Silicon wafer manufacturing production line

Abstract

The application relates to a silicon wafer manufacturing production line. The silicon wafer manufacturing production line comprises a back film device, a conveying device, a printing device and a detection device. The back film device is used for coating a back surface of a silicon wafer; the conveying device is used for conveying the silicon wafer with completed back film to the printing device; the detection device is provided with a sensing head which is installed on the conveying device; the detection device is used for detecting appearance information of a front surface of the silicon wafer with completed back film, and an abnormal signal is sent when the appearance information is abnormal. The silicon wafer manufacturing production line provided by the application can intercept the silicon wafer and reduce silicon wafer waste.

Description

Technical Field

[0001] This application relates to the field of photovoltaic technology, specifically to a silicon wafer manufacturing production line. Background Technology

[0002] After the front film (coating on the front side of the silicon wafer) of the solar cell is completed, the back film and screen printing are performed sequentially. During back film coating, the silicon wafers are arranged in pairs, with the front sides of the two wafers facing each other and pressed together, while the back sides are set away from each other. Different pairs of wafers are stacked on different blades of a boat. In this way, the back film airflow passes through the gap between the two blades and the perforated areas on the blades, ensuring sufficient contact with the back sides of the two silicon wafers and completing the back film coating process. Because the front sides of the two silicon wafers are pressed together, it is difficult for the back film airflow to contact the front sides of the wafers, thus preventing back film airflow deposition on the front sides.

[0003] However, if a single silicon wafer falls off the boat blade, the front side of the remaining silicon wafers supported on the boat blade will be exposed, which will lead to back-film deposition of airflow on the front side during back-filming, and the wafer will need to be reworked.

[0004] Traditional silicon wafer manufacturing production lines cannot intercept silicon wafers that need to be reworked. If a silicon wafer that needs to be reworked flows to the next printing process and is printed, the wafer will no longer be able to be reworked and will be scrapped directly, resulting in waste of silicon wafers. Utility Model Content

[0005] Therefore, it is necessary to provide a silicon wafer manufacturing production line that can intercept silicon wafers and reduce silicon wafer waste in order to address the above problems.

[0006] A silicon wafer manufacturing production line includes a back-filming device, a conveying device, a printing device, and an inspection device. The back-filming device is used to deposit a film on the back side of the silicon wafer. The conveying device is used to convey the back-filmed silicon wafer to the printing device. The inspection device has a sensing head mounted on the conveying device. The inspection device is used to detect the appearance information of the front side of the back-filmed silicon wafer and to issue an abnormal signal when the appearance information is abnormal.

[0007] In some embodiments, the sensing head is a color sensor, and the detection device further includes an optical fiber and a connector port, wherein the color sensor is optically connected to the connector port via the optical fiber.

[0008] In some embodiments, the conveying device includes a mounting frame, a motor, a drive pulley, a driven pulley, a synchronous belt, a drive shaft, two drive pulleys, two driven pulleys, and two synchronous belts. The motor is mounted on the mounting bracket and is connected to the drive wheel. The driven wheel and the two drive wheels are all sleeved and fixed on the drive shaft. The synchronous belt is sleeved on the drive wheel and the driven wheel. The two drive wheels and the two driven wheels correspond one-to-one with the two synchronous belts. The two synchronous belts are spaced apart, and the synchronous belts are sleeved on the corresponding drive wheels and driven wheels.

[0009] In some embodiments, the two conveying drive wheels are distributed on opposite sides of the transmission driven wheel.

[0010] In some embodiments, the two conveyor belts are spaced apart and define a cutout, with the sensing head located in the cutout.

[0011] In some embodiments, the mounting frame includes a support base, two longitudinal beams and multiple crossbeams. The two longitudinal beams correspond one-to-one with the two synchronous conveyor belts. The longitudinal beams are at least partially fitted inside the corresponding synchronous conveyor belts. All the crossbeams are located within the hollowed-out portion and are spaced apart along the direction in which the silicon wafer is conveyed by the conveying device. All the crossbeams are connected between the two longitudinal beams, and at least one crossbeam is connected to the support base. The sensing head is hooked onto one of the longitudinal beams.

[0012] In some embodiments, at least one of the longitudinal beams includes a first part and a second part. The first part is sleeved inside the corresponding conveyor belt to support the corresponding conveyor belt. The second part is located inside the hollowed-out portion and has a hook groove. The sensing head is provided with a hook, and the hook is hooked into the hook groove of the longitudinal beam.

[0013] In some embodiments, the inner wall of the hook groove is covered with a cushioning element, and the hook is in elastic contact with the cushioning element.

