Heat dissipation device and vehicle-mounted host

Abstract

The application provides a heat dissipation device and a vehicle-mounted host, and relates to the technical scheme points, which include a bottom shell, a surface shell, and a circuit board arranged between the bottom shell and the surface shell, wherein a main chip assembly is arranged on the circuit board; a heat pipe assembly and a fin assembly are sequentially arranged in the surface shell, one side of the heat pipe assembly is in contact with the main chip assembly through a heat conduction medium, the other side of the heat pipe assembly is in thermal connection with the fin assembly; and a fan assembly is arranged on the surface shell and located at one side of the fin assembly, and is used for forcibly conducting convection heat dissipation on the fin assembly; the application has the advantages of high heat dissipation efficiency through the combination and cooperative work of multiple heat dissipation structures.

Description

Technical Field

[0001] This application relates to the field of vehicle host accessories technology, and in particular to a heat dissipation device and a vehicle host. Background Technology

[0002] With the popularization of smart cockpits and advanced driver assistance functions, the power consumption of various acceleration chips in the vehicle host has risen rapidly. The peak power consumption has increased from the traditional 5-8W to 40-60W or even higher. The high temperature environment inside the vehicle combined with the small installation space makes heat dissipation significantly more difficult.

[0003] Existing technical solutions mainly use die-cast aluminum alloy as heat sinks, and rely on a single method such as natural heat dissipation, traditional air cooling, and water cooling to dissipate heat from the vehicle host chip. This method cannot quickly transfer heat to the heat sink, and it is easy to form heat accumulation, resulting in poor heat dissipation and low heat dissipation efficiency. Utility Model Content

[0004] To address the shortcomings of existing technologies, this application provides a heat dissipation device and an in-vehicle host to solve the problems existing in related technologies. The technical solution is as follows: In a first aspect, embodiments of this application provide a heat dissipation device, including: a bottom shell, a top shell, and a circuit board disposed between the bottom shell and the top shell, wherein a main chip assembly is disposed on the circuit board; a heat pipe assembly and a fin assembly are sequentially disposed within the top shell, one side of the heat pipe assembly being in contact with the main chip assembly via a thermally conductive medium, and the other side being thermally connected to the fin assembly; and a fan assembly disposed on the top shell and located on one side of the fin assembly, for forced convection cooling of the fin assembly. The heat pipe assembly, fin assembly, and fan assembly are respectively disposed at different positions within the heat dissipation device, and through the heat transfer path of main chip assembly → heat pipe assembly → top shell → fin assembly, the heat of the circuit board is efficiently transferred through multiple paths at each stage. The high thermal conductivity of multiple different thermally conductive components diffuses the heat to the entire plane, eliminating local heat accumulation; simultaneously, the fan assembly also provides forced convection cooling of the fin assembly, combining active and passive cooling to make the overall heat conduction of the device more efficient.

[0005] In one embodiment, the heat pipe assembly includes a first heat spreader and a group of heat pipes disposed on the first heat spreader, the heat pipe group being thermally connected to the fin assembly; the first heat spreader is in contact with the high heat dissipation area of ​​the main chip assembly, and the heat pipe group includes multiple individually disposed heat pipes arranged radially from the first heat spreader. The first heat spreader is a copper heat spreader, and copper has a high thermal conductivity. The copper heat spreader is in contact with areas on the main chip assembly where heat is easily accumulated, which can quickly and evenly distribute and transfer the heat from the main high heat dissipation components in the main chip assembly to the heat pipe group; the heat pipe group is composed of multiple individual heat pipes, one end of which is an evaporation end and the other end is a condensation end. Through the evaporation-condensation cycle effect, the heat pipe can efficiently transfer a large amount of heat from one end to the other, achieving the heat transfer effect of the heat pipe assembly.

