Heat dissipation device for electronic equipment

Abstract

The application relates to the technical field of electronic equipment heat dissipation, and discloses a heat dissipation device for electronic equipment, which comprises a heat conduction part, a heat dissipation fan and a shell. The heat conduction part comprises a heat conduction plate part and a plurality of heat dissipation fin parts. The heat conduction plate part is arranged on a heat generating component of the electronic equipment and comprises a first mounting area and a second mounting area. The plurality of heat dissipation fin parts are formed in the first mounting area and can dissipate heat to the outside. An air duct is formed between two adjacent heat dissipation fin parts. The heat dissipation fan is arranged in the second mounting area and located on one side of the air duct in the axial direction. The heat dissipation fan has an air inlet and a first air outlet, both of which are directed towards the air duct. The shell is arranged outside the heat dissipation fan and the plurality of heat dissipation fin parts and has a hollow part for allowing external airflow to enter the air inlet at a position corresponding to the air inlet. The inner wall of the shell is attached to the side wall of the heat dissipation fin part towards the shell. The shell has a second air outlet at one end of the air duct away from the heat dissipation fan. The heat dissipation device has good heat dissipation effect.

Description

Technical Field

[0001] This application belongs to the field of heat dissipation technology for electronic devices, and specifically relates to a heat dissipation device for electronic devices. Background Technology

[0002] Currently, many high-performance electronic devices (such as 3D scanners) have high internal power consumption and heat generation, and generally rely on built-in fans for forced cooling. This active cooling method requires the device to have air inlets and outlets to draw in cool air and expel internal heat. It is because of the existence of these openings that the device casing cannot be completely sealed, making it difficult to have reliable waterproof function. On the other hand, if a fanless passive cooling method is used to achieve a waterproof rating, its cooling efficiency is far from sufficient to meet the cooling requirements of the device under high load, thus restricting its performance. Utility Model Content

[0003] The purpose of this application is to provide a heat dissipation device for electronic devices, which has a simple structure and can at least solve one of the above-mentioned technical problems.

[0004] To achieve the above objectives, this application provides a heat dissipation device for electronic devices, the heat dissipation device comprising: A heat-conducting component includes a heat-conducting plate portion and multiple heat dissipation fin portions. The heat-conducting plate portion is used to be disposed on the heat-generating component of an electronic device and includes a first mounting area and a second mounting area that are adjacently distributed. Multiple heat dissipation fin portions are formed in the first mounting area and are used to dissipate heat from the heat-conducting plate portion to the outside. An air duct is formed between two adjacent heat dissipation fin portions. A cooling fan is provided in the second mounting area and located on one side of the air duct. The cooling fan has an air inlet and a first air outlet, with the first air outlet facing the air duct. The outer casing covers the outside of the cooling fan and multiple cooling fins. The outer casing has a perforated part at the position corresponding to the air inlet to allow external airflow to enter the air inlet. The inner wall of the outer casing is in contact with the side wall of the cooling fins facing the outer casing. The outer casing has a second air outlet at the end of the air duct away from the cooling fan.

[0005] In the embodiments of this application, the end of the heat dissipation fins away from the cooling fan is exposed at the second air outlet.

[0006] In the embodiments of this application, the portion of the heat dissipation fins exposed at the second air outlet has a chamfered angle.

[0007] In the embodiments of this application, the cross-sectional width of the heat dissipation fins gradually decreases in the direction that gradually moves away from the heat-generating component.

[0008] In the embodiments of this application, the heat-conducting component is made of aluminum alloy.

[0009] In embodiments of this application, the heat dissipation device further includes a filter screen disposed at the location of the hollowed-out portion and used to filter impurities in the airflow flowing into the air inlet.

[0010] In embodiments of this application, the heat dissipation device further includes a first waterproof pad disposed between the housing and the heat-conducting component.

[0011] In embodiments of this application, the heat dissipation device further includes a second waterproof pad disposed between the heat-conducting component and the cooling fan.

[0012] In the embodiments of this application, the protection level of the cooling fan is not lower than IP65.

