A piezoelectric heat-dissipating element

Abstract

The utility model relates to a piezoelectric heat dissipation element, include: air inlet cover, including at least one group of air inlet unit, air outlet cover, air outlet cover quantity and the group number of air inlet hole group correspond, vibration subassembly, set up between every air outlet cover and air inlet cover, including electrode subassembly, piezoelectric ceramic element and vibration substrate, the rim of air outlet cover forms the side wall downwardly, the side wall bottom surface is provided with vibration wafer, is provided with at least one jet hole on vibration wafer, forms the air outlet chamber between vibration wafer and air outlet cover, the interval between vibration wafer and vibration substrate has, when vibration substrate moves upward, its structure is extremely compact, jet directional concentration, high speed, can form heat dissipation array or module, and the versatility is strong, and the design is flexible, satisfies the heat dissipation demand of different power consumption grade, is applicable to the light and thin electronic equipment of space limited such as cell -phone, panel, super base.

Description

Technical Field

[0001] This utility model relates to the field of heat dissipation technology for electronic devices, and in particular to a piezoelectric heat dissipation element. Background Technology

[0002] As electronic devices become increasingly miniaturized and highly integrated, their chip power consumption and heat flux density are rising sharply, making heat dissipation a growing concern. Traditional heat dissipation methods, such as axial fans, suffer from problems such as bulkiness, high noise, and high energy consumption, making them unsuitable for the heat dissipation needs of ultra-thin electronic devices.

[0003] Piezoelectric fans, as a novel heat dissipation technology, utilize the inverse piezoelectric effect of piezoelectric ceramics to drive a vibrating plate to vibrate at high frequency, thereby promoting airflow. However, existing piezoelectric fans still have the following limitations: (1) a single piezoelectric fan has a small air volume and short air path, resulting in limited heat dissipation capacity; (2) the airflow direction is divergent, making it difficult to accurately spray air onto high-heat areas; and (3) they lack a flexible expansion mechanism, making it impossible to flexibly configure heat dissipation capacity according to changes in heat load. Therefore, there is an urgent need for an ultra-thin, efficient, and modularly expandable piezoelectric heat dissipation solution. Summary of the Invention

[0004] To overcome at least one of the problems mentioned above, this utility model provides a piezoelectric heat dissipation element with a valveless structure, which is extremely compact and ultra-thin. The jet is directional, concentrated, and high-speed, and can form a heat dissipation array or module. It is highly versatile, flexible in design, and meets the heat dissipation requirements of different power consumption levels. It is suitable for thin and light electronic devices with limited space, such as mobile phones, tablets, and ultrabooks.

[0005] The technical solution adopted by this utility model to solve its technical problem is: a piezoelectric heat dissipation element, comprising:

[0006] The air inlet cover includes at least one set of air inlet units, each set of air inlet units is provided with an air inlet hole group, and the air inlet hole group is composed of multiple air inlets arranged in a ring;

[0007] The number of air outlet covers corresponds to the number of air inlet groups. Each air inlet unit is provided with an air outlet cover at the top. A main air outlet is provided in the middle of the air outlet cover, and multiple auxiliary air outlets are provided around the main air outlet.

[0008] The vibration assembly, disposed between each air outlet cover and air inlet cover, includes an electrode assembly, a piezoelectric ceramic element, and a vibration substrate;

[0009] The electrode assembly has a cavity in the middle, the air inlet group is located in the middle of the cavity, and the air inlet cover, the electrode assembly, and the piezoelectric ceramic element form an air inlet chamber;

[0010] The edge of the air outlet cover extends downward to form a sidewall. A vibrating plate is provided on the bottom surface of the sidewall. At least one jet hole is provided on the vibrating plate. An air outlet chamber is formed between the vibrating plate and the air outlet cover. There is a gap between the vibrating plate and the vibrating substrate. A resonant cavity is formed between the vibrating substrate and the vibrating plate. When the vibrating substrate is in the initial position or moves downward, the volume of the resonant cavity increases and a negative pressure is formed inside, which causes the main gas to be drawn into the resonant cavity from the air inlet chamber.