[0006] In one embodiment, the fin assembly includes a fin group, a second heat spreader, and a fin group protective cover. The second heat spreader is disposed on the front shell and thermally connected to the heat pipe assembly. The fin group is disposed on the second heat spreader, and the fin group protective cover is disposed on the outside of the fin group and connected to the front shell. The second heat spreader is an aluminum heat spreader. Due to its high thermal conductivity, it can quickly and evenly distribute the heat from the front shell and heat pipe assembly to the fin group. Its surface is electroplated with a nickel coating to improve the thermal conductivity and solderability of the material. It is fixed to the front shell, heat pipe assembly, and fin group by solder paste. The fin group is fixed by riveting or welding multiple stamped fins. Airflow channels are formed between the stamped fins, which can significantly increase the contact area with air. Combined with the fan assembly, forced convection achieves a rapid heat dissipation effect.

[0007] In one embodiment, the housing is a metal housing with an electroplated coating on its surface. The housing is fixed to the heat pipe assembly and the second heat spreader by welding. The housing is made of die-cast aluminum alloy with a nickel-plated coating to improve its thermal conductivity and solderability. It is soldered to the heat pipe assembly and the second heat spreader using solder paste, enabling the heat from the main chip assembly to be quickly and evenly distributed and transferred, improving thermal conductivity and heat dissipation capacity.

[0008] In one embodiment, the fan assembly includes a fan guard and at least one fan; the fan is disposed on the faceplate and located on one side of the fin assembly, and the fan guard is disposed on the faceplate and covers the outside of the fan. The fan, located on the side of the faceplate, actively delivers cool air through the fin assembly, enabling rapid heat dissipation of the product; the fan guard, covering the outside of the fan, prevents damage to the fan from foreign objects and guides the cool air from the fan through the fin assembly, improving convection efficiency and achieving product heat dissipation.

[0009] In one embodiment, the thermally conductive medium is a thermally conductive gel, thermally conductive silicone grease, or a thermally conductive phase change material. The thermally conductive medium can be a thermally conductive material with a high thermal conductivity, such as a thermally conductive gel, thermally conductive silicone grease, or thermally conductive phase change material.

[0010] In one embodiment, the device further includes a connector assembly. The housing has a corresponding receiving cavity, and the connector assembly is disposed on the main chip assembly and housed within the receiving cavity. The connector assembly, mounted on the main chip assembly and housed within the receiving cavity, can expand the product interface, thereby increasing product functionality.

[0011] In one embodiment, a connector bracket is disposed outside the accommodating cavity, and a shielding bracket is disposed inside the accommodating cavity. The shielding bracket connects the connector assembly and the main chip assembly respectively for grounding connection. The connector bracket is made of galvanized steel plate, which is fixed to the faceplate and seals the accommodating cavity to form an enclosing cavity, protecting the internal components of the accommodating cavity from electromagnetic interference from the external environment. The shielding bracket is installed between the main chip assembly and the connector assembly, which can achieve a good grounding connection of the circuit board, prevent the circuit board from being affected by electromagnetic interference from the external environment, and improve product reliability.

[0012] In one embodiment, at least one antenna assembly is disposed on the side of the housing opposite to the accommodating cavity for transmitting and receiving signals. The antenna assembly includes a plastic antenna bracket with an FPC antenna attached inside, which is fixed to the housing to provide antenna protection. The antenna assembly directly transmits and receives signals.

[0013] Secondly, embodiments of this application provide an in-vehicle host, including the aforementioned heat dissipation device.

[0014] The advantages or beneficial effects of the above technical solutions include at least the following: This application comprises multiple heat dissipation components. Through a heat transfer path of main chip assembly → heat pipe assembly → front shell → fin assembly, heat from the circuit board is efficiently transferred step-by-step via multiple paths. The high thermal conductivity of multiple different thermally conductive components diffuses heat across the entire plane, eliminating localized heat accumulation. Simultaneously, a fan assembly provides forced convection cooling to the fin assembly. This combination of active and passive cooling makes the overall heat conduction of the device more efficient. Furthermore, the device includes connector and antenna assemblies, which can enhance product functionality.

[0015] The above overview is for illustrative purposes only and is not intended to be limiting in any way. In addition to the illustrative aspects, embodiments, and features described above, further aspects, embodiments, and features of this application will become readily apparent from the accompanying drawings and the following detailed description. Attached Figure Description

[0016] In the accompanying drawings, unless otherwise specified, the same reference numerals throughout the various drawings denote the same or similar parts or elements. These drawings are not necessarily drawn to scale. It should be understood that these drawings depict only some embodiments disclosed in this application and should not be construed as limiting the scope of this application.