[0013] In the embodiments of this application, a first perforation is formed on the heat-conducting plate for the connection wire of the cooling fan to pass through, and the heat dissipation device also includes a waterproof adhesive, which fills the space between the connection wire and the wall of the first perforation.

[0014] As can be seen from the above technical solution, the heat dissipation device for electronic devices includes: a heat-conducting component, comprising a heat-conducting plate and multiple heat dissipation fins. The heat-conducting plate is disposed on the heat-generating component of the electronic device and includes adjacent first and second mounting areas. The multiple heat dissipation fins are formed in the first mounting area and are used to dissipate heat from the heat-conducting plate to the outside. An air duct is formed between two adjacent heat dissipation fins. A cooling fan is disposed in the second mounting area and located on one axial side of the air duct. The cooling fan has an air inlet and a first air outlet, with the first air outlet facing the air duct. A housing covers the outside of the cooling fan and the multiple heat dissipation fins. The housing has a perforated portion at a position corresponding to the air inlet for allowing external airflow to enter the air inlet. The inner wall of the housing is in contact with the side wall of the heat dissipation fins facing the housing. A second air outlet is formed at the end of the air duct away from the cooling fan. This heat dissipation device is installed on the outside of the electronic device, has a simple structure, and provides excellent heat dissipation.

[0015] Other features and advantages of the embodiments of this application will be described in detail in the following detailed description section. Attached Figure Description

[0016] The accompanying drawings are provided to further illustrate the embodiments of this application and form part of the specification. They are used together with the following detailed description to explain the embodiments of this application, but do not constitute a limitation on the embodiments of this application. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without any inventive effort. In the drawings: Figure 1 This is a schematic diagram of the heat dissipation device installed on the 3D scanner in this embodiment; Figure 2This is a schematic diagram of the heat dissipation device installed on the electronic device in this embodiment; Figure 3 This is an exploded view of the heat dissipation device component in this embodiment; Figure 4 This is a side view of the heat dissipation device in this embodiment; Figure 5 This is section AA in the side view of the heat dissipation device in this embodiment; Figure 6 This is a BB cross-sectional view in the side view of the heat dissipation device in this embodiment; Figure 7 This is a schematic diagram of the cross-section of the heat dissipation fins in this embodiment; Figure 8 This is a schematic diagram showing the connection of the heat-conducting plate to the heating element in this embodiment; Figure 9 This is a schematic diagram showing the installation of the first waterproof pad and the second waterproof pad onto the heat dissipation device in this embodiment; Figure 10 This is a schematic diagram showing the cooling fan installed on the heat-conducting plate in this embodiment; Figure 11 This is a schematic diagram showing the application of the waterproof adhesive to the first and second perforations in this embodiment; Figure 12 This is a schematic diagram showing how the filter screen is fixed to the outer casing in this embodiment.

[0017] Explanation of reference numerals in the attached figures 1-Heat-conducting component; 101-Heat-conducting plate; 102-Heat dissipation fins; 103-First mounting area; 104-Second mounting area; 105-Air duct; 106-Chamfer; 2-Heat-generating component; 201-Heat-generating device; 202-Core board; 3-Cooling fan; 301-Air inlet; 302-First air outlet; 4-Outer shell; 401-Hollowed-out section; 402-Second air outlet; 403-Sunken platform; 5-Filter screen; 6-First waterproof pad; 7-Second waterproof pad; 8-First perforation; 9-Waterproof adhesive; 10-Connecting wire; 11-Second perforation; 12-First bolt assembly; 13-Second bolt assembly; 14-Third bolt assembly. Detailed Implementation

[0018] The specific embodiments of this application will be described in detail below with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are for illustration and explanation only and are not intended to limit this application.

