A heat sink structure for a silicon carbide active power filter

Abstract

The utility model discloses a radiator structure for silicon carbide active power filter belongs to power electronic equipment heat dissipation technical field, and this structure includes buffer board, fixed part, guide rod, sliding block, first spring, base, fin, clamping plate, second spring and connecting piece, and buffer board is as the installation base, and fixed part is fixed on it, and guide rod is vertically fixed in fixed part, and sliding block is fixed in the top end and bottom of guide rod, and first spring is set in buffer board top. Base sets up in first spring top and is elastically supported, and the open hole movable sleeve is set in guide rod, and fin is fixedly connected in base top, and clamping plate is slidably connected in guide rod, and second spring sleeve is set in guide rod, and one end abuts fixed part, and the other end abuts clamping plate. The utility model has the advantages of high -efficient heat dissipation, shock attenuation and impact and convenient dismounting, improves equipment reliability and maintenance efficiency.

Description

Technical Field

[0001] This utility model relates to the field of heat dissipation technology for power electronic equipment, and in particular to a heat sink structure for a silicon carbide active power filter. Background Technology

[0002] Silicon carbide active power filters, as important devices in the field of power electronics, play a crucial role in harmonic control and reactive power compensation in power components. Due to the high power density and high switching frequency of silicon carbide devices, they generate a significant amount of heat during operation. Effective management of this heat is essential for ensuring the long-term stable operation of the equipment and improving its performance.

[0003] Currently, heat sink structures are commonly used to dissipate heat from silicon carbide active power filters. Traditional heat sink structures typically use rigid connections to fix the heat dissipation components to the device body. This rigid connection method helps ensure close contact between the heat dissipation components and the heat source, thereby achieving efficient heat conduction. However, in real-world applications, power filters are often subjected to vibrations and shocks from machine operation, transportation, or the external environment. When faced with these vibrations and shocks, rigidly connected heat sink structures are prone to stress concentration, loosening of connections, and even structural fatigue damage, thus affecting heat dissipation efficiency and the overall reliability of the equipment.

[0004] To address the challenges posed by vibration, some solutions attempt to introduce buffering or vibration damping mechanisms into the heat sink structure. However, simple buffering structures often struggle to maintain the required high thermal conductivity contact surface between the heat sink components and the heat source, or they complicate the heat sink structure, increasing the difficulty of disassembly and maintenance. Especially when rapid inspection or replacement of internal modules is required, overly complex or unstable connections between the heat sink and the equipment body will significantly increase maintenance time and costs. Therefore, how to ensure efficient heat dissipation performance while simultaneously providing effective vibration damping capabilities and enabling quick and convenient disassembly of the heat sink structure has become a critical issue that urgently needs to be addressed in silicon carbide active power filter heat dissipation technology.

[0005] Therefore, this invention proposes a heat sink structure for silicon carbide active power filters to address the shortcomings of existing technologies. Utility Model Content

[0006] To overcome the above shortcomings, this utility model provides a heat sink structure for silicon carbide active power filters, aiming to improve the problems of heat sink structures for silicon carbide active power filters, which are difficult to balance efficient heat dissipation, vibration and shock resistance, and ease of maintenance, and are prone to structural loosening under vibration. This utility model aims to provide a heat sink structure for silicon carbide active power filters with an improved structure that can effectively solve the above problems.

[0007] To achieve the above objectives, the present invention adopts the following technical solution: a heat sink structure for a silicon carbide active power filter, comprising: a buffer plate, a fixing member, a guide rod, a slider, a first spring; and a base, a heat sink, a retaining plate, a second spring, and a connecting member.

[0008] The buffer plate serves as the mounting base. The fixing member is fixed to the buffer plate, the guide rod is vertically fixed to the fixing member, and the slider is fixed to the top and bottom ends of the guide rod. The first spring is positioned above the buffer plate. The base is positioned above the first spring for elastic support, and the base has a through hole and is movably fitted onto the guide rod. The heat sink is fixedly connected to the top of the base. The retaining plate is slidably connected to the guide rod. The second spring is fitted onto the guide rod, with one end abutting against the fixing member and the other end abutting against the retaining plate. The connecting member is fixedly connected to the retaining plate and is used to drive the retaining plate to slide along the guide rod and engage or disengage with the slider to lock the base onto or release it from the buffer plate.

[0009] Preferably, the bottom of the heat sink is integrally formed with a screw, and the base is provided with a screw hole that is threaded to the screw.

[0010] Preferably, both the base and the buffer plate have heat dissipation grooves.

[0011] Preferably, the radiator structure further includes an elastic pad disposed above the buffer plate to provide limiting cushioning when the base vibrates excessively.

