A turnover clamping mechanism and SMT chip mounter

CN224924100UActive Publication Date: 2026-10-30XIAN WENFENG ELECTRONIC TECH CO LTD
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Patent Information

Application Number
CN202521804873.8
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-08-25
Publication Date
2026-10-30
Estimated Expiration
2035-08-25

AI Technical Summary

Technical Problem

[0005]贴片机进行贴装动作时,会带动元器件移动,并与电路板接触;接触过程中,元器件与电路板之间存在挤压力(挤压力较小);由于常见的翻转夹持机构中,承接框架与移动框架转动连接,且贴装的元器件较多(即元器件与电路板之间的接触频率较高,速率较快),多次累积下,可能会带动承接框架转动,使得电路板的位置发生偏转,会影响贴片的精准度

Benefits of technology

[0015]与现有技术相比,本实用新型的有益效果是:通过滑动夹块与转轴之间的摩擦力以及挤压力,以增大转轴转动的阻力,从而确保承接框架的水平状态,以此避免贴片过程中,贴片模块与电路板高频率的贴片接触导致承接框架脱离水平状态而导致贴片精度降低。

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Abstract

The utility model relates to a kind of turnover clamping mechanisms, specifically a kind of turnover clamping mechanism and SMT chip mounter, including fixed frame;Still including mobile frame, the mobile frame is slidably installed on the fixed frame;Receiving frame;The receiving frame is fixedly installed with the rotationally connected pivot of the mobile frame;Still including clamping piece, including the clamping plate of rotationally installed in the receiving frame both ends and symmetrically arranged;The clamping plate can rotate;Turnover part, the turnover part can drive the receiving frame overturn;Still including locking piece, the locking piece is arranged on the mobile frame, including the sliding clamp block of the radial extrusion to the pivot;By the friction force between sliding clamp block and pivot and extrusion force, to increase the resistance of pivot rotation, to ensure the horizontal state of receiving frame, to avoid the process of chip, chip module and circuit board high-frequency chip contact lead to receiving frame from horizontal state and lead to the decrease of chip precision.
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Description

Technical Field

[0001] This utility model relates to a flipping clamping mechanism, specifically a flipping clamping mechanism and an SMT placement machine. Background Technology

[0002] SMT (Surface Mount Technology) placement machines are the core equipment in surface mount technology production lines. They are mainly used to quickly and accurately mount surface mount components (such as resistors, capacitors, and IC chips) onto designated pads on printed circuit boards (PCBs). They are key equipment in modern electronics manufacturing for achieving miniaturization, high density, and high reliability of electronic products, and are widely used in consumer electronics (mobile phones, tablets), communication equipment (5G base stations), automotive electronics, medical equipment, and other fields.

[0003] In SMT (Surface Mount Technology) production, single-sided and double-sided mounting are two mainstream PCB mounting methods, each suitable for different product requirements. Compared to single-sided mounting, double-sided mounting can more effectively improve the utilization of circuit board space. When using double-sided mounting, a flip-grip mechanism is often used to clamp and flip the circuit board.

[0004] Common flipping clamping mechanisms include a fixed frame and a movable frame. The movable frame is slidably mounted on the fixed frame. A receiving frame is rotatably mounted on the movable frame, and a clamping plate is provided on the receiving frame. The circuit board is clamped by the clamping plate and the receiving frame. At the same time, a rotating module is fixedly mounted on the rotating shaft of the receiving frame. The rotation of the rotating module drives the receiving frame to flip on the movable frame.

[0005] When a pick-and-place machine performs the placement operation, it moves the components and brings them into contact with the circuit board. During this contact process, there is a squeezing force between the components and the circuit board (the squeezing force is relatively small). Because in common flip-grip mechanisms, the receiving frame and the moving frame are rotatably connected, and there are many components being placed (i.e., the contact frequency between the components and the circuit board is high and the speed is fast), the cumulative effect of multiple placements may cause the receiving frame to rotate, resulting in a deviation in the position of the circuit board, which will affect the placement accuracy. Summary of the Invention

[0006] The purpose of this invention is to provide a flipping clamping mechanism and an SMT placement machine to solve the problems mentioned in the background art.