[0019] An embodiment of this application provides a heat dissipation device for an electronic device, the heat dissipation device comprising: The heat-conducting component 1 includes a heat-conducting plate portion 101 and a plurality of heat dissipation fin portions 102. The heat-conducting plate portion 101 is used to be disposed on the heat-generating component 2 of the electronic device and includes a first mounting area 103 and a second mounting area 104 that are adjacent to each other. The plurality of heat dissipation fin portions 102 are all formed in the first mounting area 103 and are used to dissipate the heat from the heat-conducting plate portion 101 to the outside. An air duct 105 is formed between two adjacent heat dissipation fin portions 102. Cooling fan 3 is disposed in the second mounting area 104 and located on one side of the air duct 105. Cooling fan 3 has an air inlet 301 and a first air outlet 302, with the first air outlet 302 facing the air duct 105. The outer casing 4 covers the outside of the cooling fan 3 and multiple cooling fins 102. The outer casing 4 has a perforated portion 401 at a position corresponding to the air inlet 301 for allowing external airflow to enter the air inlet 301. The inner wall of the outer casing 4 is in contact with the side wall of the cooling fins 102 facing the outer casing 4. The outer casing 4 has a second air outlet 402 at the end of the air duct 105 away from the cooling fan 3.

[0020] Specifically, such as Figures 1-3 As shown, the electronic device in this embodiment can be a 3D scanner. The first mounting area 103 and the second mounting area 104 are both located on the side of the heat-conducting plate portion 101 facing away from the heat-generating component 2. The heat-generating component 2 includes a heat-generating device 201 and a core plate 202 for mounting the heat-generating device 201. The heat-conducting plate portion 101 is fixed to the core plate 202 by a first bolt assembly 12, which can be four M2x4 screws. The connection position between the core plate 202 and the heat-conducting plate portion 101 is on the back side of the first mounting area 103 (i.e., the back side of the multiple heat dissipation fin portions 102), so that heat is conducted to the heat dissipation fin portions 102 rather than the cooling fan 3. Thermal grease is applied to the heat-generating device 201 to ensure that the heat-generating component 2... The heat is better conducted to the heat-conducting plate 101. In this embodiment, the heat dissipation fins 102 can be selected as ten, and the spacing between two adjacent heat dissipation fins 102 is equal. Multiple heat dissipation fins 102 can effectively increase the heat dissipation area of ​​the heat-conducting component 1. Two adjacent heat dissipation fins 102 and the outer shell 4 together form the air duct 105 in this embodiment. The cooling fan 3 is fixed to the second mounting area 104 by the second bolt assembly 13. The second bolt assembly 13 can be four M2x3 screws. The first air outlet 302 can generate airflow towards the air duct, further accelerating the dissipation of heat from the multiple heat dissipation fins 102 to the outside. The outer shell 4 is fixed to the heat-conducting plate 101 of the heat-conducting component 1 by the third bolt assembly 14 (e.g., Figure 8As shown), the third bolt assembly 14 can be selected as four M3x5 screws. The air inlet 301 and the hollow part 401 are both circular and have the same size. After the outer shell 4 and the heat conduction plate part 101 are installed together, the hollow part 401 is close to the air inlet 301 and is located on the side of the air inlet 301 closer to the outside. From the direction perpendicular to the hollow part 401 and the air inlet 301, the outer edge of the hollow part 401 coincides with the outer edge of the air inlet 301 so that the outside airflow can smoothly enter the cooling fan 3. The second air outlet 402 makes the end of all the air ducts 105 away from the cooling fan 3 directly connected to the outside so that the airflow can smoothly flow out of the air duct 105.

[0021] Furthermore, the outer casing 4 can be made of aluminum alloy. This material choice allows the outer casing 4 to effectively conduct heat outward at the locations where it contacts the multiple heat dissipation fins 102. At the same time, the low density of aluminum alloy reduces the overall weight of the heat dissipation device.

[0022] In this embodiment, the heat dissipation device for electronic devices is installed on the outside of the electronic devices. By setting the outer casing 4, the cooling fan 3 and multiple heat dissipation fins 102, not only is the heat dissipation area increased, but multiple air ducts are also formed inside the heat dissipation device. At the same time, the airflow generated by the cooling fan 3 can further enhance the heat dissipation effect. The heat dissipation device has a simple structure and good heat dissipation effect.

[0023] In one embodiment of this application, the end of the heat dissipation fin portion 102 away from the cooling fan 3 is exposed at the second air outlet 402.

[0024] Specifically, such as Figures 4-5 As shown, a portion of the heat dissipation fin portion 102 at the end furthest from the cooling fan 3 is directly exposed to the outside environment facing the side wall of the outer casing 4, without contacting the inner wall of the outer casing 4. This arrangement increases the contact area between the heat dissipation fin portion 102 and the outside environment, further enhancing the heat dissipation effect.

