energy storage device

Abstract

The application provides an energy storage device, which comprises a heat dissipation shell, an inverter circuit board and a semiconductor refrigeration sheet. An installation space for accommodating the inverter circuit board is formed on the inner side of the heat dissipation shell, and a plurality of heat dissipation fins are arranged on the outer side of the heat dissipation shell. The heat radiation surface of the semiconductor refrigeration sheet is attached to the inner wall of the heat dissipation shell and located in the region opposite to the plurality of heat dissipation fins, and the heat absorption surface faces the inverter circuit board. The inverter circuit board is arranged in the installation space of the heat dissipation shell, and the inverter circuit board is provided with a controller, a driving circuit and a power supply end. The controller is used for controlling the driving circuit, so that the heat generated by the semiconductor refrigeration sheet on the inverter circuit board is absorbed through the heat absorption surface and is transmitted to the heat dissipation shell and the heat dissipation fins through the heat radiation surface for heat dissipation. The energy storage device can effectively reduce the volume of the energy storage inverter by controlling the driving circuit to drive the semiconductor refrigeration sheet to realize the refrigeration function of the semiconductor refrigeration sheet.

Description

Technical Field

[0001] This application relates to the field of energy storage equipment technology, and more specifically, to an energy storage device. Background Technology

[0002] As the market size of energy storage systems gradually expands, product competition is becoming increasingly fierce. The heat dissipation method plays a key role in energy storage systems. Currently, some energy storage systems use natural cooling, but this method has low heat dissipation efficiency, resulting in large machine size and low power density.

[0003] In related technologies, energy storage devices can also employ air-cooling and water-cooling solutions to dissipate heat. Air-cooling uses a fan to directly blow heat from the heat sink fins, removing the heat generated by the energy storage device. However, this method suffers from problems such as high noise levels, difficulties in airflow design, and insufficient protection levels. Water-cooling, on the other hand, uses a water pump to pump cold water into the heat sink fins to remove heat, thus cooling the energy storage device. However, this method requires additional components such as water pumps and piping, leading to a larger overall size of the energy storage device. Utility Model Content

[0004] This application aims to at least address the technical problems of high noise, large size, and complex structural design in the heat dissipation methods of existing energy storage systems.

[0005] Therefore, this application provides an energy storage device.

[0006] This application provides an energy storage device, including: a heat dissipation housing, an inverter circuit board, and a thermoelectric cooler; the inner side of the heat dissipation housing forms an installation space for accommodating the inverter circuit board, and the outer side of the heat dissipation housing is provided with multiple heat dissipation fins; the thermoelectric cooler has a heat absorption surface and a heat dissipation surface arranged opposite to each other, the heat dissipation surface is attached to the inner wall of the heat dissipation housing and located in the area opposite to the multiple heat dissipation fins, and the heat absorption surface faces the inverter circuit board; the inverter circuit board is disposed in the installation space of the heat dissipation housing, and the inverter circuit board is provided with a controller, a drive circuit, and a power supply terminal, the drive circuit is electrically connected to the controller and the thermoelectric cooler respectively, the power supply terminal is electrically connected to the thermoelectric cooler to supply power to the thermoelectric cooler, and the controller is used to control the drive circuit so that the thermoelectric cooler absorbs the heat generated by the inverter circuit board through the heat absorption surface and transfers it to the heat dissipation housing and heat dissipation fins through the heat dissipation surface for heat dissipation.

[0007] The energy storage device provided in this application utilizes a thermoelectric cooler. The heat-dissipating surface of the thermoelectric cooler is attached to the inner side of a heat sink housing, while multiple heat dissipation fins on the outer side of the housing are positioned back-to-back. When the controller controls the drive circuit to operate the thermoelectric cooler, the heat-absorbing surface of the cooler absorbs heat from inside the heat sink housing and transfers it to the heat-dissipating surface. The heat is then transferred to the heat dissipation fins on the outside of the housing, dissipating the heat into the air outside the housing, thus achieving the heat dissipation process of the energy storage device. Compared to traditional air-cooling and water-cooling solutions, using a thermoelectric cooler for heat dissipation effectively reduces vibration and noise generated during operation. Furthermore, the thermoelectric cooler is small in size and occupies little space, thus effectively reducing the overall size of the energy storage device.

[0008] In some technical solutions, optionally, the semiconductor cooling chip includes: a first semiconductor, the first end of which is connected to the positive terminal of the power supply; and a second semiconductor, the first end of which is connected to the negative terminal of the power supply via a driving circuit, and the second end of which is connected to the second end of the first semiconductor; wherein the second end of the first semiconductor and the second end of the second semiconductor are heat-absorbing surfaces, and the first end of the first semiconductor and the first end of the second semiconductor are heat-releasing surfaces.

[0009] In this technical solution, the thermoelectric cooler includes a first semiconductor and a second semiconductor. The first end of the first semiconductor is connected to the positive terminal of the power supply, and the first end of the second semiconductor is connected to the negative terminal of the power supply via a driving circuit. Simultaneously, the second end of the second semiconductor is connected to the second end of the first semiconductor. That is, under the drive of the driving circuit, the electrical energy supplied by the power supply flows sequentially through the first end of the first semiconductor, the second end of the first semiconductor, the second end of the second semiconductor, the first end of the second semiconductor, and the driving circuit, finally flowing to the negative terminal of the power supply, thus forming the current flow path of the thermoelectric cooler.

[0010] Simultaneously, the second ends of both the first and second semiconductors serve as heat-absorbing surfaces, meaning that the second ends of both semiconductors face the interior of the heat sink. When current flows through the semiconductor cooling chip, the temperatures of the second ends of both semiconductors decrease, thus absorbing heat from the heat sink. Correspondingly, the first ends of both semiconductors serve as heat-dissipating surfaces, meaning that the first ends of both semiconductors are attached to the inner side of the heat sink and located in an area opposite to the multiple heat dissipation fins. This allows them to transfer the absorbed heat to the heat dissipation fins, which then exchange heat with the air outside the heat sink, thereby achieving the heat dissipation function of the energy storage device.

[0011] In some technical solutions, optionally, the first semiconductor includes an N-type semiconductor and the second semiconductor includes a P-type semiconductor.

