A heat dissipation device and a cabinet

Abstract

The application relates to a heat dissipation device and a box, and relates to the technical field of electronic equipment heat dissipation. The heat dissipation device comprises a fan, a wind guide structure arranged on the air outlet side of the fan, the wind guide structure being provided with a first air outlet, a second air outlet and a third air outlet which are independent of each other, and a heat exchanger, an internal heat exchange air duct of which is formed, and the inlet of the heat exchange air duct is communicated with the second air outlet. The first air outlet is used for driving the circulation of gas in the space, the second air outlet is used for making the gas flow through the heat exchange air duct for heat exchange, and the third air outlet is used for directly blowing and cooling a specified heat generator. The wind guide structure with three independent air outlets is used for distributing the fan air flow into circulation air flow, special heat exchange air flow and fixed-point cooling air flow. Through the synergistic effect of the three, the heat dissipation efficiency and temperature uniformity of the sealed cavity are significantly improved under the premise of compact structure.

Description

Technical Field

[0001] This application relates to the field of heat dissipation technology for electronic devices, and in particular to a heat dissipation device and enclosure. Background Technology

[0002] In the field of power electronic equipment applications, to ensure stable operation of equipment in various environments, it is usually necessary to seal its core electronic components in a high-protection enclosure. While this sealing structure effectively isolates external dust and moisture, it also blocks the heat convection path between the internal air and the external environment, causing the heat generated during equipment operation to continuously accumulate inside the cavity.

[0003] Currently, the common approach to heat dissipation in such sealed cavities is to install internal fans, forcing airflow to enhance internal air turbulence. However, this traditional cooling method has significant drawbacks: due to the lack of scientific airflow organization design, the airflow generated by the fan flows randomly within the sealed space. This makes it difficult to concentrate the heat generated by the heat-generating components to an effective heat exchange interface, nor can it form a comprehensive circulating airflow channel within the cavity. This random flow leads to low heat dissipation efficiency, significant temperature gradients between different areas within the cavity, and prominent localized overheating. Especially in high-power-density devices, traditional fan cooling solutions are no longer sufficient to meet the heat dissipation performance requirements of modern electronic equipment. Utility Model Content

[0004] To address the issues of low heat dissipation efficiency and uneven temperature distribution inside existing sealed enclosures, this application provides a heat dissipation device and enclosure.

[0005] The heat dissipation device and housing provided in this application adopt the following technical solution: A heat dissipation device, comprising: fan; An air guide structure is provided on the air outlet side of the fan, and the air guide structure is provided with a first air outlet, a second air outlet and a third air outlet that are independent of each other; A heat exchanger having a heat exchange air duct inside, the inlet of which is connected to the second air outlet; The first air outlet is used to drive the gas circulation in the space it is in, the second air outlet is used to allow the airflow to pass through the heat exchange duct for heat exchange, and the third air outlet is used to directly cool the designated heat source.

[0006] By adopting the above technical solution, the fan, in conjunction with an air guide structure with three independent air outlets, achieves multi-functional distribution of a single air source. Specifically, the first air outlet promotes uniform heat distribution and avoids local overheating by driving gas circulation in its space. The second air outlet dedicates its airflow to forced convection heat transfer through the heat exchange duct, achieving efficient operation of the core heat dissipation channel. The third air outlet directly cools the designated heat-generating element, specifically addressing the temperature rise problem of key components. This solution, through a synergistic heat dissipation mechanism that utilizes one airflow for three purposes, significantly improves the overall heat dissipation efficiency and temperature uniformity within the sealed cavity while maintaining a compact structure.

[0007] In one specific implementation, the heat exchanger includes a substrate, a plurality of fins disposed on the substrate, and a cover plate; the substrate has a first region and a second region, the cover plate is fitted onto the fins in the first region and together with the substrate forms the heat exchange air duct; the fins in the second region are exposed outside the heat exchange air duct, and the position of the second region corresponds to the first air outlet.