[0025] In one embodiment of this application, the portion of the heat dissipation fin portion 102 exposed at the second air outlet 402 is formed with a chamfer 106.

[0026] Specifically, such as Figure 5 As shown, the chamfer 106 makes the overall lines of the heat dissipation device smoother and avoids the abruptness of the exposed right angle. At the same time, the chamfer 106 can, to a certain extent, prevent the exposed part of the heat dissipation fins 102 from scratching or bumping the user.

[0027] In one embodiment of this application, the cross-sectional width of the heat dissipation fin portion 102 gradually decreases in the direction gradually moving away from the heat-generating component 2.

[0028] Specifically, such as Figure 7As shown, the angle between the top edge of the heat dissipation fin portion 102 and the left and right side edges is greater than 90°. In this embodiment, the angle is set to 92°. This setting further increases the heat dissipation area of ​​the heat dissipation fin portion 102, thereby further enhancing the heat dissipation effect of the heat dissipation device.

[0029] In one embodiment of this application, the heat-conducting component 1 is made of aluminum alloy.

[0030] Specifically, aluminum alloy has good thermal conductivity, low density, and high plasticity. Using aluminum alloy for heat-conducting component 1 reduces the overall weight of the heat dissipation device while ensuring heat dissipation effect, thus improving ease of use. At the same time, the high plasticity of aluminum alloy ensures the convenience of processing heat-conducting component 1 and reduces processing costs.

[0031] In one embodiment of this application, the heat dissipation device further includes a filter screen 5 disposed at the location of the hollow portion 401 and used to filter impurities in the airflow flowing into the air inlet 301.

[0032] Specifically, such as Figure 3 , Figure 12 As shown, a recessed platform 403 is formed on the outer periphery of the hollow portion 401 of the outer casing 4. The outer edges of the recessed platform 403 and the filter screen 5 are both rectangular and have the same size. The filter screen 5 is attached to the recessed platform 403, allowing airflow to enter the air inlet 301 while filtering dust and other impurities from the outside, reducing the negative impact of external impurities on the cooling fan 3. Furthermore, the filter screen 5 is made of stainless steel, which ensures the service life of the filter screen 5, thereby enhancing the long-term reliability of the heat dissipation device.

[0033] In one embodiment of this application, the heat dissipation device further includes a first waterproof pad 6 disposed between the housing 4 and the heat-conducting element 1.

[0034] Specifically, such as Figure 3 , Figure 6 As shown, in this embodiment, the first waterproof pad 6 can be selected as waterproof foam. The first waterproof pad 6 is in the shape of a hollow rectangle and is set at the periphery of the outer shell 4 and the heat conduction plate 101. The above arrangement can prevent external water vapor from entering the heat dissipation device and enhance the waterproof effect of the heat dissipation device.

[0035] In one embodiment of this application, the heat dissipation device further includes a second waterproof pad 7 disposed between the heat-conducting element 1 and the cooling fan 3.

[0036] Specifically, in this embodiment, the second waterproof pad 7 can be selected as waterproof foam, such as... Figure 3 , Figure 9As shown, the second waterproof pad 7 is rectangular in shape and is disposed between the cooling fan 3 and the heat conduction plate 101. This arrangement can further prevent external moisture from entering the interior of the heat dissipation device, thereby further enhancing the waterproof effect of the heat dissipation device.

[0037] In one embodiment of this application, the protection level of the cooling fan 3 is not lower than IP65.

[0038] Specifically, in this embodiment, the cooling fan 3 can be selected as a waterproof fan with an IP67 protection rating (i.e., completely preventing the intrusion of foreign objects and dust, and resisting immersion in water up to one meter deep for 30 minutes). This setting enables the cooling fan 3 itself to have a certain waterproof effect, thereby further enhancing the waterproof performance of the heat dissipation device.

[0039] In one embodiment of this application, a first through hole 8 is formed on the heat-conducting plate portion 101 for the connection wire 10 of the cooling fan 3 to pass through, and the heat dissipation device also includes a waterproof adhesive 9, which fills the space between the connection wire 10 and the hole wall of the first through hole 8.

