Heat dissipation device and vehicle-mounted host

Abstract

The application provides a heat dissipation device and a vehicle-mounted host, and relates to the technical scheme points of the heat dissipation device, which comprises a bottom shell, a surface shell and a circuit board arranged between the bottom shell and the surface shell, and further comprises: a main chip module arranged on the circuit board; a fin module arranged on one side of the surface shell away from the bottom shell; an isothermal module, one side of which is in contact with the main chip module through a heat-conducting medium, and the other side of which is in contact with the fin module, the isothermal module being at least partially embedded in the surface shell; and a fan module arranged on one side of the fin module away from the isothermal module, used for forcibly conducting convection heat dissipation on the fin module; the multiple heat dissipation structures are combined and work cooperatively, and the application has the advantage of high heat dissipation efficiency.

Description

Technical Field

[0001] This application relates to the field of vehicle host accessories technology, and in particular to a heat dissipation device and a vehicle host. Background Technology

[0002] With the popularization of smart cockpits and advanced driver assistance functions, the power consumption of various acceleration chips in the vehicle host has risen rapidly. The peak power consumption has increased from the traditional 5-8W to 40-60W or even higher. The high temperature environment inside the vehicle combined with the small installation space makes heat dissipation significantly more difficult.

[0003] Existing technical solutions mainly use die-cast aluminum alloy as heat sinks, and rely on a single method such as natural heat dissipation, traditional air cooling, and water cooling to dissipate heat from the vehicle host chip. The heat generated by the chip cannot be quickly transferred to the heat sink, which easily leads to heat accumulation and poor heat dissipation, resulting in low heat dissipation efficiency. Utility Model Content

[0004] To address the shortcomings of existing technologies, this application provides a heat dissipation device and an in-vehicle host to solve the problems existing in related technologies. The technical solution is as follows: In a first aspect, embodiments of this application provide a heat dissipation device, including a bottom shell, a front shell, and a circuit board disposed between the bottom shell and the front shell, further including: a main chip module disposed on the circuit board; a fin module disposed on the side of the front shell facing away from the bottom shell; a heat spreader module, one side of which is in contact with the main chip module through a thermally conductive medium, and the other side of which is in contact with the fin module, the heat spreader module being at least partially embedded in the front shell; and a fan module disposed on the side of the fin module facing away from the heat spreader module, for forced convection heat dissipation of the fin module.

[0005] The fin module, heat spreader module, and fan module are sequentially arranged in different positions within the device. Through the heat transfer path of main chip module → heat spreader module → front shell → fin module, the heat of the circuit board is efficiently transferred through multiple paths at each stage. The high thermal conductivity of multiple heat-conducting modules diffuses the heat to the entire plane, eliminating local heat accumulation. At the same time, the fan module provides forced convection cooling to the fin module. The combination of active and passive cooling makes the overall heat conduction of the device more efficient.

[0006] In one embodiment, the temperature distribution module includes a first end face and a second end face disposed opposite to each other. The first end face is provided with a first heat-conducting protrusion protruding along the direction of the main chip module, and the second end face is provided with a second heat-conducting protrusion protruding along the direction of the fin module. The first heat-conducting protrusion contacts the high heat dissipation area of ​​the main chip module, and the second heat-conducting protrusion contacts the fin module.

[0007] The first end face and the second end face are located on opposite sides of the temperature equalization module. The first heat-conducting protrusion is set on the first end face and contacts the high heat dissipation area of ​​the main chip module. The second heat-conducting protrusion is set on the second end face and contacts the fin module. The heat generated by the main high heat dissipation components in the main chip module can be quickly and evenly distributed from the temperature equalization module to the fin module.

[0008] In one embodiment, the first thermally conductive protrusion is disposed in the middle of the first end face, and the second thermally conductive protrusion is disposed on opposite sides of the second end face. The first thermally conductive protrusion is located at the center of the first end face, and the second thermally conductive protrusions are located at dispersed positions on opposite sides of the second end face. The centrally located first thermally conductive protrusion and the second thermally conductive protrusions distributed on both sides allow heat to be dispersed from the center of the temperature equalization module to both sides during heat transfer, thereby enabling heat to be evenly distributed across the entire plane of the temperature equalization module to achieve a uniform heat distribution effect.

[0009] In one embodiment, the temperature equalization module has a sealed vacuum chamber filled with a working fluid. The inner wall of the vacuum chamber is covered with a capillary structure, which includes a copper powder sintered layer, a copper mesh, or microgrooves. The precise capillary structure covering the inner wall of the vacuum chamber drives the working fluid to circulate within the vacuum chamber under capillary action, achieving efficient two-dimensional heat diffusion using the phase change heat transfer principle and improving the overall efficiency of the heat dissipation system. The capillary structure can be a copper powder sintered layer, a copper mesh, or microgrooves, which, under capillary action, drive the circulation of the working fluid within the vacuum chamber.

[0010] In one embodiment, the housing has a receiving cavity, the heat spreader module is embedded and fixed in the receiving cavity, and the fin module is disposed on the outside of the receiving cavity. The heat spreader module is embedded in the receiving cavity of the housing and covers the entire inner surface of the housing as much as possible, which can achieve maximum thermal contact and heat diffusion, laying an efficient foundation for the subsequent heat dissipation of the fin module.

[0011] In one embodiment, the housing is a metal housing with an electroplated coating on its surface. The housing is fixed to the heat spreader module by welding. The housing is made of die-cast aluminum alloy with a nickel-plated coating to improve its thermal conductivity and solderability. It is soldered to the heat spreader module with solder paste, allowing the heat from the main chip module to be quickly and evenly distributed and transferred, improving thermal conductivity and heat dissipation capacity.

[0012] In one embodiment, the fin module includes a fin assembly with a placement groove on the fin assembly. The fan module is housed within the placement groove, and the fin assembly is thermally connected to the heat exchange module. The fin assembly is fixed by riveting or welding multiple stamped fins, and airflow channels are formed between the stamped fins, which can significantly increase the contact area with air, and work in conjunction with the fan for forced convection to quickly dissipate heat.

[0013] In one embodiment, the fan module includes a fan and a fan protective cover; the fan is disposed within the placement groove, and the fan protective cover is connected to the faceplate and covers the outside of the fan. The fan actively delivers cool air through the fin module, enabling rapid heat dissipation of the product; the fan protective cover, covering the outside of the fan, prevents foreign objects from damaging the fan, while guiding the cool air from the fan through the fin module to flow out, improving convection efficiency and achieving product heat dissipation.

[0014] In one embodiment, the thermally conductive medium is a thermally conductive gel, thermally conductive silicone grease, or a thermally conductive phase change material. The thermally conductive medium can be a thermally conductive material with a high thermal conductivity, such as a thermally conductive gel, thermally conductive silicone grease, or thermally conductive phase change material.

[0015] Secondly, embodiments of this application provide an in-vehicle host, including a heat dissipation device.

[0016] The advantages or beneficial effects of the above technical solutions include at least the following: This application consists of multiple heat dissipation modules. Through the heat transfer path of main chip module → heat distribution module → surface shell → fin module, the heat of the circuit board is efficiently transferred through multiple paths. The high thermal conductivity of multiple heat-conducting modules diffuses the heat to the entire plane, eliminating local heat accumulation. At the same time, the fan module provides forced convection cooling to the fin module. The combination of active and passive heat dissipation makes the overall heat conduction of the device more efficient.

[0017] The above overview is for illustrative purposes only and is not intended to be limiting in any way. In addition to the illustrative aspects, embodiments, and features described above, further aspects, embodiments, and features of this application will become readily apparent from the accompanying drawings and the following detailed description. Attached Figure Description

[0018] In the accompanying drawings, unless otherwise specified, the same reference numerals throughout the various drawings denote the same or similar parts or elements. These drawings are not necessarily drawn to scale. It should be understood that these drawings depict only some embodiments disclosed in this application and should not be construed as limiting the scope of this application.

[0019] Figure 1 This is an exploded view of the heat dissipation device of this utility model; Figure 2 This is a first schematic diagram of the temperature equalization module in this utility model; Figure 3 This is a second schematic diagram of the temperature equalization module in this utility model; Figure 4 This is a schematic diagram of the fin assembly in this utility model; Figure 5 This is a schematic diagram of the heat transfer of the heat dissipation device of this utility model.

[0020] In the diagram: 1. Bottom shell; 2. Top shell; 3. Circuit board; 4. Main chip module; 5. Fin module; 6. Heat spreader module; 7. Thermal conductive medium; 8. Fan module; 9. First end face; 10. Second end face; 11. First thermally conductive boss; 12. Second thermally conductive boss; 13. Fin assembly; 14. Placement groove; 15. Fan; 16. Fan protective cover. Detailed Implementation

[0021] In the following description, only certain exemplary embodiments are briefly described to make the objectives, features, and advantages of this invention more apparent. As those skilled in the art will recognize, the described embodiments can be modified in various ways without departing from the spirit or scope of this application. Therefore, the drawings and description are considered exemplary in nature and not restrictive.

[0022] The present invention will now be described in detail with reference to the accompanying drawings and embodiments.

[0023] Example 1 like Figure 1 As shown, this embodiment provides a heat dissipation device, including a bottom shell 1, a front shell 2, and a circuit board 3 disposed between the bottom shell 1 and the front shell 2. It also includes: a main chip module 4 disposed on the circuit board 3; a fin module 5 disposed on the side of the front shell 2 facing away from the bottom shell 1; a heat spreader module 6, one side of which contacts the main chip module 4 via a thermally conductive medium 7, and the other side of which contacts the fin module 5, the heat spreader module 6 being at least partially embedded in the front shell 2; and a fan module 8 disposed on the side of the fin module 5 facing away from the heat spreader module 6, used for forced convection heat dissipation of the fin module 5.

[0024] In this embodiment, the bottom shell 1 can be made of die-cast aluminum alloy, which provides heat dissipation for the components on the back of the circuit board 3; the front shell 2 can be made of die-cast aluminum alloy, serving as the structural support and mounting base for the circuit board 3, and providing heat dissipation. In addition to the main chip module 4, there are other heat-generating chips on the circuit board 3, which can be heat-dissipating through heat dissipation protrusions designed on the front shell 2 and heat conduction through thermally conductive gel with high thermal conductivity; the circuit board 3 is set between the bottom shell 1 and the front shell 2, forming a stable multilayer structure.

[0025] The main chip module 4 provides the product's main computing power and is also the module with the largest heat generation on the circuit board 3. The fin module 5, heat spreader module 6, and fan module 8 are sequentially arranged in different positions within the device. The heat spreader module 6 is mounted on the front shell 2, with its two ends contacting the main chip module 4 and the fin module 5, respectively. The thermally conductive medium 7 fills the tiny gap between the main chip module 4 and the heat spreader module 6 to reduce contact thermal resistance. The heat generated by the main chip module 4 can be transferred from the heat spreader module 6 to the fin module 5, forming a heat transfer path of main chip module 4 → heat spreader module 6 → front shell 2 → fin module 5. (See [reference]). Figure 5 This allows the heat from the circuit board 3 to be transferred efficiently through multiple paths, and the heat is diffused to the entire plane through the high thermal conductivity of multiple different heat-conducting modules, eliminating local heat accumulation. At the same time, the fan module 8 also provides forced convection cooling to the fin module 5. The combination of active and passive heat dissipation makes the overall heat conduction of the device more efficient.

[0026] This application combines active and passive heat dissipation to efficiently transfer heat from the circuit board 3 through multiple paths. The high thermal conductivity of multiple different heat-conducting modules diffuses the heat to the entire plane, eliminating local heat accumulation and making the overall heat conduction of the device more efficient.

[0027] like Figure 2 and Figure 3 As shown, the temperature equalization module 6 includes a first end face 9 and a second end face 10 disposed opposite to each other. The first end face 9 is provided with a first heat-conducting protrusion 11 protruding along the direction of the main chip module 4, and the second end face 10 is provided with a second heat-conducting protrusion 12 protruding along the direction of the fin module 5. The first heat-conducting protrusion 11 is in contact with the high heat dissipation area of ​​the main chip module 4, and the second heat-conducting protrusion 12 is in contact with the fin module 5.

[0028] In this embodiment, the vapor chamber module 6 uses a VC vapor chamber plate (also known as a vacuum chamber vapor chamber plate). One side (evaporation zone) of the VC vapor chamber plate is in close contact with the main chip module 4, and the other side (condensation zone) is in contact with the fin module 5. When the main chip module 4 generates heat, the working fluid in the evaporation zone of the VC vapor chamber plate rapidly vaporizes and undergoes a phase change. Driven by the pressure difference in the cavity, the vapor instantly diffuses to the entire condensation zone. In the condensation zone, the vapor releases its latent heat and re-liquefies. It then returns to the evaporation zone through the powerful capillary pumping force generated by the sintered capillary structure inside the VC vapor chamber plate, forming an efficient heat transfer cycle.

[0029] The first end face 9 and the second end face 10 are located on opposite sides of the temperature equalization module 6. The first heat-conducting protrusion 11 is disposed on the first end face 9 and contacts the high heat dissipation area of ​​the main chip module 4. The second heat-conducting protrusion 12 is disposed on the second end face 10 and contacts the fin module 5. The heat generated by the main high heat dissipation components in the main chip module 4 can be quickly and evenly distributed from the temperature equalization module 6 to the fin module 5.

[0030] The first heat-conducting protrusion 11 is disposed in the middle of the first end face 9, and the second heat-conducting protrusion 12 is disposed on opposite sides of the second end face 10.

[0031] See Figure 2 and Figure 3 The first heat-conducting protrusion 11 is located at the center of the first end face 9, and the second heat-conducting protrusion 12 is located at the opposite sides of the second end face 10. Since the heat generated by the main chip module 4 is transported to the temperature equalization module 6 by the first heat-conducting protrusion 11 and then to the fin module 5 by the second heat-conducting protrusion 12, the centrally arranged first heat-conducting protrusion 11 and the second heat-conducting protrusion 12 distributed on both sides can disperse the heat from the center of the temperature equalization module 6 to both sides during heat transfer, so that the heat can be evenly distributed on the entire plane of the temperature equalization module 6 to achieve a uniform heat distribution effect.

[0032] The temperature equalization module 6 has a sealed vacuum cavity inside, which is filled with working fluid. The inner wall of the vacuum cavity is covered with a capillary structure, which includes a copper powder sintered layer, a copper mesh, or microgrooves.

[0033] The heat spreader module 6 consists of upper and lower cover plates, forming a completely sealed vacuum chamber filled with a working fluid (such as degassed pure water). The inner wall of the vacuum chamber is covered with a precise capillary structure. These structures can drive the working fluid to circulate within the vacuum chamber under capillary action, achieving efficient two-dimensional planar heat diffusion using the phase change heat transfer principle, thus improving the overall efficiency of the heat dissipation system. The surface of the heat spreader module 6 is treated with copper anti-oxidation to improve the weldability of the material.

[0034] The capillary structure on the inner wall of the vacuum chamber can be made of copper powder sintered layer, copper mesh or microgroove. These structures can drive the working fluid in the vacuum chamber to circulate under the action of the capillary structure.

[0035] The shell 2 has a cavity, the temperature equalization module 6 is embedded and fixed in the cavity, and the fin module 5 is disposed on the outside of the cavity.

[0036] The upper end of the shell 2 has an inwardly recessed cavity. The shape of the heat dissipation module 6 can adopt a large-size planar layout, and its projected area can cover the entire inner surface of the cavity of the shell 2 as much as possible to achieve maximum thermal contact and heat diffusion, laying an efficient foundation for the heat dissipation of the subsequent fin module 5.

[0037] The face shell 2 is a metal shell with an electroplated coating on its surface. The face shell 2 is fixed to the temperature equalization module 6 by welding.

[0038] The faceplate 2 is made of die-cast aluminum alloy with a nickel-plated coating to improve its thermal conductivity and solderability. It is soldered with the heat spreader module 6 using solder paste, so that the faceplate 2 and the heat spreader module 6 together form a low thermal resistance, high strength integrated heat dissipation base. This allows the heat from the main chip module 4 to be quickly and evenly distributed and diffused to the entire faceplate 2, improving thermal conductivity and heat dissipation capacity, and laying an efficient foundation for the subsequent heat dissipation of the fin module 5.

[0039] like Figure 4 As shown, the fin module 5 includes a fin group 13, and a placement groove 14 is provided on the fin group 13. The fan module 8 is housed in the placement groove 14, and the fin group 13 is thermally connected to the temperature equalization module 6.

[0040] After the heat is evenly diffused to the entire plane of the shell 2, sufficient heat dissipation fins are needed to provide air contact area. Combined with the fan 15, forced convection and rapid heat dissipation are achieved. Traditional heat sinks cannot be formed with a sufficient area due to process limitations.

[0041] In this embodiment, the fin assembly 13 is disposed on the face shell 2. Its material is AL1100, which is formed into a three-dimensional structure by precision stamping of multiple 0.3mm thick aluminum alloy sheets. These fins are arranged in parallel at a 1.5mm spacing to form a dense heat dissipation array. They are fixed by a special riveting-brazing composite process, which ensures the continuity of heat conduction between each fin while maintaining the structural strength. At the same time, it achieves multiple times the heat dissipation area in a compact space.

[0042] The fan module 8 is housed in the placement groove 14 opened in the fin assembly 13, which reduces the space occupied by the fan module 8. When the fan module 8 is running, the airflow passes evenly along the specific flow channels between the fins. The fin surface effectively enhances the airflow disturbance and heat exchange efficiency, providing stable and reliable heat dissipation performance. This meets the needs of automotive electronic devices for efficient heat dissipation in a compact space and solves the pain point of insufficient heat dissipation area in the automotive environment of traditional heat dissipation solutions.

[0043] The fan module 8 includes a fan 15 and a fan protective cover 16; the fan 15 is disposed in the placement groove 14, and the fan protective cover 16 is connected to the face shell 2 and covers the outside of the fan 15.

[0044] The fan 15 is placed in the placement groove 14 of the fin assembly 13. The fan 15 actively delivers cold air through the fin assembly 13, which can realize the rapid heat dissipation of the product. The fan protective cover 16 is placed on the outside of the fan 15 to prevent foreign objects from damaging the fan 15. At the same time, it guides the cold air from the fan 15 through the fin module 5 to flow out, improves the convection efficiency, and realizes the heat dissipation of the product.

[0045] The thermally conductive medium 7 is a thermally conductive gel, thermally conductive silicone grease, or thermally conductive phase change material.

[0046] The thermal conductive medium 7 can be a thermally conductive material with a high thermal conductivity, such as thermally conductive gel, thermally conductive grease, or thermally conductive phase change material. In this embodiment, thermally conductive gel is used. The thermally conductive gel fills the tiny gaps between the top surface of the main chip module 4 and the shell 2 and the heat dissipation module, reducing contact thermal resistance and improving heat dissipation efficiency.

[0047] Example 2 This embodiment provides an in-vehicle host, including the heat dissipation device of Embodiment 1.

[0048] In this embodiment, the high-efficiency heat dissipation device can be applied to different vehicle-mounted hosts, extending the advantages of the high-efficiency heat dissipation device to the vehicle-mounted host, enabling the vehicle-mounted host to have stronger heat dissipation capabilities. The high-efficiency heat dissipation device has all the technical effects of Embodiment 1, which will not be repeated here.

[0049] This utility model discloses a heat dissipation device and a vehicle-mounted host. The functions of each module in each device in the embodiment can be found in the corresponding description in the above method. Through the combination and coordinated operation of multiple heat dissipation structures, it has the advantage of high heat dissipation efficiency.

[0050] In this specification, unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances. The terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include one or more of that feature.

[0051] In this invention, unless otherwise expressly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" of the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature. The terms "vertical," "horizontal," "left," "right," "above," "below," and similar expressions are for illustrative purposes only and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed or operated in a specific orientation, and therefore should not be construed as limiting the invention.

[0052] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any person skilled in the art can easily conceive of various variations or substitutions within the technical scope disclosed in this application, and these should all be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A heat dissipation device, comprising a bottom shell (1), a front shell (2), and a circuit board (3) disposed between the bottom shell (1) and the front shell (2), characterized in that, Also includes: The main chip module (4) is disposed on the circuit board (3); Fin module (5) is disposed on the side of the front shell (2) facing away from the bottom shell (1); The temperature equalization module (6) has one side in contact with the main chip module (4) through a thermally conductive medium (7) and the other side in contact with the fin module (5). The temperature equalization module (6) is at least partially embedded in the face shell (2). A fan module (8) is disposed on the side of the fin module (5) facing away from the heat exchange module (6) and is used to perform forced convection heat dissipation on the fin module (5).

2. The heat dissipation device according to claim 1, characterized in that, The temperature equalization module (6) includes a first end face (9) and a second end face (10) arranged opposite to each other. A first heat-conducting boss (11) is provided on the first end face (9) along the direction of the main chip module (4), and a second heat-conducting boss (12) is provided on the second end face (10) along the direction of the fin module (5). The first thermally conductive protrusion (11) is in contact with the high heat dissipation area of ​​the main chip module (4), and the second thermally conductive protrusion (12) is in contact with the fin module (5).

3. The heat dissipation device according to claim 2, characterized in that, The first heat-conducting boss (11) is located in the middle of the first end face (9), and the second heat-conducting boss (12) is located on opposite sides of the second end face (10).

4. The heat dissipation device according to claim 1, characterized in that, The temperature equalization module (6) has a sealed vacuum cavity inside, which is filled with working fluid. The inner wall of the vacuum cavity is covered with a capillary structure, which includes a copper powder sintered layer, a copper mesh, or microgrooves.

5. The heat dissipation device according to claim 1, characterized in that, The shell (2) has a cavity, the temperature equalization module (6) is embedded and fixed in the cavity, and the fin module (5) is disposed on the outside of the cavity.

6. The heat dissipation device according to claim 1 or 5, characterized in that, The face shell (2) is a metal shell with an electroplated coating on its surface. The face shell (2) is fixed to the temperature equalization module (6) by welding.

7. The heat dissipation device according to claim 1, characterized in that, The fin module (5) includes a fin group (13), and a placement groove (14) is provided on the fin group (13). The fan module (8) is housed in the placement groove (14), and the fin group (13) is thermally connected to the temperature equalization module (6).

8. The heat dissipation device according to claim 7, characterized in that, The fan module (8) includes a fan (15) and a fan cover (16); the fan (15) is disposed in the placement groove (14), and the fan cover (16) is connected to the face shell (2) and covers the outside of the fan (15).

9. The heat dissipation device according to claim 1, characterized in that, The thermally conductive medium (7) is a thermally conductive gel, thermally conductive silicone grease, or thermally conductive phase change material.

10. A vehicle-mounted host, characterized in that, Includes the heat dissipation device as described in any one of claims 1-9.

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