[0014] In some embodiments, the silicon wafer manufacturing production line further includes a control device and an alarm device, the control device being electrically connected to the alarm device and the sensing head, and the control device being configured to control the alarm device to sound an alarm when the abnormal signal is received.

[0015] In some embodiments, the silicon wafer manufacturing production line further includes a control device electrically connected to the conveying device and the sensing head, and the control device is configured to control the conveying device to stop conveying the silicon wafer when the abnormal signal is received.

[0016] Compared with the prior art, this application has the following beneficial effects: In the aforementioned silicon wafer manufacturing production line, the back-filming device is used to coat the back of the silicon wafer after the front-filming is completed. The conveying device is used to transport the back-filmed silicon wafer to the printing device, which is used to perform screen printing on the back of the silicon wafer. The detection device has a sensing head mounted on the conveying device and is used to detect the appearance information of the front of the back-filmed silicon wafer during the conveying process. When the appearance information is abnormal, an abnormal signal is issued. In this way, the issued abnormal signal can trigger a prompt, allowing the staff to intercept silicon wafers with abnormal front appearance information, preventing them from flowing into the printing device for printing, thereby reducing the silicon wafer scrap rate and silicon wafer waste. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the overall structure of a silicon wafer manufacturing production line in one embodiment of this application; Figure 2 for Figure 1 The diagram shows the structure of the conveying device and the sensing head working together. Figure 3 for Figure 2 An enlarged schematic diagram of a portion of structure A after the conveying device and the sensing head are combined; Figure 4 for Figure 2 The diagram shows a structure with a hook on the sensor head.

[0018] Icon labels: 100. Silicon wafer manufacturing production line; 10. Backing film assembly; 30. Conveying device; 50. Detection device; 70. Printing device; 31. Mounting frame; 311. Support base; 312. Longitudinal beam; 3121. First part; 3122. Second part; 3123. Hook groove; 313. Crossbeam; 32. Motor; 33. Drive pulley; 34. Driven pulley; 35. Synchronous belt; 36. Drive shaft; 37. Driven pulley; 38. Driven pulley; 39. Synchronous belt; 41. Buffer component; 51. Sensor head; 52. Hook; B, hollowed-out section; X, first horizontal direction; Y, first horizontal direction. Detailed Implementation

[0019] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0020] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0021] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0022] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0023] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0024] It should be noted that when an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. When an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementation.

[0025] After the front film (coating on the front side of the silicon wafer) of the solar cell is completed, the back film and screen printing are performed sequentially. During back film coating, the silicon wafers are arranged in pairs, with the front sides of the two wafers facing each other and pressed together, while the back sides are set away from each other. Different pairs of wafers are stacked on different blades of a boat. In this way, the back film airflow passes through the gap between the two blades and the perforated areas on the blades, ensuring sufficient contact with the back sides of the two silicon wafers and completing the back film coating process. Because the front sides of the two silicon wafers are pressed together, it is difficult for the back film airflow to contact the front sides of the wafers, thus preventing back film airflow deposition on the front sides.

[0026] However, if a single silicon wafer falls off the boat blade, the front side of the remaining silicon wafers supported on the boat blade will be exposed, which will lead to back-film deposition of airflow on the front side during back-filming, and the wafer will need to be reworked.

[0027] Traditional silicon wafer manufacturing production lines cannot intercept silicon wafers that need to be reworked. If a silicon wafer that needs to be reworked flows to the next printing process and is printed, the wafer will no longer be able to be reworked and will be scrapped directly, resulting in waste of silicon wafers.

[0028] Please see Figures 1 to 4 In view of this, in order to alleviate the above problems, the applicant has conducted in-depth research and designed a silicon wafer manufacturing production line 100. The silicon wafer manufacturing production line 100 includes a back film device 10, a conveying device 30, a printing device 70, and a detection device 50. The back film device 10 is used to deposit a film on the back side of the silicon wafer. The conveying device 30 is used to convey the back-filmed silicon wafer to the printing device 70. The detection device 50 has a sensing head 51, which is mounted on the conveying device 30. The detection device 50 is used to detect the appearance information of the front side of the back-filmed silicon wafer and to issue an abnormal signal when the appearance information is abnormal.

[0029] The back film device 10 and the printing device 70 are conventional designs in the art, and therefore will not be described in detail here.

[0030] As an example, the detection device 50 can be a camera, a color sensing module, etc., and can be specifically configured according to requirements. Taking the detection device 50 as a camera as an example, the sensing head 51 is the camera lens; taking the detection device 50 as a color sensing module as an example, the sensing head 51 is a color sensor.