[0040] Specifically, such as Figure 3 , Figures 10-11 As shown, the connecting wire 10 passes through the second waterproof pad 7 and the heat-conducting plate portion 101 and connects the cooling fan 3 to the electronic device, so that the power supply of the electronic device provides power to the cooling fan 3. A second perforation 11 is formed on the second waterproof pad 7. A waterproof adhesive 9 is filled between the connecting wire 10 and the hole wall of the first perforation 8, and between the connecting wire 10 and the hole wall of the second perforation 11. The waterproof adhesive 9 can cure after use. The above arrangement can prevent moisture from entering the interior of the heat dissipation device and the interior of the electronic device from the first perforation 8 and the second perforation 11, thereby further enhancing the waterproof performance of the heat dissipation device.

[0041] In the description of this application, it should be understood that the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0042] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection, an electrical connection, or a connection that allows communication between components; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0043] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0044] Although embodiments of this application have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting this application. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of this application.

Claims

1. A heat dissipation device for electronic devices, characterized in that, The heat dissipation device includes: The heat-conducting component (1) includes a heat-conducting plate portion (101) and a plurality of heat dissipation fin portions (102). The heat-conducting plate portion (101) is used to be disposed on the heat-generating component (2) of the electronic device and includes a first mounting area (103) and a second mounting area (104) distributed adjacent to each other. The plurality of heat dissipation fin portions (102) are formed in the first mounting area (103) and are used to dissipate the heat from the heat-conducting plate portion (101) to the outside. An air duct (105) is formed between two adjacent heat dissipation fin portions (102). A cooling fan (3) is provided in the second mounting area (104) and located on one side of the air duct (105). The cooling fan (3) has an air inlet (301) and a first air outlet (302), with the first air outlet (302) facing the air duct (105). The outer casing (4) covers the outside of the cooling fan (3) and the plurality of cooling fins (102). The outer casing (4) has a hollowed-out portion (401) at a position corresponding to the air inlet (301) for allowing external airflow to enter the air inlet (301). The inner wall of the outer casing (4) is in contact with the side wall of the cooling fins (102) facing the outer casing (4). The outer casing (4) has a second air outlet (402) at the end of the air duct (105) away from the cooling fan (3).

2. The heat dissipation device for electronic devices according to claim 1, characterized in that, The end of the heat dissipation fin portion (102) away from the heat dissipation fan (3) is exposed at the second air outlet (402).

3. The heat dissipation device for electronic devices according to claim 2, characterized in that, The portion of the heat dissipation fins (102) exposed at the second air outlet (402) has a chamfer (106).

4. The heat dissipation device for electronic devices according to claim 1, characterized in that, The cross-sectional width of the heat dissipation fin portion (102) gradually decreases in the direction that gradually moves away from the heat-generating component (2).

5. The heat dissipation device for electronic devices according to claim 1, characterized in that, The heat-conducting component (1) is made of aluminum alloy.

6. The heat dissipation device for electronic devices according to claim 1, characterized in that, The heat dissipation device also includes a filter screen (5) disposed at the location of the hollow part (401) and used to filter impurities in the airflow flowing into the air inlet (301).

7. The heat dissipation device for electronic devices according to claim 1, characterized in that, The heat dissipation device also includes a first waterproof pad (6) disposed between the outer casing (4) and the heat-conducting component (1).

8. The heat dissipation device for electronic devices according to claim 1, characterized in that, The heat dissipation device also includes a second waterproof pad (7) disposed between the heat-conducting component (1) and the cooling fan (3).

9. The heat dissipation device for electronic devices according to claim 1, characterized in that, The protection level of the cooling fan (3) is not lower than IP65.

10. The heat dissipation device for electronic devices according to any one of claims 1-9, characterized in that, The heat-conducting plate portion (101) has a first perforation (8) for the connecting wire (10) of the cooling fan (3) to pass through. The heat dissipation device also includes a waterproof adhesive (9) which fills the space between the connecting wire (10) and the wall of the first perforation (8).

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