[0008] By adopting the above technical solution and through the partitioned heat exchanger structure, the first area forms a closed heat exchange duct through the cover plate, which is dedicated to receiving the airflow from the second air outlet for forced convection heat exchange, ensuring core heat dissipation efficiency; the exposed fins of the second area directly face the first air outlet, which not only increases the contact area with the circulating air, but also assists in the temperature balance inside the cavity through natural convection and radiation heat dissipation on the fin surface.

[0009] In one specific implementation, the fins are detachably connected to the cover plate.

[0010] By adopting the above technical solution and using a detachable connection method, the heat exchanger maintenance becomes very convenient. When dust accumulates on the fin surface and affects the heat dissipation effect, the cover plate can be easily removed for cleaning, greatly reducing maintenance costs and time. At the same time, this connection method also provides flexibility for replacing fins of different specifications, enabling the device to adapt to different heat dissipation needs.

[0011] In one specific implementation, the sidewall of the fin is inclined from the connection point with the substrate in a direction away from the substrate, and the sidewall of the fin forms an angle of 1°-5° with the direction perpendicular to the substrate.

[0012] By adopting the above technical solution and setting the inclination angle of the fin sidewall, the flow characteristics of airflow between fins are improved; the inclination angle can guide the airflow to better adhere to the fin surface, reduce flow separation, reduce flow resistance, and at the same time enhance the heat exchange efficiency between the airflow and the fin surface.

[0013] In one specific implementation, the height of the fin is ≤60mm, and the spacing between two adjacent fins is ≥5.8mm.

[0014] By adopting the above technical solution and optimizing the fin height and spacing parameters, the best balance between heat dissipation area and ventilation resistance is achieved within a limited space. This size design ensures sufficient heat exchange area while avoiding excessive ventilation resistance caused by overly dense fins, ensuring that the maximum effective airflow can be obtained under a given fan power, thereby achieving the best heat dissipation effect.

[0015] In one specific implementation, the heat dissipation device further includes a radiator, which is correspondingly arranged with the heat exchanger, and the air inlet direction of the radiator is arranged to intersect the extension direction of the heat exchanger.

[0016] By adopting the above technical solution, and by adding an external radiator and using a cross-flow design, a composite heat dissipation system combining internal and external components is established. The internal heat exchanger is responsible for removing heat from the cavity, while the external radiator further dissipates the removed heat into the environment. The cross arrangement of the air intake directions of the two radiators can avoid airflow interference, while making full use of airflow from different directions to form a three-dimensional heat dissipation channel, which greatly improves the overall heat dissipation capacity.

[0017] In one specific implementation, the fan is tilted, and the tilt direction of the fan forms an angle of 30°-60° with the horizontal direction.

[0018] By adopting the above technical solution, the airflow path is optimized by tilting the fan. This tilt angle allows the airflow to enter the air guide structure more smoothly, reducing flow loss, and at the same time, it is conducive to forming a more effective circulating airflow pattern in the cavity. Experimental verification shows that this tilt angle can achieve the best balance between spatial constraints and airflow organization.

[0019] In one specific implementation scheme, a baffle is provided at the second air outlet to directly guide the air outlet from the second air outlet to the inlet of the heat exchange duct.

[0020] By adopting the above technical solution and setting a baffle at the second air outlet, it is ensured that the airflow used for core heat exchange can enter the heat exchange duct completely and directly, avoiding airflow loss and waste, maximizing the working efficiency of the heat exchanger, and also helping to establish a clear airflow organization in the cavity, avoiding mutual interference between different airflows.

[0021] In one specific implementation scheme, the air volume of the first air outlet accounts for 35%-45% of the total air volume, the air volume of the second air outlet accounts for 40%-50% of the total air volume, and the air volume of the third air outlet accounts for 10%-20% of the total air volume.

