows in a direction parallel to the surface of the circuit board and flows through the surface of the circuit board.

[0007] In one embodiment, the device further includes a mounting plate vertically disposed on the circuit board, the mounting plate having a window, wherein: the turbine is mounted to the window of the mounting plate by fasteners, the inlet and / or the outlet are disposed facing the window; and / or, the diameter of the inlet and / or the outlet is adapted to the diameter of the window.

[0008] In one embodiment, multiple turbines are provided, and the mounting plate has multiple windows, with each turbine and each window corresponding to one another.

[0009] In one embodiment, a plurality of mounting plates are provided, and the plurality of mounting plates are spaced apart in the length direction of the circuit board; the plurality of mounting plates include at least two adjacent first mounting plates and second mounting plates, and at least one window of the first mounting plate is aligned with a window of the second mounting plate in the length direction of the circuit board.

[0010] In one embodiment, the first mounting plate and the second mounting plate have the same number of windows, and each window of the first mounting plate and each window of the second mounting plate correspond one-to-one in the length direction of the circuit board. The projections of the first mounting plate and the second mounting plate in the length direction of the circuit board are the same.

[0011] In one embodiment, the circuit board is provided with a plurality of sub-connectors, each of which is used to connect the wires of each turbine.

[0012] In one embodiment, in the length direction perpendicular to the circuit board, the cross-sectional profile of each turbine is quadrilateral, and each sub-connector is respectively set at an included angle close to the cross-sectional profile of the turbine.

[0013] In one embodiment, a master connector is provided on the edge of the circuit board, which is electrically connected to each of the sub-connectors via the circuit board; the master connector includes a plurality of gold-plated contacts arranged along the edge of the circuit board, which are used for electrical connection with external devices.

[0014] In one embodiment, the main connector is positioned to extend relative to the edge of the circuit board so as to be inserted into a corresponding interface of an external device.

[0015] In one embodiment, the turbine includes a housing, an impeller, and a drive motor. The drive motor is disposed inside the housing, and the impeller is connected to the output shaft of the drive motor. The housing has an inlet and an outlet on opposite sides. The housing is mounted to the window of the mounting plate by means of fasteners.

[0016] This invention integrates a turbine into the circuit board and drives the coolant to flow in a directional manner, changing the traditional cooling mode that relies on external circulation pumps or piezoelectric fans. This forces the coolant to flow in a directional manner on the circuit board surface, effectively improving heat exchange efficiency. Unlike the vibration-based cooling of piezoelectric fans, the turbine drives the fluid through stable rotational motion, avoiding mechanical impact on the circuit board and reducing the risk of loose component solder joints and circuit board fatigue damage. Furthermore, by designing the turbine's inlet and outlet to be parallel to the circuit board surface, the coolant can flow closely along the circuit board surface, reducing eddy current losses during flow and enhancing the flushing effect on densely populated component areas, making heat exchange more direct and efficient. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0018] Figure 1 A schematic diagram of the assembly of the heat dissipation structure provided by this utility model (first perspective);

[0019] Figure 2 Assembly diagram of the heat dissipation structure provided by this utility model (second perspective);

[0020] Figure 3 A schematic diagram of the turbine structure provided by this utility model for heat dissipation.

[0021] Explanation of reference numerals in the attached figures:

[0022] 1. Circuit board; 2. Turbine; 21. Inlet; 22. Outlet; 23. Housing; 24. Impeller; 3. Mounting plate; 31. Window; 3a. First mounting plate; 3b. Second mounting plate; 4. Sub-connector; 5. Main connector; 6. Fastener. Detailed Implementation

[0023] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present utility model.

[0024] It should be noted that if the embodiments of this utility model involve directional indicators (such as up, down, left, right, front, back, etc.), the directional indicators are only used to explain the relative positional relationship and movement of the components in a specific posture. If the specific posture changes, the directional indicators will also change accordingly.

