An EMI filter with a heat dissipation structure

Abstract

The utility model provides a kind of EMI filter with heat dissipation structure, it is related to filter technical field, including lower shielding shell and upper shielding shell, the lower shielding shell inside is provided with locating seat, the locating seat inside is provided with circuit substrate, the upper surface of the circuit substrate is respectively provided with inductance module, capacitor module, resistance module, the upper shielding shell and lower shielding shell between installation are used for guiding heat dissipation heat conduction component.The utility model is pasted with capacitor module, inductance module by heat conduction sheet, can strengthen heat dissipation to capacitor module, inductance module, utilize the flexible material that heat conduction sheet is and module can be pasted to improve contact area, so that heat can be transmitted in time when heating, and capacitor module, inductance module is relatively easy heating site, by strengthening heat dissipation to easy heating site, improve the heat dissipation efficiency, compared with traditional indirect heat dissipation, thermal resistance is smaller, and heat dissipation effect is more remarkable.

Description

Technical Field

[0001] This utility model relates to the field of filter technology, and more specifically, to an EMI filter with a heat dissipation structure. Background Technology

[0002] As a key electromagnetic compatibility component in electronic equipment, EMI filters play an irreplaceable role in suppressing electromagnetic interference and ensuring stable equipment operation. For example, patent publication number CN207819759U describes an electromagnetic interference (EMI) filter and filtering circuit. The EMI filter circuit has m phase line branches and one neutral line branch. The EMI filter includes at least one common-mode inductor, at least one Y capacitor group, and at least one X capacitor group connected in the circuit, where m is a positive integer. The EMI filter also includes PCB board-level inductors. Each X capacitor group in the at least one X capacitor group includes m X capacitors corresponding to the m phase line branches, and one end of each of the m X capacitors is connected to the corresponding phase line branch.

[0003] However, the aforementioned EMI filter uses a closed shielding structure. While this design effectively blocks external electromagnetic interference, it also hinders the dissipation of internal heat. However, directly opening heat dissipation channels will reduce the shielding performance of the shielding structure. As a result, in high-power applications, the inductors and capacitors inside the filter will generate significant heat. If this heat cannot be dissipated in a timely and effective manner, the internal temperature of the filter will continue to rise, thereby affecting the electrical performance and lifespan of the components. Utility Model Content

[0004] The main purpose of this invention is to provide an EMI filter with a heat dissipation structure, which can effectively solve the problem of poor heat dissipation performance caused by the need to ensure shielding performance in existing EMI filters.

[0005] To achieve the above objectives, the technical solution adopted by this utility model is as follows:

[0006] An EMI filter with a heat dissipation structure includes a lower shielding shell and an upper shielding shell. A positioning seat is provided inside the lower shielding shell, and a circuit board is provided inside the positioning seat. An inductor module, a capacitor module, and a resistor module are respectively provided on the upper surface of the circuit board. Connection modules are respectively provided on both sides of the upper surface of the circuit board. A heat sink is installed at the upper end of the upper shielding shell, and a heat-conducting component for guiding heat dissipation is installed between the upper shielding shell and the lower shielding shell.

[0007] Preferably, the heat-conducting component includes a heat-conducting bent rod located above the circuit board. The lower shielding shell and the upper shielding shell are respectively provided with through slots at both ends. The two ends of the heat-conducting bent rod are fixedly installed inside the through slots. The two ends of the heat-conducting bent rod are respectively provided with bonding guide plates, and the bonding guide plates on both sides are fixedly connected to the heat sink.

[0008] Preferably, positioning sleeves are provided on both sides of the heat-conducting bent rod, each positioning sleeve is located inside the corresponding through slot, and a locking block is provided on the outside of the positioning sleeve to limit the corresponding through slot.

[0009] Preferably, the heat-conducting bent rod body is provided with several extended heat exchange plates, and the bottom of some of the extended heat exchange plates is attached to the capacitor module and the inductor module through heat-conducting sheets.

[0010] Preferably, the lower shielding shell and the upper shielding shell are respectively provided with combination plates on both sides, and a connecting bolt is interspersed between every two adjacent combination plates, and a connecting nut is threaded on one end of each connecting bolt.

[0011] Preferably, the lower shielding shell has mating grooves on both sides and mating protrusions on both sides of the upper shielding shell. The mating grooves and mating protrusions are matched for limiting the fit, and the mating grooves and mating protrusions have through slots in the middle.