[0022] By adopting the above technical solution and controlling the airflow distribution ratio, the functions of the three air outlets are optimally configured. A larger proportion of the second airflow ensures that the heat exchanger receives sufficient airflow for efficient heat exchange; a moderate proportion of the first airflow provides sufficient power for internal circulation and promotes temperature balance; and a smaller proportion of the third airflow is used for directional cooling of key components. This airflow ratio has been experimentally verified to maximize overall heat dissipation efficiency while ensuring the effective implementation of each function.

[0023] A housing includes a cavity formed by housing wall panels, a heating element disposed within the cavity, and a heat dissipation device as described above. The fan, the air guide structure, and the heat exchanger are disposed within the cavity, and the first air outlet of the air guide structure directly acts on the internal space of the cavity to drive gas circulation within the cavity. The air outlet of the third air outlet is directed directly toward the heating element.

[0024] By adopting the above technical solution, a complete and efficient heat dissipation system is constructed by integrating the optimized heat dissipation device into the enclosure. The first air outlet blows air into the cavity, driving internal air circulation and preventing heat accumulation and the formation of hot spots. The third air outlet directly targets the heating element for targeted cooling. The second air outlet achieves heat exchange between the inside and outside through a heat exchanger. This system-level design enables the entire enclosure to maintain good sealing while possessing strong heat dissipation capabilities, effectively ensuring the reliable operation of the internal heating element.

[0025] In summary, the beneficial technical effects of this application are as follows: This application distributes a single fan air source to three functionally independent air outlets through an air guide structure, and combined with the closed heat exchange duct structure of the heat exchanger, it simultaneously achieves a triple synergy of forced convection heat transfer, internal gas circulation, and targeted cooling of key components within a sealed enclosure; this solution establishes an orderly airflow organization within the enclosure, ensuring efficient removal of core heat and promoting uniform distribution of the internal temperature field, while accurately cooling heat-generating components; while maintaining the complete sealing of the enclosure, it improves overall heat dissipation efficiency, effectively ensuring the operational reliability and service life of high-power-density electronic equipment in a sealed environment. Attached Figure Description

[0026] Figure 1 This is a structural schematic diagram of the heat dissipation device and housing according to an embodiment of this application.

[0027] Figure 2 This is a structural diagram used to demonstrate the fan and air guide structure.

[0028] Figure 3 This is a structural diagram used to demonstrate the air guide structure.

[0029] Figure 4 This is a schematic diagram used to illustrate the structure of a heat exchanger.

[0030] Figure 5 It is a structural diagram used to illustrate heat exchangers and radiators.

[0031] Figure 6 This is a schematic diagram illustrating the structure of the heat exchanger in Embodiment 2.

[0032] Explanation of reference numerals in the attached drawings: 1. Fan; 2. Air guide structure; 21. First air outlet; 22. Second air outlet; 23. Third air outlet; 24. Air inlet; 25. First flow channel; 26. Second flow channel; 27. Third flow channel; 3. Heat exchanger; 31. Heat exchange air duct; 32. Substrate; 321. First region; 322. Second region; 33. Fin; 331. Umbrella-shaped structure; 34. Cover plate; 341. Clip; 4. Radiator; 5. Baffle; 6. Cavity; 7. Heating element; 8. External cooling fan; 9. Screw; 10. Screw hole. Detailed Implementation

[0033] The following is in conjunction with the appendix Figure 1-6 This application will be described in further detail.

[0034] Example 1 This application discloses a heat dissipation device and enclosure. This solution is applicable to electronic devices that require sealed heat dissipation, including but not limited to energy storage boxes, energy storage cabinets, transformer boxes, and distribution boxes. This embodiment takes an energy storage box as an example.

[0035] Reference Figure 1 and Figure 2 The energy storage box includes a sealed cavity 6 formed by enclosure wall panels and a heat-generating element 7 (such as a circuit board and its chips) disposed within the cavity 6; the heat dissipation device is installed on the box to dissipate heat from the heat-generating element 7 inside the box.