[0025] Furthermore, if the embodiments of this utility model involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the use of "and / or" or "and / or" throughout the text includes three parallel solutions. For example, "A and / or B" includes solution A, solution B, or a solution where both A and B are satisfied simultaneously. Furthermore, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this utility model.

[0026] In existing technologies, piezoelectric fans are installed on the server's circuit boards to enhance the flow of coolant inside the server. The core structure of this piezoelectric fan is a cantilever beam, where one end is fixed (as a fulcrum), while the other end is suspended freely. When an alternating voltage is applied to the piezoelectric fan, its periodic elongation and contraction cause the entire cantilever beam to bend and vibrate. At this time, the free end will oscillate back and forth at a fixed frequency (similar to "swinging"), which can then impact the circuit board or cause it to vibrate. This vibration can not only lead to loose solder joints and poor contact on the circuit board, but may also accelerate fatigue damage to the circuit board itself, reducing the server's operational stability and lifespan.

[0027] In view of this, the present invention provides a heat dissipation structure, which aims to solve the problems of low flow efficiency of coolant inside the server and damage to the circuit board caused by vibration in the existing immersion liquid cooling technology, so as to improve the heat dissipation effect while avoiding mechanical damage to the circuit board.

[0028] Please see Figure 1 and Figure 2The heat dissipation structure includes a circuit board 1 and a turbine 2. The turbine 2 is disposed on one side of the circuit board 1 and electrically connected to the circuit board 1. The operation of the turbine 2 drives the coolant to flow through the circuit board 1, thereby enhancing the flow efficiency of the coolant on the surface of the circuit board 1. The coolant immersed in this heat dissipation structure should have excellent insulating properties, such as mineral oil or fluorinated liquid, which can achieve efficient heat transfer without affecting the electrical performance of the circuit board 1.

[0029] The turbine 2 can be either an axial-flow turbine 2 or a centrifugal turbine 2, and its size can be adapted to the spatial layout of the circuit board 1. There are several ways to mount the turbine 2 on the circuit board 1; specifically, the turbine 2 can be directly soldered onto the circuit board 1, or it can be detachably connected to the circuit board 1 using a snap-fit ​​or slot structure, or it can be mounted on the circuit board 1 using a rotating mounting structure. Furthermore, the mounting position and operating parameters of the turbine 2 can be flexibly adjusted according to the heat source distribution on the circuit board 1. For example, adding a turbine 2 or optimizing the turbine 2 speed in high-power chip areas can achieve enhanced local heat dissipation.

[0030] To ensure the coolant flows more closely to the surface of circuit board 1 and maximizes coverage of densely populated component areas, the orientation of the inlet 21 and outlet 22 of turbine 2 is defined. Specifically, turbine 2 has an inlet 21 for drawing in coolant and an outlet 22 for discharging coolant, with the inlet 21 and outlet 22 oriented parallel to the surface of circuit board 1.

[0031] The inlet 21 and outlet 22 are oriented parallel to the surface of the circuit board 1, allowing the coolant to flow smoothly along the surface of the circuit board 1 before entering the turbine 2. After being pressurized by the turbine 2, the coolant discharged from the outlet 22 can also continuously flush the components on the circuit board 1 along the surface direction, reducing eddies and dead zones in the coolant flow process and further improving the coverage efficiency of the circuit board 1 surface. This design is particularly suitable for areas with dense component layouts, as the directional flow of coolant can quickly remove heat from the heat-generating core, avoiding local heat accumulation.

[0032] This embodiment of the invention integrates a turbine 2 into the circuit board 1 and drives the coolant to flow in a directional manner, changing the traditional heat dissipation mode that relies on an external circulation pump or piezoelectric fan. This forces the coolant to flow in a forced convection pattern on the surface of the circuit board 1, effectively improving heat exchange efficiency. Unlike the vibration-based cooling of a piezoelectric fan, the turbine 2 drives the fluid through stable rotational motion, avoiding mechanical impact on the circuit board 1 and reducing the risk of loose component solder joints and fatigue damage to the circuit board 1. Furthermore, by oriented the turbine 2's inlet 21 and outlet 22 parallel to the surface of the circuit board 1, the coolant can flow along the surface of the circuit board 2 in a close-fitting manner, reducing eddy current losses during the flow process and enhancing the flushing effect on densely populated areas of components, making heat exchange more direct and efficient.