[0007] To achieve the above objectives, this utility model provides the following technical solution: A flipping clamping mechanism includes a fixed frame; It also includes a movable frame, which is slidably mounted on the fixed frame; A supporting frame; a rotating shaft that is rotatably connected to the movable frame is fixedly installed on the supporting frame; It also includes clamping components, including clamping plates rotatably mounted at both ends of the receiving frame and symmetrically arranged; the clamping plates are rotatable; A flipping component, which can cause the supporting frame to flip; It also includes a locking element disposed on the movable frame, which includes a sliding clamp that radially compresses the rotating shaft.

[0008] The flipping clamping mechanism as described above includes multiple sets of dual-head motors fixedly installed on both sides of the receiving frame and symmetrically arranged; a lead screw is fixedly installed on the output end of each of the dual-head motors, and a threaded sleeve is threadedly connected to the lead screw, the threaded sleeve slidingly engaging with the receiving frame; a connecting rod rotatably installed on the threaded sleeve and rotatably connected to the clamping plate.

[0009] The flip-grip mechanism described above has a slot for attaching the patch in the middle of the receiving frame.

[0010] The flipping clamping mechanism as described above: the flipping component includes a gear fixedly mounted on one end of the rotating shaft; a toothed block that can mesh with the gear is fixedly mounted on the fixed frame.

[0011] The flipping clamping mechanism as described above includes a locking member that is fixedly mounted on the movable frame and is rotatably connected to the rotating shaft. A sliding plate is slidably fitted onto the fixed clamping block, and the sliding clamping block is fixedly mounted on the sliding plate. A spring is provided on the fixed clamping block, and the two ends of the spring abut against the sliding plate and the fixed clamping block, respectively.

[0012] As described above, the flipping clamping mechanism has a large elastic coefficient of the spring and a large coefficient of friction on the surface where the sliding clamp block contacts the rotating shaft.

[0013] The flipping clamping mechanism described above includes a pressing block fixedly mounted on the fixed frame, which can press against the slide plate; and both sides of the pressing block are inclined.

[0014] An SMT placement machine, including a chassis; It also includes the flipping clamping mechanism described above; and the fixed frame is fixedly connected to the chassis.

[0015] Compared with the prior art, the beneficial effects of this utility model are: by increasing the friction and squeezing force between the sliding clamp and the rotating shaft, the resistance to the rotation of the rotating shaft is increased, thereby ensuring the horizontal state of the receiving frame. This avoids the high-frequency contact between the mounting module and the circuit board during the mounting process, which could cause the receiving frame to deviate from the horizontal state and reduce the mounting accuracy. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the flip-clamping mechanism and the SMT placement machine.

[0017] Figure 2 This is a schematic diagram of the flip-grip mechanism and the fixed frame in an SMT placement machine.

[0018] Figure 3 This is a schematic diagram of the flip-grip mechanism and the moving frame in an SMT placement machine.

[0019] Figure 4 This is a schematic diagram of the flip-clamping mechanism and the supporting frame in an SMT placement machine.

[0020] Figure 5 for Figure 4 A schematic diagram of the structure at point A in the middle.

[0021] Figure 6 This is a schematic diagram of the flip-grip mechanism and the clamping plate in an SMT placement machine.

[0022] In the diagram: 1. Chassis; 2. Fixed frame; 3. Mobile frame; 4. Supporting framework; 5. Clamping plate; 6. Dual-head motor; 7. Lead screw column; 8. Threaded sleeve; 9. Connecting rod; 10. Shaft; 11. Gear; 12. Tooth block; 13. Fixing clamp; 14. Spring; 15. Extruded blocks; 16. Skateboard; 1601. Sliding clamp. Detailed Implementation

[0023] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.

