An optoelectronic product packaging apparatus

Abstract

The utility model relates to the technical field of optoelectronic product, concretely relates to a kind of optoelectronic product packaging equipment;Including base, conveying belt, packaging assembly, multiple positioning seat and buffer collection component, buffer collection component includes collection frame, first sponge pad, fixed frame, movable frame, two slide bars, two buffer springs and receiving plate, collection frame is set to the top of base, first sponge pad is fixedly connected with collection frame, and is located in collection frame, fixed frame is fixedly connected with base, and is located the top of base, the both ends of each slide bar are fixedly connected with base and fixed frame respectively, movable frame is slidably connected with two slide bars, the both ends of each buffer spring are fixedly connected with base and movable frame respectively, and are respectively set in the outside of corresponding slide bar, receiving plate is fixedly connected with movable frame, and is located the top of movable frame, using above-mentioned mode, it is realized that the optoelectronic product after packaging can be conveniently collected, manpower and time are reduced, and it is easy to operate.

Description

Technical Field

[0001] This utility model relates to the field of optoelectronic product technology, and in particular to an optoelectronic product packaging device. Background Technology

[0002] Optoelectronic products refer to electronic products that use optical principles or fiber optic technology for information transmission, processing, storage, and transmission. With the development of information technology, optoelectronic products are widely used in fields such as communications, computers, consumer electronics, and automotive electronics. During the production of optoelectronic products, chips and optical devices need to be packaged. However, current packaging machines require manual placement of the optoelectronic products under the machine for packaging, followed by unloading, making continuous packaging difficult and reducing the packaging speed.

[0003] In existing technology patent CN220753375U, a packaging device for optoelectronic products is disclosed. Through the combination of two load-bearing support plates, drive rollers and servo motors, the conveyor belt and optoelectronic products can be moved. The grating sensor on the packaging support base can sense the movement of the optoelectronic products during transportation and quickly stop the movement of the optoelectronic products. Through the extension movement of the cylinder, and in conjunction with the connecting plate and the packaging plate, the packaging plate can quickly package the optoelectronic products inside the positioning seat, thereby achieving the effect of continuous packaging of optoelectronic products and improving the packaging speed of the packaging equipment for optoelectronic products.

[0004] In the existing method described above, after the optoelectronic products are packaged, they are transported by a conveyor belt. Workers pick up the packaged optoelectronic products from one side of the conveyor belt. Since the optoelectronic products are embedded in the positioning base, it is very inconvenient, time-consuming and labor-intensive to pick them up. Utility Model Content

[0005] The purpose of this utility model is to provide a packaging equipment for optoelectronic products, which solves the problem that in the past, workers would pick up the packaged optoelectronic products from one side of the conveyor belt. Since the optoelectronic products are embedded in the positioning seat, it is very inconvenient, time-consuming and labor-intensive to pick up the optoelectronic products.

[0006] To achieve the above objectives, this utility model employs an optoelectronic product packaging device, comprising a base, a conveyor belt, a packaging assembly, multiple positioning seats, and a buffer collection assembly. The conveyor belt is fixedly connected to the base and located above it. The packaging assembly is positioned above the conveyor belt. The multiple positioning seats are all fixedly connected to the conveyor belt and are evenly distributed on it. The buffer collection assembly includes a collection frame, a first sponge pad, a fixed frame, a movable frame, two slide rods, two buffer springs, and a receiving plate. The collection frame is positioned above the base. The first sponge pad is fixedly connected to the collection frame and located inside it. The fixed frame is fixedly connected to the base and located above it. Both ends of each slide rod are fixedly connected to the base and the fixed frame, respectively. Each movable frame is slidably connected to two slide rods. Both ends of each buffer spring are fixedly connected to the base and the movable frame, respectively, and are respectively sleeved on the outside of the corresponding slide rod. The receiving plate is fixedly connected to the movable frame and located above it.