[0031] The back-film device 10 is used to deposit a film on the back side of the silicon wafer after the front film is completed. The conveying device 30 is used to convey the silicon wafer with the back film completed to the printing device 70. The printing device 70 is used to perform screen printing on the back side of the silicon wafer. The detection device 50 has a sensing head 51, which is mounted on the conveying device 30 and is used to detect the appearance information of the front side of the silicon wafer with the back film completed during the process of conveying the silicon wafer by the conveying device 30. When the appearance information is abnormal, an abnormal signal is issued. In this way, the issued abnormal signal can trigger a prompt, so that the staff can intercept the silicon wafer with abnormal front appearance information to prevent the silicon wafer with abnormal front appearance information from flowing into the printing device 70 for printing, thereby reducing the scrap rate of silicon wafers and reducing silicon wafer waste.

[0032] It is worth mentioning that during the back film and printing process, the back side of the silicon wafer faces upward and the front side faces downward.

[0033] In some embodiments, the sensing head 51 is a color sensor, and the detection device 50 further includes an optical fiber and a connector port, wherein the color sensor is optically connected to the connector port via the optical fiber.

[0034] The connector port transmits laser light to the color sensor via optical fiber. The laser light is output from the color sensor, hits the front side of the silicon wafer, and is reflected. The color sensor then receives the reflected laser light and generates an electrical signal. The laser light intensity reflected to the color sensor when the appearance information on the front side of the silicon wafer is normal differs from the laser light intensity reflected when the appearance information on the front side of the silicon wafer is abnormal, and / or, the color components reflected to the color sensor when the appearance information on the front side of the silicon wafer is normal differ from the color components reflected when the appearance information on the front side of the silicon wafer is abnormal. The color sensor generates a normal signal based on the normal laser light intensity and / or color components, and generates an abnormal signal based on the abnormal laser light intensity and / or color components.

[0035] By setting up a detection device 50 consisting of a color sensor, optical fiber, and connector port, the cost of the color sensor, optical fiber, and connector port is lower than that of setting up a camera, which helps to reduce the manufacturing cost of the silicon wafer manufacturing production line 100.

[0036] In some embodiments, the silicon wafer manufacturing production line 100 also includes an alarm device, with the sensing head 51 directly electrically connected to the alarm device. The alarm device sounds an alarm when it receives an abnormal signal to prompt the staff to intercept silicon wafers with abnormal appearance information on the front.

[0037] In some embodiments, the silicon wafer manufacturing production line 100 further includes a control device electrically connected to an alarm device and a sensing head 51, and the control device is configured to control the alarm device to sound an alarm when an abnormal signal is received.

[0038] In actual operation, the sensor head 51 will feed back the generated normal or abnormal signals to the control device. The control device will control the alarm device to turn off according to the received normal signal, and control the alarm device to turn on and sound an alarm according to the received abnormal signal, so as to improve the ability of staff to intercept silicon wafers with abnormal front appearance in a timely manner.

[0039] In some embodiments, the silicon wafer manufacturing production line 100 further includes a control device electrically connected to the conveying device 30 and the sensing head 51, and the control device is configured to control the conveying device 30 to stop conveying silicon wafers when an abnormal signal is received. In this way, even if the operator fails to intercept silicon wafers with abnormal front appearance in time, the silicon wafers will not be transferred to the printing device 70 for printing and thus be scrapped, thereby reducing the scrap rate of silicon wafers.

[0040] It is worth mentioning that, in embodiments with a control device, the control device is also used to control the operation of the back film device 10, the conveying device 30, the inspection device 50 and the printing device 70 to achieve automation of silicon wafer production.

[0041] Please see Figure 2 In some embodiments, the conveying device 30 includes a mounting frame 31, a motor 32, a drive pulley 33, a driven pulley 34, a synchronous belt 35, a drive shaft 36, two drive pulleys 37, two driven pulleys 38, and two synchronous belts 39. The motor 32 is mounted on the mounting frame 31 and is connected to the drive pulley 33. The driven pulley 34 and the two drive pulleys 37 are all sleeved and fixed on the drive shaft 36. The synchronous belt 35 is sleeved on the drive pulleys 33 and 34. The two drive pulleys 37 and 38 correspond one-to-one with the two synchronous belts 39. The two synchronous belts 39 are spaced apart and are sleeved on the corresponding drive pulleys 37 and 38.

[0042] Specifically, the synchronous conveyor belt 39 conveys the silicon wafer along the first horizontal direction X, and the two synchronous conveyor belts 39 are spaced apart along the first horizontal direction Y, which is perpendicular to the first horizontal direction X. The two synchronous conveyor belts 39 are used to jointly carry the same silicon wafer to improve the stability of silicon wafer conveying.