[0011] When the vibrating substrate moves upward, the volume of the resonant cavity decreases, and the internal gas is compressed. The compressed gas first forces the vibrating plate to undergo slight deformation, causing it to be ejected at high speed from the central jet hole (with a diameter of φ0.5~0.9mm) to the main air outlet of the air outlet chamber. The upward movement of the vibrating plate also causes the volume of the air outlet chamber to decrease, and the small amount of residual gas in the chamber is discharged from the auxiliary air outlet. The vibrating substrate repeats the above cycle at a frequency of 220,000 to 270,000 times per second (i.e., 220kHz~270kHz), thereby forming a continuous and stable directional jet.

[0012] Preferably, the electrode assembly is provided with a conductive contact piece extending towards the center, and a pair of electrode interfaces are provided along the outer edge of the electrode assembly, with the two electrode interfaces respectively connecting the conductive contact piece and the periphery of the electrode assembly.

[0013] Preferably, the side of the air inlet cover is provided with mounting ears.

[0014] Preferably, the air intake unit consists of four sets, each with a corresponding air outlet cover and vibration component.

[0015] Preferably, the system also includes a pair of FPC circuit boards, each with four contact terminals at its end, which are respectively connected to two sets of electrode assemblies.

[0016] The beneficial effects of this utility model are as follows: A piezoelectric heat dissipation element adopts a valveless structure, is extremely compact and ultra-thin, with an overall thickness controllable within 1.6mm. It can generate a directional and concentrated high-speed jet and supports the flexible combination of multiple heat dissipation devices to form a heat dissipation array or module, realizing on-demand expansion of heat dissipation capacity. It has strong versatility and flexible design, thereby achieving a linear improvement in heat dissipation performance and meeting the heat dissipation requirements of different power consumption levels. It is especially suitable for thin and light electronic devices with limited space, such as mobile phones, tablets, and ultrabooks. Attached Figure Description

[0017] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0018] Figure 1 This is a schematic diagram of the overall structure of the piezoelectric heat dissipation element described in this utility model;

[0019] Figure 2 yes Figure 1 A schematic diagram of the back structure;

[0020] Figure 3 yes Figure 1 Exploded view in the image;

[0021] Figure 4 This is a cross-sectional structural diagram of the piezoelectric heat dissipation element described in this utility model;

[0022] Figure 5 This is a schematic diagram of the air outlet of the piezoelectric heat dissipation element described in this utility model;

[0023] Figure 6 This is a schematic diagram of the air intake of the piezoelectric heat dissipation element described in this utility model;

[0024] Figure 7 This is a schematic diagram of the multi-group air intake unit structure of the piezoelectric heat dissipation element described in this utility model;

[0025] Figure 8 yes Figure 7 A schematic diagram of the back structure;

[0026] Figure 9 This is a partially enlarged cross-sectional view of the piezoelectric heat dissipation element described in this utility model.

[0027] Icon labels:

[0028] 1. Air inlet cover; 11. Air inlet hole; 12. Mounting lug; 13. Air inlet chamber; 2. Air outlet cover; 21. Main air outlet; 22. Auxiliary air outlet; 23. Air outlet chamber; 3. Electrode assembly; 31. Conductive contact piece; 32. Electrode interface; 4. Piezoelectric ceramic element; 5. Vibrating substrate; 6. Vibrating sheet; 61. Jet hole; 62. Auxiliary deformation groove; 7. FPC circuit board; 8. Resonant cavity. Detailed Implementation

[0029] The present invention will now be described in further detail with reference to the accompanying drawings. These drawings are simplified schematic diagrams, illustrating only the basic structure of the present invention, and therefore only show the components relevant to the present invention.

[0030] Example

[0031] like Figure 1-4 The piezoelectric heat dissipation element consists of an air inlet cover 1, an air outlet cover 2, and a vibration assembly. The airflow is guided from the air inlet group to the jet holes 61 and then to the main air outlet 21 and auxiliary air outlet 22 of the air outlet cover. The airflow is directional and concentrated, resulting in good heat dissipation performance.

[0032] See Figure 3 , 7The air intake cover 1 consists of at least one set of air intake units, each set of air intake units is provided with an air intake hole group, and the air intake hole group consists of multiple air intake holes 11 arranged in a ring. Multiple sets of air intake units form a heat dissipation array or module, realizing the on-demand expansion of heat dissipation capacity, with strong versatility and flexible design.