[0012] In this technical solution, the first semiconductor is an N-type semiconductor, and the second semiconductor is a P-type semiconductor. Based on the Peltier effect, when the semiconductor heat sink is energized, current flows from the node between the N-type semiconductor and the P-type semiconductor, that is, from the first end to the second end of the N-type semiconductor. At the second end of the N-type semiconductor, heat is absorbed, causing its temperature to decrease. After the current reaches the second end of the P-type semiconductor, it flows back to the first end, causing its temperature to rise and releasing heat into the heat sink fins.

[0013] In some technical solutions, optionally, multiple power devices are provided on the inverter circuit board, with the multiple power devices located on the side of the inverter circuit board facing the thermoelectric cooler.

[0014] In this technical solution, multiple power devices can also be installed on the inverter circuit board. These multiple power devices can operate under the control of the controller, thereby controlling the inverter circuit board and enabling the energy storage device to control the electrical parameters through the inverter circuit board during operation.

[0015] In this configuration, multiple power devices are positioned on the side of the inverter circuit board facing the thermoelectric cooler, meaning they are located close to the cooler. This is because, during operation, the power devices, as the primary heat source, generate significant amounts of heat. By placing these devices close to the cooler on the inverter circuit board, the heat generated during operation can be rapidly transferred to the cooler, where it is absorbed by the cooler's heat-absorbing surface. This effectively improves the heat dissipation efficiency of the cooling system for the power devices.

[0016] In some technical solutions, the energy storage device may optionally include: a temperature acquisition unit, located in the installation space of the heat dissipation shell, for acquiring the temperature inside the heat dissipation shell, the temperature acquisition unit being electrically connected to the controller, and the controller being used to control the drive circuit based on the temperature acquired by the temperature acquisition unit.

[0017] In this technical solution, the energy storage device may also include a temperature acquisition unit, which is installed in the installation space of the heat dissipation shell of the energy storage device. Through the temperature acquisition unit, the temperature inside the heat dissipation shell of the energy storage device can be acquired in real time, thereby enabling the controller of the energy storage device to drive the semiconductor cooling chip according to the temperature control drive circuit inside the heat dissipation shell of the energy storage device.

[0018] By setting up a temperature acquisition unit, the operation of the heat dissipation device can be controlled based on the real-time temperature inside the heat dissipation shell during the operation of the energy storage device, which effectively improves the control accuracy of the heat dissipation device.

[0019] In some technical solutions, optionally, there are multiple semiconductor cooling chips, and the heat dissipation surfaces of the multiple semiconductor cooling chips are attached to the inner wall of the heat dissipation housing and located in an area opposite to the multiple heat dissipation fins.

[0020] In this technical solution, the energy storage device can be equipped with multiple thermoelectric coolers. The heat-dissipating surfaces of the multiple thermoelectric coolers are attached to the inner side of the heat dissipation shell, and the heat-dissipating surfaces of the multiple thermoelectric coolers are all located in the area opposite to the multiple heat dissipation fins. This allows the multiple thermoelectric coolers to transfer heat to the multiple heat dissipation fins at the same time. In other words, the heat inside the heat dissipation shell is absorbed by the multiple thermoelectric coolers at the same time, thereby improving the heat dissipation efficiency of the heat dissipation device.

[0021] It should be noted that, in addition to setting multiple thermoelectric coolers, a corresponding drive circuit can be set for each thermoelectric cooler to ensure the normal operation of each thermoelectric cooler.

[0022] In some technical solutions, the energy storage device may optionally include a thermally conductive insulating layer, which is attached to the inner wall of the heat sink and located between the semiconductor cooling chip and the inner wall of the heat sink.

[0023] In this technical solution, a thermally conductive insulating layer can be provided between the heat dissipation housing and the thermoelectric cooler. The thermally conductive insulating layer can achieve insulation between the thermoelectric cooler and the heat dissipation housing.

[0024] In some technical solutions, the energy storage device may optionally include: a battery housing and an energy storage battery; the inner side of the battery housing forms a receiving space for accommodating the energy storage battery; the energy storage battery is disposed in the receiving space of the battery housing and is electrically connected to the inverter circuit board.

[0025] In this technical solution, the energy storage device may also include a battery casing and an energy storage battery disposed within the battery casing. Specifically, the inner side of the battery casing forms a accommodating space for accommodating the energy storage battery, thereby enabling the energy storage battery to be accommodated within the accommodating space of the battery casing.

[0026] Energy storage batteries can store electrical energy and provide it when needed. Inverter circuit boards can control electrical parameters during the charging and discharging of the energy storage batteries to ensure the normal operation of the energy storage device.

[0027] In some technical solutions, optionally, the driving circuit includes: a first transistor, a first terminal of which is connected to a first terminal of a second semiconductor, and a second terminal of which is connected to the negative terminal of a power supply; a control circuit, which is connected to the control terminal of the first transistor and a controller, and is used to send a driving signal to the control terminal of the first transistor upon receiving a control signal from the controller, so as to control the conduction between the first terminal and the second terminal of the first transistor; a second transistor, a first terminal of which is connected to the power supply, a second terminal of which is grounded, and a control terminal of which is connected to the controller; and a third transistor, a first terminal of which is connected to the power supply, a second terminal of which is connected to the control terminal of the first transistor, and a control terminal of which is connected to the first terminal of the second transistor.

[0028] In this technical solution, the driving circuit may specifically include a first transistor and a control circuit. The first end of the first transistor is connected to the first end of the second semiconductor, and the second end of the first transistor is connected to the negative terminal of the power supply. That is, when the first end and the second end of the first transistor are turned on, the current supplied by the power supply can pass through the first end of the first semiconductor, the second end of the first semiconductor, the second end of the second semiconductor, the first end of the second semiconductor, and the first transistor in sequence, and finally reach the negative terminal of the power supply, thereby forming the current flow path of the semiconductor cooling chip.

[0029] Specifically, the control terminal of the first transistor is connected to the control circuit, and the control circuit is connected to the controller. In this way, the controller can control the control circuit. That is, the control circuit can receive the control signal sent by the controller and send a drive signal to the control terminal of the first transistor based on the control signal, thereby driving the first terminal and the second terminal of the first transistor to conduct, and thus realizing the power supply of the semiconductor cooling chip.

[0030] The control circuit may include a second transistor and a third transistor. The first terminal of the second transistor is connected to a power supply terminal, thereby providing a drive current to the second transistor through the power supply terminal. The second terminal of the second transistor is grounded. The control terminal of the second transistor is connected to a controller. The controller can send a control signal to the control terminal of the second transistor to control the conduction and cutoff between the first terminal of the second transistor and the second terminal of the second transistor.

[0031] The first terminal of the third transistor is connected to the power supply terminal, thereby providing drive current to the third transistor through the power supply terminal. The second terminal of the third transistor is connected to the control terminal of the first transistor, and the control terminal of the third transistor is connected to the first terminal of the second transistor. When the controller sends a control signal to the second transistor, the first and second terminals of the second transistor conduct, allowing the current supplied by the power supply terminal to flow through the second transistor. At this time, the voltage level of the first terminal of the second transistor is low, which means the voltage level of the control terminal of the third transistor changes from high to low. The second terminal of the third transistor then conducts, allowing the current supplied by the power supply terminal to flow through the third transistor. Similarly, the voltage level of the second terminal of the third transistor then becomes high, causing the voltage level of the control terminal of the first transistor to change from low to high. This conduction of the first and second terminals of the first transistor allows the current supplied by the power supply terminal to flow through the thermoelectric cooler, thus realizing the cooling function of the thermoelectric cooler.

[0032] In some technical solutions, the driving circuit may optionally further include: a first current-limiting resistor, one end of which is connected to the control terminal of the first transistor, and the other end of which is connected to the second terminal of the first transistor; a second current-limiting resistor, one end of which is connected to the control terminal of the second transistor, and the other end of which is connected to the second terminal of the second transistor; a third current-limiting resistor, one end of which is connected to the power supply terminal, and the other end of which is connected to the first terminal of the second transistor; a fourth current-limiting resistor, one end of which is connected to the first terminal of the third transistor, and the other end of which is connected to the control terminal of the third transistor; and a fifth current-limiting resistor, one end of which is connected to the second terminal of the third transistor, and the other end of which is connected to the control terminal of the first transistor.

[0033] In this technical solution, the driving circuit also includes a first current-limiting resistor. The first current-limiting resistor is set between the control terminal of the first transistor and the second terminal of the first transistor. By setting the first current-limiting resistor, the voltage difference between the control terminal and the second terminal of the first transistor can be effectively avoided to prevent the first transistor from breaking down due to excessive voltage difference, that is, to prevent the first transistor from being damaged and to ensure the stable operation of the driving circuit.

[0034] The control circuit also includes a second current-limiting resistor, which is set between the control terminal of the second transistor and the second terminal of the second transistor. By setting the second current-limiting resistor, the voltage difference between the control terminal of the second transistor and the second terminal of the second transistor can be effectively prevented from being too large, which would cause the second transistor to break down, thus preventing damage to the second transistor and ensuring the stable operation of the control circuit.

[0035] Optionally, the control circuit also includes a third current-limiting resistor, which is connected between the power supply terminal and the first terminal of the second transistor. By setting the third current-limiting resistor, the current flowing from the power supply terminal to the second transistor can be effectively reduced, that is, the voltage between the first and second terminals of the second transistor can be effectively reduced, thereby avoiding excessive voltage across the second transistor and causing damage to the second transistor, and ensuring the stable operation of the control circuit.

[0036] The control circuit also includes a fourth current-limiting resistor, which is set between the control terminal and the first terminal of the third transistor. By setting the fourth current-limiting resistor, the voltage difference between the control terminal and the first terminal of the third transistor can be effectively prevented from being too large, which could cause the third transistor to break down. In other words, the third transistor is prevented from being damaged, and the stable operation of the control circuit is ensured.

[0037] Optionally, the control circuit also includes a fifth current-limiting resistor, which is connected between the second terminal of the third transistor and the control terminal of the first transistor. By setting the fifth current-limiting resistor, the magnitude of the current flowing to the control terminal of the first transistor can be effectively reduced, so as to avoid the first transistor being damaged due to excessive current at the control terminal, and to ensure the stable operation of the drive circuit.

[0038] Additional aspects and advantages of this application will become apparent in the following description or may be learned by practice of this application. Attached Figure Description

[0039] The above and / or additional aspects and advantages of this application will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which: Figure 1 One of the structural schematic diagrams of the energy storage device according to an embodiment of this application is shown; Figure 2 A second schematic diagram of the structure of the energy storage device according to an embodiment of this application is shown; Figure 3 A schematic diagram of the structure of a semiconductor refrigeration chip in an energy storage device according to an embodiment of this application is shown; Figure 4 A circuit diagram of the drive circuit in the energy storage device according to an embodiment of this application is shown; Figure 5 The third schematic diagram of the energy storage device according to an embodiment of this application is shown; Figure 6 The fourth schematic diagram of the energy storage device according to an embodiment of this application is shown; Figure 7 A timing diagram showing the relationship between the temperature inside the heat sink housing and the drive signal of the first transistor in the energy storage device according to an embodiment of this application is shown. Figure 8The fifth schematic diagram of the energy storage device according to an embodiment of this application is shown; Figure 9 A schematic diagram of the battery casing in an energy storage device according to an embodiment of this application is shown.

[0040] Figure label: 100 Energy storage device, 102 Heat sink housing, 104 Inverter circuit board, 106 Controller, 110 Heat sink fins, 112 Semiconductor cooling chip, 114 Drive circuit, 116 Heat absorption surface, 118 Heat dissipation surface, 120 Power supply terminal, 122 First semiconductor, 124 Second semiconductor, 126 First transistor, 128 Control circuit, 130 First current limiting resistor, 132 Second transistor, 134 Third transistor, 136 Second current limiting resistor, 138 Third current limiting resistor, 140 Fourth current limiting resistor, 142 Fifth current limiting resistor, 144 Temperature acquisition unit, 146 Thermally conductive insulation layer, 148 Power device, 150 Battery housing, 152 Energy storage battery, 154 Installation space, 156 Accommodation space. Detailed Implementation

[0041] To better understand the above-mentioned objectives, features, and advantages of this application, the application will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be noted that, unless otherwise specified, the embodiments and features described in these embodiments can be combined with each other.

[0042] Many specific details are set forth in the following description in order to provide a full understanding of this application. However, this application may also be implemented in other ways different from those described herein. Therefore, the scope of protection of this application is not limited to the specific embodiments disclosed below.

[0043] The following reference Figures 1 to 9 This application describes an energy storage device provided according to some embodiments.

[0044] In this application, the energy storage device can be one of a balcony energy storage device, a home energy storage device, or a portable energy storage device.

[0045] Among them, balcony energy storage equipment is a micro-photovoltaic energy storage system specifically designed for small spaces such as apartment balconies. Users can install photovoltaic panels on their balconies to store the solar energy generated during the day in an integrated energy storage device for nighttime use. It can effectively improve the self-consumption rate of green electricity, making it suitable for single-person or small family users, reducing dependence on the grid and electricity bills.

[0046] Home energy storage devices are fixed, off-grid energy storage systems installed in detached houses, often in conjunction with rooftop solar power. They store surplus electricity generated by the solar panels or charge the system during off-peak hours, providing backup power for the entire house during peak hours, high electricity prices, or grid outages. Their core value lies in achieving energy self-sufficiency, saving on electricity bills, and ensuring the continuity and security of household electricity supply.

[0047] Portable energy storage devices are mobile outdoor power sources, typically equipped with multiple interfaces such as AC, DC, and USB. They do not rely on fuel and are charged via mains power or solar panels. Their core function is to provide a stable power output. They are mainly used in off-grid scenarios such as outdoor camping, road trips, and emergency disaster preparedness to power various small electrical appliances and digital devices.

[0048] Some embodiments of this application provide an energy storage device 100, such as Figure 1 , Figure 5 , Figure 6 and Figure 8 As shown, the energy storage device 100 includes: a heat dissipation housing 102, an inverter circuit board 104, and a thermoelectric cooler 112; the inner side of the heat dissipation housing 102 forms an installation space 154 for accommodating the inverter circuit board 104, and the outer side of the heat dissipation housing 102 is provided with a plurality of heat dissipation fins 110; the thermoelectric cooler 112 has a heat absorption surface 116 and a heat dissipation surface 118 arranged opposite to each other, the heat dissipation surface 118 is attached to the inner wall of the heat dissipation housing 102 and located in the area opposite to the plurality of heat dissipation fins 110, and the heat absorption surface 116 faces the inverter circuit board 104; the inverter circuit board 104 is located on ... dissipation surface 116 faces the inverter circuit board 104; the inverter circuit board 104 is located on The heat sink housing 102 has an installation space 154. The inverter circuit board 104 is equipped with a controller 106, a drive circuit 114, and a power supply terminal 120. The drive circuit 114 is electrically connected to the controller 106 and the thermoelectric cooler 112. The power supply terminal 120 is electrically connected to the thermoelectric cooler 112 to supply power to the thermoelectric cooler 112. The controller 106 is used to control the drive circuit 114 so that the thermoelectric cooler 112 absorbs the heat generated by the inverter circuit board 104 through the heat absorption surface 116 and transfers it to the heat sink housing 102 and the heat dissipation fins 110 for heat dissipation through the heat release surface 118.

[0049] The energy storage device 100 provided in this application includes a heat sink housing 102 and an inverter circuit board 104. An installation space 154 for accommodating the inverter circuit board 104 is formed inside the heat sink housing 102, and the inverter circuit board 104 is disposed within the heat sink housing 102, i.e., the inverter circuit board 104 is disposed within the installation space 154 of the heat sink housing 102. A controller 106 is provided on the inverter circuit board 104. Through the controller 106, the switching components in the inverter of the energy storage device 100 on the inverter circuit board 104 can be controlled. When the energy storage device 100 is connected to a DC power supply, it can convert the input DC power into AC power to supply AC loads. When the energy storage device 100 is connected to an AC power supply, the controller 106 controls the switching components to adjust the parameters of the AC power, ensuring that the parameters of the AC power output by the energy storage device 100 meet the normal operating requirements of the load, thus guaranteeing the normal operation of the load. In addition, the energy storage device 100 can also convert AC power into DC power and transmit the DC power to the energy storage battery for storage.

[0050] Optionally, multiple heat dissipation fins 110 may be provided on the outer side of the heat dissipation housing 102. Correspondingly, the energy storage device 100 also includes a thermoelectric cooler 112. Specifically, the thermoelectric cooler 112 has a heat-absorbing surface 116 and a heat-dissipating surface 118 arranged opposite to each other. The heat-dissipating surface 118 of the thermoelectric cooler 112 is attached to the inner wall of the heat dissipation housing 102, and the heat-dissipating surface 118 of the thermoelectric cooler 112 is located in the area where the multiple heat dissipation fins 110 are arranged opposite to each other. That is, the thermoelectric cooler 112 and the multiple heat dissipation fins 110 are located on the inner and outer sides of the heat dissipation housing 102, respectively.

[0051] Understandably, when the thermoelectric cooler 112 is operating, it can absorb heat from the mounting space 154 of the heat sink housing 102 through the heat absorption surface 116, and then transfer the heat absorbed by the heat absorption surface 116 to the heat dissipation surface 118 of the thermoelectric cooler 112. Since the heat dissipation surface 118 is attached to the inner wall of the heat sink housing 102 and is located in the area where multiple heat dissipation fins 110 are arranged back to back, the heat dissipation surface 118 can transfer heat to the multiple heat dissipation fins 110 on the outside of the heat sink housing 102, and then dissipate the heat to the air outside the heat sink housing 102 through the multiple heat dissipation fins 110. This achieves heat dissipation of the interior of the energy storage device 100, preventing the internal temperature of the energy storage device 100 from becoming too high and affecting the operation of electronic components such as the inverter circuit board 104.

[0052] It is understood that the thermoelectric cooler 112, also known as a Peltier cooler, is a solid-state energy conversion device that utilizes the Peltier effect. It lacks moving parts found in traditional compressor refrigeration systems, such as compressors, refrigerants, and valves, making it a noiseless, vibration-free, refrigerant-free, and compact refrigeration or heating device. In other words, by using heat dissipation fins 110 and the thermoelectric cooler 112 as the heat dissipation device, the energy storage device 100 of this application can effectively reduce the vibration and noise emitted during operation. Furthermore, the small size and minimal space occupied by the thermoelectric cooler 112 also effectively reduce the overall size of the energy storage device 100.