[0036] In this embodiment, the heat dissipation device mainly includes a fan 1, an air guide structure 2, a heat exchanger 3, and a radiator 4; wherein, the fan 1, the air guide structure 2, and the heat exchanger 3 are disposed inside the cavity 6 of the housing, and the radiator 4 is disposed outside the housing and is correspondingly disposed to the heat exchanger 3.

[0037] Specifically, the air guide structure 2 is located on the air outlet side of the fan 1, and the air guide structure 2 is provided with a first air outlet 21, a second air outlet 22 and a third air outlet 23 that are independent of each other; The heat exchanger 3 is located on the air outlet side of the air guide structure 2. The heat exchanger 3 is provided with a heat exchange air duct 31 that is closed on all four sides and open at both ends. The inlet of the heat exchange air duct 31 is directly connected to the second air outlet 22. The first air outlet 21 of the air guide structure 2 is directed towards the cavity 6 to drive the gas circulation in the cavity 6, so that the airflow forms a circulating flow (such as clockwise) along the inner wall of the closed cavity 6, and disturbs the airflow in the cavity to the maximum extent; the second air outlet 22 is used to dedicate its airflow to heat exchange through the heat exchange duct 31; the third air outlet 23 is directed directly towards the heating element 7 to directly cool the designated heating element 7, so as to achieve accurate cooling of the key heating element 7.

[0038] Reference Figure 2 and Figure 3 In this embodiment, the fan 1 is fixedly installed on the air inlet 24 of the air guide structure 2. In order to optimize the smoothness of airflow into the air guide structure 2 and reduce flow loss, the fan 1 is tilted, and its tilting direction forms an angle A with the horizontal direction X. The angle A is 30°-60°, preferably 45°. The 45° tilt can make the airflow of the fan 1 enter the air guide structure 2 more smoothly, minimize flow loss, and at the same time help to form a more effective circulating airflow pattern in the cavity 6, so as to achieve the best balance between space constraints and airflow organization.

[0039] In this embodiment, the air guide structure 2 is fixedly installed on the inner bottom wall of the cavity 6. The air guide structure 2 is located on the air outlet side of the fan 1 and has an air inlet 24 that communicates with the fan 1. Inside, it is divided into three airtightly isolated flow channels by an integrally formed partition: the first flow channel 25, the second flow channel 26 and the third flow channel 27. One side of these three independent flow channels leads to the air inlet 24, and the other side leads to the first air outlet 21, the second air outlet 22 and the third air outlet 23, respectively.

[0040] To achieve optimal heat dissipation, the cross-sectional areas of the three air outlets are precisely designed so that, under the rated operating conditions of fan 1, the airflow is distributed in a specific ratio: the airflow from the first air outlet 21 accounts for 35%-45% of the total airflow, the second air outlet 22 accounts for 40%-50%, and the third air outlet 23 accounts for 10%-20%. In this embodiment, the preferred ratio is: the first air outlet 21 accounts for 40%, the second air outlet 22 accounts for 45%, and the third air outlet 23 accounts for 15%. This configuration ensures a reasonable distribution of airflow for each function: the first air outlet 21 blows air into the cavity 6, driving internal air circulation and preventing heat accumulation and the formation of hot spots; the second air outlet 22 is specifically used to supply air to the heat exchange duct 31 of the heat exchanger 3, providing the main forced convection heat exchange capacity for the enclosure; the third air outlet 23 is directly aimed at the heating element 7 for targeted forced air cooling; through this airflow distribution, while ensuring the core heat dissipation performance, the needs of overall temperature balance and elimination of local hot spots are also taken into account.

[0041] Reference Figure 1 and Figure 4 In this embodiment, the heat exchanger 3 is fixedly installed on the inner bottom wall of the cavity 6 and is located on the air outlet side of the air guide structure 2. The heat exchanger 3 is made of metal material and specifically includes a substrate 32, multiple fins 33 and a cover plate 34. The substrate 32 is preferably an aluminum alloy profile integrally formed by extrusion process, and multiple vertical and parallel fins 33 are integrally formed on it.