[0043] In actual operation, the power of motor 32 is sequentially transmitted to the conveying synchronous belt 39 through the drive pulley 33, the synchronous belt 35, the driven pulley 34, the drive shaft 36, and the conveying drive pulley 37, thereby realizing the conveying of silicon wafers.

[0044] By designing a motor 32, a drive pulley 33, a driven pulley 34, a synchronous belt 35, a drive shaft 36, two drive pulleys 37, two driven pulleys 38, and two synchronous belts 39 for power transmission, the power transmission is more stable, thus enabling smooth transport of silicon wafers. Furthermore, by utilizing the drive pulley 33, driven pulley 34, and synchronous belt 35, a single motor 32 can drive both synchronous belts 39, reducing the number of motors 32 required, resulting in a more compact structure and lower cost.

[0045] Furthermore, in some embodiments, the two driving conveyor wheels 37 are distributed on opposite sides of the driven conveyor wheel 34. In this way, the weight of the two driving conveyor wheels 37 can be evenly distributed on both sides of the driven conveyor wheel 34, so that the driven conveyor wheel 34 can smoothly drive the two driving conveyor wheels 37 to rotate via the drive shaft 36.

[0046] In some embodiments, two synchronous conveyor belts 39 are spaced apart and define a cutout portion B, with the sensing head 51 located in the cutout portion B.

[0047] Specifically, the two opposite ends of the silicon wafer are respectively attached to two synchronous conveyor belts 39, and the front side of the silicon wafer is exposed within the cutout portion B. Therefore, by placing the sensing head 51 within the cutout portion B, the sensing head 51 is not obstructed, thereby enabling accurate sensing of the appearance information of the front side of the silicon wafer and improving detection efficiency.

[0048] Furthermore, in some embodiments, the mounting frame 31 includes a support base 311, two longitudinal beams 312 and a plurality of crossbeams 313. The two longitudinal beams 312 correspond one-to-one with the two synchronous conveyor belts 39. The longitudinal beams 312 are at least partially fitted inside the corresponding synchronous conveyor belts 39. All crossbeams 313 are located in the hollowed-out portion B and are spaced apart along the direction of conveying silicon wafers by the conveying device 30. All crossbeams 313 are connected between the two longitudinal beams 312. At least one crossbeam 313 is connected to the support base 311. The sensing head 51 is hooked on one of the longitudinal beams 312.

[0049] Specifically, the support base 311 is installed on the floor of the workshop environment where the silicon wafer manufacturing production line 100 is located, and is used to support the crossbeams 313 and the longitudinal beams 312. The longitudinal beams 312 are used to support the corresponding synchronous conveyor belts 39 to prevent the synchronous conveyor belts 39 from collapsing due to pressure from the silicon wafers. The support base 311, the two longitudinal beams 312, the multiple crossbeams 313 and the synchronous conveyor belts 39 work together to form a stable structure for conveying silicon wafers.

[0050] The sensor head 51 is hooked onto a longitudinal beam 312, which improves the ease of installation of the sensor head 51 and makes it easy to replace if the sensor head 51 is damaged.

[0051] Please see Figures 2 to 4Furthermore, in some embodiments, at least one longitudinal beam 312 includes a first portion 3121 and a second portion 3122. The first portion 3121 is fitted inside the corresponding synchronous conveyor belt 39 to support the corresponding synchronous conveyor belt 39. The second portion 3122 is located inside the hollow portion B, and a hook groove 3123 is provided on the second portion 3122. A hook 52 is provided on the sensing head 51, and the hook 52 is hooked into the hook groove 3123 of the longitudinal beam 312. The hook groove 3123 improves the ease of hooking the sensing head 51. In addition, the groove wall of the hook groove 3123 can also limit the hook 52, reducing the risk of the sensing head 51 falling off.

[0052] In some embodiments, the inner wall of the hook groove 3123 is covered with a buffer 41, and the hook 52 is in elastic contact with the buffer 41.

[0053] As an example, the buffer 41 can be made of elastic materials such as rubber, silicone, or sponge.

[0054] During actual operation, the mounting frame 31 may vibrate due to the movement of the conveyor belt 39, resulting in a certain impact between the hook 52 and the longitudinal beam 312. With prolonged operation, this impact will be transmitted to the sensing head 51, causing damage to the sensing head 51.

[0055] In this application, by designing the hook 52 to make elastic contact with the buffer 41, the impact between the hook 52 and the longitudinal beam 312 can be reduced, which in turn helps to reduce the impact between the sensing head 51 and the longitudinal beam 312 and improves the service life of the sensing head 51.