[0053] Optionally, the energy storage device 100 also includes a controller 106, a drive circuit 114, and a power supply terminal 120 disposed on the inverter circuit board 104. The drive circuit 114 can be used to drive the thermoelectric cooler 112 to realize the operation of the thermoelectric cooler 112, thereby realizing heat dissipation of the energy storage device 100 through the thermoelectric cooler 112. Specifically, the drive circuit 114 can be directly disposed on the inverter circuit board 104, that is, it utilizes the original space of the inverter circuit board 104 of the energy storage device 100 without occupying other space inside the heat dissipation housing 102 of the energy storage device 100, thus ensuring the overall miniaturization design of the energy storage device 100. Specifically, the drive circuit 114 can be electrically connected to the controller 106 and the thermoelectric cooler 112 respectively, so that the controller 106 of the energy storage device 100 can directly control the drive circuit 114, so that the drive circuit 114 can drive the thermoelectric cooler 112 to run under the control of the controller 106, so that the power supply terminal 120 supplies power to the thermoelectric cooler 112, ensuring the intelligent control process of the heat dissipation device.

[0054] The energy storage device 100 provided in this application uses a semiconductor cooling chip 112. The heat-dissipating surface 118 of the semiconductor cooling chip 112 is attached to the inner side of the heat dissipation housing 102, and the area where multiple heat dissipation fins 110 on the outer side of the heat dissipation housing 102 are arranged back to back. When the controller 106 controls the drive circuit 114 to drive the semiconductor cooling chip 112 to run, the heat-absorbing surface 116 of the semiconductor cooling chip 112 can absorb the heat inside the heat dissipation housing 102 and transfer it to the heat-dissipating surface 118. Then, the heat is transferred to the heat dissipation fins 110 on the outside of the heat dissipation housing 102 through the heat dissipating surface 118, so as to dissipate the heat to the air outside the heat dissipation housing 102, thus realizing the heat dissipation process of the energy storage device 100. Compared to traditional air-cooling and water-cooling solutions, the method of heat dissipation through the semiconductor cooling chip 112 can effectively reduce the vibration and noise emitted by the energy storage device 100 during operation. At the same time, the semiconductor cooling chip 112 is small in size and occupies little space, which can also effectively reduce the size of the energy storage device 100.

[0055] In some embodiments, optionally, such as Figure 3 As shown, the thermoelectric cooler 112 includes: a first semiconductor 122, the first end of which is connected to the positive terminal of the power supply terminal 120; and a second semiconductor 124, the first end of which is connected to the negative terminal of the power supply terminal 120 via a driving circuit 114, and the second end of which is connected to the second end of the first semiconductor 122; wherein the second end of the first semiconductor 122 and the second end of the second semiconductor 124 are heat-absorbing surfaces 116, and the first end of the first semiconductor 122 and the first end of the second semiconductor 124 are heat-dissipating surfaces 118.

[0056] In this embodiment, the thermoelectric cooler 112 includes a first semiconductor 122 and a second semiconductor 124. The first end of the first semiconductor 122 is connected to the positive terminal of the power supply terminal 120, and the first end of the second semiconductor 124 is connected to the negative terminal of the power supply terminal 120 via a driving circuit 114. Simultaneously, the second end of the second semiconductor 124 is connected to the second end of the first semiconductor 122. That is, under the drive of the driving circuit 114, the electrical energy provided by the power supply terminal 120 flows sequentially through the first end of the first semiconductor 122, the second end of the first semiconductor 122, the second end of the second semiconductor 124, the first end of the second semiconductor 124, and the driving circuit 114, finally flowing to the negative terminal of the power supply terminal 120, thereby forming the current flow path of the thermoelectric cooler 112.

[0057] Meanwhile, the second ends of the first semiconductor 122 and the second ends of the second semiconductor 124 are heat-absorbing surfaces 116, meaning that the second ends of both the first semiconductor 122 and the second ends of the second semiconductor 124 face the interior of the heat dissipation housing 102. When current flows through the thermoelectric cooler 112, the temperature of the second ends of the first semiconductor 122 and the second ends of the second semiconductor 124 decreases, thus absorbing heat from the heat dissipation housing 102. Correspondingly, the first ends of the first semiconductor 122 and the first ends of the second semiconductor 124 are heat-dissipating surfaces 118, meaning that the first ends of both the first semiconductor 122 and the first ends of the second semiconductor 124 are attached to the inner side of the heat dissipation housing 102 and located in the area opposite to the multiple heat dissipation fins 110, thereby transferring the absorbed heat to the heat dissipation fins 110, so that the heat can be exchanged with the air outside the heat dissipation housing 102 through the heat dissipation fins 110, thereby realizing the heat dissipation function of the energy storage device 100.

[0058] Optionally, the first semiconductor 122 is an N-type semiconductor and the second semiconductor 124 is a P-type semiconductor. Based on the Peltier effect, when the semiconductor heat sink is energized, current flows from the node of the N-type semiconductor to the P-type semiconductor, that is, from the first end to the second end of the N-type semiconductor. Heat is absorbed at the second end of the N-type semiconductor, causing its temperature to decrease. After the current flows to the second end of the P-type semiconductor, it flows back to the first end, causing its temperature to rise and releasing heat into the heat sink fins 110.

[0059] In some embodiments, optionally, such as Figure 2 As shown, a plurality of power devices 148 are disposed on the inverter circuit board 104, and the plurality of power devices 148 are disposed on the side of the inverter circuit board 104 facing the semiconductor cooling chip 112.

[0060] In this embodiment, the inverter circuit board 104 may also be provided with multiple power devices 148. The multiple power devices 148 can operate under the control of the controller 106, thereby controlling the inverter circuit board 104 so that the energy storage device 100 can control the electrical parameters through the inverter circuit board 104 during operation.

[0061] Multiple power devices 148 are disposed on the side of the inverter circuit board 104 facing the thermoelectric cooler 112, that is, multiple power devices 148 are disposed on the side of the inverter circuit board 104 close to the thermoelectric cooler 112. It is understood that during the operation of the energy storage device 100, the power devices 148, as the main heat source, will generate a significant amount of heat. By disposing of the power devices 148 on the side of the inverter circuit board 104 close to the thermoelectric cooler 112, the heat generated during operation can be rapidly transferred to the thermoelectric cooler 112, and then absorbed by the heat-absorbing surface 116 of the thermoelectric cooler 112, thereby effectively improving the heat dissipation efficiency of the heat dissipation device for the power devices 148.

