High-efficiency heat dissipation device and vehicle-mounted host

Abstract

The application provides an efficient heat dissipation device and a vehicle-mounted host, and relates to the technical scheme as follows: a bottom shell, a surface shell, and a circuit board arranged between the bottom shell and the surface shell, wherein a main chip module is arranged on the circuit board; a TEC module is arranged on one side of the surface shell facing the circuit board, and the cold end of the TEC module is in contact with the main chip module through a heat-conducting medium; a heat pipe module is arranged on the side of the surface shell away from the circuit board, and the hot end of the TEC module is in contact with the heat pipe module; a fin module is further arranged on the surface shell, the fin module is in thermal connection with the heat pipe module; and a fan module is arranged on one side of the fin module and is used for forcibly convection heat dissipation of the fin module; the multiple heat dissipation structures are combined and work cooperatively, and the application has the advantages of high heat dissipation efficiency.

Description

Technical Field

[0001] This application relates to the field of vehicle host accessory technology, and in particular to a high-efficiency heat dissipation device and a vehicle host. Background Technology

[0002] With the popularization of smart cockpits and advanced driver assistance functions, the power consumption of various acceleration chips in the vehicle host has risen rapidly. The peak power consumption has increased from the traditional 5-8W to 40-60W or even higher. The high temperature environment inside the vehicle combined with the small installation space makes heat dissipation significantly more difficult.

[0003] Existing technical solutions mainly use die-cast aluminum alloy as heat sinks, and rely on a single method such as natural heat dissipation, traditional air cooling, and water cooling to dissipate heat from the vehicle host chip. This method cannot quickly transfer heat to the heat sink, and it is easy to form heat accumulation, resulting in poor heat dissipation and low heat dissipation efficiency. Summary of the Invention

[0004] To address the shortcomings of existing technologies, this application provides a high-efficiency heat dissipation device and an in-vehicle host to solve the problems existing in related technologies. The technical solution is as follows: In a first aspect, embodiments of this application provide a high-efficiency heat dissipation device, comprising: a bottom shell, a front shell, and a circuit board disposed between the bottom shell and the front shell, wherein a main chip module is disposed on the circuit board; a TEC module is disposed on the side of the front shell facing the circuit board, the cold end of the TEC module being in contact with the main chip module through a heat-conducting medium; a heat pipe module is disposed on the side of the front shell away from the circuit board, the hot end of the TEC module being in contact with the heat pipe module; a fin module is also disposed on the front shell, the fin module being thermally connected to the heat pipe module; and a fan module is disposed on one side of the fin module for forced convection heat dissipation of the fin module.

[0005] The TEC module, heat pipe module, fin module, and fan module are sequentially arranged in different positions within the device. Through the heat transfer path of main chip module → TEC module, and front shell → heat pipe module → fin module, the heat of the circuit board is efficiently transferred through multiple paths at each stage. The high thermal conductivity of multiple heat-conducting modules diffuses the heat to the entire plane, eliminating local heat accumulation. At the same time, the fan module provides forced convection cooling to the fin module. The combination of active and passive cooling makes the overall heat conduction of the device more efficient.

[0006] In one embodiment, a first heat spreader is disposed between the main chip module and the cold end of the TEC module, and the first heat spreader is in contact with the high heat dissipation area of ​​the main chip module. The first heat spreader is a copper heat spreader. Copper has a high thermal conductivity. The copper heat spreader is in contact with the area on the main chip module where heat is prone to accumulate, which can quickly and evenly distribute the heat of the main high heat dissipation components in the main chip module to the cold end of the TEC module.

[0007] In one embodiment, the first heat spreader is bonded to the cold end of the TEC module using thermally conductive epoxy adhesive. Due to the high thermal conductivity of the thermally conductive epoxy adhesive, heat from the main high-heat-dissipation components within the main chip module can be quickly and evenly distributed and transferred to the TEC module.

[0008] In one embodiment, the housing is a metal housing with an electroplated coating on its surface. The housing is fixed to the heat pipe module by welding. The housing is made of die-cast aluminum alloy with a nickel-plated coating to improve its thermal conductivity and solderability. It is soldered to the heat pipe module with solder paste, allowing the heat from the main chip module to be quickly and evenly distributed and transferred, improving thermal conductivity and heat dissipation capacity.

[0009] In one embodiment, the heat pipe module includes multiple individually arranged heat pipes, which are arranged radially from the hot end of the TEC module. The heat pipe module is composed of multiple individual heat pipes, with one end of each heat pipe serving as an evaporator and the other as a condenser. Through the evaporation-condensation cycle effect, the heat pipes can efficiently transfer a large amount of heat from one end to the other, achieving a heat transfer effect on the TEC module.