[0056] The aforementioned silicon wafer manufacturing production line 100 includes a back-filming device 10 for depositing a film on the back of the silicon wafer after the front-filming is completed, a conveying device 30 for conveying the back-filmed silicon wafer to a printing device 70 for screen printing on the back of the silicon wafer, and a detection device 50 with a sensing head 51 mounted on the conveying device 30 for detecting the appearance information of the front of the back-filmed silicon wafer during the conveying process. The sensing head 51 issues an abnormal signal when the appearance information is abnormal, thus prompting workers to intercept silicon wafers with abnormal front-side appearance information to prevent them from flowing into the printing device 70 for printing, thereby reducing the silicon wafer scrap rate and waste.

[0057] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0058] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A silicon wafer manufacturing production line, characterized in that, The silicon wafer manufacturing production line includes a back film device (10), a conveying device (30), a printing device (70), and a detection device (50). The back film device (10) is used to deposit a film on the back side of the silicon wafer. The conveying device (30) is used to convey the back-filmed silicon wafer to the printing device (70). The detection device (50) has a sensing head (51) which is mounted on the conveying device (30). The detection device (50) is used to detect the appearance information of the front side of the back-filmed silicon wafer and to issue an abnormal signal when the appearance information is abnormal.

2. The silicon wafer manufacturing production line according to claim 1, characterized in that, The sensing head (51) is a color sensor, and the detection device (50) also includes an optical fiber and a connector port. The color sensor is optically connected to the connector port through the optical fiber.

3. The silicon wafer manufacturing production line according to claim 1, characterized in that, The conveying device (30) includes a mounting frame (31), a motor (32), a drive pulley (33), a driven pulley (34), a synchronous belt (35), a drive shaft (36), two drive pulleys (37), two driven pulleys (38), and two synchronous belts (39). The motor (32) is mounted on the mounting bracket (31) and is connected to the drive wheel (33). The driven wheel (34) and the two drive wheels (37) are all sleeved and fixed on the drive shaft (36). The synchronous belt (35) is sleeved on the drive wheel (33) and the driven wheel (34). The two drive wheels (37) and the two driven wheels (38) correspond one-to-one with the two synchronous belts (39). The two synchronous belts (39) are spaced apart, and the synchronous belts (39) are sleeved on the corresponding drive wheels (37) and driven wheels (38).

4. The silicon wafer manufacturing production line according to claim 3, characterized in that, The two conveying drive wheels (37) are distributed on opposite sides of the transmission driven wheel (34).

5. The silicon wafer manufacturing production line according to claim 3, characterized in that, Two conveyor belts (39) are spaced apart and define a cutout (B), and the sensing head (51) is located in the cutout (B).

6. The silicon wafer manufacturing production line according to claim 5, characterized in that, The mounting frame (31) includes a support base (311), two longitudinal beams (312) and multiple crossbeams (313). The two longitudinal beams (312) correspond one-to-one with the two conveyor belts (39). The longitudinal beams (312) are at least partially fitted inside the corresponding conveyor belts (39). All the crossbeams (313) are located inside the hollow part (B) and are spaced apart along the direction of the conveying device (30) conveying the silicon wafer. All the crossbeams (313) are connected between the two longitudinal beams (312). At least one crossbeam (313) is connected to the support base (311). The sensing head (51) is hooked on one of the longitudinal beams (312).

7. The silicon wafer manufacturing production line according to claim 6, characterized in that, At least one of the longitudinal beams (312) includes a first part (3121) and a second part (3122). The first part (3121) is fitted inside the corresponding conveyor belt (39) to support the corresponding conveyor belt (39). The second part (3122) is located inside the hollow part (B) and has a hook groove (3123). The sensing head (51) is provided with a hook (52) and the hook (52) is hooked into the hook groove (3123) of the longitudinal beam (312).

8. The silicon wafer manufacturing production line according to claim 7, characterized in that, The inner wall of the hook groove (3123) is covered with a buffer (41), and the hook (52) is in elastic contact with the buffer (41).

9. The silicon wafer manufacturing production line according to claim 1, characterized in that, The silicon wafer manufacturing production line also includes a control device and an alarm device. The control device is electrically connected to the alarm device and the sensing head (51), and the control device is configured to control the alarm device to sound an alarm when it receives the abnormal signal.

10. The silicon wafer manufacturing production line according to claim 1, characterized in that, The silicon wafer manufacturing production line also includes a control device electrically connected to the conveying device (30) and the sensing head (51), and the control device is configured to control the conveying device (30) to stop conveying the silicon wafer when the abnormal signal is received.

Images