[0042] The substrate 32 is divided into a first region 321 and a second region 322. The fins 33 of the first region 321 are covered by a cover plate 34, which together form a heat exchange duct 31 that is open at both ends and closed on all sides. The inlet of the heat exchange duct 31 corresponds to and is directly connected to the second air outlet 22 of the air guide structure 2, thereby forming a closed convection heat exchange channel.

[0043] The fins 33 of the second region 322 are completely exposed outside the heat exchange duct 31. Importantly, the mounting position of the second region 322 on the substrate 32 corresponds to the first air outlet 21 of the air guide structure 2. This allows the airflow blown out from the first air outlet 21 to directly blow onto the exposed fins 33. On the one hand, the surface of the fins 33 is used for auxiliary heat dissipation. On the other hand, the heated airflow can circulate more effectively in the sealed cavity 6, so that the airflow circulates clockwise along the inner wall of the sealed cavity 6, disturbing the airflow in the cavity to the maximum extent and promoting temperature balance.

[0044] Reference Figure 3 and Figure 4 In order to ensure that the airflow from the second air outlet 22 of the air guide structure 2 can act on the heat exchange channel of the heat exchanger 3 in a fully efficient manner, a downwardly extending baffle 5 is provided at the second air outlet 22. The baffle 5 is integrally formed with the air guide structure 2, and its function is to guide the airflow directly to the inlet of the heat exchanger 3 to prevent the airflow from being lost.

[0045] Reference Figure 4 In order to achieve the best balance between heat dissipation area and ventilation resistance in a limited space, the structural parameters of fin 33 have been optimized: the height of fin 33 is ≤60mm, preferably 60mm; the distance between two adjacent fins 33 is ≥5.8mm, preferably 5.8mm; in this embodiment, the height and / or distance of fins 33 in the first region 321 and the second region 322 can be the same or different.

[0046] In addition, to further enhance the heat exchange effect between the circulating airflow driven by the first air outlet 21 and the exposed fins 33 in the second region 322, this embodiment optimizes the tilt angle of the fins 33 in this region; specifically, the sidewall of the fin 33 extends obliquely from its connection with the substrate 32 in a direction away from the substrate 32, forming an angle B with the direction perpendicular to the substrate 32 (vertical direction Y).

[0047] As a preferred embodiment, the two sidewalls of the fin 33 are arranged symmetrically and inclined to form a trapezoidal structure with a narrow top and wide bottom cross-section. When the included angle B is controlled within the range of 1°-5° (preferably 2°), the gradually expanding flow channel can guide the circulating airflow to pass more smoothly through the gap of the fin 33. While reducing the flow resistance by more than 15%, it can also significantly improve the convective heat transfer efficiency between the circulating airflow and the fin 33 by enhancing airflow disturbance and disrupting the thermal boundary layer, thereby further enhancing the temperature balance effect within the cavity 6. As an alternative, at least one sidewall of the fin 33 can be designed with an inclined angle within the same range, which can also improve airflow adhesion, reduce flow resistance, and enhance heat transfer.

[0048] The cover plate 34 includes, but is not limited to, sheet metal parts and injection molded parts, preferably sheet metal parts. To facilitate maintenance and cleaning, the fins 33 of the first region 321 on the substrate 32 are detachably connected to the cover plate 34. Specifically, in this embodiment, the cover plate 34 is snap-fit ​​connected to the fins 33 of the first region 321: in the fins 33 of the first region 321 of the substrate 32, the tops of the two outermost fins 33 are provided with relatively protruding umbrella-shaped structures 331; correspondingly, the cover plate 34 is provided with downwardly bent buckles 341; during assembly, the cover plate 34 is pressed downward, and the elastic deformation of the sheet metal parts themselves is used to make the buckles 341 pass over the two opposite umbrella-shaped structures 331 and form an interference fit with them (for example, 0.3mm interference on one side), thereby achieving a firm and sealed snap-fit.