[0012] Preferably, positioning grooves are provided on both sides of the docking groove and the docking protrusion, and a connecting module connection end is interspersed inside each positioning groove.

[0013] Compared with the prior art, the present invention has the following beneficial effects:

[0014] (1) It should be noted that the heat-conducting bend and the extended heat exchange plate are both made of metal materials, such as aluminum and copper. These materials not only facilitate heat conduction but also, in conjunction with the upper and lower shielding shells, provide shielding at the slot, significantly reducing direct contact between the internal structure and the external environment to ensure filter performance. The shape of the heat-conducting bend can be customized according to the dimensions of each module to ensure effective heat dissipation. This heat dissipation structure achieves efficient heat dissipation while maintaining the continuity of the shielding shell through a reasonable structural design. The part where the heat-conducting bend passes through the shielding shell employs a tight fit design, effectively preventing electromagnetic leakage and ensuring that the electromagnetic shielding performance of the filter is not affected.

[0015] (2) By attaching the heat-conducting sheet to the capacitor module and the inductor module, the heat dissipation of the capacitor module and the inductor module can be enhanced. The heat-conducting sheet is a flexible material that can be attached to the module to increase the contact area, so that the heat can be transferred out in time when it is heated. The capacitor module and the inductor module are relatively easy to heat up. By strengthening the heat dissipation of the easy-to-heat parts, the heat dissipation efficiency is improved. Compared with the traditional indirect heat dissipation, this direct heat conduction method has lower thermal resistance and more significant heat dissipation effect.

[0016] (3) When the internal heat of this application is generated, the heat is guided from the inside to the outside through the heat-conducting bent rod and fixedly connected to the heat sink plate by the bonding guide plates on both sides. The heat sink plate can be used to contact the guided heat with the low temperature air outside to achieve heat dissipation. Compared with the existing EMI filter, which is prone to heat accumulation inside due to the lack of heat dissipation structure, thus affecting the performance of the EMI filter, this application can efficiently conduct the internal heat out through the heat-conducting component and dissipate heat in time with the heat sink plate, thereby ensuring the operation effect of the EMI filter. Attached Figure Description

[0017] Figure 1 This is a three-dimensional structural schematic diagram of the present invention;

[0018] Figure 2 This is a top view of the structure of this utility model;

[0019] Figure 3 for Figure 2 Schematic diagram of the cross-sectional structure at point AA;

[0020] Figure 4 This is a schematic diagram of the internal three-dimensional structure of the present invention;

[0021] Figure 5 This is a side view of the structure of this utility model;

[0022] Figure 6 for Figure 5 Schematic diagram of the cross-sectional structure at point BB;

[0023] Figure 7 for Figure 5 Schematic diagram of the cross-sectional structure at the CC section;

[0024] Figure 8 for Figure 7 Enlarged structural diagram at point a.

[0025] In the diagram: 1. Lower shielding shell; 101. Docking groove; 102. Positioning seat; 2. Upper shielding shell; 201. Docking protrusion; 3. Combination plate; 301. Connecting bolt; 302. Connecting nut; 4. Heat-conducting component; 401. Heat-conducting bent rod; 402. Adhesive guide plate; 403. Extended heat exchange plate; 404. Heat-conducting sheet; 405. Through slot; 406. Positioning sleeve; 5. Heat sink; 6. Circuit board; 7. Inductor module; 8. Capacitor module; 9. Connection module; 10. Resistor module; 11. Positioning groove. Detailed Implementation

[0026] The technical solutions of this utility model will be clearly and completely described below with reference to the embodiments of this utility model. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of this utility model.

[0027] like Figures 1 to 8 As shown, an EMI filter with a heat dissipation structure includes a lower shielding shell 1 and an upper shielding shell 2. A positioning seat 102 is disposed inside the lower shielding shell 1, and a circuit board 6 is disposed inside the positioning seat 102. An inductor module 7, a capacitor module 8, and a resistor module 10 are respectively disposed on the upper surface of the circuit board 6. Connecting modules 9 are respectively disposed on both sides of the upper surface of the circuit board 6. A heat sink 5 is mounted on the upper end of the upper shielding shell 2. A heat-conducting component 4 for guiding heat dissipation is installed between the upper shielding shell 2 and the lower shielding shell 1. By combining the upper shielding shell 2 and the lower shielding shell 1 to surround the various modules, external interference is reduced, allowing the inductor module 7 to effectively suppress the transmission of interference signals and cooperate with the capacitor module 8 and the resistor module 10 to achieve filtering. The heat sink 5 can be connected to the heat-conducting component 4, thereby transferring the heat guided by the heat-conducting component 4 to the heat sink 5. The increased heat dissipation area of ​​the heat sink 5 achieves efficient heat dissipation.

[0028] In this embodiment, the heat-conducting component 4 includes a heat-conducting bent rod 401, which is located above the circuit board 6. The lower shielding shell 1 and the upper shielding shell 2 are respectively provided with through slots 405. The two ends of the heat-conducting bent rod 401 are fixedly installed inside the through slots 405. The two ends of the heat-conducting bent rod 401 are respectively provided with bonding guide plates 402, and the bonding guide plates 402 on both sides are fixedly connected to the heat sink 5.

[0029] The heat-conducting bent rod 401 has positioning sleeves 406 on both sides of the rod body. Each positioning sleeve 406 is located inside the corresponding through slot 405. The outside of the positioning sleeve 406 is provided with a locking block that cooperates with the corresponding through slot 405 for limiting.

[0030] Among them, the heat-conducting bent rod 401 is provided with several extended heat exchange plates 403, and the bottom of some of the extended heat exchange plates 403 are attached to the capacitor module 8 and the inductor module 7 through heat-conducting sheets 404.

[0031] It should be noted that the heat-conducting bent rod 401 and the extended heat exchange plate 403 are both made of metal materials, such as aluminum and copper. They not only conduct heat through their materials, but also, together with the upper shielding shell 2 and the lower shielding shell 1, can shield the through slot 405, greatly reducing the direct contact between the internal structure and the outside world, so as to ensure the performance of the filter. The shape of the heat-conducting bent rod 401 can be set according to the size of each module to ensure the heat dissipation effect.

[0032] By attaching the heat-conducting sheet 404 to the capacitor module 8 and the inductor module 7, heat dissipation of the capacitor module 8 and the inductor module 7 can be enhanced. The heat-conducting sheet 404 is a flexible material that can be attached to the module to increase the contact area, so that heat can be transferred away in time when it is heated. In addition, the capacitor module 8 and the inductor module 7 are relatively easy to heat up. By strengthening the heat dissipation of the easy-to-heat parts, the heat dissipation effect of this application can be improved.

[0033] This application utilizes internal heat generation, thereby guiding heat from the inside to the outside using the heat-conducting bent rod 401 and fixing it to the heat sink 5 using the two side-mounted guide plates 402. This allows the heat to come into contact with the low-temperature outside air, achieving a heat dissipation effect. Compared to existing EMI filters that are prone to internal heat accumulation due to the lack of a heat dissipation structure, thus affecting the performance of the EMI filter, this application can efficiently conduct internal heat away through the heat-conducting component 4 and, together with the heat sink 5, dissipate heat in a timely manner, thereby ensuring the operating effect of the EMI filter.

[0034] In this embodiment, a combination plate 3 is provided on both sides of the lower shielding shell 1 and the upper shielding shell 2, and a connecting bolt 301 is interspersed between every two adjacent combination plates 3. A connecting nut 302 is threaded onto one end of each connecting bolt 301.

[0035] By connecting the bolt 301 and the nut 302 with thread engagement, the upper and lower side combination plates 3 can be clamped between the nut 302 and the bolt 301, so that the lower shielding shell 1 and the upper shielding shell 2 can be stably connected.

[0036] In this embodiment, the lower shielding shell 1 has docking grooves 101 on both sides, and the upper shielding shell 2 has docking protrusions 201 on both sides. The docking grooves 101 and the docking protrusions 201 are matched in a limiting manner, and the docking grooves 101 and the docking protrusions 201 have through slots 405 in the middle.

[0037] In this embodiment, positioning grooves 11 are respectively provided on both sides of the docking groove 101 and the docking protrusion 201, and a connecting end of the connecting module 9 is interspersed inside each positioning groove 11.

