Wet preparation device and solar cell manufacturing production line

Abstract

The application relates to a wet preparation device and a solar cell manufacturing production line. The wet preparation device comprises a wet preparation main body with a wet preparation tank, and a bubbling pipeline assembly arranged in the wet preparation tank, wherein the bubbling pipeline assembly comprises an air inlet pipe and a bubbling pipe, the air inlet pipe is communicated between an external air source and the bubbling pipe, the bubbling pipe is provided with a plurality of bubbling holes arranged along an axial direction of the bubbling pipe in sequence at intervals, and the bubbling pipe is provided with a first section, a second section and a third section gradually away from the air inlet pipe along the axial direction, the distance between every two adjacent bubbling holes in the first section is L1, the distance between every two adjacent bubbling holes in the second section is L2, the distance between every two adjacent bubbling holes in the third section is L3, and L1>L2>L3. The wet preparation device and the solar cell manufacturing production line provided in the application can reduce the defective pieces in silicon piece production.

Description

Technical Field

[0001] This application relates to the field of photovoltaic technology, specifically to a wet process preparation apparatus and a solar cell manufacturing production line. Background Technology

[0002] In the production of silicon wafers for solar cells, wet processing is required, including texturing, etching, and electroplating. The wet processing steps are primarily carried out in a wet processing tank. To ensure optimal wafer preparation, a bubble tube is typically used to introduce gas into the wet processing tank. This gas agitates the chemical solution, ensuring a more uniform concentration and allowing the solution to fully contact and react with the silicon wafer.

[0003] However, due to the inherent structure of the traditional bubbling tube, the gas bubbled into the liquid medicine cannot be fully and evenly stirred, which increases the risk of defective tablets formed by wet preparation. Utility Model Content

[0004] Therefore, it is necessary to provide a wet process preparation apparatus and a solar cell manufacturing production line that can reduce defective wafers in silicon wafer production, in order to address the above problems.

[0005] A wet preparation apparatus, the wet preparation apparatus comprising:

[0006] The wet preparation body contains a wet preparation tank.

[0007] A bubbling pipe assembly is disposed in the wet preparation tank, and the bubbling pipe assembly includes an air inlet pipe and a bubbling pipe. The air inlet pipe is connected between an external air source and the bubbling pipe. The bubbling pipe has a plurality of bubbling holes arranged sequentially at intervals along its axial direction, and a first section, a second section, and a third section that gradually move away from the air inlet pipe along its axial direction. The distance between any two adjacent bubbling holes in the first section is L1, the distance between any two adjacent bubbling holes in the second section is L2, and the distance between any two adjacent bubbling holes in the third section is L3, where L1 > L2 > L3.

[0008] In some embodiments, the distance between any two adjacent bubbling tubes gradually decreases along the axial direction of the bubbling tubes.

[0009] In some embodiments, 15mm≤L1≤30mm, and / or, 10mm≤L2≤20mm, and / or, 5mm≤L3≤15mm.

[0010] In some embodiments, 0.6L1≤L2≤0.8L1, and / or 0.5L1≤L3≤0.7L1.

[0011] In some embodiments, the length of the bubbling tube is L, where L1 = 1 / 4L, L2 = 2 / 4L, and L3 = 1 / 4L.

[0012] In some embodiments, the bubbling pipe assembly is disposed at the bottom of the wet preparation tank, and the bubbling holes are inclined toward the plane where the opening of the wet preparation tank is located.

[0013] In some embodiments, the angle between the central axis of the bubbling hole and the plane containing the opening of the wet preparation tank is an acute angle A, where 30°≤A≤60°.

[0014] In some embodiments, the bubbling tube is vertically connected to the air intake tube.

[0015] In some embodiments, the bubbling tubes are multiple and are distributed parallel to and at equal intervals along the axial direction of the air intake pipe.

[0016] A solar cell manufacturing production line includes a wet preparation apparatus as described in any of the above embodiments.