[0049] Reference Figure 1 and Figure 5 In order to dissipate the heat from the heat exchanger 3 from the cavity 6 to the external environment more efficiently, the heat dissipation device in this embodiment also includes a radiator 4 and an external cooling fan 8 disposed outside the housing; in this embodiment, the radiator 4 is disposed corresponding to the heat exchanger 3, and the radiator 4 includes, but is not limited to, a finned radiator. The radiator 4 is fixed on the outer wall of the housing and is thermally connected to the outer surface of the substrate 32 of the heat exchanger 3.

[0050] The air inlet direction of the radiator 4 (i.e., the air blowing direction of the external cooling fan 8) is intersected with the extension direction of the heat exchange duct 31 inside the heat exchanger 3 (i.e., the airflow direction of the heat exchange duct 31). In this embodiment, the air inlet direction of the radiator 4 is perpendicular to the extension direction of the heat exchange duct 31 inside the heat exchanger 3 (set at 90°), but it can also be any angle greater than 0° and less than 90°. This cross-flow (or near-cross-flow) design can maximize the destruction of the thermal boundary layer between the internal and external airflows, avoid mutual interference of airflows, form a three-dimensional heat dissipation channel, and thus improve the overall heat exchange efficiency of internal and external coordination.

[0051] The implementation principle of this application embodiment is as follows: During operation, the fan 1 starts, draws in air and forces it into the air guide structure 2; the airflow is accurately divided within the air guide structure 2: approximately 45% of the airflow is guided from the second air outlet 22 through the baffle 5 and enters the heat exchange duct 31 of the heat exchanger 3, forcibly blowing over the fins 33 of the first region 321, carrying away the heat on the fins 33, and completing the core heat exchange; approximately 40% of the airflow is blown out from the first air outlet 21, directly blowing onto the exposed fins 33 of the second region 322 of the heat exchanger 3, and forming a large-scale circulation in a clockwise direction along the wall of the cavity 6, stirring the air in the entire cavity 6, making its temperature uniform, and avoiding local overheating; approximately 15% of the airflow is blown out from the third air outlet 23, directly targeting and blowing on the key heat-generating chip on the circuit board, achieving fixed-point forced air cooling; at the same time, the heat extracted from the internal heat exchanger 3 is transferred to the heat sink 4 through heat conduction, and is finally dissipated into the environment by the external airflow.

[0052] This application utilizes a single fan 1 in conjunction with a guide structure 2 with three independent outlets to accurately distribute airflow into three coordinated airflows: one for internal circulation within the drive chamber 6, one for forced heat exchange in the closed heat exchange duct 31, and one for targeted cooling of the heating element 7. Combined with a zoned heat exchanger 3 and an external cross-flow radiator 4, this design effectively solves the problems of low heat dissipation efficiency and uneven temperature distribution in traditional solutions while ensuring the airtightness of the enclosure. It achieves a synergistic heat dissipation effect of efficient heat exchange, overall temperature uniformity, and elimination of local hot spots, significantly improving the heat dissipation performance and reliability of high-power-density sealed equipment.

[0053] Example 2 Reference Figure 6 The difference between this embodiment and embodiment 1 is that the fins 33 on the first region 321 of the heat exchanger substrate 32 are detachably connected to the cover plate 34; the other structural features are the same as in embodiment 1.

[0054] Specifically, in this embodiment, the cover plate 34 and the fin 33 are connected by screws 9; matching screw holes 10 are opened at corresponding positions on the cover plate 34 and the first region 321 of the fin 33, and the connection is fixed by screws 9; this connection method provides a more robust mechanical connection and is suitable for applications with harsh vibration environments.

[0055] Example 3 This embodiment further optimizes the internal structure of the air guide component 2 based on embodiment 1.