[0033] In some embodiments, please refer to Figure 1 and Figure 2 To facilitate the installation of the turbine 2 on the circuit board 1, a mounting plate 3 is added; at the same time, to improve cooling efficiency, the orientation of the turbine 2 and the mounting plate 3 is limited. Specifically, the heat dissipation structure also includes a mounting plate 3 vertically arranged on the circuit board 1, and the mounting plate 3 is provided with a window 31; the turbine 2 is installed at the window 31 of the mounting plate 3 by fasteners 6, and the inlet 21 and / or outlet 22 are arranged facing the window 31.

[0034] The mounting plate 3 is vertically mounted on the circuit board 1. This can be understood as the mounting plate 3 forming a 90-degree angle with the circuit board 1. It is fixedly connected to the circuit board 1 by means of welding, screwing, or integral molding to provide a stable support structure.

[0035] The fasteners 6 used to mount the turbine 2 onto the mounting plate 3 can be bolts, screws, or clips. If bolts or screws are used, threaded holes can be made at corresponding positions on the mounting plate 3, and the turbine 2 housing 23 can be fastened to the mounting plate 3 through threaded connection. If a clip structure is used, elastic claws can be set on the outside of the turbine 2 housing 23, and slots can be set on the edge of the window 31 of the mounting plate 3, so that quick installation and disassembly can be achieved through the elastic cooperation between the claws and the slots.

[0036] The phrase "inlet 21 and / or outlet 22 facing window 31" includes the following three scenarios. First, inlet 21 faces window 31. In this case, coolant is drawn into turbine 2 through window 31. The mounting plate 3 can be used to initially guide the coolant flowing towards window 31, reducing the impact of external interference flow on the inlet 21's suction efficiency. Second, outlet 22 faces window 31. Coolant discharged from turbine 2 flows out directionally through window 31, guiding it towards pre-defined high-heat areas on circuit board 1, improving the targeted nature of localized heat dissipation. Third, both inlet 21 and outlet 22 face window 31. In this case, the thickness of mounting plate 3 must be greater than the thickness of turbine 2. For example, mounting plate 3 can be a hollow frame structure with windows 31 corresponding to the length of circuit board 1. The inlet 21 and outlet 22 of turbine 2 can correspond to the windows 31 of the frame structure. Coolant enters turbine 2 from one window 31, is pressurized, and then discharged from the other window 31, forming a directional flow channel penetrating mounting plate 3.

[0037] This embodiment of the utility model achieves a stable fixation of the turbine 2 on the circuit board 1 by opening a window 31 on the mounting plate 3 and installing the turbine 2 at the window 31. At the same time, the window 31 guides the flow of coolant so that the flow of coolant is in the direction of the board surface of the circuit board 1, thereby enhancing the contact area and flow efficiency between the coolant and the surface of the circuit board 1.

[0038] In some embodiments, please refer to Figure 1 and Figure 2 To facilitate the installation of the turbine 2 on the circuit board 1, a mounting plate 3 is added; at the same time, to improve the compactness of the structure, the opening size of the turbine 2 and the mounting plate 3 is limited. Specifically, the heat dissipation structure also includes a mounting plate 3 vertically arranged on the circuit board 1, the mounting plate 3 being provided with a window 31, and the diameter of the inlet 21 and / or outlet 22 being adapted to the diameter of the window 31.

[0039] Specifically, if the inlet 21 of turbine 2 faces the window 31 of mounting plate 3, the diameter of inlet 21 matches the diameter of window 31; if the outlet 22 of turbine 2 faces the window 31 of mounting plate 3, the diameter of outlet 22 matches the diameter of window 31; if both inlet 21 and outlet 22 face window 31, the diameters of inlet 21 and outlet 22 respectively match the diameters of the corresponding windows 31. This design reduces the flow resistance of coolant at the interface between window 31 and turbine 2, avoids local eddies or pressure loss caused by mismatched diameters, and ensures that coolant passes through turbine 2 at a high flow rate and is discharged in a directional manner.