[0062] In some embodiments, optionally, such as Figure 1 , Figure 2 and Figure 6 As shown, the energy storage device 100 also includes a temperature acquisition unit 144, which is located in the installation space 154 of the heat dissipation housing 102 and is used to acquire the temperature inside the heat dissipation housing 102. The temperature acquisition unit 144 is electrically connected to the controller 106, and the controller 106 is used to control the drive circuit 114 according to the temperature acquired by the temperature acquisition unit 144.

[0063] In this embodiment, the energy storage device 100 may further include a temperature acquisition unit 144, which is disposed in the installation space 154 of the heat dissipation shell 102 of the energy storage device 100. Through the temperature acquisition unit 144, the temperature inside the heat dissipation shell 102 of the energy storage device 100 can be acquired in real time, thereby enabling the controller 106 of the energy storage device 100 to drive the semiconductor cooling chip 112 according to the temperature control drive circuit 114 inside the heat dissipation shell 102 of the energy storage device 100.

[0064] By setting up a temperature acquisition unit 144, the operation of the heat dissipation device can be controlled according to the real-time temperature inside the heat dissipation shell 102 during the operation of the energy storage device 100, which effectively improves the control accuracy of the heat dissipation device.

[0065] Specifically, the temperature acquisition unit 144 is electrically connected to the controller 106. The temperature acquisition unit 144 can transmit the acquired temperature inside the heat sink 102 to the controller 106, enabling the controller 106 to determine whether the heat sink 102 is overheating based on the received temperature. When the temperature inside the heat sink 102 reaches a first temperature threshold, it is determined that the heat sink 102 is overheating, and the controller can control the drive circuit 114 to energize the thermoelectric cooler 112, so that the thermoelectric cooler 112 operates and dissipates heat from the energy storage device 100. Then, the temperature acquisition unit 144 continues to acquire the temperature inside the heat sink 102. When the controller 106 determines that the temperature inside the heat sink 102 has dropped below a second temperature threshold, the controller 106 can control the drive circuit 114 to stop energizing the thermoelectric cooler 112, thereby reducing the power consumption of the energy storage device 100. For example, the first temperature threshold can be set to 65 degrees Celsius, and the second temperature threshold can be set to 60 degrees Celsius. Correspondingly, the timing relationship between the temperature inside the heat sink 102 and the drive signal of the first transistor 126 is as follows: Figure 7 As shown.

[0066] In some embodiments, optionally, such as Figure 2 and Figure 6 As shown, there are multiple semiconductor cooling chips 112, and the heat dissipation surfaces 118 of the multiple semiconductor cooling chips 112 are attached to the inner wall of the heat dissipation housing 102 and located in the area opposite to the multiple heat dissipation fins 110.

[0067] In this embodiment, the energy storage device 100 may be provided with a plurality of thermoelectric coolers 112, with the heat-dissipating surfaces 118 of the plurality of thermoelectric coolers 112 attached to the inner side of the heat dissipation housing 102, and the heat-dissipating surfaces 118 of the plurality of thermoelectric coolers 112 are all located in the area opposite to the plurality of heat dissipation fins 110, so that the plurality of thermoelectric coolers 112 can simultaneously transfer heat to the plurality of heat dissipation fins 110, that is, the plurality of thermoelectric coolers 112 simultaneously absorb the heat in the heat dissipation housing 102, thereby improving the heat dissipation efficiency of the heat dissipation device.

[0068] It should be noted that, in addition to setting multiple thermoelectric coolers 112, a corresponding driving circuit 114 can be set for each thermoelectric cooler 112 to ensure the normal operation of each thermoelectric cooler 112.

[0069] In some embodiments, optionally, such as Figure 1 As shown, the energy storage device 100 further includes a thermally conductive insulating layer 146, which is attached to the inner wall of the heat dissipation housing 102 and located between the semiconductor cooling chip 112 and the inner wall of the heat dissipation housing 102.

[0070] In this embodiment, a thermally conductive insulating layer 146 may be provided between the heat dissipation housing 102 and the semiconductor cooling chip 112. The thermally conductive insulating layer 146 can achieve insulation between the semiconductor cooling chip 112 and the heat dissipation housing 102.

[0071] It is understandable that, since the thermoelectric cooler 112 is a conductive material, current will flow through it during operation. Furthermore, since the heat dissipation surface 118 of the thermoelectric cooler 112 is attached to the heat sink 102, by providing a thermally conductive insulating layer 146 between the thermoelectric cooler 112 and the heat sink 102, insulation between the thermoelectric cooler 112 and the heat sink 102 is achieved while ensuring that the thermoelectric cooler 112 can transfer heat to the heat sink 102. This prevents leakage of current in the heat sink 102 and ensures the safety of the energy storage device 100.

[0072] For example, the thermally conductive insulating layer 146 may specifically be configured as thermally conductive insulating paper.

[0073] In some embodiments, optionally, such as Figure 8 and Figure 9 As shown, the energy storage device 100 also includes: a battery housing 150 and an energy storage battery 152; an accommodating space 156 for accommodating the energy storage battery 152 is formed on the inner side of the battery housing 150; the energy storage battery 152 is disposed in the accommodating space 156 of the battery housing 150 and is electrically connected to the inverter circuit board 104.

[0074] In this embodiment, the energy storage device 100 may further include a battery housing 150 and an energy storage battery 152 disposed within the battery housing 150. Specifically, an accommodating space 156 for accommodating the energy storage battery 152 is formed on the inner side of the battery housing 150, thereby enabling the energy storage battery 152 to be accommodated within the accommodating space 156 of the battery housing 150.

[0075] The energy storage battery 152 can store electrical energy and provide electrical energy when needed. The inverter circuit board 104 can control the electrical parameters during the charging or discharging process of the energy storage battery 152 to ensure the normal operation of the energy storage device 100.