[0056] In this embodiment, the three flow channels (first flow channel 25, second flow channel 26, and third flow channel 27) inside the air guide structure 2 adopt a tapered design (not shown in the figure), that is, the cross-sectional area of ​​the flow channel gradually decreases from the air inlet 24 to the air outlet (first air outlet 21, second air outlet 22, and third air outlet 23).

[0057] Specifically, the taper ratios of the three flow channels are different. The second flow channel 26 adopts a larger taper ratio (e.g., 0.8-0.85), which can significantly increase the flow velocity of the second air outlet 22, thereby enhancing the impact heat transfer effect and destroying the thermal boundary layer. The first flow channel 25 adopts a medium taper ratio (e.g., 0.85-0.9), which can appropriately increase the airflow velocity while ensuring the circulating air volume, and enhance the ability to agitate the air in the cavity 6. The third flow channel 27 adopts a smaller taper ratio (e.g., 0.9-0.95), which ensures the gentleness of the fixed-point cooling airflow and avoids damage to the heating element 7 caused by excessively high wind speed.

[0058] The above are all preferred embodiments of this application, and are not intended to limit the scope of protection of this application. Therefore, all equivalent changes made in accordance with the structure, shape and principle of this application should be covered within the scope of protection of this application.

Claims

1. A heat dissipation device, characterized in that: include: fan; An air guide structure is provided on the air outlet side of the fan, and the air guide structure is provided with a first air outlet, a second air outlet and a third air outlet that are independent of each other; A heat exchanger having a heat exchange air duct inside, the inlet of which is connected to the second air outlet; The first air outlet is used to drive the gas circulation in the space it is in, the second air outlet is used to allow the airflow to pass through the heat exchange duct for heat exchange, and the third air outlet is used to directly cool the designated heat source.

2. The heat dissipation device according to claim 1, characterized in that: The heat exchanger includes a substrate, a plurality of fins disposed on the substrate, and a cover plate; the substrate has a first region and a second region, the cover plate is mounted on the fins of the first region and together with the substrate forms the heat exchange air duct; the fins of the second region are exposed outside the heat exchange air duct, and the position of the second region corresponds to the first air outlet.

3. The heat dissipation device according to claim 2, characterized in that: The fins are detachably connected to the cover plate.

4. The heat dissipation device according to claim 2, characterized in that: The sidewall of the fin is inclined from the connection point with the substrate in a direction away from the substrate, and the sidewall of the fin forms an angle of 1°-5° with the direction perpendicular to the substrate.

5. The heat dissipation device according to claim 2, characterized in that: The height of the fin is ≤60mm, and the distance between two adjacent fins is ≥5.8mm.

6. The heat dissipation device according to claim 1, characterized in that: The heat dissipation device also includes a radiator, which is arranged correspondingly to the heat exchanger, and the air inlet direction of the radiator is arranged to intersect the extension direction of the heat exchanger.

7. The heat dissipation device according to claim 1, characterized in that: The fan is tilted, and the tilt direction of the fan forms an angle of 30°-60° with the horizontal direction.

8. The heat dissipation device according to claim 1, characterized in that: A baffle is provided at the second air outlet to guide the air outlet directly to the inlet of the heat exchange duct.

9. The heat dissipation device according to claim 1, characterized in that: The air volume of the first air outlet accounts for 35%-45% of the total air volume, the air volume of the second air outlet accounts for 40%-50% of the total air volume, and the air volume of the third air outlet accounts for 10%-20% of the total air volume.

10. A box, characterized in that: The device includes a cavity enclosed by a housing wall panel, a heating element disposed within the cavity, and a heat dissipation device as described in any one of claims 1-9; the fan, the air guide structure, and the heat exchanger are disposed within the cavity, and the first air outlet of the air guide structure directly acts on the internal space of the cavity to drive gas circulation within the cavity, and the air outlet of the third air outlet is directed directly toward the heating element.

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