[0040] This embodiment of the invention optimizes the flow path of the coolant between the turbine 2 and the mounting plate 3 by adapting the diameter of the turbine 2 inlet 21 and / or outlet 22 to the diameter of the window 31 on the mounting plate 3, thereby reducing energy loss when the fluid passes through the interface. When the diameters are matched, the window 31 can serve as a transition channel between the turbine 2 and the external flow field, ensuring a smooth flow of the coolant when entering or exiting the turbine 2 and reducing local resistance caused by abrupt changes in cross-section. This improves the coolant delivery efficiency of the turbine 2, allowing more coolant to participate in heat exchange on the surface of the circuit board 1, further enhancing the overall heat dissipation effect.

[0041] In some embodiments, please refer to Figure 1 and Figure 2 To further increase the flow rate of coolant per unit area of ​​circuit board 1, multiple turbines 2 are installed on a single mounting plate 3. Specifically, multiple turbines 2 are installed, and multiple windows 31 are opened on the mounting plate 3, with each turbine 2 and each window 31 corresponding to one another.

[0042] The number of turbines 2 on a single mounting plate 3 can be configured according to the size of the circuit board 1 and the heat dissipation requirements. For example, on a circuit board 1 with a large area, 2 to 4 turbines 2 can be spaced apart along the heat source distribution direction, or multiple turbines 2 can be arranged in a concentrated array to form a heat dissipation unit in high power consumption areas. The inlets 21 and outlets 22 of the multiple turbines 2 can be arranged in the same direction or staggered. When arranged in the same direction, the outlets 22 of all turbines 2 face the same direction, which can form a continuous coolant flow path on the surface of the circuit board 1. When arranged in a staggered manner, the outlets 22 of adjacent turbines 2 face opposite directions, which can disrupt the flow boundary layer through fluid interaction, enhance the turbulent mixing of coolant and the surface of the circuit board 1, and improve the local heat transfer coefficient.

[0043] This embodiment of the invention achieves zoned enhancement of coolant flow on the surface of the circuit board 1 by setting multiple turbines 2 on a single mounting plate 3 and corresponding one-to-one with the windows 31. When multiple turbines 2 work together, they can form independent forced convection flow fields in different areas of the circuit board 1, avoiding local heat dissipation blind spots caused by the limited range of a single turbine 2.

[0044] In some embodiments, please refer to Figure 1 and Figure 2 To allow coolant to flow over a larger area of ​​the circuit board 1, multiple mounting plates 3 are provided, and these mounting plates 3 are arranged along the length of the circuit board 1 (the length direction is...). Figure 1 The interval is set above (indicated by the dashed line 'a').

[0045] The spacing between the mounting plates 3 can be adjusted according to the heat source distribution density on the circuit board 1. For example, in areas where heat sources are more dispersed, the spacing between the mounting plates 3 can be appropriately increased; while in areas where heat sources are dense, the spacing between the mounting plates 3 can be reduced to ensure that the coolant can fully cover all heat-generating areas of the circuit board 1. The arrangement of multiple mounting plates 3 makes the layout of the turbine 2 more flexible, allowing for targeted heat dissipation design based on the characteristics of different areas of the circuit board 1, thereby further improving the heat dissipation uniformity and efficiency of the entire circuit board 1.

[0046] This embodiment of the invention arranges multiple mounting plates 3 at intervals along the length of the circuit board 1, allowing the layout of the turbine 2 to be adapted to the distribution characteristics of heat sources on the circuit board 1. When there are multiple dispersed high-heat areas on the circuit board 1, heat dissipation can be achieved for different areas by setting mounting plates 3 and turbines 2 at corresponding positions in each area.

[0047] In some embodiments, please refer to Figure 1 and Figure 2 Along the length of the circuit board 1, the spacing between any two adjacent mounting plates 3 among the plurality of mounting plates 3 is the same.