[0010] In one embodiment, a second heat spreader is further included, the surface of which is provided with an electroplated coating. The second heat spreader is fixed to the front shell, the heat pipe module, and the fin module by welding. The second heat spreader is an aluminum heat spreader. Due to its high thermal conductivity, it can quickly and evenly distribute the heat from the front shell and the heat pipe module to the fin module. Its surface is electroplated with a nickel coating to improve the thermal conductivity and solderability of the material. It is fixed to the front shell, the heat pipe module, and the fin module by solder paste.

[0011] In one embodiment, the fin module includes a fin group disposed on the second heat spreader plate, the fin group having a placement groove, and the fan module being housed within the placement groove. The fin group is fixed by riveting or welding multiple stamped fins, and airflow channels are formed between the stamped fins, which can significantly increase the contact area with air, and work in conjunction with the fan for forced convection to quickly dissipate heat.

[0012] In one embodiment, the fan module includes a fan and a fan protective cover; the fan is disposed within the placement groove, and the fan protective cover is connected to the second heat spreader and covers the outside of the fan. The fan actively delivers cool air through the fin module, enabling rapid heat dissipation of the product; the fan protective cover, covering the outside of the fan, prevents foreign objects from damaging the fan, while guiding the cool air from the fan through the fin module to flow out, improving convection efficiency and achieving product heat dissipation.

[0013] In one embodiment, the thermally conductive medium is a thermally conductive gel, thermally conductive silicone grease, or a thermally conductive phase change material. The thermally conductive medium can be a thermally conductive material with a high thermal conductivity, such as a thermally conductive gel, thermally conductive silicone grease, or thermally conductive phase change material.

[0014] Secondly, embodiments of this application provide an in-vehicle host, including the aforementioned high-efficiency heat dissipation device.

[0015] The advantages or beneficial effects of the above technical solutions include at least the following: This application consists of multiple heat dissipation modules. Through the heat transfer path of main chip module → TEC module, and front shell → heat pipe module → fin module, the heat of the circuit board is efficiently transferred through multiple paths. The high thermal conductivity of multiple heat conduction modules diffuses the heat to the entire plane, eliminating local heat accumulation. At the same time, the fan module provides forced convection cooling to the fin module. The combination of active and passive heat dissipation makes the overall heat conduction of the device more efficient.

[0016] The above overview is for illustrative purposes only and is not intended to be limiting in any way. In addition to the illustrative aspects, embodiments, and features described above, further aspects, embodiments, and features of this application will become readily apparent from the accompanying drawings and the following detailed description. Attached Figure Description

[0017] In the accompanying drawings, unless otherwise specified, the same reference numerals throughout the various drawings denote the same or similar parts or elements. These drawings are not necessarily drawn to scale. It should be understood that these drawings depict only some embodiments disclosed in this application and should not be construed as limiting the scope of this application.

[0018] Figure 1 This is an overall schematic diagram of the high-efficiency heat dissipation device of this utility model; Figure 2 This is an exploded view of the high-efficiency heat dissipation device of this utility model; Figure 3 This is a plan view of the first heat spreader in this utility model; Figure 4 This is a cross-sectional schematic diagram of the TEC module in this utility model; Figure 5This is a schematic diagram of the installation of the heat pipe module in this utility model; Figure 6 This is a schematic diagram of the fin assembly in this utility model; Figure 7 This is a schematic diagram of the heat transfer of the high-efficiency heat dissipation device of this utility model.

[0019] In the diagram: 1. Bottom shell; 2. Top shell; 3. Circuit board; 4. Main chip module; 5. TEC module; 6. Thermal medium; 7. Heat pipe module; 8. Fin module; 9. Fan module; 10. First heat spreader; 11. Heat pipe; 12. Second heat spreader; 13. Fin assembly; 14. Placement groove; 15. Fan; 16. Fan protective cover; 17. Cold end of TEC module; 18. Hot end of TEC module. Detailed Implementation

[0020] In the following description, only certain exemplary embodiments are briefly described to make the objectives, features, and advantages of this invention more apparent. As those skilled in the art will recognize, the described embodiments can be modified in various ways without departing from the spirit or scope of this application. Therefore, the drawings and description are considered exemplary in nature and not restrictive.

[0021] The present invention will now be described in detail with reference to the accompanying drawings and embodiments.

