A flow channel structure for high-power liquid cooling heat dissipation

Abstract

The utility model relates to PCBA board GPU module heat dissipation test technical field, concretely is a kind of flow channel structure for high-power liquid cooling heat dissipation, including water channel flow upper copper block, the central part of water channel flow upper copper block surface is equipped with flow pass, water channel flow upper copper block surface and located the both sides of strip-shaped through groove are equipped with flow channel groove. The utility model discloses water channel flow upper copper block is set, and the upper part of water channel flow upper copper block is designed into two triangular flow channel grooves, water current gradually rises from below through strip-shaped through groove, and water is directly discharged from the triangular place of flow channel groove, without passing through curved water channel detour, can realize quickly water change, and heat is rapidly dissipated through water current, reaches the case when testing, GPU temperature is controlled below 90 ° when high power 1500W. Water channel flow upper copper block of the utility model adopts water current double channel, is triangular, shortens water flow path, reduces water resistance, quickly removes heat.

Description

Technical Field

[0001] This utility model relates to the field of heat dissipation testing technology for GPU modules on PCBA boards, specifically a flow channel structure for high-power liquid cooling. Background Technology

[0002] PCBA boards are indispensable physical carriers and connection centers for electronic devices. Among the most important components on a PCBA board is the GPU module. The GPU module is a powerful but structurally unique PCBA component that relies on the main PCBA board for power, data, and instructions, providing a platform for its powerful computing capabilities. GPU modules generate a significant amount of heat during operation.

[0003] Currently, the GPU module testing section of PCBA boards typically uses air cooling. However, air cooling has technical bottlenecks, such as bulky structure, high noise, and poor heat dissipation, which can cause great trouble for testing. Utility Model Content

[0004] The purpose of this invention is to provide a flow channel structure for high-power liquid cooling, so as to solve the problems mentioned in the background art, such as bulky structure, high noise, and poor heat dissipation effect of the existing air-cooling mode.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a flow channel structure for high-power liquid cooling heat dissipation, including a water channel flowing over a copper block, a flow port being provided at the center of the surface of the water channel flowing over the copper block, and flow channel grooves being provided on both sides of the surface of the water channel flowing over the copper block and located in a strip-shaped channel, and the flow channel grooves being symmetrically arranged about the center line of the strip-shaped channel, the flow channel grooves being triangular in shape, and the two flow channel grooves forming a dual water flow channel, shortening the water flow path, reducing water resistance, and enabling rapid heat removal.

[0006] Preferably, the interior of the flow channel is provided with a strip-shaped through groove, the bottom end of which passes through the water channel to allow the copper block to flow.

[0007] Preferably, an inlet / outlet copper block is provided above the copper block in the waterway, and an inlet is provided on one side of the inlet / outlet copper block, which is connected to the flow outlet.

[0008] Preferably, an outlet is provided on the surface of the inlet and outlet copper block away from the inlet, and the outlet is connected to the flow channel groove.

[0009] Preferably, the bottom end of the upper copper block in the water channel is connected to a lower copper block for liquid cooling, and a GPU is provided at the bottom end of the lower copper block for liquid cooling.

[0010] Compared with existing technologies, the beneficial effects of this invention are as follows: When the flow channel structure for high-power liquid cooling is implemented, water enters through the inlet and flows into the outlet. Upon entering the surface of the copper block under the liquid cooling system, it dissipates heat from the GPU. The hot water enters the flow channel through the strip-shaped grooves and finally flows out through the outlet. This invention, by setting up a flow channel on the copper block, with the upper part of the flow channel designed as two triangular flow channel grooves, allows water to gradually rise from below through the strip-shaped grooves and exit directly from the triangular part of the flow channel. This avoids the need for winding waterways, enabling rapid water exchange and quick heat dissipation. During testing at a high power of 1500W, the GPU temperature was controlled below 90°C. The copper block in this invention employs a dual-channel, triangular shape, shortening the water flow path, reducing water resistance, and quickly carrying away heat. Attached Figure Description

[0011] Figure 1 This is a three-dimensional structural diagram of the present invention;

[0012] Figure 2 This is a schematic diagram of the cross-sectional structure of the present invention;

[0013] Figure 3 This is a schematic diagram of the exploded structure of this utility model;

[0014] Figure 4 This is an enlarged schematic diagram of the copper block structure in the waterway of this utility model.

[0015] In the diagram: 1. Upper copper block for water flow; 11. Flow channel; 12. Strip-shaped channel; 13. Flow port; 2. Inlet and outlet copper blocks; 3. Lower copper block for liquid cooling; 4. GPU. Detailed Implementation

[0016] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, not all embodiments. In addition, the terms "first", "second", "third", "upper", "lower", "left", "right", etc. are used for descriptive purposes only and should not be construed as indicating or implying relative importance. At the same time, in the description of the present utility model, unless otherwise explicitly specified and limited, the terms "connected" and "linked" should be interpreted broadly. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present utility model.