[0017] Figure 1 This is an overall structural diagram of the heat dissipation device of this utility model; Figure 2 This is an exploded view of the heat dissipation device of this utility model; Figure 3 This is a plan view of the circuit board in this utility model; Figure 4 This is a schematic diagram of the installation of the heat pipe assembly in this utility model; Figure 5 This is an exploded view of the heat pipe assembly in this utility model; Figure 6 This is a cross-sectional schematic diagram of the heat dissipation device of this utility model; Figure 7 This is a schematic diagram of the heat dissipation device of this utility model.

[0018] In the diagram: 1. Bottom shell; 2. Front shell; 3. Circuit board; 4. Main chip assembly; 5. Heat pipe assembly; 6. Fin assembly; 7. Thermal medium; 8. Fan assembly; 9. First heat spreader; 10. Heat pipe assembly; 11. Fin assembly; 12. Second heat spreader; 13. Fin assembly protective cover; 14. Fan protective cover; 15. Fan; 16. Connector assembly; 17. Connector bracket; 18. Shielding bracket; 19. Antenna assembly; 20. Opening. Detailed Implementation

[0019] In the following description, only certain exemplary embodiments are briefly described to make the objectives, features, and advantages of this invention more apparent. As those skilled in the art will recognize, the described embodiments can be modified in various ways without departing from the spirit or scope of this application. Therefore, the drawings and description are considered exemplary in nature and not restrictive.

[0020] The present invention will now be described in detail with reference to the accompanying drawings and embodiments.

[0021] Example 1 like Figure 1 and Figure 2As shown, this embodiment provides a heat dissipation device, including: a bottom shell 1, a front shell 2, and a circuit board 3 disposed between the bottom shell 1 and the front shell 2. A main chip assembly 4 is disposed on the circuit board 3. A heat pipe assembly 5 and a fin assembly 6 are disposed sequentially inside the front shell 2. One side of the heat pipe assembly 5 is in contact with the main chip assembly 4 through a thermally conductive medium 7, and the other side is thermally connected to the fin assembly 6. A fan assembly 8 is disposed on the front shell 2 and located on one side of the fin assembly 6 for forced convection heat dissipation of the fin assembly 6.

[0022] In this embodiment, the bottom shell 1 can be made of die-cast aluminum alloy, which provides heat dissipation for the components on the back of the circuit board 3; the top shell 2 can be made of die-cast aluminum alloy, serving as the structural support and mounting base for the circuit board 3, and providing heat dissipation. In addition to the main chip assembly 4, there are other heat-generating chips on the circuit board 3, which can be heat-dissipating through heat dissipation protrusions designed on the top shell 2 and heat conduction through thermally conductive gel with high thermal conductivity; the circuit board 3 is disposed between the bottom shell 1 and the top shell 2, forming a stable multilayer structure.

[0023] The main chip assembly 4 provides the main computing power of the product and is also the component with the largest heat generation on the circuit board 3. The heat pipe assembly 5, fin assembly 6, and fan assembly 8 are respectively set in different positions within the heat dissipation device. The thermally conductive medium 7 can fill the tiny gap between the main chip assembly 4 and the heat pipe assembly 5 to reduce the contact thermal resistance. The heat generated by the main chip assembly 4 during operation can be transferred to the fin assembly 6 by the heat pipe assembly 5, forming a heat transfer path of main chip assembly 4 → heat pipe assembly 5 → shell 2 → fin assembly 6. This allows the heat of the circuit board 3 to be transferred efficiently through multiple paths at each stage. The high thermal conductivity of multiple different thermally conductive components diffuses the heat to the entire plane, eliminating local heat accumulation. At the same time, the fan assembly 8 also provides forced convection cooling for the fin assembly 6. The combination of active and passive cooling makes the overall heat conduction of the device more efficient.

[0024] In addition, the heat dissipation device also includes a connector assembly 16 and an antenna assembly 19, which can expand the product interface and increase product functions to achieve autonomous signal transmission and reception. This application combines active heat dissipation with passive heat dissipation to enable efficient heat transfer of the circuit board 3 through multiple paths. The high thermal conductivity of multiple different heat-conducting components diffuses the heat to the entire plane, eliminating local heat accumulation and making the overall heat conduction of the device more efficient.