[0022] Example 1 like Figures 1 to 7 As shown, this embodiment provides a high-efficiency heat dissipation device, including: a bottom shell 1, a front shell 2, and a circuit board 3 disposed between the bottom shell 1 and the front shell 2. A main chip module 4 is disposed on the circuit board 3. A TEC module 5 is disposed on the side of the front shell 2 facing the circuit board 3, and the cold end of the TEC module 5 is in contact with the main chip module 4 through a heat-conducting medium 6. A heat pipe module 7 is disposed on the side of the front shell 2 away from the circuit board 3, and the hot end of the TEC module 5 is in contact with the heat pipe module 7. A fin module 8 is also disposed on the front shell 2, and the fin module 8 is thermally connected to the heat pipe module 7. A fan module 9 is disposed on one side of the fin module 8 for forced convection heat dissipation of the fin module 8.

[0023] In this embodiment, the bottom shell 1 can be made of die-cast aluminum alloy, which provides heat dissipation for the components on the back of the circuit board 3; the front shell 2 can be made of die-cast aluminum alloy, serving as the structural support and mounting base for the circuit board 3, and providing heat dissipation. In addition to the main chip module 4, there are other heat-generating chips on the circuit board 3, which can be heat-dissipating through heat dissipation protrusions designed on the front shell 2 and heat conduction through thermally conductive gel with high thermal conductivity; the circuit board 3 is set between the bottom shell 1 and the front shell 2, forming a stable multilayer structure.

[0024] The main chip module 4 provides the main computing power of the product and is also the module 5 with the largest heat generation on the circuit board 3. The TEC module 5 is an energy conversion module 5 that uses the Peltier effect of semiconductor materials to achieve cooling or heating. One side of it is the cold end, and the opposite side is the hot end. It is composed of several pairs of p and n type semiconductor thermocouples connected in series. When current passes through the thermocouple composed of the two semiconductor materials, the phenomenon of one end absorbing heat and the other end releasing heat can occur at the two ends of the thermocouple.

[0025] The TEC module 5 requires a highly efficient cooling system to dissipate heat evenly, quickly, and efficiently to ensure stable operation. The TEC module 5 has a hot end and a cold end. The cold end 17 of the TEC module is thermally coupled to the main chip module 4 through the thermally conductive medium 6, and the hot end 18 of the TEC module is thermally coupled to the heat pipe module 7, so that the heat generated by the main chip module 4 during operation can be transferred to the heat pipe module 7 through the TEC module 5. The heat pipe module 7 is thermally coupled to the fin module 8, so that the heat collected by the heat pipe module 7 can be transferred to the fin module 8, forming a heat transfer path of main chip module 4 → TEC module 5, and shell 2 → heat pipe module 7 → fin module 8, achieving a passive cooling effect. The fan module 9 is set on the fin module 8, and can perform forced convection cooling on the fin module 8 during operation, achieving an active cooling effect.

[0026] This application combines active and passive heat dissipation to efficiently transfer heat from the circuit board 3 through multiple paths. The high thermal conductivity of multiple different heat-conducting modules 5 diffuses the heat to the entire plane, eliminating local heat accumulation and making the overall heat conduction of the device more efficient.

[0027] A first heat spreader 10 is provided between the cold end of the main chip module 4 and the TEC module 5, and the first heat spreader 10 is in contact with the high heat dissipation area of ​​the main chip module 4.

[0028] The main chip and DDR chip in the main chip module 4 have the highest heat dissipation and are located close to each other, making them prone to heat accumulation. This area is the high heat dissipation area of ​​the main chip module 4. The first heat dissipation plate 10 is thermally coupled to the high heat dissipation area and is located between the main chip module 4 and the cold end of the TEC module 5. The first heat dissipation plate 10 is a copper heat dissipation plate, which can be made of die-cast aluminum alloy Cu1100, which has a high thermal conductivity. The copper heat dissipation plate is in contact with the area on the main chip module 4 that is prone to heat accumulation, which can quickly and evenly distribute the heat of the main high heat dissipation components in the main chip module 4 to the cold end of the TEC module 5.

[0029] The first heat spreader 10 is bonded to the cold end of the TEC module 5 with thermally conductive epoxy adhesive.

[0030] The first heat spreader 10 and the TEC module 5 are bonded together with thermally conductive epoxy adhesive. Due to the high thermal conductivity of the thermally conductive epoxy adhesive, the heat of the main high heat dissipation components in the main chip module 4 can be quickly and evenly distributed and transferred to the TEC module 5, which facilitates the heat transfer to the first heat spreader 10.