[0007] The buffer collection component further includes a positioning frame, which is fixedly connected to the base and located above the base. The collection frame is adapted to the positioning frame.

[0008] The buffer collection assembly further includes a storage plate, which is movably connected to and extends through the collection frame. The storage plate has multiple receiving slots.

[0009] The buffer collection assembly includes multiple second sponge pads, and each of the receiving slots is fixedly disposed within a second sponge pad.

[0010] The packaging assembly includes a support base, a cylinder, a packaging plate, a detection plate, and a photoelectric sensor. The support base is fixedly connected to the conveyor belt and located above the conveyor belt. The cylinder is fixedly connected to the support base. The packaging plate is fixedly connected to the output end of the cylinder. The detection plate is fixedly connected to the support base and located on the outer side wall of the support base. The photoelectric sensor is fixedly disposed below the detection plate.

[0011] This utility model discloses a packaging device for optoelectronic products. In use, a conveyor belt moves the optoelectronic products, and the packaging assembly rapidly packages the products inside the positioning seat. When the packaged products move to the end of the conveyor belt, they fall onto the receiving plate. The receiving plate is pressed, causing the movable frame to slide on the slide rod and simultaneously compressing the buffer spring. The buffer spring's force dissipates energy and cushions the optoelectronic products. Due to the inclined design of the receiving plate, the optoelectronic products slide down into the collection frame for storage. This process is repeated to achieve continuous packaging and collection of optoelectronic products, reducing manual labor. This method facilitates the collection of packaged optoelectronic products, reduces manpower and time, and is easy to operate. Attached Figure Description

[0012] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0013] Figure 1 This is a structural schematic diagram of the optoelectronic product packaging equipment of this utility model.

[0014] Figure 2 This is a side view of the structure of the optoelectronic product packaging equipment of this utility model.

[0015] Figure 3 This is a front view of the structure of the optoelectronic product packaging equipment of this utility model.

[0016] Figure 4 This is the utility model Figure 3 A cross-sectional view of the AA line structure.

[0017] 101-Base, 102-Conveyor belt, 103-Positioning seat, 104-Collection frame, 105-First sponge pad, 106-Fixed frame, 107-Modible frame, 108-Slide rod, 109-Buffer spring, 110-Receiving plate, 111-Positioning frame, 112-Storage plate, 113-Second sponge pad, 114-Support seat, 115-Cylinder, 116-Encapsulation plate, 117-Detection plate, 118-Photoelectric sensor, 119-Receiving slot. Detailed Implementation

[0018] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain this utility model, and should not be construed as limiting this utility model.

[0019] Please see Figures 1-4 This utility model provides a packaging device for optoelectronic products: including a base 101, a conveyor belt 102, a packaging assembly, multiple positioning seats 103, and a buffer collection assembly. The conveyor belt 102 is fixedly connected to the base 101 and is located above the base 101. The packaging assembly is disposed above the conveyor belt 102. The multiple positioning seats 103 are all fixedly connected to the conveyor belt 102 and are evenly distributed on the conveyor belt 102. The buffer collection assembly includes a collection frame 104, a first sponge pad 105, a fixed frame 106, a movable frame 107, two sliding rods 108, two buffer springs 109, and a receiving plate 110. The collection frame 104 is disposed on the base. Above 101, the first sponge pad 105 is fixedly connected to the collection frame 104 and located inside the collection frame 104. The fixing frame 106 is fixedly connected to the base 101 and located above the base 101. The two ends of each slide rod 108 are fixedly connected to the base 101 and the fixing frame 106 respectively. The movable frame 107 is slidably connected to two slide rods 108. The two ends of each buffer spring 109 are fixedly connected to the base 101 and the movable frame 107 respectively, and are respectively sleeved on the outside of the corresponding slide rod 108. The receiving plate 110 is fixedly connected to the movable frame 107 and located above the movable frame 107.