[0033] in, Figure 1 , 2 This is a schematic diagram of a set of intake units.

[0034] In one embodiment, multiple sets of air intake units are snapped together to form an air intake cover 1.

[0035] In another embodiment, multiple air intake units are combined to form an integrated air intake cover 1.

[0036] See Figure 3 8. The number of air outlet covers 2 corresponds to the number of air inlet groups. Each air inlet unit has an air outlet cover 2 on its upper part. A main air outlet 21 is located in the center of the air outlet cover 2, and multiple auxiliary air outlets 22 are arranged around the main air outlet 21. The diameter of the main air outlet 21 is larger than the diameter of the jet hole 61 and the diameter of the auxiliary air outlets 22. The auxiliary air outlets 22 are arranged in a matrix, with the main air outlet 21 located in the center, forming a heat dissipation array. High-frequency vibration compresses and gathers air, directing it from the key central jet hole 61 to the main air outlet 21 (e.g., ...). Figure 5 The airflow is concentrated and directed upwards, with the auxiliary air outlets 22 on the periphery serving as auxiliary flow holes, and the core airflow coming from the main air outlet 21 at the center.

[0037] See Figure 3 The vibration assembly is located between each air outlet cover 2 and air inlet cover 1, and includes an electrode assembly 3, a piezoelectric ceramic element 4, and a vibration substrate 5.

[0038] See Figure 3 , 4 The electrode assembly 3 has a cavity in the middle, and the air inlet group is located in the middle of the cavity. The air inlet cover 1, the electrode assembly 3, and the piezoelectric ceramic element 4 form an air inlet chamber.

[0039] See Figure 4 , 5 6. The edge of the air outlet cover plate 2 extends downward to form a side wall. A vibrating plate 6 is provided on the bottom surface of the side wall. A jet hole 61 (φ0.5~0.9mm) is provided at the center of the vibrating plate 6. An air outlet chamber 23 is formed between the vibrating plate 6 and the air outlet cover plate 2. A resonant cavity 8 is formed between the vibrating plate 6 and the vibrating substrate 5.

[0040] See Figure 4 , 6When the vibrating substrate 5 is in its initial position or moves downward, the volume of the resonant cavity 8 increases, and a negative pressure is formed inside, which causes the main gas to be drawn into the resonant cavity 8 from the air inlet chamber 13.

[0041] See Figure 5 When the vibrating substrate 5 moves upward, the volume of the resonant cavity 8 decreases, and the internal gas is compressed. The compressed gas first forces the vibrating plate 6 to undergo slight deformation, causing it to be ejected at high speed from the central jet hole 61 (the hole diameter is set to φ0.5~0.9mm) directly to the main air outlet 21 of the air outlet chamber 23. The upward movement of the vibrating plate 6 also causes the volume of the air outlet chamber 23 to decrease, and the small amount of gas remaining in the chamber is discharged from the auxiliary air outlet 22. The vibrating substrate 5 repeats the above cycle at a frequency of 220,000 to 270,000 times per second (i.e. 220kHz~270kHz), thereby forming a continuous and stable directional jet.

[0042] The vibrating sheet 6 also has multiple auxiliary deformation slots 62 around its periphery. The positions of the auxiliary deformation slots 62 correspond to the gap area in the middle of the vibrating substrate 5 (refer to CN 221784567 U for a piezoelectric vibrating sheet structure and piezoelectric sheet of a piezoelectric pump). The connection positions of the auxiliary deformation slots 62 and the gap area in the middle of the vibrating substrate 5 (refer to the elastic support arm in CN221784567 U) correspond to each other.

[0043] In this embodiment, the initial distance between the vibrating plate 6 and the vibrating substrate 5 is 0.01 to 0.03 mm. That is, the initial height of the resonant cavity 8 is 0.01 to 0.03 mm.

[0044] The air inlet cover 1, the air outlet cover 2, and the vibration assembly are bonded and sealed together or fastened by a snap-fit ​​structure.

[0045] See Figure 3 The electrode assembly 3 is provided with a conductive contact piece 31 extending towards the center, and a pair of electrode interfaces 32 are provided on the outer edge of the electrode assembly 3. The two electrode interfaces 32 are respectively connected to the conductive contact piece 31 and the periphery of the electrode assembly 3.

