Heat pipe radiator with bottom heat dissipation

Abstract

The utility model discloses a heat pipe type radiator with bottom heat dissipation, which comprises a bottom plate provided with a first mounting groove penetrating through from top to bottom, a heat conduction plate arranged in the first mounting groove, a heat dissipation seat fixedly arranged on the top of the heat conduction plate and provided with a plurality of first heat dissipation fins at intervals on the top, a heat pipe group comprising a first heat pipe member and a second heat pipe member in U shape, the bottom sections of the first heat pipe member and the second heat pipe member being clamped between the heat conduction plate and the heat dissipation seat, a heat dissipation module comprising a plurality of second heat dissipation fins arranged at intervals, each second heat dissipation fin being sleeved on the side sections of the first heat pipe member and the second heat pipe member, and a first side plate arranged on both sides of the heat dissipation module and fixedly connected with the bottom plate. By arranging the heat dissipation seat and the first heat dissipation fins, the heat dissipation surface area of the radiator is increased, the bottom sections can conduct part of the heat to the heat dissipation seat and the first heat dissipation fins in a contact conduction mode, and the heat dissipation efficiency is improved.

Description

Technical Field

[0001] This utility model relates to the field of heat dissipation device technology, and in particular to heat pipe radiators. Background Technology

[0002] The miniaturization of electronic devices and the high integration of electronic components result in concentrated heat during operation, leading to localized temperature increases. High temperatures not only cause instability and pose safety risks during operation but also accelerate material aging and reduce lifespan. Therefore, for electronic components with concentrated heat, efficient heat dissipation devices such as heat pipe radiators are needed to quickly dissipate heat and reduce temperature rise.

[0003] A heat pipe cooler typically consists of a base, heat pipes, and a cooling module. The cooling module is spaced above the base and has multiple fins to increase the heat dissipation surface area. The heat pipes connect the base and the cooling module. During installation and use, the base absorbs heat upon contact with the heat source, transferring the heat to the heat pipes. The heat pipes then rapidly transfer the heat to the cooling module, where its large surface area dissipates the heat. A fan can also be installed on the cooling module to promote airflow and enhance heat dissipation.

[0004] The heat is concentrated in the part where the heat pipe contacts the base, and this part usually lacks a heat sink structure that can conduct heat, which means that the heat dissipation efficiency of the radiator needs to be improved. Utility Model Content

[0005] The purpose of this invention is to provide a heat pipe radiator with bottom heat dissipation, which can improve the heat dissipation efficiency of the radiator.

[0006] To achieve the above objectives, a heat pipe radiator with bottom heat dissipation is provided, comprising: a base plate having a first mounting groove extending vertically; a heat-conducting plate disposed within the first mounting groove; a heat sink fixedly disposed on the top of the heat-conducting plate, with a plurality of first heat sink fins spaced apart on the top; a heat pipe assembly including a U-shaped first heat pipe component and a second heat pipe component, the width of the first heat pipe component being smaller than the width of the second heat pipe component, the bottom sections of the first heat pipe component and the second heat pipe component sandwiched between the heat-conducting plate and the heat sink; a heat dissipation module located above the first heat sink fins and including a plurality of second heat sink fins spaced apart, each second heat sink fin being sleeved on the side section of the first heat pipe component and the second heat pipe component; and two first side plates disposed on both sides of the heat dissipation module, the first side plates being fixedly connected to the base plate.

[0007] According to the heat pipe radiator with bottom heat dissipation, the heat-conducting plate is a copper plate; or, the heat-conducting plate is a heat spreader; or, the heat-conducting plate includes a third heat pipe arranged in sequential contact.

[0008] According to the heat pipe radiator with bottom heat dissipation, the bottom surface of the heat sink is provided with a second mounting groove, and the bottom sections of the first heat pipe and the second heat pipe are both disposed in the second mounting groove.

[0009] According to the heat pipe radiator with bottom heat dissipation, there are multiple first heat pipes and multiple second heat pipes, and the bottom sections of the multiple first heat pipes and the multiple second heat pipes are arranged in alternating contact along the front-back direction; the side sections of each first heat pipe and each second heat pipe are arranged at intervals along the front-back direction.

[0010] According to the heat pipe radiator with bottom heat dissipation, the bottom section of the first heat pipe and the bottom section of the second heat pipe are both rectangular in cross-section.

[0011] According to the heat pipe radiator with bottom heat dissipation, each of the second heat sinks is arranged horizontally, and each of the second heat sinks has a V-shaped groove in the middle of its front side.

[0012] According to the heat pipe radiator with bottom heat dissipation, the front side of the first side plate has two first plates arranged vertically, and the first plates have first holes.