[0076] In addition, the battery housing 150 and the heat dissipation housing 102 can be fastened together. Through the fastening connection between the battery housing 150 and the heat dissipation housing 102, the energy storage battery 152, the inverter circuit board 104 and other electrical components of the energy storage device 100 can be protected from impacts by external objects. At the same time, the overall structure of the energy storage device 100 is also improved.

[0077] In some embodiments, optionally, such as Figure 4 As shown, the driving circuit 114 includes: a first transistor 126, the first end of which is connected to the first end of the second semiconductor 124, and the second end of which is connected to the negative terminal of the power supply; a control circuit 128, which is connected to the control terminal of the first transistor 126 and the controller 106, and is used to send a driving signal to the control terminal of the first transistor 126 when receiving a control signal from the controller 106, so as to control the conduction between the first end and the second end of the first transistor 126; a second transistor 132, the first end of which is connected to the power supply 120, the second end of which is grounded, and the control terminal of which is connected to the controller 106; and a third transistor 134, the first end of which is connected to the power supply 120, the second end of which is connected to the control terminal of the first transistor 126, and the control terminal of which is connected to the first end of the second transistor 132.

[0078] In this embodiment, the driving circuit 114 may specifically include a first transistor 126 and a control circuit 128. The first end of the first transistor 126 is connected to the first end of the second semiconductor 124, and the second end of the first transistor 126 is connected to the negative terminal of the power supply. That is, when the first end and the second end of the first transistor 126 are turned on, the current provided by the power supply 120 can pass through the first end of the first semiconductor 122, the second end of the first semiconductor 122, the second end of the second semiconductor 124, the first end of the second semiconductor 124, and the first transistor 126 in sequence, and finally flow to the negative terminal of the power supply 120, thereby forming the current flow path of the semiconductor cooling chip 112.

[0079] Specifically, the control terminal of the first transistor 126 is connected to the control circuit 128, and the control circuit 128 is connected to the controller 106. In this way, the controller 106 can control the control circuit 128. That is, the control circuit 128 can receive the control signal sent by the controller 106 and send a drive signal to the control terminal of the first transistor 126 based on the control signal, thereby driving the first terminal and the second terminal of the first transistor 126 to conduct, thereby realizing the power supply of the semiconductor cooling chip 112.

[0080] Optionally, the control circuit 128 may include a second transistor 132 and a third transistor 134. The first terminal of the second transistor 132 is connected to the power supply terminal 120, thereby providing a drive current to the second transistor 132 through the power supply terminal 120. The second terminal of the second transistor 132 is grounded. The control terminal of the second transistor 132 is connected to the controller 106. The controller 106 can send a control signal to the control terminal of the second transistor 132, thereby controlling the conduction and cutoff between the first terminal and the second terminal of the second transistor 132.

[0081] The first terminal of the third transistor 134 is connected to the power supply terminal 120, thereby providing drive current to the third transistor 134 through the power supply terminal 120. The second terminal of the third transistor 134 is connected to the control terminal of the first transistor 126, and the control terminal of the third transistor 134 is connected to the first terminal of the second transistor 132. When the controller 106 sends a control signal to the second transistor 132, the first and second terminals of the second transistor 132 are connected, allowing the current supplied by the power supply terminal 120 to flow through the second transistor 132. At this time, the level of the first terminal of the second transistor 132 is low, that is, the level of the control terminal of the third transistor 134 changes from high to low. At this time, the first and second terminals of the third transistor 134 are connected, allowing the current supplied by the power supply terminal 120 to flow through the third transistor 134. At this time, the level of the second terminal of the third transistor 134 is high, that is, the level of the control terminal of the first transistor 126 changes from low to high. At this time, the first and second terminals of the first transistor 126 are connected, allowing the current supplied by the power supply terminal 120 to flow through the thermoelectric cooler 112, thereby realizing the cooling function of the thermoelectric cooler 112.

[0082] In some embodiments, such as Figure 4As shown, the driving circuit 114 further includes: a first current-limiting resistor 130, one end of which is connected to the control terminal of the first transistor 126, and the other end of which is connected to the second terminal of the first transistor 126; a second current-limiting resistor 136, one end of which is connected to the control terminal of the second transistor 132, and the other end of which is connected to the second terminal of the second transistor 132; a third current-limiting resistor 138, one end of which is connected to the power supply terminal 120, and the other end of which is connected to the first terminal of the second transistor 132; a fourth current-limiting resistor 140, one end of which is connected to the first terminal of the third transistor 134, and the other end of which is connected to the control terminal of the third transistor 134; and a fifth current-limiting resistor 142, one end of which is connected to the second terminal of the third transistor 134, and the other end of which is connected to the control terminal of the first transistor 126.

[0083] In this embodiment, the driving circuit 114 further includes a first current-limiting resistor 130. The first current-limiting resistor 130 is disposed between the control terminal of the first transistor 126 and the second terminal of the first transistor 126. By setting the first current-limiting resistor 130, the voltage difference between the control terminal of the first transistor 126 and the second terminal of the first transistor 126 can be effectively avoided to prevent the first transistor 126 from breaking down due to excessive voltage difference, that is, to prevent the first transistor 126 from being damaged and to ensure the stable operation of the driving circuit 114.

[0084] For example, the first transistor 126 can be an N-type metal-oxide-semiconductor (NMOS), and the first current-limiting resistor 130 is connected between the gate and source of the NMOS.

[0085] Optionally, the control circuit 128 further includes a second current-limiting resistor 136. The second current-limiting resistor 136 is disposed between the control terminal of the second transistor 132 and the second terminal of the second transistor 132. By setting the second current-limiting resistor 136, the voltage difference between the control terminal of the second transistor 132 and the second terminal of the second transistor 132 can be effectively avoided to prevent the second transistor 132 from breaking down due to excessive voltage difference, that is, to prevent the second transistor 132 from being damaged and to ensure the stable operation of the control circuit 128.

[0086] Optionally, the control circuit 128 further includes a third current-limiting resistor 138. The third current-limiting resistor 138 is connected between the power supply terminal 120 and the first terminal of the second transistor 132. By setting the third current-limiting resistor 138, the current flowing from the power supply terminal 120 to the second transistor 132 can be effectively reduced, that is, the voltage between the first and second terminals of the second transistor 132 can be effectively reduced, thereby avoiding the second transistor 132 from being damaged due to excessive voltage across the second transistor 132, and ensuring the stable operation of the control circuit 128.