[0024] Please see Figures 1-6 As one embodiment of the present utility model, the flipping clamping mechanism includes a fixed frame 2; It also includes a movable frame 3, which is slidably mounted on the fixed frame 2; A supporting frame 4; a rotating shaft 10, which is rotatably connected to the movable frame 3, is fixedly installed on the supporting frame 4. It also includes clamping components, including clamping plates 5 that are rotatably mounted on both ends of the receiving frame 4 and symmetrically arranged; the clamping plates 5 are rotatable; A flipping component, which can cause the supporting frame 4 to flip; It also includes a locking element, which is disposed on the movable frame 3 and includes a sliding clamp 1601 that radially presses the rotating shaft 10.

[0025] In this embodiment, the fixed frame 2 is fixedly installed on the chassis 1 of the pick and place machine. The output end of the moving module of the pick and place machine is fixedly connected to the moving frame 3. When the moving module moves, it will drive the moving frame 3 to move back and forth along the length direction of the fixed frame 2. During the movement, the pick and place module of the pick and place machine will place the parts on the circuit board.

[0026] In the initial state, the movable frame 3 is located on one side of the fixed frame 2, and the clamping plate 5 is above the supporting frame 4. The supporting frame 4 is set horizontally, and the clamping plate 5 supports the frame 4 vertically.

[0027] After the circuit board is placed on the receiving frame 4, the clamping component will move, causing the clamping plate 5 to rotate so that the clamping plate 5 rotates closer to the receiving frame 4 (making the clamping plate 5 parallel to the receiving frame 4). Thus, the circuit board is clamped by the squeezing action of the receiving frame 4 and the clamping plate 5. The clamping component holds the circuit board on the receiving frame 4 to avoid displacement of the circuit board during placement, which would damage the placement accuracy. It also prevents the circuit board from separating from the receiving frame 4 when the flipping component moves, thus ensuring successful flipping.

[0028] During the movement of the moving module and the moving frame 3, and after the placement module completes the placement of components on one side of the circuit board, the flipping component will move, causing the receiving frame 4 to flip to allow placement on the other side. Once both sides of the circuit board have been placed, the clamping plate 5 will rotate in the opposite direction to release the circuit board. After the circuit board is released, the moving module will move the moving frame 3 in the opposite direction to reset it. During the reset process, the flipping component will cause the receiving frame 4 to flip in the opposite direction to reset, thus facilitating placement on the next set of circuit boards.

[0029] The locking element increases the resistance to the rotation of the shaft 10. Specifically, the radial compression of the shaft 10 by the sliding clamp 1601, along with the friction and compression between the sliding clamp 1601 and the shaft 10, increases the resistance to the rotation of the shaft 10, thereby ensuring the horizontal state of the receiving frame 4. This prevents the receiving frame 4 from deviating from its horizontal state due to the high-frequency contact between the placement module and the circuit board during the placement process, which would otherwise reduce the placement accuracy.

[0030] As a further embodiment of this utility model, the clamping component includes multiple sets of dual-head motors 6 fixedly installed on both sides of the receiving frame 4 and symmetrically arranged; a lead screw column 7 is fixedly installed on the output end of each of the two ends of the dual-head motor 6, and a threaded sleeve 8 is threadedly connected to the lead screw column 7, and the threaded sleeve 8 is slidably fitted with the receiving frame 4; a connecting rod 9 rotatably installed on the threaded sleeve 8 and rotatably connected to the clamping plate 5.

[0031] In this embodiment, after the circuit board is placed on the receiving frame 4, the dual-head motor 6 is started, thereby driving the lead screws 7 at both ends to rotate synchronously. The threads of the two sets of lead screws 7 are opposite, so the rotating lead screws 7 drive the threaded sleeves 8 to move closer to each other through the threaded engagement with the threaded sleeves 8, thereby driving the clamping plate 5 to rotate through the connecting rod 9, so that the clamping plate 5, which is perpendicular to the receiving frame 4, gradually becomes parallel to the receiving frame 4, so that the clamping action of the circuit board is achieved by the squeezing action of the clamping plate 5 and the receiving frame 4 on the circuit board.