[0031] The face shell 2 is a metal shell with an electroplated coating on its surface. The face shell 2 is fixed to the heat pipe module 7 by welding.

[0032] The faceplate 2 is made of die-cast aluminum alloy ADC12 with a nickel-plated coating on its surface to improve the thermal conductivity and solderability of the material. It is soldered to the heat pipe module 7 with solder paste, so that the heat of the main chip module 4 can be quickly and evenly distributed and transferred, improving the thermal conductivity and heat dissipation capacity.

[0033] The heat pipe module 7 includes multiple individually installed heat pipes 11, which are arranged radially from the hot end of the TEC module 5.

[0034] The heat pipe module 7 consists of multiple individual heat pipes 11, which are arranged radially from the TEC module 5. The heat pipe 11 is a highly efficient two-phase heat transfer device, consisting of a sealed metal shell (usually copper), a capillary wick (sintered copper powder or metal mesh), and a working fluid (such as water or acetone). One end of the heat pipe 11 is the evaporation end, and the other end is the condensation end. When one end of the heat pipe 11 is heated, a temperature difference is formed between the two ends, and the liquid in the capillary wick begins to evaporate and vaporize. Under the action of the pressure difference, the vapor rushes to the other end of the heat pipe 11, releasing heat in the process and condensing into liquid. Subsequently, these liquids flow back to the evaporation section along the porous material tube wall by capillary force, thus forming a cycle. It is this cycle that enables the heat pipe 11 to efficiently transfer a large amount of heat from one end to the other.

[0035] It also includes a second heat spreader 12, the surface of which is provided with an electroplated coating. The second heat spreader 12 is fixed to the front shell 2, the heat pipe module 7 and the fin module 8 by welding.

[0036] The second heat spreader 12 is an aluminum heat spreader. As the supporting base for the heat pipe module 7 and the fin module 8, the aluminum heat spreader can conduct heat from the heat pipe module 7 to the fin module 8. Due to the high thermal conductivity of its material, the heat from the shell 2 and the heat pipe module 7 can be quickly and evenly distributed and transferred to the fin module 8. The surface of the aluminum heat spreader is electroplated with a nickel coating to improve the thermal conductivity and solderability of the material. It is fixed to the shell 2, the heat pipe module 7 and the fin module 8 by solder paste.

[0037] The fin module 8 includes a fin group 13 disposed on the second heat spreader 12, and a placement groove 14 is provided on the fin group 13, and the fan module 9 is housed in the placement groove 14.

[0038] After the heat is evenly diffused to the entire plane of the second heat spreader 12, sufficient heat dissipation fins are needed to provide air contact area. Combined with the fan 15, forced convection and rapid heat dissipation are achieved. Traditional heat sinks cannot be formed with a sufficient area due to process limitations.

[0039] In this application, the fin group 13 is disposed on the second heat sink 12. Its material is AL1100, which is formed into a three-dimensional structure by precision stamping of multiple 0.3mm thick aluminum alloy sheets. These fins are arranged in parallel at a 1.5mm spacing to form a dense heat dissipation array. They are fixed by a special riveting-brazing composite process, which ensures the continuity of heat conduction between each fin while maintaining the structural strength. At the same time, it achieves multiple times the heat dissipation area in a compact space.

[0040] The fan module 9 is housed in the placement groove 14 opened in the fin assembly 13, which reduces the space occupied by the fan module 9. When the fan module 9 is running, the airflow passes evenly along the specific flow channels between the fins. The fin surface effectively enhances the airflow disturbance and heat exchange efficiency, providing stable and reliable heat dissipation performance, meeting the needs of automotive electronic devices for efficient heat dissipation in a compact space, and solving the pain point of insufficient heat dissipation area of ​​traditional heat dissipation solutions in the automotive environment.

[0041] The fan module 9 includes a fan 15 and a fan protective cover 16; the fan 15 is disposed in the placement groove 14, and the fan protective cover 16 is connected to the second heat dissipation plate 12 and covers the outside of the fan 15.

[0042] The fan 15 is placed in the placement groove 14 of the fin assembly 13. The fan 15 actively delivers cold air through the fin assembly 13, which can realize the rapid heat dissipation of the product. The fan protective cover 16 is placed on the outside of the fan 15 to prevent foreign objects from damaging the fan 15. At the same time, it guides the cold air from the fan 15 through the fin module 8 to flow out, improves the convection efficiency, and realizes the heat dissipation of the product.