[0013] Beneficial effects: In the above solution, by setting up a heat sink and a first heat sink, the utilization rate of the inner space of the heat sink is improved, the heat dissipation surface area of ​​the heat sink is increased, and the bottom sections of the first heat pipe and the second heat pipe that contact the base plate can conduct some heat to the heat sink and the first heat sink through contact conduction, shortening the heat conduction distance and improving heat dissipation efficiency.

[0014] Additional aspects and advantages of this invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0015] The present invention will be further described below with reference to the accompanying drawings and embodiments;

[0016] Figure 1 This is a schematic diagram of the structure of an embodiment of the present utility model;

[0017] Figure 2 for Figure 1 Front view of the embodiment shown;

[0018] Figure 3 for Figure 1 An exploded view of the embodiment shown. Detailed Implementation

[0019] This section will describe in detail the specific embodiments of the present utility model. The preferred embodiments of the present utility model are shown in the accompanying drawings. The purpose of the drawings is to supplement the textual description with graphics, so that people can intuitively and vividly understand each technical feature and the overall technical solution of the present utility model, but they should not be construed as limiting the scope of protection of the present utility model.

[0020] In the description of this utility model, it should be understood that the directional descriptions, such as up, down, front, back, left, right, etc., indicate the directional or positional relationship based on the directional or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0021] In the description of this utility model, terms such as greater than, less than, and exceeding are understood to exclude the stated number, while terms such as above, below, and within are understood to include the stated number. The use of terms like "first" and "second" is merely for distinguishing technical features and should not be construed as indicating or implying relative importance, or implicitly indicating the quantity or sequence of the indicated technical features.

[0022] In the description of this utility model, unless otherwise explicitly defined, terms such as "setting," "installation," and "connection" should be interpreted broadly, and those skilled in the art can reasonably determine the specific meaning of the above terms in this utility model in conjunction with the specific content of the technical solution.

[0023] Reference Figure 1-3 This utility model discloses a heat pipe radiator with bottom heat dissipation, comprising a base plate 10, a heat-conducting plate 20, a heat sink 30, a heat pipe assembly 40, a heat dissipation module 50, and a side plate. The base plate 10 has a vertically penetrating first mounting groove 11, within which the heat-conducting plate 20 is disposed. The heat sink 30 is fixedly disposed on the top of the heat-conducting plate 20, and a plurality of first heat dissipation fins 31 are spaced apart on the top of the heat sink 30. The heat pipe assembly 40 includes a U-shaped first heat pipe component 41 and a second heat pipe component 42, such that both the first heat pipe component 41 and the second heat pipe component 42 have a horizontal bottom section and a vertical side section. The width of the first heat pipe component 41 is smaller than the width of the second heat pipe component 42. The bottom sections of the first heat pipe 41 and the second heat pipe 42 are sandwiched between the heat-conducting plate 20 and the heat sink 30; the heat dissipation module 50 is located above the first heat sink 31, and the heat dissipation module 50 includes a plurality of second heat sinks 51 arranged at intervals, each of the second heat sinks 51 being sleeved on the side sections of the first heat pipe 41 and the second heat pipe 42; the first side plate 60 is configured as two and is respectively disposed on both sides of the heat dissipation module 50, and the bottom of the first side plate 60 is fixedly connected to the base plate 10 by insert threaded fasteners.

[0024] During operation, the heat-conducting plate 20 absorbs heat upon contact with the heat source, dispersing and conducting the heat to the bottom sections of the first heat pipe 41 and the second heat pipe 42. A portion of the heat from the bottom sections is conducted to the heat sink 30, and another portion is conducted through the side sections to the heat dissipation module 50. The heat is then dissipated through the first heat sink 31 of the heat sink 30 and the second heat sink 51 of the heat dissipation module 50. In this design, by setting the heat sink 30 and the first heat sink 31, the utilization rate of the internal space of the radiator is improved, and the heat dissipation surface area of ​​the radiator is increased. Furthermore, the bottom sections of the first heat pipe 41 and the second heat pipe 42 that contact the base plate 10 can conduct some heat to the heat sink 30 and the first heat sink 31 through contact conduction, shortening the heat conduction distance and improving heat dissipation efficiency.

[0025] In this embodiment, the heat-conducting plate 20 has three forms: first, the heat-conducting plate 20 is a copper plate; second, the heat-conducting plate 20 is a heat spreader; and third, the heat-conducting plate 20 includes a series of third heat pipes arranged in sequence, with the surfaces of adjacent third heat pipes in contact. All of these forms of the heat-conducting plate 20 can quickly absorb heat from the heat source and distribute the heat evenly, so that the first heat pipe component 41 and the second heat pipe component 42 can fully and uniformly absorb heat.

[0026] In this embodiment, a second mounting groove 32 is provided on the bottom surface of the heat sink 30. The bottom sections of the first heat pipe 41 and the second heat pipe 42 are both disposed in the second mounting groove 32, and the cross-sections of the bottom sections of the first heat pipe 41 and the second heat pipe 42 are both rectangular. The heat sink 30 can cooperate with the heat-conducting plate 20 to position each bottom section, and a first heat sink 31 can also be provided to increase heat dissipation. The first heat pipe 41 and the second heat pipe 42 can be formed into the above shape by pressing, bending and other processing of circular heat pipes with a diameter of 6mm or 8mm, which can increase the contact area with the heat-conducting plate 20, the heat sink 30 and the second heat sink 51, reduce thermal resistance and improve heat conduction efficiency.

[0027] In this embodiment, multiple first heat pipes 41 and multiple second heat pipes 42 are provided. The bottom sections of the multiple first heat pipes 41 and the multiple second heat pipes 42 are arranged alternately in the front-back direction, and the bottom sections of adjacent first heat pipes 41 and second heat pipes 42 are in contact. The side sections of each first heat pipe 41 and each side section of each second heat pipe 42 are arranged at intervals in the front-back direction. This structure allows the bottom sections of the first heat pipes 41 and the second heat pipes 42 to be densely arranged to better absorb heat and to conduct heat quickly and evenly to the second heat sink 51.

[0028] In this embodiment, the front side of the first side plate 60 has two first plates 61 arranged vertically, and the first plates 61 have first holes 62. The first holes 62 are used to install a fan for enhanced air cooling; and the two first side plates 60 can restrict airflow and ensure that the airflow is concentrated through the second heat sink 51.

[0029] The second heat sink 51 can be connected to the side sections of the first heat pipe 41 and the second heat pipe 42 using methods such as interference fit, riveting fit, and soldering. The second heat sink 51 can be stamped from a 0.3-0.5mm thick metal material, and the gap between adjacent second heat sinks 51 is 1-3.5mm. Each second heat sink 51 is arranged laterally, and each second heat sink 51 has a V-groove 52 in the middle of its front side to facilitate air intake and reduce wind resistance.

[0030] The embodiments of the present utility model have been described in detail above with reference to the accompanying drawings. However, the present utility model is not limited to the above embodiments. Within the scope of knowledge possessed by those skilled in the art, various changes can be made without departing from the spirit of the present utility model.

Claims

1. A heat pipe radiator with bottom heat dissipation, characterized in that, include: The base plate has a first mounting groove that runs vertically through it. A heat-conducting plate is disposed in the first mounting slot; A heat sink is fixedly mounted on the top of a heat-conducting plate, and multiple first heat sinks are spaced apart on the top. The heat pipe assembly includes a first heat pipe component and a second heat pipe component in a U-shape. The width of the first heat pipe component is smaller than the width of the second heat pipe component. The bottom sections of the first heat pipe component and the second heat pipe component are sandwiched between the heat-conducting plate and the heat sink. The heat dissipation module is located above the first heat sink and includes a plurality of second heat sinks arranged at intervals, each of the second heat sinks being sleeved on the side section of the first heat pipe and the second heat pipe. The first side plate is configured as two and is located on both sides of the heat dissipation module. The first side plate is fixedly connected to the base plate.

2. A heat pipe radiator with bottom heat dissipation according to claim 1, characterized in that, The heat-conducting plate is made of copper. Alternatively, the heat-conducting plate can be configured as a heat spreader. Alternatively, the heat-conducting plate may include a third heat pipe arranged in sequential contact.

3. A heat pipe radiator with bottom heat dissipation according to claim 1, characterized in that, The bottom surface of the heat sink is provided with a second mounting groove, and the bottom sections of the first heat pipe and the second heat pipe are both disposed in the second mounting groove.

4. A heat pipe radiator with bottom heat dissipation according to claim 3, characterized in that, The first heat pipe and the second heat pipe are both provided in multiples, and the bottom sections of the multiple first heat pipes and the bottom sections of the multiple second heat pipes are arranged in alternating contact along the front-back direction; The side sections of each first heat pipe component and the side sections of each second heat pipe component are arranged at intervals along the front-to-back direction.

5. A heat pipe radiator with bottom heat dissipation according to claim 3 or 4, characterized in that, The bottom sections of both the first and second heat pipe components have rectangular cross-sections.

6. A heat pipe radiator with bottom heat dissipation according to claim 1, characterized in that, Each of the second heat sinks is arranged horizontally, and each of the second heat sinks has a V-shaped groove in the middle of its front side.

7. A heat pipe radiator with bottom heat dissipation according to claim 1 or 6, characterized in that, The front side of the first side plate has two first plates arranged vertically, and the first plates have first holes.

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