[0025] like Figure 4 As shown, the heat pipe assembly 5 includes a first heat spreader 9 and a heat pipe group 10 disposed on the first heat spreader 9. The heat pipe group 10 is thermally connected to the fin assembly 6. The first heat spreader 9 is in contact with the high heat dissipation area of ​​the main chip assembly 4. The heat pipe group 10 includes multiple individually disposed heat pipes, which are arranged radially from the first heat spreader 9 to the surrounding area.

[0026] The main chip and DDR chip in the main chip assembly 4 have the highest heat dissipation and are located close together, making them prone to heat accumulation. This area represents the high heat dissipation region of the main chip assembly 4. The first heat dissipation plate 9 is thermally coupled to this high heat dissipation region. The first heat dissipation plate 9 is a copper heat dissipation plate, as copper has a high thermal conductivity. The copper heat dissipation plate covers the main chip assembly 4 and contacts the areas on the main chip assembly 4 prone to heat accumulation through a boss structure. See [link to relevant documentation]. Figure 3 and Figure 6 This allows the heat from the main high-heat-power components in the main chip assembly 4 to be quickly and evenly distributed and transferred to the heat pipe assembly 10.

[0027] The heat pipe assembly 10 is composed of multiple individual heat pipes 10, and the shape of the heat pipes is radially distributed from the first heat spreader 9 to the surrounding area. The heat pipe is a highly efficient two-phase heat transfer device, consisting of a sealed metal shell (usually copper), a capillary wick (sintered copper powder or metal wire mesh), and a working fluid (such as water or acetone). One end of the heat pipe is the evaporation end, and the other end is the condensation end. When one end of the heat pipe is heated, a temperature difference is formed between the two ends, and the liquid in the capillary wick begins to evaporate and vaporize. Under the action of the pressure difference, the vapor rushes to the other end of the heat pipe and releases heat in the process, condensing into liquid. Subsequently, these liquids flow back to the evaporation section along the porous material tube wall by capillary force, thus forming a cycle. It is this cycle that enables the heat pipe to efficiently transfer a large amount of heat from one end to the other end.

[0028] like Figure 5 As shown, the fin assembly 6 includes a fin group 11, a second heat spreader 12, and a fin group protective cover 13; the second heat spreader 12 is disposed on the face shell 2 and is thermally connected to the heat pipe group 10, the fin group 11 is disposed on the second heat spreader 12, and the fin group protective cover 13 is disposed on the outside of the fin group 11 and connected to the face shell 2.

[0029] The second heat spreader 12 is an aluminum heat spreader. As the supporting base for the heat pipe assembly 5 and the fin assembly 11, the aluminum heat spreader can conduct the heat of the heat pipe assembly 5 to the fin assembly 11. Due to the high thermal conductivity of its material, the heat of the shell 2 and the heat pipe assembly 5 can be quickly and evenly distributed and transferred to the fin assembly 11. The surface of the aluminum heat spreader is electroplated with a nickel coating to improve the thermal conductivity and solderability of the material. It is fixed to the shell 2, the heat pipe assembly 5 and the fin assembly 11 by solder paste.

[0030] The fin assembly 11 is made of multiple stamped fins fixed by riveting or welding. It is made of AL1100 and is formed into a three-dimensional structure by precision stamping of multiple 0.3mm thick aluminum alloy sheets. These fins are arranged in parallel at a 2.5mm spacing to form a dense heat dissipation array. They are fixed by a special riveting-brazing composite process, which ensures the continuity of heat conduction between the fins while maintaining the structural strength. At the same time, it achieves multiple times the heat dissipation area in a compact space.

[0031] The fins stamped on the fin assembly 11 form airflow channels, which can greatly increase the contact area with air. The airflow channels are directed towards the fan assembly 8, which can work with the fan assembly 8 to force convection and achieve rapid heat dissipation. The fin assembly protective cover 13 is installed on the faceplate 2 and covers the outside of the fin assembly 11. It can prevent foreign objects from damaging the fin assembly 11, and at the same time guide the cold air from the fan 15 through the fin assembly 11 to flow out, improve convection efficiency, and realize product heat dissipation.