[0038] By using the mating groove 101 and the mating protrusion 201 for limiting, the lower shielding shell 1 and the upper shielding shell 2 can be limited when combined. With the combination plate 3, precise combination can be achieved. During the combination process, the positioning groove 11 can position the connection end of the connection module 9 to ensure the stable placement of the circuit board 6 and the extension of the connection end of the connection module 9 to connect with external equipment.

[0039] It should be noted that the heat-conducting bent rod 401 is in close contact with some heat-generating modules through the heat-conducting plate 404, which can actively guide heat away, improve the heat transfer speed, and achieve efficient heat dissipation. Furthermore, the formation of the extended heat exchange plate 403 can be designed according to the shape and size of the module to increase the contact area and improve heat dissipation.

[0040] The working principle of an EMI filter with a heat dissipation structure:

[0041] During use, the inductor module 7 and capacitor module 8 generate heat over long periods of operation. The heat-conducting sheet 404 is attached to the capacitor module 8 and inductor module 7 to enhance heat dissipation. The heat-conducting sheet 404 is a flexible material that can be attached to the module to increase the contact area, allowing heat to be transferred away in a timely manner. The heat-conducting bent rod 401 guides the heat from the inside to the outside and is fixedly connected to the heat sink 5 by the two side-attached guide plates 402. This allows the heat to come into contact with the low-temperature outside air, achieving a heat dissipation effect.

[0042] Obviously, the above embodiments of this utility model are merely examples for clearly illustrating this utility model, and are not intended to limit the implementation of this utility model. For those skilled in the art, other variations or modifications can be made based on the above description. It is impossible to exhaustively list all the implementation methods here. Any obvious variations or modifications derived from the technical solutions of this utility model are still within the protection scope of this utility model.

Claims

1. An EMI filter with a heat dissipation structure, comprising a lower shielding shell (1) and an upper shielding shell (2), characterized in that: The lower shielding shell (1) is provided with a positioning seat (102) inside, and a circuit board (6) is provided inside the positioning seat (102). An inductor module (7), a capacitor module (8), and a resistor module (10) are respectively provided on the upper surface of the circuit board (6). A connection module (9) is provided on both sides of the upper surface of the circuit board (6). A heat sink (5) is installed on the upper end of the upper shielding shell (2). A heat-conducting component (4) for guiding heat dissipation is installed between the upper shielding shell (2) and the lower shielding shell (1).

2. An EMI filter with a heat dissipation structure according to claim 1, characterized in that: The heat-conducting component (4) includes a heat-conducting bent rod (401), which is located above the circuit board (6). The lower shielding shell (1) and the upper shielding shell (2) are respectively provided with through slots (405). The two ends of the heat-conducting bent rod (401) are fixedly installed inside the through slots (405). The two ends of the heat-conducting bent rod (401) are respectively provided with bonding guides (402). The bonding guides (402) on both sides are fixedly connected to the heat sink (5).

3. An EMI filter with a heat dissipation structure according to claim 2, characterized in that: The heat-conducting bent rod (401) has positioning sleeves (406) on both sides of its body. Each positioning sleeve (406) is located inside a corresponding through slot (405). A locking block is provided on the outside of the positioning sleeve (406) to limit the corresponding through slot (405).

4. An EMI filter with a heat dissipation structure according to claim 2, characterized in that: The heat-conducting bent rod (401) is provided with several extended heat exchange plates (403), and the bottom of some of the extended heat exchange plates (403) are attached to the capacitor module (8) and the inductor module (7) through heat-conducting sheets (404).

5. An EMI filter with a heat dissipation structure according to claim 1, characterized in that: The lower shielding shell (1) and the upper shielding shell (2) are respectively provided with a combination plate (3) on both sides. A connecting bolt (301) is interspersed between every two adjacent combination plates (3). A connecting nut (302) is threaded on one end of each connecting bolt (301).

6. An EMI filter with a heat dissipation structure according to claim 1, characterized in that: The lower shielding shell (1) has mating grooves (101) on both sides, and the upper shielding shell (2) has mating protrusions (201) on both sides. The mating grooves (101) and the mating protrusions (201) are matched in a limiting manner. The mating grooves (101) and the mating protrusions (201) have through slots (405) in the middle.

7. An EMI filter with a heat dissipation structure according to claim 6, characterized in that: The docking groove (101) and the docking protrusion (201) are respectively provided with positioning grooves (11), and each positioning groove (11) is provided with a connecting end of a connecting module (9).

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