[0012] Preferably, multiple sliders are provided.

[0013] Preferably, multiple card plates are provided, and the multiple card plates are adapted to engage between the multiple sliders.

[0014] Preferably, the connector is located on top of the card plate.

[0015] Preferably, the slider is fixed to the top and bottom of the guide rod; the locking plate is driven by the connector and slides between the slider at the top and bottom of the guide rod.

[0016] This utility model has the following beneficial effects: 1. This utility model solves the problems of low heat dissipation efficiency and insufficient heat conduction in the prior art by using a threaded connection between the heat sink and the base, and heat dissipation grooves are provided on both the base and the buffer plate. This achieves the effects of efficient heat conduction between the heat sink and the base and enhanced structural stability, significantly improving heat dissipation efficiency and maintaining the device at a safe operating temperature.

[0017] 2. This utility model, by setting a first spring between the buffer plate and the base, allows the base to be elastically supported and movably sleeved on the guide rod, and is supplemented with an elastic pad to provide limiting buffer, solves the problem that silicon carbide active power filters in the prior art are prone to structural loosening or damage under vibration and impact environments, and achieves the technical effect of effectively absorbing and isolating external vibration energy, providing impact protection, and ensuring the stability and reliability of the equipment. Attached Figure Description

[0018] Figure 1 This is a perspective view of a heat sink structure for a silicon carbide active power filter proposed in this utility model. Figure 2 This is a schematic diagram of a buffer plate for a heat sink structure used in a silicon carbide active power filter according to the present invention. Figure 3 This is a schematic diagram of a heat sink structure for a silicon carbide active power filter proposed in this utility model. Figure 4 This is a schematic diagram of the slider structure for a heat sink used in a silicon carbide active power filter according to the present invention.

[0019] Legend: 1. Buffer assembly; 101. Base; 102. First spring; 103. Buffer plate; 104. Elastic pad; 2. Heat dissipation assembly; 201. Heat sink; 202. Screw; 203. Screw hole; 204. Heat dissipation groove; 3. Disassembly assembly; 301. Connector; 302. Fixing component; 303. Guide rod; 304. Second spring; 305. Clamping plate; 306. Slider. Detailed Implementation

[0020] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0021] Please refer to Figures 1 to 4 This utility model provides a heat sink structure for a silicon carbide active power filter, aiming to solve the problems in the prior art where silicon carbide active power filter heat sinks are difficult to balance efficient heat dissipation, vibration and shock resistance, and ease of maintenance, and are prone to structural loosening under vibration.

[0022] like Figure 1 , Figure 2 and Figure 4 As shown, the heat sink structure for the silicon carbide active power filter includes a fixed base, which includes a buffer plate 103. The buffer plate 103 serves as a mounting base, and a heat dissipation groove 204 is formed inside the buffer plate 103. The fixing member 302 of the disassembly assembly 3 is fixed to the buffer plate 103. The guide rod 303 is vertically fixed to the fixing member 302. The slider 306 is fixed to the top and bottom ends of the guide rod 303. The first spring 102 is disposed above the buffer plate 103. The elastic pad 104 is disposed above the buffer plate 103.

[0023] like Figure 1 and Figure 3 As shown, the structure includes a base 101 of the buffer assembly 1, which is positioned above the first spring 102 and elastically supported by the first spring 102. When there is excessive vibration, the base 101 abuts against the elastic pad 104 to provide limiting buffer. The base 101 has a through hole and is movably sleeved on the guide rod 303. The base 101 also has a heat dissipation groove 204. The heat dissipation fin 201 of the heat dissipation assembly 2 is fixedly connected to the top of the base 101. A screw 202 is integrally formed at the bottom of the heat dissipation fin 201. A screw hole 203 is provided on the base 101 to be threadedly engaged with the screw 202. The heat dissipation fin 201 is fixedly connected by the screw 202 and the screw hole 203.

[0024] The structure also includes a retaining plate 305 for disassembling component 3, which is slidably connected to guide rod 303; a second spring 304 is sleeved on guide rod 303 with one end abutting against fixing member 302 and the other end abutting against retaining plate 305; a connector 301 is fixedly connected to retaining plate 305, which is used to drive retaining plate 305 to slide along guide rod 303 and engage or disengage with slider 306 to lock base 101 to buffer plate 103 or release it from buffer plate 103.

[0025] The guide rod 303 has a cylindrical structure and is vertically fixed to the fixing member 302. The fixing member 302 is fixed to the buffer plate 103. On the outer circumferential surface of the guide rod 303, multiple sliders 306 are fixedly provided at the top and bottom ends respectively. The sliders 306 have a specific shape for engagement, such as a chamfer, for engaging with the claws of the clamping plate 305. The function of the guide rod 303 is to provide precise guidance and limit for the sliding of the clamping plate 305.

[0026] Meanwhile, the card plate 305 is provided with inwardly protruding claws. The inner shape of the claws is adapted to the engaging shape of the slider 306. In the assembled state, the inner hole of the card plate 305 slides on the outer circumferential surface of the guide rod 303, and the claws of the card plate 305 are suitable for engaging with the slider 306. This sliding engagement between the guide rod and the card plate, as well as the engaging structure between the card plate and the slider, ensures the structural stability of the base 101 in the locked state and the convenience of disassembly.

[0027] The connection 301 that drives the movement of the card plate 305 and the second spring 304 that provides the reset force can be implemented in a variety of conventional ways by those skilled in the art. The specific internal structure is well known technology and will not be described in detail here.

[0028] In a preferred embodiment, to ensure efficient heat conduction and structural stability between the heat sink 201 and the base 101, a screw 202 is integrally formed on the bottom of the heat sink 201. The screw 202 is screwed into a threaded hole 203 on the base 101 via a threaded connection. The threaded engagement between the screw 202 and the threaded hole 203 ensures tight contact between the heat sink 201 and the base 101, minimizing thermal contact resistance.

[0029] In a preferred embodiment, to further improve heat dissipation efficiency, heat dissipation grooves 204 are provided in both the base 101 and the buffer plate 103. The heat dissipation grooves 204 are parallel, straight-through grooves with a rectangular cross-sectional shape, extending in a specific direction to form multiple unobstructed cooling channels. These heat dissipation grooves 204 increase the contact area with air and guide the cooling air to flow along a specific path, effectively removing heat whether through natural convection or forced air cooling.

[0030] In a preferred embodiment, to provide additional protection when the base 101 is subjected to a large impact exceeding the normal buffering range of the first spring 102, an elastic pad 104 is disposed above the buffer plate 103. The elastic pad 104 is preferably made of an elastic material with good energy absorption properties, such as silicone rubber or polyurethane foam, and its shape is adapted to the bottom shape of the base 101. When the base 101 moves downwards due to impact beyond the initial compression stroke of the first spring 102, the elastic pad 104 can effectively absorb the remaining impact energy, preventing the base 101 from rigidly colliding with the buffer plate 103 and causing structural damage.

[0031] In a preferred embodiment, in order to improve the stability and reliability of the locking mechanism, multiple sliders 306 are provided. Two or more sets of sliders 306 can be evenly distributed along the circumferential direction at the top and bottom of the guide rod 303. Each set of sliders 306 has a chamfer or bevel so that the claws of the locking plate 305 can smoothly enter and engage.

[0032] In a preferred embodiment, to achieve more reliable engagement with the multiple sliders 306, multiple locking plates 305 are provided. For example, two or three locking plates 305 can be provided, which are arranged around the outer periphery of the guide rod 303. Each locking plate 305 has inwardly protruding claws. The shape, size and position of these claws are precisely matched with the multiple sliders 306 on the guide rod 303, ensuring that when the locking plate 305 slides into place, the multiple claws can simultaneously engage with the multiple sliders 306, providing a uniform locking force.

[0033] In a preferred embodiment, to facilitate user operation, the connector 301 is located on the top of the card plate 305. The connector 301 can be designed as a push button or a push-pull rod, with its bottom fixedly connected to the card plate 305. This allows the user to directly drive the card plate 305 to slide along the guide rod 303 by pressing or pushing the connector 301, thereby achieving locking or releasing operations.

[0034] In a preferred embodiment, to achieve rapid locking and releasing, the slider 306 is fixed to the top and bottom of the guide rod 303, forming two sets of engaging positions. When the connector 301 is subjected to force, causing the locking plate 305 to slide along the guide rod 303, the claws of the locking plate 305 can sequentially pass through the slider 306 at the top of the guide rod 303 and engage at a certain position in the middle or at the bottom slider, forming a locked state. When the connector 301 is pressed again, the claws of the locking plate 305 can move further downward, disengaging from the currently engaged slider. Then, under the action of the second spring 304, the locking plate 305, together with the connector 301, returns to its original position, thereby releasing the base 101.