[0017] Compared with the prior art, this application has the following beneficial effects:

[0018] The aforementioned wet process fabrication apparatus and solar cell manufacturing production line, through a design where the spacing between adjacent bubble holes in the first section is smaller than that in the second section, and the spacing between adjacent bubble holes in the second section is smaller than that in the third section, compensates for the pressure loss along the gas flow path. This allows the gas to be uniformly output from the bubble holes in the first, second, and third sections. In this configuration, the gas flow rates from the first, second, and third sections are relatively similar, enabling the gas to enter the wet process tank uniformly along the axial direction of the bubble tube and thoroughly agitate the chemical solution. This ensures a more uniform concentration of the chemical solution and allows for sufficient contact and uniform reaction between the chemical solution and the silicon wafers, improving reaction efficiency and reducing defective wafers. Furthermore, because the pressure loss is minimal as the gas flows through the bubble tube, the gas is fully utilized for agitating the chemical solution, thereby improving gas utilization. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the wet preparation apparatus in one embodiment of this application.

[0020] Icon labels:

[0021] 100. Wet preparation apparatus;

[0022] 10. Wet preparation main body; 20. Bubbling pipe assembly;

[0023] 11. Wet preparation tank;

[0024] 21. Intake pipe; 22. Bubble tube; 221. First section; 222. Second section; 223. Third section. Detailed Implementation

[0025] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0026] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0027] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0028] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0029] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0030] It should be noted that when an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. When an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementation.

[0031] In the production of silicon wafers for solar cells, wet processing is required, including texturing, etching, and electroplating. The wet processing steps are primarily carried out in a wet processing tank. To ensure optimal wafer preparation, a bubble tube is typically used to introduce gas into the wet processing tank. This gas agitates the chemical solution, ensuring a more uniform concentration and allowing the solution to fully contact and react with the silicon wafer.

[0032] However, due to the inherent structure of the traditional bubbling tube, the gas bubbled into the liquid medicine cannot be fully and evenly stirred, which increases the risk of defective tablets formed by wet preparation.

[0033] Please see Figure 1 To alleviate the aforementioned problems, the applicant, after in-depth research, designed a wet preparation apparatus 100, which includes a wet preparation body 10 and a bubbling pipe assembly 20. The wet preparation body 10 has a wet preparation tank 11, and the bubbling pipe assembly 20 is disposed within the wet preparation tank 11. The bubbling pipe assembly 20 includes an air inlet pipe 21 and a bubbling pipe 22. The air inlet pipe 21 connects to an external air source and the bubbling pipe 22. The bubbling pipe 22 has a axial direction (e.g., along its axis) Figure 1 Multiple bubbling holes (as indicated by Y in the middle) are arranged at intervals in sequence, and the first section 221, the second section 222 and the third section 223 are gradually moved away from the intake pipe 21 along its axial direction. The distance between each two adjacent bubbling holes in the first section 221 is L1, the distance between each two adjacent bubbling holes in the second section 222 is L2, and the distance between each two adjacent bubbling holes in the third section 223 is L3, where L1 > L2 > L3.

[0034] The wet preparation tank 11 is used to provide preparation space for the wet preparation of silicon wafers. A basket is placed in the wet preparation tank 11, and multiple silicon wafers are contained in the basket and fully contacted with the liquid in the wet preparation tank 11 to achieve the wet preparation of silicon wafers.

[0035] As an example, the wet preparation tank 11 can be a circular tank, a square tank, an irregularly shaped tank, or other types of tanks, and the specific design can be determined according to requirements.

[0036] Specifically, the external gas source can be various gas sources such as air, nitrogen, and oxygen. The specific source can be set according to the requirements. It is only necessary to ensure that the gas input into the wet preparation tank 11 does not react with the silicon wafer and the chemical solution.

[0037] The bubbling pipe assembly 20 is used to introduce gas from an external gas source into the wet preparation tank 11 so that the gas can fully agitate the liquid, thereby allowing the chemical substances in the liquid to be distributed more evenly and the liquid to fully contact the silicon wafer.

[0038] The intake pipe 21 is a hollow pipe with one end open and the other end closed. One end of the intake pipe 21 is open and connected to an external air source. The pipe wall of the intake pipe 21 is provided with an opening that connects to the air inlet of the bubbling pipe 22.

[0039] As an example, the intake pipe 21 can be made of polyvinylidene fluoride (PVDF). The inner diameter of the intake pipe 21 is in the range of 20 mm to 50 mm.

[0040] The bubbling tube 22 is used to output the gas introduced into the air inlet tube 21 into the wet preparation tank 11.