[0032] The face shell 2 is a metal shell with an electroplated coating on its surface. The face shell 2 is fixed to the heat pipe assembly 10 and the second heat spreader 12 by welding.

[0033] The faceplate 2 is made of die-cast aluminum alloy ADC12 with a nickel-plated coating on its surface to improve the thermal conductivity and solderability of the material. It is soldered to the heat pipe assembly 5 with solder paste, so that the heat of the main chip assembly 4 can be quickly and evenly distributed and transferred, improving the thermal conductivity and heat dissipation capacity.

[0034] like Figure 7 As shown, the fan assembly 8 includes a fan protective cover 14 and at least one fan 15; the fan 15 is disposed on the face shell 2 and located on one side of the fin assembly 6, and the fan protective cover 14 is disposed on the face shell 2 and covers the outside of the fan 15.

[0035] The fan 15 is located on the side of the front shell 2. The fan 15 actively delivers cool air through the airflow channels on the fin assembly 11, achieving rapid heat dissipation. In this embodiment, the product adopts a dual-fan design, with the width of the two fans 15 arranged in parallel matching the width of the fin assembly 11. This design increases the airflow of the air-cooling system while ensuring that each fin on the fin assembly 11 is reached by the fan 15, maximizing the heat dissipation area of ​​the front shell 2 and the fin assembly 6, thus greatly improving heat dissipation efficiency. Furthermore, the mounting position of the fan 15 on the front shell 2 is designed with an opening 20, see [reference needed]. Figure 7 This allows some of the air from fan 15 to be blown directly into the product, further improving the product's heat dissipation efficiency.

[0036] The fan cover 14 is installed on the outside of the fan 15 to prevent foreign objects from damaging the fan 15. At the same time, it guides the cool air from the fan 15 through the fin assembly 6 to flow out, improving convection efficiency and realizing product heat dissipation.

[0037] The thermally conductive medium 7 is a thermally conductive gel, thermally conductive silicone grease, or thermally conductive phase change material.

[0038] The thermal conductive medium 7 can be a thermally conductive material with a high thermal conductivity, such as thermally conductive gel, thermally conductive grease, or thermally conductive phase change material. In this embodiment, thermally conductive gel is used. The thermally conductive gel fills the tiny gap between the top surface of the main chip assembly 4 and the shell 2, reducing contact thermal resistance and improving heat dissipation efficiency.

[0039] It also includes a connector assembly 16, on which a receiving cavity corresponding to the connector assembly 16 is opened. The connector assembly 16 is disposed on the main chip assembly 4 and housed in the receiving cavity.

[0040] The connector assembly 16 is mounted on the main chip assembly 4 and housed in the accommodating cavity. The accommodating cavity can separate the connector assembly 16 from the heat dissipation structure, making the structural design more reasonable. The connector assembly 16 can expand the product interface, thereby increasing the product functionality.

[0041] A connector bracket 17 is provided outside the accommodating cavity, and a shielding bracket 18 is provided inside the accommodating cavity. The shielding bracket 18 is connected to the connector assembly 16 and the main chip assembly 4 respectively for grounding connection.

[0042] The connector bracket 17 is made of galvanized steel plate. It is fixed on the housing 2 and encloses the cavity to form a cavity-enclosing structure, which can protect the internal components of the cavity from electromagnetic interference from the external environment. The shielding bracket 18 is installed between the main chip assembly 4 and the connector assembly 16, which can realize a good grounding connection of the circuit board 3, avoid the circuit board 3 from electromagnetic interference from the external environment, and improve product reliability.

[0043] At least one antenna assembly 19 is provided on the face shell 2 on the side opposite to the accommodating cavity for transmitting and receiving signals.

[0044] The antenna assembly 19 includes a plastic antenna bracket with an FPC antenna attached inside. It is fixed to the housing 2 to provide antenna fixation and protection. The antenna assembly 19 directly transmits and receives signals.