[0020] In this embodiment, during use, the conveyor belt 102 drives the optoelectronic product to move. The packaging assembly quickly packages the optoelectronic product inside the positioning seat 103. When the packaged optoelectronic product moves to the end of the conveyor belt 102, it falls onto the receiving plate 110. The receiving plate 110 is pressed, causing the movable frame 107 to slide on the slide rod 108, while simultaneously squeezing the buffer spring 109. The force of the buffer spring 109 dissipates energy and buffers the optoelectronic product. Since the receiving plate 110 is tilted, the optoelectronic product slides down into the collection frame 104 for storage. The above process is repeated to achieve continuous packaging and collection of optoelectronic products, reducing manual labor. By adopting the above method, it is possible to easily collect the packaged optoelectronic products, reducing manpower and time, and simplifying the operation.

[0021] Furthermore, the buffer collection assembly also includes a positioning frame 111, which is fixedly connected to the base 101 and located above the base 101, and the collection frame 104 is adapted to the positioning frame 111.

[0022] In this embodiment, by setting the positioning frame 111 above the base 101, the collection frame 104 is limited by the positioning frame 111 to prevent the collection frame 104 from shifting.

[0023] Furthermore, the buffer collection assembly also includes a storage plate 112, which is movably connected to and extends through the collection frame 104. The storage plate 112 has a plurality of receiving slots 119.

[0024] In this embodiment, by movably arranging the storage plate 112 on the collection box, each optoelectronic product can be placed at intervals using the storage plate 112, which is beneficial for the storage of optoelectronic products.

[0025] Furthermore, the buffer collection assembly includes a plurality of second sponge pads 113, and each of the receiving slots 119 is fixedly disposed within a second sponge pad 113.

[0026] In this embodiment, by providing the second sponge pad 113 in each of the receiving slots 119, the second sponge pad 113 can better protect the optoelectronic products.

[0027] Furthermore, the packaging assembly includes a support base 114, a cylinder 115, a packaging plate 116, a detection plate 117, and a photoelectric sensor 118. The support base 114 is fixedly connected to the conveyor belt 102 and is located above the conveyor belt 102. The cylinder 115 is fixedly connected to the support base 114. The packaging plate 116 is fixedly connected to the output end of the cylinder 115. The detection plate 117 is fixedly connected to the support base 114 and is located on the outer side wall of the support base 114. The photoelectric sensor 118 is fixedly disposed below the detection plate 117.

[0028] In this embodiment, the conveyor belt 102 is activated to move the optoelectronic product. The photoelectric sensor 118 provided on the support base 114 senses the movement of the optoelectronic product during transport and can quickly stop its movement. The extension movement of the cylinder 115 enables the packaging plate 116 to quickly package the optoelectronic product inside the positioning base 103, thereby achieving continuous packaging of the optoelectronic product and improving the packaging speed of the packaging equipment. The above is prior art and will not be described in detail here.

[0029] The above-disclosed embodiments are merely preferred embodiments of the present utility model and should not be construed as limiting the scope of the present utility model. Those skilled in the art can understand that implementing all or part of the above-described embodiments and making equivalent changes in accordance with the claims of the present utility model are still within the scope of the utility model.

Claims

1. A packaging device for optoelectronic products, comprising a base, a conveyor belt, a packaging assembly, and a plurality of positioning seats, wherein the conveyor belt is fixedly connected to the base and located above the base, the packaging assembly is disposed above the conveyor belt, and the plurality of positioning seats are all fixedly connected to the conveyor belt and evenly distributed on the conveyor belt, characterized in that, It also includes a buffer collection assembly, which comprises a collection frame, a first sponge pad, a fixed frame, a movable frame, two slide rods, two buffer springs, and a receiving plate. The collection frame is disposed above the base. The first sponge pad is fixedly connected to the collection frame and located inside the collection frame. The fixed frame is fixedly connected to the base and located above the base. