A heat dissipation device and an inverter

Abstract

The utility model discloses a heat abstractor and inverter, heat abstractor includes, the external heat abstractor, the external heat abstractor includes external radiator and heat dissipation fan, and the at least partial exposure of external radiator is in the outside of the box of the equipment to be radiated, and heat dissipation fan is located the side of external radiator to make the airflow from external radiator pass through, the internal heat abstractor, the internal heat abstractor includes internal radiator and several heat pipe, and the at least partial of internal radiator is housed in the inner chamber of the box of the equipment to be radiated, and each heat pipe is worn in internal radiator, can absorb the heat of the inner chamber of the box, the heat insulation pad of heat conduction, one side of heat insulation pad of heat conduction and external radiator are pasted, and the other side of heat insulation pad of heat conduction and internal radiator are pasted, so that the heat of internal heat abstractor is transferred to external heat abstractor through heat insulation pad of heat conduction. Through the mode of heat conduction and heat convection, can transfer the heat in the equipment to be radiated to the outside, to reduce the device temperature in equipment.

Description

Technical Field

[0001] This utility model relates to the field of heat dissipation technology, and in particular to a heat dissipation device and an inverter. Background Technology

[0002] Currently, inverter power ratings are continuously increasing, but the demand for inverter miniaturization is also growing, leading to a significant increase in the volumetric power density of the equipment and consequently causing excessive internal temperature rise. For equipment with low heat generation, adding a turbulence fan inside can usually effectively control the temperature; however, when the power density increases further, relying solely on the internal turbulence fan is no longer sufficient to meet the heat dissipation requirements.

[0003] In related technologies, heat exchangers are installed on the outside of the equipment to achieve internal heat dissipation through the temperature difference between the internal and external airflows. However, heat exchangers are usually large in size, which not only increases the cost and structural complexity, but also occupies a lot of space. Utility Model Content

[0004] One object of this invention is to provide a heat dissipation device that can solve or at least partially alleviate at least one of the defects in the aforementioned background art.

[0005] Another objective of this invention is to provide an inverter having the aforementioned heat dissipation device.

[0006] To achieve at least one of the above objectives, the technical solution adopted by this utility model is as follows: a heat dissipation device, comprising: an external heat dissipation component, the external heat dissipation component including an external radiator and a cooling fan, at least a portion of the external radiator being exposed outside the casing of the device to be cooled, the cooling fan being located on the side of the external radiator so that airflow passes through the external radiator; an internal heat dissipation component, the internal heat dissipation component including an internal radiator and a plurality of heat pipes, at least a portion of the internal radiator being housed within the cavity of the casing of the device to be cooled, each of the heat pipes passing through the internal radiator to absorb heat from the cavity of the casing; and a thermally conductive insulating pad, one side of the thermally conductive insulating pad being in contact with the external radiator, and the other side of the thermally conductive insulating pad being in contact with the internal radiator, so that the heat of the internal heat dissipation component is transferred to the external heat dissipation component via the thermally conductive insulating pad.

[0007] As a preferred embodiment, the external heat sink includes an integrally formed first substrate and a plurality of first fins. The first substrate is fixed to the housing of the device to be cooled. Each of the first fins extends in a plane perpendicular to the first substrate, and a plurality of first flow channels are formed between each of the first fins. The extension direction of each of the first flow channels is consistent, and the exhaust direction of the cooling fan is parallel to the extension direction of the first flow channels. A sealing groove is formed on the surface of the first substrate opposite to the first fins. The external heat sink also includes a sealing ring, which is accommodated in the sealing groove so as to fit snugly against the housing of the device to be cooled.

[0008] As a preferred embodiment, the thickness of the thermally conductive insulating pad is denoted as H, and when the sealing ring is housed in the sealing groove, the height of the sealing ring protruding from the surface of the first substrate is denoted as L, satisfying: H≥L+0.8mm.

[0009] As a preferred embodiment, the built-in heat sink includes a second substrate and a plurality of second fins. The second substrate is fixed to the housing of the device to be cooled. Each of the second fins extends in a plane perpendicular to the second substrate. A plurality of second flow channels are formed between each of the second fins, and the extension directions of each of the second flow channels are consistent.

[0010] As a preferred embodiment, the built-in heat sink includes a second substrate and a plurality of second fins. The second substrate is fixed to the housing of the device to be cooled. The second substrate and each of the second fins are distributed in parallel at intervals. A plurality of second flow channels are formed between each of the second fins, and the extension direction of each of the second flow channels is consistent.

[0011] As a preferred embodiment, the heat pipe includes an integrally formed first straight section, at least one second straight section, and a connecting section. The first straight section extends in a direction parallel to the extension direction of the second substrate and is covered by the second substrate. The second straight section extends in a direction parallel to the arrangement direction of each of the second fins and penetrates each of the second fins. The connecting section bends to connect the first straight section and the second straight section.

[0012] As a preferred embodiment, the turning radius of the connecting section at the bend is denoted as R, and the diameter of the heat pipe is denoted as D, satisfying: R≥3D.

[0013] As a preferred embodiment, the built-in heat dissipation assembly further includes a built-in fan, which is housed within the cavity of the enclosure of the device to be cooled, so that airflow passes through the built-in heat sink.

[0014] As a preferred embodiment, the external heat dissipation component further includes a top cover, which is fixed to the housing of the device to be cooled, so as to cover the top of the external heat dissipation component. A through ventilation channel is formed between the top cover and the housing of the device to be cooled, and the ventilation channel extends along the arrangement direction of the external heat sink and the cooling fan.

[0015] To achieve at least one of the above objectives, the technical solution adopted by this utility model is as follows: an inverter, comprising: a housing having an inner cavity for accommodating semiconductor devices and power devices; and a heat dissipation device as described above, wherein the heat dissipation device is fixed to the housing, the built-in heat dissipation component of the heat dissipation device is located within the inner cavity, and the external heat dissipation component of the heat dissipation device is exposed outside the housing.

[0016] Compared with the prior art, the beneficial effects of this utility model are as follows: (1) The built-in heat dissipation components can efficiently absorb the heat from the high-temperature airflow in the cavity of the device to be cooled. In particular, the built-in heat dissipation components are equipped with heat pipes, which not only improves the efficiency of transferring the heat of the high-temperature airflow to the thermally conductive insulating pad, but also helps to avoid excessive occupation of the cavity space. Furthermore, the external heat dissipation components can dissipate the heat to the outside air. In other words, through heat conduction and heat convection, the heat inside the device to be cooled can be transferred to the outside, thereby reducing the temperature of the devices inside the device and the temperature of the cavity.

[0017] (2) The heat dissipation device has a simple and compact structure, which can reduce production costs and is easy to assemble. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of a heat dissipation device installed on an inverter according to some embodiments of this application.

[0019] Figure 2 This is a schematic diagram of a heat dissipation device installed in a housing according to some embodiments of this application.

[0020] Figure 3 This is a schematic diagram of a heat dissipation device installed in a housing according to other embodiments of this application.

[0021] Figure 4 This is a solid view of the bottom surface of an external heat sink according to some embodiments of this application.

[0022] Figure 5 This is a schematic diagram of a sealing ring and a thermally conductive insulating pad installed on an external heat sink according to some embodiments of this application.

[0023] Figure 6 This is a side view of a sealing ring and a thermally conductive insulating pad installed on an external heat sink according to some embodiments of this application.

[0024] Figure 7 yes Figure 6 Enlarged view of point A in the middle.

[0025] Figure 8 This is a cross-sectional schematic diagram of a heat dissipation device installed in a housing according to some embodiments of this application.

[0026] Figure 9 This is a cross-sectional schematic diagram of a heat dissipation device installed in a housing according to some other embodiments of this application.

[0027] Figure 10 This is an exploded view of a built-in heat dissipation assembly according to some embodiments of this application.

[0028] Figure 11 This is a schematic diagram of a heat pipe according to Embodiment 1 of this application.

[0029] Figure 12 This is a schematic diagram of another heat pipe according to Embodiment 1 of this application.

[0030] Figure 13 This is a schematic diagram of a heat pipe according to some embodiments of this application.

[0031] Figure 14 This is an exploded view of the built-in heat dissipation assembly according to some other embodiments of this application.

[0032] Figure 15 This is a schematic diagram of a heat pipe according to Embodiment 2 of this application.

[0033] In the diagram: 1. Heat dissipation device; 10. External heat dissipation component; 11. External heat sink; 111. First substrate; 1111. Sealing groove; 112. First fin; 113. First flow channel; 12. Cooling fan; 13. Sealing ring; 14. Top cover; 141. Ventilation channel; 20. Internal heat dissipation component; 21. Internal heat sink; 211. Second substrate; 212. Second fin; 213. Opening; 214. Second flow channel; 22. Heat pipe; 221. First straight section; 222. Second straight section; 223. Connecting section; 2231. Third straight section; 2232. Bend; 30. Thermally conductive insulating pad; 2. Inverter; 40. Cabinet; 41. Inner cavity; 50. External. Detailed Implementation

[0034] The present invention will be further described below with reference to specific embodiments. It should be noted that, without conflict, the various embodiments or technical features described below can be arbitrarily combined to form new embodiments.

[0035] In the description of this utility model, it should be noted that the directional terms such as "center", "lateral", "longitudinal", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", and "counterclockwise" are based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. They should not be construed as limiting the specific protection scope of this utility model.

[0036] It should be noted that the terms "first," "second," etc., in the specification and claims of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence.

[0037] A heat dissipation device 1, such as Figures 1-15 As shown, the device includes an external heat dissipation assembly 10, an internal heat dissipation assembly 20, and a thermally conductive insulating pad 30. Specifically, the external heat dissipation assembly 10 includes an external heat sink 11 and a cooling fan 12. At least a portion of the external heat sink 11 is exposed outside the casing 40 of the device to be cooled. The cooling fan 12 is located on the side of the external heat sink 11 to allow airflow through it. The internal heat dissipation assembly 20 includes an internal heat sink 21 and several heat pipes 22. At least a portion of the internal heat sink 21 is housed within the inner cavity 41 of the casing 40 of the device to be cooled. Each heat pipe 22 passes through the internal heat sink 21 to absorb heat from the inner cavity 41 of the casing 40. One side of the thermally conductive insulating pad 30 is in contact with the external heat sink 11, and the other side is in contact with the internal heat sink 21, allowing heat from the internal heat dissipation assembly 20 to be transferred to the external heat dissipation assembly 10 via the thermally conductive insulating pad 30.

[0038] This should be understandable, such as Figure 2 and Figure 3 As shown, the built-in heat dissipation component 20 efficiently absorbs the heat from the high-temperature airflow in the inner cavity 41 of the device to be cooled. In particular, the built-in heat dissipation component 20 is equipped with heat pipes 22, which not only improves the efficiency of transferring the heat from the high-temperature airflow to the thermally conductive insulating pad 30, but also helps to avoid excessive space occupation in the inner cavity 41. Furthermore, the external heat dissipation component 10 dissipates the heat into the outside air 50. In other words, through heat conduction and convection, the heat inside the device to be cooled can be transferred to the outside, thereby reducing the temperature of the components inside the device and lowering the temperature of the inner cavity 41.

[0039] It is worth mentioning that the heat dissipation device 1 in this embodiment has a simple and compact structure, which reduces the overall size of the equipment to be cooled, thus facilitating the miniaturization of the equipment. Furthermore, using a heat exchanger to dissipate heat from the equipment may lead to problems such as scaling, clogging, and corrosion, requiring regular cleaning and maintenance. If a leak occurs, repairs are difficult. In contrast, the heat dissipation device 1 in this embodiment mainly consists of an internal radiator 21, an external radiator 11, and a cooling fan 12, which not only reduces production costs and facilitates assembly but also requires virtually no subsequent maintenance, thereby reducing maintenance costs.

[0040] The device to be cooled can be the inverter 2 or other electrical equipment; this application does not impose any specific restrictions on this.

[0041] In some embodiments, such as Figures 2-4 As shown, the external heat sink 11 includes an integrally formed first substrate 111 and a plurality of first fins 112. The first substrate 111 can be fixed to the housing 40 of the device to be cooled. Each first fin 112 extends in a plane perpendicular to the first substrate 111. A plurality of first flow channels 113 are formed between each first fin 112. The extension direction of each first flow channel 113 is consistent. The air outlet direction of the cooling fan 12 is parallel to the extension direction of the first flow channel 113 so that the airflow passes through the first flow channel 113, thereby improving the heat dissipation efficiency of the external heat sink 11.

[0042] In at least one embodiment, the first substrate 111 and the housing 40 are connected by fasteners so that the external heat sink 11 is fixed to the outer surface of the device to be cooled. This arrangement facilitates the installation, disassembly and replacement of the external heat sink 11.

[0043] It is worth mentioning that, such as Figure 2 and Figure 3 As shown, the air outlet of the cooling fan 12 can face the external heat sink 11, so that the airflow flows from the cooling fan 12 to the first flow channel 113 of the external heat sink 11; the air outlet of the cooling fan 12 can also face away from the external heat sink 11, so that the airflow flows from the flow channel of the external heat sink 11 to the cooling fan 12. This application does not impose any specific restrictions on this.

[0044] In some embodiments, such as Figure 1 , Figure 8 and Figure 9As shown, the external heat dissipation component 10 also includes a top cover 14, which is fixed to the housing 40 of the device to be cooled, covering the external heat dissipation component 10. This top cover serves to prevent dust accumulation and protect the first fins 112, and also reduces the risk of the cooling fan 12 being blocked by foreign objects. Furthermore, a through ventilation channel 141 is formed between the top cover 14 and the housing 40 of the device to be cooled, extending along the arrangement direction of the external heat sink 11 and the cooling fan 12. It should be understood that the ventilation channel 141 between the top cover 14 and the housing 40 helps to guide and concentrate airflow, thereby increasing the air velocity in the first flow channel 113 and improving heat dissipation efficiency.

[0045] In some embodiments, such as Figure 4 and Figure 5 As shown, a sealing groove 1111 is formed on the surface of the first substrate 111 opposite to the first fin 112. The external heat dissipation assembly 10 also includes a sealing ring 13, which is housed in the sealing groove 1111 and fits snugly against the housing 40 of the device to be cooled. It should be understood that the sealing ring 13 enables a sealed connection between the external heat sink 11 and the housing 40, keeping the inner cavity 41 of the housing 40 of the device to be cooled sealed. This helps prevent dust, liquid water, high humidity air, corrosive gases, etc., from entering the inner cavity 41, thus protecting the devices in the inner cavity 41, ensuring that the device to be cooled meets the IP rating, thereby improving the stability of the device to be cooled and extending its service life.

[0046] In some embodiments, such as Figure 6 and Figure 7 As shown, the thickness of the thermally conductive insulating pad 30 is denoted as H, and the height of the sealing ring 13 protruding from the surface of the first substrate 111 when it is housed in the sealing groove 1111 is denoted as L, satisfying: H≥L+0.8mm. Wherein, the height L of the sealing ring 13 protruding from the surface of the first substrate 111 is the height of the sealing ring 13 in its uncompressed state. It should be understood that the housing 40 of the device to be cooled has through holes to accommodate the thermally conductive insulating pad 30; furthermore, one side of the thermally conductive insulating pad 30 is bonded to the external heat sink 11 via adhesive, and the other side of the thermally conductive insulating pad 30 is bonded to the internal heat sink 21 via adhesive. In other words, when one side of the thermally conductive insulating pad 30 is in contact with the external heat sink 11 and the external heat sink 11 is fixed to the outer surface of the housing 40, the other side of the thermally conductive insulating pad 30 should extend into the inner cavity 41 of the housing 40, or at least be flush with the inner surface of the housing 40, thereby ensuring that the thermally conductive insulating pad 30 is in contact with the built-in heat sink 21 fixed to the inner surface of the housing 40, so that the heat conduction between the built-in heat sink 21, the thermally conductive insulating pad 30 and the external heat sink 11 is more stable and efficient.

[0047] In at least one embodiment, H≈L+1mm, which ensures that the thermally conductive insulating pad 30 fits snugly against the external heat sink 11 and the internal heat sink 21, and also helps to prevent the thermally conductive insulating pad 30 from occupying too much space in the inner cavity 41. In addition, it also helps to prevent the thermal conductivity efficiency from being reduced due to the thermally conductive insulating pad 30 being too thick.

[0048] It is worth mentioning that the thickness of the thermally conductive insulating pad 30 can also be adjusted according to the thickness of the enclosure 40 of the device to be cooled, for example, H≈L+1.5mm, or H≈L+2mm, or H≈L+3mm. This application does not impose any specific restrictions on this.