[0041] Optionally, there may be one bubbling tube 22. Preferably, there may be multiple bubbling tubes 22, which are parallel to the axial direction of the intake pipe 21 and evenly spaced. To save costs, the number of bubbling tubes 22 can be designed to be 2 to 8. This is achieved by designing multiple bubbling tubes 22 along the axial direction of the intake pipe 21 (e.g., ...). Figure 1 The parallel and equally spaced distribution of the X-shaped components allows the gas to be uniformly output into the wet preparation tank 11, thereby more thoroughly stirring the solution and improving the uniformity of the wet preparation of silicon wafers.

[0042] As an example, the inner diameter of the bubbling tube 22 is in the range of 10 mm to 30 mm. The diameter of the bubbling hole is in the range of 0.5 mm to 2 mm.

[0043] As an example, the bubbling tube 22 is vertically connected to the air inlet pipe 21. Generally, for ease of molding, the wet preparation tank 11 is designed as a square tank. In this case, the vertical connection between the bubbling tube 22 and the air inlet pipe 21 makes the bubbling pipe assembly 20 formed by the bubbling tube 22 and the air inlet pipe 21 more square in shape, which is convenient for layout within the wet preparation tank 11.

[0044] In this embodiment, the air inlet pipe 21 can extend along the width direction of the wet preparation tank 11, and the bubbling pipe 22 can extend along the length direction of the wet preparation tank 11.

[0045] The bubbling tube 22 gradually moves away from the first section 221 and the second section 222 of the intake pipe 21 along its axial direction (the first section 221 and the second section 222 of the bubbling tube 22 are formed by...). Figure 1 The dashed line Z1 divides the section into two segments (the second segment 222 and the third segment 223 of the bubbling tube 22 are formed by the two segments). Figure 1 (Separated by the dashed line Z2), the first section 221, the second section 222 and the third section 223 each have multiple bubbling holes arranged sequentially along the axial direction of the bubbling tube 22. The air inlet pipe 21 inputs gas from an external air source into the bubbling tube 22. The gas is output into the liquid medicine through the bubbling holes on the first section 221, the second section 222 and the third section 223 of the bubbling tube 22 to agitate the liquid medicine.

[0046] In the axial direction of the bubbling tube 22, the first segment 221 is connected to and communicates with the intake pipe 21; the second segment 222 is positioned away from the intake pipe 21 relative to the first segment 221; and the third segment 223 is positioned away from the intake pipe 21 relative to the second segment 222. That is, the distance between the first segment 221, the second segment 222, and the third segment 223 and the bubbling tube 22 gradually increases along the axial direction. The distance between any two adjacent bubbling holes in the first segment 221 is L1, the distance between any two adjacent bubbling holes in the second segment 222 is L2, and the distance between any two adjacent bubbling holes in the third segment 223 is L3, where L1 > L2 > L3. In other words, the closer a segment of the bubbling tube 22 is to the intake pipe 21, the sparser the bubbling holes; and the farther a segment of the bubbling tube 22 is from the intake pipe 21, the denser the bubbling holes.

[0047] It can be understood that the distance between two adjacent bubbling holes is the minimum distance between the two adjacent bubbling holes in the axial direction of the bubbling tube 22. Taking a circular bubbling hole as an example, the distance between two adjacent bubbling holes is the distance between the two tangents of the two adjacent bubbling holes that are close to each other.

[0048] Due to pressure loss during the flow of gas in the bubbling tube 22, the gas flow rate and bubble density are high near the air inlet where the bubbling tube 22 is directly connected to the air inlet tube 21. However, the gas flow rate is high and the bubble density is high in the end area far from the air inlet due to pressure reduction, resulting in sparse bubbles or even no bubbles being generated. This creates an uneven distribution of gas with "dense near and sparse far".

[0049] In this application, by designing the bubbling tube 22 such that the spacing between any two adjacent bubbling holes in the first section 221 is smaller than that in the second section 222, and the spacing between any two adjacent bubbling holes in the second section 222 is smaller than that in the third section 223, the pressure loss along the flow path can be compensated, allowing the gas to be uniformly output from the bubbling holes of the first, second, and third sections 221 and 222 and 223. In this configuration, the gas flow rates from the first, second, and third sections 221 and 222 are relatively similar, enabling the gas to enter the wet preparation tank 11 uniformly along the axial direction of the bubbling tube 22 and thoroughly stir the chemical solution, ensuring a more uniform concentration of the chemical solution and allowing the chemical solution to fully contact and react uniformly with the silicon wafer, thus improving reaction efficiency and reducing defective wafers. Furthermore, because the pressure loss is small as the gas flows through the bubbling tube 22, the gas can be fully utilized for stirring the chemical solution, thereby improving gas utilization.