[0017] This utility model provides a flow channel structure for high-power liquid cooling heat dissipation, as shown in the following figure. Figure 1 as well as Figure 3 As shown, the device includes a copper block 1 for water flow, with a flow port 13 at the center of the surface of the copper block 1. Flow channels 11 are provided on both sides of the surface of the copper block 1 and on both sides of the strip-shaped through groove 12. The flow channels 11 are symmetrically arranged about the center line of the strip-shaped through groove 12. The flow channels 11 are triangular in shape, and the two flow channels 11 form a double water flow channel, which shortens the water flow path, reduces water resistance, and can quickly remove heat.

[0018] This invention features a water-flow upper copper block 1. The upper part of the water-flow upper copper block 1 is designed with two triangular flow channels 11. Water flows upward gradually from below through strip-shaped channels 12 and exits directly from the triangular part of the flow channel 11. This bypasses winding waterways, enabling rapid water exchange and quick heat dissipation. During testing at a high power of 1500W, the GPU temperature was kept below 90°C. The water-flow upper copper block 1 of this invention employs a dual-channel, triangular shape, shortening the water flow path, reducing water resistance, and rapidly carrying away heat.

[0019] Furthermore, such as Figure 2 as well as Figure 4 As shown, a strip-shaped channel 12 is provided inside the flow channel 11. The bottom end of the strip-shaped channel 12 passes through the upper copper block 1 of the water channel. A water inlet / outlet copper block 2 is provided above the upper copper block 1 of the water channel. A water inlet 21 is provided on one side of the water inlet / outlet copper block 2. The water inlet 21 is connected to the flow port 13. A water outlet 22 is provided on the surface of the water inlet / outlet copper block 2 away from the water inlet 21. The water outlet 22 is connected to the flow channel 11. The bottom end of the upper copper block 1 of the water channel is connected to the liquid cooling heat dissipation lower copper block 3. A GPU 4 is provided at the bottom end of the liquid cooling heat dissipation lower copper block 3.

[0020] During implementation, water enters through inlet 21 and flows into outlet 13. The water then enters the surface of the liquid-cooled copper block 3 to cool the GPU 4. The hot water enters the flow channel 11 through the strip-shaped channel 12 and finally flows out through outlet 22.

[0021] Working principle: When in use, water first enters through the inlet 21 and then flows into the flow outlet 13. The water enters the surface of the liquid cooling copper block 3 to dissipate heat from the GPU 4. The hot water will enter the flow channel 11 through the strip-shaped channel 12 and finally flow out through the outlet 22.

[0022] This invention features a water-flow upper copper block 1. The upper part of the water-flow upper copper block 1 is designed with two triangular flow channels 11. Water flows upward gradually from below through strip-shaped channels 12 and exits directly from the triangular part of the flow channel 11. This bypasses winding waterways, enabling rapid water exchange and quick heat dissipation. During testing at a high power of 1500W, the GPU temperature was kept below 90°C. The water-flow upper copper block 1 of this invention employs a dual-channel, triangular shape, shortening the water flow path, reducing water resistance, and rapidly carrying away heat.

[0023] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

Claims

1. A flow channel structure for high-power liquid cooling, comprising a water channel through which a copper block (1) flows, characterized in that: The water channel flows through the center of the copper block (1) and has a flow port (13). The water channel flows through the copper block (1) and has flow channels (11) on both sides of the strip-shaped channel (12). The flow channels (11) are symmetrical about the center line of the strip-shaped channel (12). The flow channels (11) are triangular in shape, and the two flow channels (11) form a double channel for water flow, which shortens the water flow path, reduces water resistance, and can quickly remove heat.

2. The flow channel structure for high-power liquid cooling heat dissipation according to claim 1, characterized in that: The interior of the flow channel (11) is provided with a strip-shaped through groove (12), the bottom end of which passes through the water channel to allow the copper block (1) to flow.

3. The flow channel structure for high-power liquid cooling heat dissipation according to claim 1, characterized in that: Above the copper block (1) in the waterway, there is an inlet / outlet copper block (2), and an inlet (21) is provided on one side of the inlet / outlet copper block (2), which is connected to the flow port (13).

4. The flow channel structure for high-power liquid cooling heat dissipation according to claim 3, characterized in that: An outlet (22) is provided on the surface of the copper block (2) away from the inlet (21), and the outlet (22) is connected to the flow channel (11).

5. The flow channel structure for high-power liquid cooling heat dissipation according to claim 1, characterized in that: The bottom end of the upper copper block (1) of the water channel is connected to the lower copper block (3) for liquid cooling, and the bottom end of the lower copper block (3) for liquid cooling is provided with a GPU (4).

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