[0048] This equidistant spacing arrangement facilitates the standardized layout of the mounting plates 3 on the circuit board 1, simplifies the installation process, and ensures uniform flow of coolant along the length of the circuit board 1. The uniform spacing allows the coolant flow fields driven by the turbines 2 on adjacent mounting plates 3 to form a more regular superposition in space, which is particularly suitable for the circuit board 1 structure where the heat source distribution is relatively uniform, and helps to improve the stability and maintainability of the overall heat dissipation system.

[0049] In some embodiments, please refer to Figure 1 and Figure 2 Considering that there are multiple mounting plates 3, which are spaced apart along the length of the circuit board 1, the arrangement of each mounting plate 3 is optimized to reduce the resistance caused by the mounting plates 3 and improve the smoothness of coolant flow. Specifically, the multiple mounting plates 3 include at least two adjacent first mounting plates 3a and second mounting plates 3b, and at least one window 31 in the first mounting plate 3a is aligned with the window 31 in the second mounting plate 3b along the length of the circuit board 1.

[0050] When the windows 31 of the first mounting plate 3a and the second mounting plate 3b are aligned along the length of the circuit board 1, the coolant flow field driven by the turbine 2 can form a continuous flow channel penetrating multiple mounting plates 3. For example, the coolant discharged from the window 31 of the first mounting plate 3a can flow directly to the window 31 area of ​​the second mounting plate 3b, reducing flow interruptions caused by the spacing of the mounting plates 3, and enabling the coolant to be transported in a "relay" manner along the length of the circuit board 1. This alignment design is particularly suitable when there are linear heat sources distributed along the length of the circuit board 1, as the directional flow of coolant can continuously carry heat from the beginning to the end of the heat source, preventing heat accumulation in the middle.

[0051] This embodiment of the invention aligns the windows 31 of adjacent mounting plates 3 along the length of the circuit board 1, creating a continuous flow path for the coolant on the surface of the circuit board 1. This continuous path design effectively reduces the obstruction effect of the mounting plates 3 on the coolant flow, enhances the smoothness and continuity of the coolant flow, and allows the coolant to flow through more areas of the circuit board 1.

[0052] In some embodiments, please refer to Figure 1 and Figure 2 To further improve the smoothness of coolant flow, the layout of the mounting plate 3 was further optimized. Specifically, the first mounting plate 3a and the second mounting plate 3b have the same number of windows 31, and each window 31 of the first mounting plate 3a and the second mounting plate 3b corresponds one-to-one in the length direction of the circuit board 1. The projections of the first mounting plate 3a and the second mounting plate 3b in the length direction of the circuit board 1 are the same.

[0053] When the number of windows 31 on the first mounting plate 3a and the second mounting plate 3b is the same and they are arranged in a one-to-one correspondence, the projections of the first mounting plate 3a and the second mounting plate 3b onto the length direction of the circuit board 1 are the same, allowing for a more precise matching of the flow fields of the turbines 2 on adjacent mounting plates 3. For example, three windows 31 spaced apart along the width direction on the first mounting plate 3a are perfectly aligned with three windows 31 spaced apart on the second mounting plate 3b. In this case, the coolant flow discharged from each window 31 can directly enter the effective range of the corresponding window 31 on the next mounting plate 3, forming multiple parallel directional flow channels. This design avoids mutual interference of flow fields caused by differences in the number or misalignment of windows 31, allowing the coolant to form a regular "comb-like" flow structure on the surface of the circuit board 1, uniformly covering all areas of the circuit board 1. At the same time, the aligned arrangement of the same number of windows 31 also facilitates the unified adjustment of the turbine 2 operating parameters. For example, by synchronously adjusting the rotational speed of the corresponding turbines 2 on adjacent mounting plates 3, precise control of the coolant flow rate and velocity in a specific flow channel can be achieved, further optimizing the heat dissipation effect.