[0046] See Figure 7 The side of the air inlet cover 1 is provided with mounting ears 12 for installation on equipment.

[0047] See Figure 7 , 8 The air intake unit consists of four sets, each with a corresponding air outlet cover 2 and vibration assembly.

[0048] See Figure 7 , 8 The FPC circuit board 7 has four contact terminals at its end, which are connected to two sets of electrode assemblies 3 respectively.

[0049] This utility model's piezoelectric heat dissipation element adopts a valveless structure, making it extremely compact and ultra-thin, with an overall thickness controllable within 1.6mm. It can generate a directional, concentrated high-speed jet and supports flexible combinations of multiple heat dissipation devices to form heat dissipation arrays or modules, enabling on-demand expansion of heat dissipation capacity. It is highly versatile and flexible in design, thus achieving a linear improvement in heat dissipation performance to meet the heat dissipation requirements of different power consumption levels. It is particularly suitable for thin and light electronic devices with limited space, such as mobile phones, tablets, and ultrabooks.

[0050] Based on the above-described preferred embodiments of this utility model, and through the foregoing description, those skilled in the art can make various changes and modifications without departing from the technical concept of this utility model. The technical scope of this utility model is not limited to the contents of the specification, but must be determined according to the scope of the claims.

Claims

1. A piezoelectric heat dissipation element, characterized in that, include: The air inlet cover includes at least one set of air inlet units, each set of air inlet units is provided with an air inlet hole group, and the air inlet hole group is composed of multiple air inlets arranged in a ring; The number of air outlet covers corresponds to the number of air inlet groups. Each air inlet unit is provided with an air outlet cover at the top. A main air outlet is provided in the middle of the air outlet cover, and multiple auxiliary air outlets are provided around the main air outlet. The vibration assembly, disposed between each air outlet cover and air inlet cover, includes an electrode assembly, a piezoelectric ceramic element, and a vibration substrate; The electrode assembly has a cavity in the middle, the air inlet group is located in the middle of the cavity, and the air inlet cover, the electrode assembly, and the piezoelectric ceramic element form an air inlet chamber; The edge of the air outlet cover extends downward to form a sidewall. A vibrating plate is provided on the bottom surface of the sidewall. At least one jet hole is provided on the vibrating plate. An air outlet chamber is formed between the vibrating plate and the air outlet cover. There is a gap between the vibrating plate and the vibrating substrate. A resonant cavity is formed between the vibrating substrate and the vibrating plate. When the vibrating substrate is in the initial position or moves downward, the volume of the resonant cavity increases and a negative pressure is formed inside, which causes the main gas to be drawn into the resonant cavity from the air inlet chamber. When the vibrating substrate moves upward, the volume of the resonant cavity decreases, and the internal gas is compressed. The compressed gas first forces the vibrating plate to undergo slight deformation, causing it to be ejected at high speed from the central jet hole to the main air outlet of the air outlet chamber. Furthermore, the upward movement of the vibrating plate also causes the volume of the air outlet chamber to decrease, and the small amount of residual gas in the chamber is discharged from the auxiliary air outlet, thus forming a continuous and stable directional jet.

2. The piezoelectric heat dissipation element according to claim 1, characterized in that: The electrode assembly is provided with a conductive contact piece extending towards the center, and a pair of electrode interfaces are provided along the outer edge of the electrode assembly. The two electrode interfaces are respectively connected to the conductive contact piece and the periphery of the electrode assembly.

3. The piezoelectric heat dissipation element according to claim 2, characterized in that: The air inlet cover is provided with mounting ears on its side.

4. The piezoelectric heat dissipation element according to claim 3, characterized in that: The air intake unit consists of four sets, each with a corresponding air outlet cover and vibration component.

5. The piezoelectric heat dissipation element according to claim 4, characterized in that: It also includes a pair of FPC circuit boards, each with four contact terminals at its end, which are respectively connected to two sets of electrode assemblies.

6. The piezoelectric heat dissipation element according to claim 1, characterized in that: The auxiliary air outlets are arranged in a matrix, with the main air outlet located in the middle, forming a heat dissipation array.

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