[0050] Practical testing shows that by designing the spacing between adjacent bubbling holes in the first segment 221 to be smaller than that in the second segment 222, and the spacing between adjacent bubbling holes in the second segment 222 to be smaller than that in the third segment 223, the coefficient of variation of bubble density throughout the bubbling tube 22 is reduced from 35%-45% in the traditional bubbling tube 22 to 8%-12%. This means that the uniformity of gas density distribution throughout the bubbling tube 22 is improved compared to the traditional bubbling tube 22. Under the same external gas source conditions, the gas mass transfer coefficient is increased by 20%-35%, and the processing time is shortened by 15%-25%, thereby improving the efficiency of wet processing. In addition, due to the improved gas utilization rate, the gas consumption per unit silicon wafer is reduced by 18%-28%.

[0051] In some embodiments, the distance between each two adjacent bubbling tubes 22 gradually decreases along the axial direction of the bubbling tube 22 to compensate for the pressure loss during the gas flow process in the bubbling tube 22, thereby achieving a uniform distribution of bubble density throughout the entire section of the bubbling tube 22.

[0052] As an example, along the axial direction of the bubbling tube 22 in the direction away from the intake tube 21, the spacing between adjacent bubbling holes varies in a gradient manner, which can be linearly decreasing or exponentially decreasing.

[0053] Of course, in this application, the design of the bubbling holes in the bubbling tube 22 is not limited to the one described above. In some other embodiments, the spacing between any two adjacent bubbling holes in the same segment of the bubbling tube 22 can be designed to be equal.

[0054] In some embodiments, 15mm ≤ L1 ≤ 30mm, and / or 10mm ≤ L2 ≤ 20mm, and / or 5mm ≤ L3 ≤ 15mm. Preferably, 15mm ≤ L1 ≤ 30mm, 10mm ≤ L2 ≤ 20mm, and 5mm ≤ L3 ≤ 15mm. Alternatively, 0.6L1 ≤ L2 ≤ 0.8L1, and / or 0.5L1 ≤ L3 ≤ 0.7L1, preferably 0.6L1 ≤ L2 ≤ 0.8L1 and 0.5L1 ≤ L3 ≤ 0.7L1.

[0055] In this way, bubble holes with appropriate spacing can be set on the bubble tube 22, reducing the manufacturing difficulty of the bubble tube 22, and also enabling the gas to be output to the wet preparation tank 11 more evenly.

[0056] In some embodiments, the length of the bubbling tube 22 is L, where L1 = 1 / 4L, L2 = 2 / 4L, and L3 = 1 / 4L. That is, the section from the air inlet of the bubbling tube 22 to 1 / 4L of the tube length is defined as the first segment 221, the section from 1 / 4L of the tube length to 3 / 4L of the tube length is defined as the second segment 222, and the section from 3 / 4L of the tube length to 4 / 4L of the tube length is defined as the third segment 223.

[0057] It is understandable that L = L1 + L2 + L3.

[0058] The density of the bubbling holes in the second section 222 is more moderate compared to that in the first section 221 and the third section 223. In this way, the gas can be output more evenly from the second section 222, and since the second section 222 occupies the longest length, the gas output from the second section 222 can evenly stir the liquid medicine in the wet preparation tank 11.

[0059] In some embodiments, the bubbling pipe assembly 20 is disposed at the bottom of the wet preparation tank 11, and the bubbling holes are inclined toward the plane where the opening of the wet preparation tank 11 is located (e.g., Figure 1 The bubble channel assembly 20 is located at the bottom of the wet preparation tank 11 (as indicated by plane B in the diagram). This reduces the obstruction of the bubble channel assembly 20 to the placement of silicon wafers and baskets, allowing for a larger space within the wet preparation tank 11 to accommodate the silicon wafers and baskets. Furthermore, the bubble holes are angled towards the plane containing the opening of the wet preparation tank 11. In this configuration, the bubble holes can release air and bubble upwards at an angle, effectively agitating the chemical solution from the bottom to the top of the wet preparation tank 11, resulting in a larger and more thorough agitation of the chemical solution.

[0060] As an example, the distance from the lowest point of the bubbling tube 22 to the bottom wall of the wet preparation tank 11 (e.g.) Figure 1 (The part H refers to) is in the range of 15mm to 30mm.