[0054] This embodiment of the invention further improves the orderliness and uniformity of coolant flow on the surface of the circuit board 1 by making the number of windows 31 of the first mounting plate 3a and the second mounting plate 3b the same and aligning them one-to-one in the length direction of the circuit board 1.

[0055] In some embodiments, please refer to Figure 1 and Figure 2 To facilitate the connection of the wires of each turbine 2, multiple sub-connectors 4 are added to the circuit board 1. Specifically, each sub-connector 4 is used to connect the wires of each turbine 2.

[0056] Each sub-connector 4 is positioned close to each turbine 2 to shorten the wire length and reduce interference and loss during signal transmission. When maintenance or replacement of a turbine 2 is required, only the corresponding sub-connector 4 needs to be disconnected, without disassembling the wiring of the entire circuit board 1, which significantly improves the maintainability of the heat dissipation structure.

[0057] In some embodiments, please refer to Figure 1 In the length direction perpendicular to the circuit 1, the cross-sectional profile of each turbine 2 is quadrilateral, and each sub-connector 4 is set at an angle close to the cross-sectional profile of the turbine 2.

[0058] The statement "in the length direction perpendicular to circuit 1, the cross-sectional profile of each turbine 2 is quadrilateral" can be understood as, when viewed along the length direction of circuit board 1, the housing 23 of the turbine 2 presents a quadrilateral structure. Correspondingly, "an included angle of the cross-sectional profile of the turbine 2" can be understood as the right angle or obtuse angle formed by the intersection of adjacent sides of the quadrilateral housing 23; for example, Figures 1 to 3The right-angled portion of the housing 23, with its square cross-sectional profile, is shown in the diagram. This structural design facilitates the provision of installation space at the corners of the turbine 2, while the sub-connector 4, positioned near one corner of the turbine 2, fully utilizes the corner area of ​​the quadrilateral housing 23, avoiding spatial interference with the installation positions of the turbine 2's inlet 21, outlet 22, or fastener 6. For example, when the turbine 2's inlet 21 and outlet 22 are located on opposite sides of the quadrilateral housing 23, the sub-connector 4 can be positioned near one of the apex corners of the housing 23, ensuring convenient wire connection without affecting the normal flow path of the coolant. Simultaneously, positioning the sub-connector 4 near the corner of the turbine 2 makes the overall layout of the turbine 2 more compact, reducing the space occupied by other components on the circuit board 1 surface, thus improving the space utilization rate of the circuit board 1.

[0059] In some embodiments, please refer to Figure 1 and Figure 2 To keep the overall heat dissipation structure simple, a main connector 5 is provided on the edge of the circuit board 1. Specifically, the main connector 5 is electrically connected to each sub-connector 4 through the circuit board 1; the main connector 5 includes multiple gold-plated contacts arranged along the edge of the circuit board 1, which are used for electrical connection with external devices. The main connector 5 integrates the circuits of each sub-connector 4, concentrating the power supply and control signals of multiple turbines 2 in one place, avoiding the messy wiring problems caused by scattered wiring. The gold-plated contacts have excellent conductivity and oxidation resistance, which can improve the stable electrical connection between the turbines 2 and the external drive module.

[0060] This utility model embodiment achieves integrated management of the power supply and control circuit of the turbine 2 by setting a hierarchical connection structure between the sub-connector 4 and the main connector 5 on the circuit board 1.

[0061] In some embodiments, please refer to Figure 1 and Figure 2 To facilitate the insertion or snapping of the main connector 5 into the corresponding interface of an external device, the main connector 5 is positioned to extend beyond the edge of the circuit board 1. The length of the main connector 5 extending beyond the edge of the circuit board 1 can be adapted to the depth of the external device interface, as long as it can make full contact with the contacts inside the interface during insertion.

[0062] This embodiment of the utility model simplifies the wiring complexity of the circuit board 1 and reduces the space occupied by the circuit by setting the main connector 5 to extend out of the edge of the circuit board 1.