[0032] The circuit board is clamped onto the receiving frame 4 by the clamping component to prevent the circuit board from shifting during placement, which would damage the placement accuracy. It also prevents the circuit board from separating from the receiving frame 4 when the flipping component is in motion, thus ensuring successful flipping.

[0033] As a further embodiment of this utility model, the receiving frame 4 has a slot for patching at the middle position.

[0034] In this embodiment, the slot exposes the component mounting area of ​​the circuit board (avoiding the clamping plate 5 or the supporting frame 4 from obstructing the mounting area), which facilitates the placement module to perform the component placement operation on the circuit board.

[0035] As a further embodiment of this utility model, the flipping component includes a gear 11 fixedly installed on one end of the rotating shaft 10; a tooth block 12 that can mesh with the gear 11 is fixedly installed on the fixing frame 2.

[0036] In this embodiment, during the movement of the moving module and the moving frame 3, the patch module performs the patching action. After one side of the circuit board is patched, the gear 11 will mesh with the tooth block 12. Through the meshing action of the gear 11 and the tooth block 12, the gear 11 can be rotated, thereby driving the rotating shaft 10 to rotate, so as to drive the receiving frame 4 to flip on the moving frame 3, so that the side of the circuit board that has been patched is flipped to face downward, while the side that has not been patched faces upward, so as to facilitate patching on the other side of the circuit board. Furthermore, when the receiving frame 4 is flipped, the gear 11 and the tooth block 12 disengage, thereby allowing the receiving frame 4 to return to a horizontal state.

[0037] As a further embodiment of this utility model, the locking member also includes a fixing block 13 fixedly installed on the movable frame 3, the fixing block 13 being rotatably connected to the rotating shaft 10; a sliding plate 16 is slidably fitted on the fixing block 13, the sliding block 1601 is fixedly installed on the sliding plate 16, and a spring 14 is provided on the fixing block 13, the two ends of the spring 14 respectively abutting against the sliding plate 16 and the fixing block 13.

[0038] In this embodiment, under the elastic force of the spring 14, the slide plate 16 approaches the rotating shaft 10, causing the sliding clamp 1601 to abut against the rotating shaft 10. At this time, the elastic force of the spring 14 will act on the sliding clamp 1601, causing the sliding clamp 1601 to radially compress the rotating shaft 10. This increases the resistance to the rotation of the rotating shaft 10 through the compressive force and friction, thereby ensuring the horizontal state of the receiving frame 4. This avoids the high-frequency contact between the placement module and the circuit board during the placement process, which could cause the receiving frame 4 to deviate from the horizontal state and reduce the placement accuracy.

[0039] As a further improvement of this utility model, the spring 14 has a large elastic coefficient, and the surface friction coefficient of the sliding clamp 1601 in contact with the rotating shaft 10 is large.

[0040] In this embodiment, the spring 14 has a large elastic coefficient, which results in a large radial compressive force of the sliding clamp 1601 on the rotating shaft 10. The surface friction coefficient of the sliding clamp 1601 and the rotating shaft 10 is also large, which results in a large frictional force between the sliding clamp 1601 and the rotating shaft 10. Thus, the resistance to the rotation of the rotating shaft 10 is increased by the compressive force and frictional force, thereby ensuring the horizontal state of the receiving frame 4. This avoids the high-frequency contact between the placement module and the circuit board during the placement process, which could cause the receiving frame 4 to deviate from the horizontal state and reduce the placement accuracy.

[0041] As a further embodiment of this utility model, the locking member also includes a pressing block 15 fixedly installed on the fixed frame 2, the pressing block 15 being able to press and cooperate with the slide plate 16; and both sides of the pressing block 15 are inclined.