[0087] Optionally, the fourth current-limiting resistor 140 is set between the control terminal of the third transistor 134 and the first terminal of the third transistor 134. By setting the fourth current-limiting resistor 140, the voltage difference between the control terminal of the third transistor 134 and the first terminal of the third transistor 134 can be effectively avoided to prevent the third transistor 134 from breaking down due to excessive voltage difference, that is, to prevent the third transistor 134 from being damaged and to ensure the stable operation of the control circuit 128.

[0088] Optionally, the control circuit 128 further includes a fifth current-limiting resistor 142, which is connected between the second terminal of the third transistor 134 and the control terminal of the first transistor 126. By setting the fifth current-limiting resistor 142, the magnitude of the current flowing to the control terminal of the first transistor 126 can be effectively reduced, so as to avoid the first transistor 126 being damaged due to excessive current at the control terminal of the first transistor 126, and to ensure the stable operation of the drive circuit 114.

[0089] In the description of this application, the term "multiple" refers to two or more. Unless otherwise expressly defined, the terms "upper," "lower," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. The terms "connection," "installation," "fixing," etc., should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be a direct connection or an indirect connection through an intermediate medium. For those skilled in the art, the specific meaning of the above terms in this application can be understood according to the specific circumstances.

[0090] In the description of this specification, the terms "one embodiment," "some embodiments," "specific embodiment," etc., refer to a specific feature, structure, material, or characteristic described in connection with that embodiment or example, which is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0091] The above are merely preferred embodiments of this application and are not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. An energy storage device, characterized in that, include: Heat sink housing, inverter circuit board, and semiconductor cooling chip; The inner side of the heat sink housing forms an installation space for accommodating the inverter circuit board, and the outer side of the heat sink housing is provided with multiple heat dissipation fins. The semiconductor cooling chip has a heat-absorbing surface and a heat-releasing surface arranged opposite to each other. The heat-releasing surface is attached to the inner wall of the heat dissipation housing and is located in the area opposite to the plurality of heat dissipation fins. The heat-absorbing surface faces the inverter circuit board. The inverter circuit board is disposed in the mounting space of the heat dissipation housing. The inverter circuit board is provided with a controller, a drive circuit and a power supply terminal. The drive circuit is electrically connected to the controller and the thermoelectric cooler respectively. The power supply terminal is electrically connected to the thermoelectric cooler to supply power to the thermoelectric cooler. The controller is used to control the drive circuit so that the thermoelectric cooler absorbs the heat generated by the inverter circuit board through the heat absorption surface and transfers it to the heat dissipation housing and the heat dissipation fins through the heat release surface for heat dissipation.

2. The energy storage device according to claim 1, characterized in that, The semiconductor cooling chip includes: A first semiconductor, wherein a first end of the first semiconductor is connected to the positive terminal of the power supply terminal; The second semiconductor has a first end connected to the negative terminal of the power supply terminal via the driving circuit, and a second end connected to the second end of the first semiconductor. Wherein, the second end of the first semiconductor and the second end of the second semiconductor are the heat-absorbing surfaces, and the first end of the first semiconductor and the first end of the second semiconductor are the heat-releasing surfaces.

3. The energy storage device according to claim 2, characterized in that, The first semiconductor includes an N-type semiconductor, and the second semiconductor includes a P-type semiconductor.

4. The energy storage device according to any one of claims 1 to 3, characterized in that, The inverter circuit board is also provided with a plurality of power devices, which are located on the side of the inverter circuit board facing the semiconductor refrigeration chip.

5. The energy storage device according to any one of claims 1 to 3, characterized in that, Also includes: A temperature acquisition unit is located in the installation space of the heat dissipation housing and is used to acquire the temperature inside the heat dissipation housing. The temperature acquisition unit is electrically connected to the controller, and the controller is used to control the drive circuit according to the temperature acquired by the temperature acquisition unit.

6. The energy storage device according to any one of claims 1 to 3, characterized in that, The number of semiconductor cooling chips is multiple, and the heat-dissipating surfaces of the multiple semiconductor cooling chips are attached to the inner wall of the heat dissipation housing and located in an area opposite to the multiple heat dissipation fins.

7. The energy storage device according to any one of claims 1 to 3, characterized in that, Also includes: A thermally conductive insulating layer is attached to the inner wall of the heat dissipation housing and located between the semiconductor cooling chip and the inner wall of the heat dissipation housing.

8. The energy storage device according to any one of claims 1 to 3, characterized in that, Also includes: Battery casing and energy storage battery; The inner side of the battery casing forms an accommodating space for accommodating the energy storage battery. The energy storage battery is disposed within the accommodating space of the battery casing, and the energy storage battery is electrically connected to the inverter circuit board.

9. The energy storage device according to claim 2, characterized in that, The driving circuit includes: A first transistor, wherein a first terminal of the first transistor is connected to a first terminal of the second semiconductor, and a second terminal of the first transistor is connected to the negative terminal of the power supply. A control circuit is connected to the control terminal of the first transistor and the controller. The control circuit is used to send a drive signal to the control terminal of the first transistor when it receives a control signal from the controller, so as to control the conduction between the first terminal and the second terminal of the first transistor. The second transistor has a first terminal connected to the power supply terminal, a second terminal grounded, and a control terminal connected to the controller. A third transistor, wherein the first terminal of the third transistor is connected to the power supply terminal, the second terminal of the third transistor is connected to the control terminal of the first transistor, and the control terminal of the third transistor is connected to the first terminal of the second transistor.

10. The energy storage device according to claim 9, characterized in that, The driving circuit also includes: A first current-limiting resistor, one end of which is connected to the control terminal of the first transistor, and the other end of which is connected to the second terminal of the first transistor; A second current-limiting resistor, one end of which is connected to the control terminal of the second transistor, and the other end of which is connected to the second terminal of the second transistor; A third current-limiting resistor, one end of which is connected to the power supply terminal, and the other end of which is connected to the first terminal of the second transistor; A fourth current-limiting resistor, one end of which is connected to the first terminal of the third transistor, and the other end of which is connected to the control terminal of the third transistor; A fifth current-limiting resistor, one end of which is connected to the second terminal of the third transistor, and the other end of which is connected to the control terminal of the first transistor.

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