[0049] In at least one embodiment, the thermal conductivity of the thermally conductive insulating pad 30 is greater than or equal to 2 W / (m·K) to improve the thermal conductivity of the heat dissipation device 1, which is beneficial to achieving the effect of rapidly reducing the temperature of the devices inside the equipment and reducing the temperature of the internal cavity 41 of the equipment.

[0050] In some embodiments, such as Figure 8 As shown, the built-in heat sink 21 includes a second substrate 211 and a plurality of second fins 212. The second substrate 211 is fixed to the housing 40 of the device to be cooled. Each second fin 212 extends in a plane perpendicular to the second substrate 211, and a plurality of second flow channels 214 are formed between the second fins 212. The extension directions of the second flow channels 214 are consistent. It should be understood that the high-temperature airflow in the inner cavity 41 can pass through the second flow channels 214 to improve the heat dissipation efficiency. For example, the high-temperature airflow can flow along... Figure 8 The flow is in either the first or second direction as shown.

[0051] In other embodiments, such as Figure 9 As shown, the second substrate 211 and each second fin 212 are distributed parallel to each other at intervals, and a plurality of second flow channels 214 are formed between each second fin 212, with each second flow channel 214 extending in the same direction. It should be understood that the high-temperature airflow in the inner cavity 41 can pass through the second flow channels 214 in any direction, thereby improving heat dissipation efficiency and reducing the requirements for the installation position of the built-in heat sink 21. For example, the high-temperature airflow can flow along... Figure 9 The flow is shown in the third, fourth, fifth, or sixth direction.

[0052] In at least one embodiment, the second substrate 211 and the housing 40 are connected by fasteners so that the built-in heat sink 21 is fixed to the inner surface of the device to be cooled. This arrangement facilitates the installation, removal and replacement of the built-in heat sink 21.

[0053] In at least one embodiment, the second substrate 211 has a threaded hole, the first substrate 111 has a light hole, and the fastener passes through the light hole of the first substrate 111, the housing 40 in sequence, and is connected to the threaded hole on the second substrate 211.

[0054] In some embodiments, such as Figures 10-15 As shown, the heat pipe 22 includes an integrally formed first straight section 221, at least one second straight section 222, and a connecting section 223. The extending direction of the first straight section 221 is parallel to the extending direction of the second substrate 211, and the first straight section 221 is covered by the second substrate 211. The extending direction of the second straight section 222 is parallel to the arrangement direction of each second fin 212, and the second straight section 222 passes through each second fin 212. The connecting section 223 bends to connect the first straight section 221 and the second straight section 222, thereby enabling heat conduction between the first straight section 221, the connecting section 223, and the second straight section 222. It is worth mentioning that, as Figure 13 As shown, when the heat pipe 22 has multiple second straight sections 222, the connecting section 223 can also be bent and connected between two adjacent second straight sections 222.

[0055] It is understandable that the thermal conductivity of the heat pipe 22 is higher than that of the built-in heat sink 21, enabling it to absorb the heat from the high-temperature airflow in the inner cavity 41 more efficiently and transfer it to the second substrate 211. Furthermore, through the first straight section 221 and the second straight section connected to the heat pipe 22, the heat from the second fins 212 can be transferred to the second substrate 211 more quickly. Further, the second substrate 211 and the thermally conductive insulating pad 30 can conduct heat to the external heat sink 11, and then, through the synergistic effect of the cooling fan 12 and the external heat sink 11, the heat is dissipated into the external air 50, achieving rapid heat dissipation for the device.

[0056] In at least one embodiment, such as Figure 10 and Figure 14 As shown, the second substrate 211 and the second fin 212 are respectively provided with openings 213 so that the first straight section 221 can be covered by the second substrate 211 and welded to the second substrate 211; and so that the second straight section 222 can pass through each of the second fins 212 and be welded to each of the second fins 212, thereby improving the connection reliability between the heat pipe 22 and the built-in heat sink 21, and ensuring good thermal conductivity between the heat pipe 22 and the built-in heat sink 21.

[0057] In some embodiments, such as Figure 11 , Figure 12 and Figure 15As shown, the turning radius of the connecting section 223 at the bend 2232 is denoted as R, and the diameter of the heat pipe 22 is denoted as D. The condition is that R≥3D. This setting can reduce the degree of decrease in thermal conductivity at the bend 2232, thereby improving the overall thermal conductivity of the heat pipe 22. It can also reduce the stress concentration phenomenon at the bend 2232, thereby improving the structural strength and reliability of the heat pipe 22.