[0063] In some embodiments, please refer to Figure 1 and Figure 3The turbine 2 adopts a simple structure. Specifically, the turbine 2 includes a housing 23, an impeller 24 and a drive motor. The drive motor is located inside the housing 23, and the impeller 24 is connected to the output shaft of the drive motor. The housing 23 has an inlet 21 and an outlet 22 on opposite sides. The housing 23 is mounted to the window 31 of the mounting plate 3 by fasteners 6.

[0064] This embodiment of the invention simplifies the structure of the turbine 2 to a combination of a housing 23, an impeller 24, and a drive motor, achieving a compact design. The housing 23, as the main structural component of the turbine 2, provides protection for the internal drive motor and impeller 24. Its inlet 21 and outlet 22, located on opposite sides, directly form flow channels for the coolant, reducing fluid resistance caused by additional connecting components. This simple turbine 2 structure is not only easy to mass-produce but also allows for quick docking with the mounting plate 3 window 31 using standardized fasteners 6, which facilitates the assembly process and maintenance convenience of the heat dissipation structure.

[0065] The above description is merely an exemplary embodiment of the present utility model and does not limit the patent scope of the present utility model. Any equivalent structural transformations made based on the technical concept of the present utility model and the contents of the present utility model specification and drawings, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present utility model.

Claims

1. A heat dissipation structure for immersion in a coolant, characterized in that, The heat dissipation structure includes: Circuit boards; and, A turbine is disposed on one side of the circuit board and electrically connected to the circuit board; the turbine has an inlet for drawing in coolant and an outlet for discharging coolant, the inlet and the outlet being oriented parallel to the surface of the circuit board, so that the coolant flows in a direction parallel to the surface of the circuit board and flows through the surface of the circuit board.

2. The heat dissipation structure according to claim 1, characterized in that, It also includes a mounting plate vertically disposed on the circuit board, the mounting plate having a window, wherein: The turbine is mounted to a window on the mounting plate by fasteners, and the inlet and / or the outlet are oriented toward the window; and / or, The diameter of the inlet and / or the outlet is adapted to the diameter of the window.

3. The heat dissipation structure according to claim 2, characterized in that, The turbine is provided in multiple ways, and the mounting plate has multiple windows, with each turbine and each window corresponding to one another.

4. The heat dissipation structure according to claim 2, characterized in that, The mounting plates are provided in multiple ways, and the multiple mounting plates are spaced apart in the length direction of the circuit board; the multiple mounting plates include at least two adjacent first mounting plates and second mounting plates, and at least one window of the first mounting plate is aligned with the window of the second mounting plate in the length direction of the circuit board.

5. The heat dissipation structure according to claim 4, characterized in that, The first mounting plate and the second mounting plate have the same number of windows. Each window of the first mounting plate and each window of the second mounting plate correspond one-to-one with each other in the length direction of the circuit board. The projections of the first mounting plate and the second mounting plate in the length direction of the circuit board are the same.

6. The heat dissipation structure according to claim 1, characterized in that, The circuit board is provided with multiple sub-connectors, each of which is used to connect the wires of each turbine.

7. The heat dissipation structure according to claim 6, characterized in that, In the length direction perpendicular to the circuit board, the cross-sectional profile of each turbine is quadrilateral, and each sub-connector is respectively set at an included angle close to the cross-sectional profile of the turbine.

8. The heat dissipation structure according to claim 6, characterized in that, The circuit board is provided with a main connector on its edge, and the main connector is electrically connected to each of the sub-connectors through the circuit board; The main connector includes a plurality of gold-plated contacts arranged along the edge of the circuit board for electrical connection with external devices.

9. The heat dissipation structure according to claim 8, characterized in that, The main connector is positioned to extend relative to the edge of the circuit board so as to be inserted into the corresponding interface of an external device.

10. The heat dissipation structure according to any one of claims 2 to 9, characterized in that, The turbine includes a housing, an impeller, and a drive motor. The drive motor is disposed inside the housing, and the impeller is connected to the output shaft of the drive motor. The inlet and the outlet are provided on opposite sides of the housing. The housing is mounted to the window of the mounting plate by means of the fasteners.

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