[0035] Working principle: When the power device in the silicon carbide active power filter is working, the large amount of heat generated is first conducted to the base 101 through the bottom surface of the power device. Since the bottom of the heat sink 201 is integrally formed with a screw 202, the screw 202 is threadedly engaged with the screw hole 203 opened on the base 101, and a tight and fixed connection is formed between the heat sink 201 and the base 101, ensuring that the heat is efficiently transferred from the base 101 to the heat sink 201. The heat sink 201 diffuses the heat to the surrounding environment through its increased surface area. In order to further improve the heat dissipation efficiency, heat dissipation grooves 204 are opened in both the base 101 and the buffer plate 103. Cooling air flows along these heat dissipation grooves 204, carrying away the heat dissipated by the heat sink 201, thereby maintaining the filter device within the safe operating temperature range. During the operation of power equipment, when it is subjected to vibration and impact, the floating heat dissipation assembly consisting of the base 101 and the heat sink 201 on it will move relative to the buffer plate 103. The first spring 102, which is set between the buffer plate 103 and the base 101, is elastically compressed or stretched to absorb and isolate external vibration energy. The base 101 has a through hole and is movably sleeved on the guide rod 303 fixed on the buffer plate 103. The guide rod 303 provides precise guidance and limit for the vertical floating of the base 101. When the external impact is large and the base 101 moves downward beyond the normal stroke of the first spring 102, the elastic pad 104 set above the buffer plate 103 can effectively abut against the bottom of the base 101 to provide additional limit buffer, prevent the base 101 from rigidly colliding with the buffer plate 103, protect the structure from damage, and maintain connection reliability. To facilitate the easy disassembly and reinstallation of the radiator, the connector 301, the clamping plate 305, and the slider 306 work together. When the user presses the connector 301 down, the connector 301 drives the clamping plate 305 to slide along the guide rod 303. The claws on the clamping plate 305 slide along the guide rod 303 and engage with the slider 306 fixed at the top of the guide rod 303. During this process, the clamping plate 305 moves downward, compressing the second spring 304 to lock the base 101 relative to the buffer plate 103, keeping it stable in a specific position. To release the base 101, the connecting piece 301 is pressed down again, causing the claws of the clamping plate 305 to disengage from the current slider 306. At this time, the compressed second spring 304 releases its elastic potential energy, pushing the clamping plate 305 upward. The clamping plate 305 clamps the slider 306 at the bottom of the guide rod 303 and slides upward along the trajectory formed by contact with the slider 306, eventually disengaging from the engagement state of the slider 306 fixed at the top of the guide rod 303. The base 101 can then be removed from the guide rod 303, enabling quick disassembly of the radiator.

Claims

1. A heat sink structure for a silicon carbide active power filter, comprising a buffer plate (103). A fastener (302) is fixed to the buffer plate (103); Guide rod (303), the guide rod (303) is vertically fixed to the fastener (302); A slider (306) is fixed to the top and bottom of the guide rod (303); A first spring (102), wherein the first spring (102) is disposed above the buffer plate (103), is characterized in that, The radiator structure also includes: The base (101) is disposed above the first spring (102) to be elastically supported by the first spring (102). The base (101) has a through hole and is movably sleeved on the guide rod (303). A heat sink (201) is fixedly connected to the top of the base (101); A card plate (305) is slidably connected to the guide rod (303); The second spring (304) is sleeved on the guide rod (303) and one end abuts against the fixing member (302), and the other end abuts against the card plate (305). A connector (301) is fixedly connected to the card plate (305). The connector (301) is used to drive the card plate (305) to slide along the guide rod (303) and engage or disengage with the slider (306) to lock the base (101) to the buffer plate (103) or release it from the buffer plate (103).

2. The heat sink structure for a silicon carbide active power filter according to claim 1, characterized in that, The bottom of the heat sink (201) is integrally formed with a screw (202), and the base (101) is provided with a screw hole (203) that is threadedly engaged with the screw (202).

3. The heat sink structure for a silicon carbide active power filter according to claim 1, characterized in that, Both the base (101) and the buffer plate (103) are provided with heat dissipation grooves (204).

4. The heat sink structure for a silicon carbide active power filter according to claim 1, characterized in that, The radiator structure also includes an elastic pad (104) disposed above the buffer plate (103) to provide limiting cushioning when the base (101) vibrates excessively.

5. The heat sink structure for a silicon carbide active power filter according to claim 1, characterized in that, The slider (306) is provided in multiple ways.

6. The heat sink structure for a silicon carbide active power filter according to claim 1 or 5, characterized in that, Multiple clamping plates (305) are provided, and the multiple clamping plates (305) are adapted to engage between the multiple sliders (306).

7. The heat sink structure for a silicon carbide active power filter according to claim 1, characterized in that, The connector (301) is located on top of the card plate (305).

8. The heat sink structure for a silicon carbide active power filter according to claim 1, characterized in that, The slider (306) is fixed to the top and bottom of the guide rod (303); the card plate (305) is driven by the connector (301) and slides between the slider (306) at the top and the slider (306) at the bottom of the guide rod (303).

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