[0061] Furthermore, in some embodiments, the central axis of the bubbling hole (e.g.) Figure 1 The angle between the plane containing P (as indicated in the middle) and the plane containing the opening of the wet preparation tank 11 is an acute angle A, where 30° ≤ A ≤ 60°. Preferably, A is 45°.

[0062] With this design, bubbling is smoother, and upward bubbles are formed naturally, resulting in better bubbling performance under the same gas supply conditions.

[0063] This application also provides a solar cell manufacturing production line, which includes the wet preparation apparatus 100 as described in any of the above embodiments. The solar cell manufacturing production line of this application has the effects of any of the above embodiments, and therefore will not be described again here.

[0064] The aforementioned wet process preparation apparatus 100 and solar cell manufacturing production line, through design along the axial direction of the bubbling tube 22, ensures that the spacing between any two adjacent bubbling holes in the first section 221 is smaller than the spacing between any two adjacent bubbling holes in the second section 222, and the spacing between any two adjacent bubbling holes in the second section 222 is smaller than the spacing between any two adjacent bubbling holes in the third section 223. This design compensates for the pressure loss formed along the gas flow path, allowing the gas to be uniformly output from the bubbling holes of the first, second, and third sections 221 and 222 and 223. In this case, the gas flow rates output from the first, second, and third sections 221 and 222 and 223 are relatively close, enabling the gas to enter the wet process preparation tank 11 uniformly along the axial direction of the bubbling tube 22 and fully stir the chemical solution, ensuring a more uniform concentration of the chemical solution and allowing the chemical solution to fully contact and react uniformly with the silicon wafer, thereby improving reaction efficiency and reducing the number of defective silicon wafers produced. In addition, since the pressure loss of the gas is small as it flows through the bubble tube 22, the gas can be fully utilized to stir the liquid, thereby improving the gas utilization rate.

[0065] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0066] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A wet preparation apparatus, characterized in that, The wet preparation apparatus includes: The wet preparation body (10) contains a wet preparation tank (11); A bubbling pipe assembly (20) is disposed in the wet preparation tank (11), and the bubbling pipe assembly (20) includes an air inlet pipe (21) and a bubbling pipe (22). The air inlet pipe (21) is connected between an external air source and the bubbling pipe (22). The bubbling pipe (22) has a plurality of bubbling holes arranged sequentially along its axial direction, and a first section (221), a second section (222), and a third section (223) that gradually move away from the air inlet pipe (21) along its axial direction. The distance between each two adjacent bubbling holes in the first section (221) is L1, the distance between each two adjacent bubbling holes in the second section (222) is L2, and the distance between each two adjacent bubbling holes in the third section (223) is L3, where L1 > L2 > L3.

2. The wet preparation apparatus according to claim 1, characterized in that, Along the axial direction of the bubbling tube (22), the distance between each two adjacent bubbling tubes (22) gradually decreases.

3. The wet preparation apparatus according to claim 1, characterized in that, 15mm≤L1≤30mm, and / or, 10mm≤L2≤20mm, and / or, 5mm≤L3≤15mm.

4. The wet preparation apparatus according to claim 1, characterized in that, 0.6L1≤L2≤0.8L1, and / or 0.5L1≤L3≤0.7L1.

5. The wet preparation apparatus according to claim 1, characterized in that, The length of the bubbling tube (22) is L, L1 = 1 / 4L, L2 = 2 / 4L, L3 = 1 / 4L.

6. The wet preparation apparatus according to claim 1, characterized in that, The bubbling pipe assembly (20) is disposed at the bottom of the wet preparation tank (11), and the bubbling hole is inclined toward the plane where the opening of the wet preparation tank (11) is located.

7. The wet preparation apparatus according to claim 6, characterized in that, The angle between the central axis of the bubbling hole and the plane containing the opening of the wet preparation tank (11) is an acute angle A, where 30°≤A≤60°.

8. The wet preparation apparatus according to claim 1, characterized in that, The bubbling tube (22) is vertically connected to the air intake tube (21).

9. The wet preparation apparatus according to claim 1, characterized in that, The bubbling tubes (22) are multiple and are distributed parallel to and at equal intervals along the axial direction of the air intake tube (21).

10. A solar cell manufacturing production line, characterized in that, Includes the wet preparation apparatus as described in any one of claims 1 to 9 above.

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