[0045] Example 2 This embodiment provides an in-vehicle host, including the heat dissipation device of Embodiment 1.

[0046] In this embodiment, the heat dissipation device can be applied to different vehicle-mounted hosts, extending the advantages of the heat dissipation device to the vehicle-mounted host, enabling the vehicle-mounted host to have stronger heat dissipation capabilities. The heat dissipation device has all the technical effects of Embodiment 1, which will not be repeated here.

[0047] This utility model discloses a heat dissipation device and a vehicle-mounted host. The functions of each module in each device in the embodiment can be found in the corresponding description in the above method. Through the combination and coordinated operation of multiple heat dissipation structures, it has the advantage of high heat dissipation efficiency.

[0048] In this specification, unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances. The terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include one or more of that feature.

[0049] In this invention, unless otherwise expressly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" of the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature. The terms "vertical," "horizontal," "left," "right," "above," "below," and similar expressions are for illustrative purposes only and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed or operated in a specific orientation, and therefore should not be construed as limiting the invention.

[0050] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any person skilled in the art can easily conceive of various variations or substitutions within the technical scope disclosed in this application, and these should all be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A heat dissipation device, comprising a bottom shell (1), a top shell (2), and a circuit board (3) disposed between the bottom shell (1) and the top shell (2), characterized in that: The circuit board (3) is provided with a main chip assembly (4); A heat pipe assembly (5) and a fin assembly (6) are sequentially arranged inside the shell (2). One side of the heat pipe assembly (5) is in contact with the main chip assembly (4) through a thermally conductive medium (7), and the other side is thermally connected to the fin assembly (6); and A fan assembly (8) is disposed on the faceplate (2) and located on one side of the fin assembly (6) for forced convection cooling of the fin assembly (6).

2. The heat dissipation device according to claim 1, characterized in that, The heat pipe assembly (5) includes a first heat spreader (9) and a heat pipe group (10) disposed on the first heat spreader (9), the heat pipe group (10) being thermally connected to the fin assembly (6); The first heat spreader (9) is in contact with the high heat dissipation area of ​​the main chip assembly (4), and the heat pipe group (10) includes multiple individually set heat pipes, which are arranged radially from the first heat spreader (9) to the surrounding area.

3. The heat dissipation device according to claim 2, characterized in that, The fin assembly (6) includes a fin group (11), a second heat spreader (12), and a fin group protective cover (13). The second heat spreader (12) is disposed on the shell (2) and is thermally connected to the heat pipe assembly (10). The fin assembly (11) is disposed on the second heat spreader (12). The fin assembly protective cover (13) is disposed on the outside of the fin assembly (11) and connected to the shell (2).

4. The heat dissipation device according to claim 3, characterized in that, The face shell (2) is a metal shell with an electroplated coating on its surface. The face shell (2) is fixed to the heat pipe assembly (10) and the second heat spreader (12) by welding.

5. The heat dissipation device according to claim 1, characterized in that, The fan assembly (8) includes a fan cover (14) and at least one fan (15); the fan (15) is disposed on the face shell (2) and located on one side of the fin assembly (6), and the fan cover (14) is disposed on the face shell (2) and covers the outside of the fan (15).

6. The heat dissipation device according to claim 1, characterized in that, The thermally conductive medium (7) is a thermally conductive gel, thermally conductive silicone grease, or thermally conductive phase change material.

7. The heat dissipation device according to claim 1, characterized in that, It also includes a connector assembly (16), on which a receiving cavity corresponding to the connector assembly (16) is opened. The connector assembly (16) is disposed on the main chip assembly (4) and housed in the receiving cavity.

8. The heat dissipation device according to claim 7, characterized in that, A connector bracket (17) is provided outside the accommodating cavity, and a shielding bracket (18) is provided inside the accommodating cavity. The shielding bracket (18) is connected to the connector assembly (16) and the main chip assembly (4) respectively for grounding connection.

9. The heat dissipation device according to claim 7, characterized in that, At least one antenna assembly (19) is provided on the face shell (2) on the side opposite to the accommodating cavity for transmitting and receiving signals.

10. A vehicle-mounted host, characterized in that, Includes the heat dissipation device as described in any one of claims 1-9.

Images