[0042] In this embodiment, the moving frame 3 drives the sliding plate 16 to move synchronously during the movement of the fixed frame 2. Before the gear 11 and the toothed block 12 mesh, the sliding plate 16 will engage with the pressing block 15. Through the pressing action of the pressing block 15 on the sliding plate 16, the sliding plate 16 can be driven to slide upward on the fixed clamping block 13 (compressing the spring 14), thereby causing the sliding clamping block 1601 to separate from the rotating shaft 10, thereby reducing the resistance to the rotation of the rotating shaft 10 and improving the efficiency of the flipping action. During the meshing of the gear 11 and the toothed block 12, the sliding plate 16 and the pressing block 15 remain in an abutting state. After the flipping action is completed, the sliding plate 16 and the pressing block 15 disengage. At this time, under the elastic force of the spring 14, the sliding clamping block 1601 will re-engage with the rotating shaft 10, thereby limiting the rotation of the rotating shaft 10 to prevent the rotating shaft 10 from rotating.

[0043] The compression block 15 is inclined on both sides, which can reduce the resistance of the sliding plate 16.

[0044] An SMT placement machine includes a chassis 1; It also includes the flipping clamping mechanism as described above; and the fixed frame 2 is fixedly connected to the chassis 1.

[0045] The above embodiments are exemplary and not restrictive. Therefore, without departing from the spirit or basic characteristics of this utility model, any technical solutions that can be implemented in other specific forms are included in this utility model.

Claims

1. A flipping clamping mechanism, comprising a fixed frame (2); Its features are, It also includes a movable frame (3), which is slidably mounted on the fixed frame (2); A receiving frame (4); a rotating shaft (10) that is rotatably connected to the moving frame (3) is fixedly installed on the receiving frame (4). It also includes clamping components, including clamping plates (5) that are rotatably mounted on both ends of the receiving frame (4) and symmetrically arranged; the clamping plates (5) are rotatable; A flipping component, which can drive the supporting frame (4) to flip; It also includes a locking element disposed on the movable frame (3), which includes a sliding clamp (1601) that radially presses the rotating shaft (10).

2. The flipping clamping mechanism according to claim 1, characterized in that, The clamping component includes multiple sets of dual-head motors (6) fixedly installed on both sides of the receiving frame (4) and symmetrically arranged; a lead screw column (7) is fixedly installed on the output end of each of the two ends of the dual-head motor (6), and a threaded sleeve (8) is threadedly connected to the lead screw column (7), and the threaded sleeve (8) is slidably fitted with the receiving frame (4); a connecting rod (9) rotatably installed on the threaded sleeve (8) and rotatably connected to the clamping plate (5).

3. The flipping clamping mechanism according to claim 2, characterized in that, The receiving frame (4) has a slot for patching in the middle.

4. The flipping clamping mechanism according to claim 1, characterized in that, The flipping component includes a gear (11) fixedly mounted on one end of the rotating shaft (10); a toothed block (12) that can mesh with the gear (11) is fixedly mounted on the fixed frame (2).

5. The flipping clamping mechanism according to claim 1, characterized in that, The locking component also includes a fixed clamping block (13) fixedly installed on the movable frame (3), the fixed clamping block (13) being rotatably connected to the rotating shaft (10); a sliding plate (16) is slidably fitted on the fixed clamping block (13), the sliding clamping block (1601) is fixedly installed on the sliding plate (16), and a spring (14) is provided on the fixed clamping block (13), the two ends of the spring (14) respectively abutting against the sliding plate (16) and the fixed clamping block (13).

6. The flipping clamping mechanism according to claim 5, characterized in that, The spring (14) has a large elastic coefficient, and the surface friction coefficient between the sliding clamp (1601) and the rotating shaft (10) is large.

7. The flipping clamping mechanism according to claim 5, characterized in that, The locking component also includes a pressing block (15) fixedly installed on the fixed frame (2), the pressing block (15) can be pressed and engaged with the slide plate (16); and both sides of the pressing block (15) are inclined.

8. An SMT placement machine, comprising a chassis (1); Its features are, It also includes the flipping clamping mechanism as described in any one of claims 1-7; and the fixed frame (2) is fixedly connected to the chassis (1).