[0058] The following are two specific embodiments of the built-in heat dissipation component 20: Example 1 like Figures 10-12 As shown, the second substrate 211 and a plurality of second fins 212 of the built-in heat sink 21 are integrally formed, and each second fin 212 extends in a plane perpendicular to the second substrate 211. Further, the heat pipe 22 includes an integrally formed first straight section 221, a second straight section 222, and a connecting section 223, wherein the first straight section 221 and the second straight section 222 are arranged in parallel. Specifically, the first straight section 221 is covered by the second substrate 211; the extension direction of the second straight section 222 is parallel to the arrangement direction of each second fin 212, thus penetrating each second fin 212; the connecting section 223 bends to connect the first straight section 221 and the second straight section 222.

[0059] It is worth mentioning that the connecting section 223 can be implemented as a third straight section 2231, that is, the heat pipe 22 is U-shaped, in order to reduce the space occupied by the heat pipe 22 in the inner cavity 41, such as Figure 11 As shown. The connecting section 223 can also be implemented as an arc-shaped section, that is, the heat pipe 22 is U-shaped, which is beneficial to increase the turning radius of the bend 2232, such as... Figure 12 As shown.

[0060] Example 2 like Figure 14 and Figure 15 As shown, the second substrate 211 and the various second fins 212 of the built-in heat sink 21 are distributed in parallel at intervals. Further, the heat pipe 22 includes an integrally formed first straight section 221, two second straight sections 222, and two connecting sections 223. Specifically, the first straight section 221 is covered by the second substrate 211; the two second straight sections 222 are respectively connected to both ends of the first straight section 221 via the connecting sections 223. The two second straight sections 222 are arranged in parallel and extend along the arrangement direction of the various second fins 212, thus penetrating and connecting to the various second fins 212. In other words, the heat pipe 22 can connect and fix the various second fins 212 to the second substrate 211.

[0061] It is worth mentioning that in Embodiment 2, the heat pipe 22 is U-shaped and connected to each of the second fins 212 through two spaced and parallel second straight sections 222, thereby improving the heat conduction efficiency from the second fins 212 to the second substrate 211 and also enhancing the connection reliability between the heat pipe 22 and the second fins 212. In other embodiments, the heat pipe 22 may also be L-shaped, i.e., connected to the second fins 212 through only one second straight section 222; the heat pipe 22 may also be mountain-shaped, i.e., connected to the second fins 212 through three spaced second straight sections 222; this application does not impose a specific limitation on the number of second straight sections 222.

[0062] In some embodiments, such as Figure 8 and Figure 9 As shown, the built-in heat dissipation assembly 20 also includes a built-in fan (not shown), which is housed within the cavity 41 of the enclosure 40 of the device to be cooled, so that airflow passes through the built-in heat sink 21. In other words, the built-in fan allows the high-temperature airflow inside the enclosure 40 to pass through the second flow channel 214 of the built-in heat sink 21, thereby improving the heat absorption efficiency of the built-in heat sink 21 and the heat pipe 22, which is beneficial for quickly reducing the temperature of the devices inside the device and reducing the temperature of the cavity 41.

[0063] An inverter 2, such as Figures 1-3 As shown, the system includes a housing 40 and the aforementioned heat dissipation device 1. Specifically, the housing 40 has an inner cavity 41, which accommodates semiconductor devices and power devices. The heat dissipation device 1 is fixed to the housing 40, with its built-in heat dissipation component 20 located within the inner cavity 41, and its external heat dissipation component 10 exposed outside the housing 40. It should be understood that the built-in heat dissipation component 20 efficiently absorbs the heat from the high-temperature airflow within the inner cavity 41 of the inverter 2. In particular, the built-in heat dissipation component 20 is equipped with heat pipes 22, which not only improves the efficiency of transferring the heat from the high-temperature airflow to the thermally conductive insulating pad 30 but also helps avoid excessive space occupation within the inner cavity 41. Furthermore, the external heat dissipation component 10 dissipates heat into the external air 50. In other words, through heat conduction and convection, heat within the inverter 2 can be transferred to the outside, thereby reducing the temperature of the devices inside the equipment and lowering the temperature of the inner cavity 41.