[0043] The thermally conductive medium 6 is a thermally conductive gel, thermally conductive silicone grease, or thermally conductive phase change material.

[0044] The thermal conductive medium 6 can be a thermally conductive material with a high thermal conductivity, such as thermally conductive gel, thermally conductive grease, or thermally conductive phase change material. In this embodiment, thermally conductive gel is used. The thermally conductive gel fills the tiny gaps between the top surface of the main chip module 4 and the shell 2 and TEC module 5 to reduce contact thermal resistance and improve heat dissipation efficiency.

[0045] Example 2 This embodiment provides an in-vehicle host, including a high-efficiency heat dissipation device.

[0046] In this embodiment, the high-efficiency heat dissipation device can be applied to different vehicle-mounted hosts, extending the advantages of the high-efficiency heat dissipation device to the vehicle-mounted host, enabling the vehicle-mounted host to have stronger heat dissipation capabilities. The high-efficiency heat dissipation device has all the technical effects of Embodiment 1, which will not be repeated here.

[0047] This utility model discloses a high-efficiency heat dissipation device and a vehicle-mounted host. The functions of each module in each device in the embodiment can be found in the corresponding description in the above method. Through the combination and coordinated operation of multiple heat dissipation structures, it has the advantage of high heat dissipation efficiency.

[0048] In this specification, unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances. The terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include one or more of that feature.

[0049] In this invention, unless otherwise expressly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" of the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature. The terms "vertical," "horizontal," "left," "right," "above," "below," and similar expressions are for illustrative purposes only and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed or operated in a specific orientation, and therefore should not be construed as limiting the invention.

[0050] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any person skilled in the art can easily conceive of various variations or substitutions within the technical scope disclosed in this application, and these should all be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A high-efficiency heat dissipation device, comprising a bottom shell (1), a front shell (2), and a circuit board (3) disposed between the bottom shell (1) and the front shell (2), characterized in that: The circuit board (3) is provided with a main chip module (4); A TEC module (5) is provided on the side of the faceplate (2) facing the circuit board (3), and the cold end of the TEC module (5) is in contact with the main chip module (4) through a heat-conducting medium (6). A heat pipe module (7) is provided on the side of the face shell (2) facing away from the circuit board (3), and the hot end of the TEC module (5) is in contact with the heat pipe module (7); The face shell (2) is also provided with a fin module (8), which is thermally connected to the heat pipe module (7); as well as A fan module (9) is disposed on one side of the fin module (8) and is used to perform forced convection heat dissipation on the fin module (8).

2. The high-efficiency heat dissipation device according to claim 1, characterized in that, A first heat spreader (10) is provided between the main chip module (4) and the cold end of the TEC module (5), and the first heat spreader (10) is in contact with the high heat dissipation area of ​​the main chip module (4).

3. The high-efficiency heat dissipation device according to claim 2, characterized in that, The first heat spreader (10) is bonded to the cold end of the TEC module (5) by thermally conductive epoxy adhesive.

4. The high-efficiency heat dissipation device according to claim 1, characterized in that, The face shell (2) is a metal shell with an electroplated coating on its surface. The face shell (2) is fixed to the heat pipe module (7) by welding.

5. The high-efficiency heat dissipation device according to claim 1 or 4, characterized in that, The heat pipe module (7) includes multiple individually arranged heat pipes (11), which are arranged radially from the hot end of the TEC module (5) to the surrounding area.

6. The high-efficiency heat dissipation device according to claim 1, characterized in that, It also includes a second heat spreader (12), the surface of which is provided with an electroplated coating. The second heat spreader (12) is fixed to the face shell (2), the heat pipe module (7) and the fin module (8) by welding.

7. The high-efficiency heat dissipation device according to claim 6, characterized in that, The fin module (8) includes a fin group (13) disposed on the second heat spreader (12), and a placement groove (14) is provided on the fin group (13), and the fan module (9) is housed in the placement groove (14).

8. The high-efficiency heat dissipation device according to claim 7, characterized in that, The fan module (9) includes a fan (15) and a fan cover (16); the fan (15) is disposed in the placement groove (14), and the fan cover (16) is connected to the second heat spreader (12) and covers the outside of the fan (15).

9. The high-efficiency heat dissipation device according to claim 1, characterized in that, The thermally conductive medium (6) is a thermally conductive gel, thermally conductive silicone grease, or thermally conductive phase change material.

10. A vehicle-mounted host, characterized in that, Includes the high-efficiency heat dissipation device as described in any one of claims 1-9.

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