[0064] The basic principles, main features, and advantages of this utility model have been described above. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely the principles of this utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claimed utility model. The scope of protection of this utility model is defined by the appended claims and their equivalents.

Claims

1. A heat dissipation device, characterized in that, include: An external heat dissipation assembly includes an external heat sink and a cooling fan. At least a portion of the external heat sink is exposed outside the enclosure of the device to be cooled. The cooling fan is located on the side of the external heat sink to allow airflow to pass through the external heat sink. The built-in heat dissipation component includes a built-in radiator and a plurality of heat pipes. At least a portion of the built-in radiator is housed within the inner cavity of the housing of the device to be cooled. Each of the heat pipes passes through the built-in radiator to absorb heat from the inner cavity of the housing. A thermally conductive insulating pad is provided, with one side of the pad adhering to the external heat sink and the other side adhering to the internal heat sink, so that the heat from the internal heat sink is transferred to the external heat sink via the thermally conductive insulating pad.

2. The heat dissipation device according to claim 1, characterized in that, The external heat sink includes an integrally formed first substrate and a plurality of first fins. The first substrate can be fixed to the housing of the device to be cooled. Each of the first fins extends in a plane perpendicular to the first substrate. A plurality of first flow channels are formed between each of the first fins. The extension direction of each of the first flow channels is consistent. The exhaust direction of the cooling fan is parallel to the extension direction of the first flow channels. A sealing groove is formed on the surface of the first substrate facing away from the first fin. The external heat dissipation assembly also includes a sealing ring, which is housed in the sealing groove so as to fit against the housing of the device to be cooled.

3. The heat dissipation device according to claim 2, characterized in that, The thickness of the thermally conductive insulating pad is denoted as H, and the height of the sealing ring protruding from the surface of the first substrate when the sealing ring is housed in the sealing groove is denoted as L, satisfying: H≥L+0.8mm.

4. The heat dissipation device according to claim 1, characterized in that, The built-in heat sink includes a second substrate and a plurality of second fins. The second substrate can be fixed to the housing of the device to be cooled. Each of the second fins extends in a plane perpendicular to the second substrate. A plurality of second flow channels are formed between each of the second fins, and the extension direction of each of the second flow channels is consistent.

5. The heat dissipation device according to claim 1, characterized in that, The built-in heat sink includes a second substrate and a plurality of second fins. The second substrate can be fixed to the housing of the device to be cooled. The second substrate and each of the second fins are distributed in parallel at intervals. A plurality of second flow channels are formed between each of the second fins, and the extension direction of each of the second flow channels is consistent.

6. The heat dissipation device according to claim 4 or 5, characterized in that, The heat pipe includes an integrally formed first straight section, at least one second straight section, and a connecting section. The extension direction of the first straight section is parallel to the extension direction of the second substrate, and the first straight section is covered by the second substrate. The extension direction of the second straight section is parallel to the arrangement direction of each of the second fins, and the second straight section penetrates each of the second fins. The connecting segment bends to connect the first straight segment and the second straight segment.

7. The heat dissipation device according to claim 6, characterized in that, Let R be the turning radius of the connecting section at the bend, and let D be the diameter of the heat pipe, satisfying: R≥3D.

8. The heat dissipation device according to any one of claims 1-5, characterized in that, The built-in heat dissipation component also includes a built-in fan, which is housed within the cavity of the housing of the device to be cooled, so that airflow passes through the built-in heat sink.

9. The heat dissipation device according to any one of claims 1-5, characterized in that, The external heat dissipation component also includes a top cover, which is fixed to the housing of the device to be cooled, so as to cover the top of the external heat dissipation component. A through ventilation channel is formed between the top cover and the housing of the device to be cooled, and the ventilation channel extends along the arrangement direction of the external heat sink and the cooling fan.

10. An inverter, characterized in that, include: A housing having an internal cavity for accommodating semiconductor devices and power devices; The heat dissipation device as described in any one of claims 1-9 is fixed to the housing, the built-in heat dissipation component of the heat dissipation device is located inside the inner cavity, and the external heat dissipation component of the heat dissipation device is exposed outside the housing.

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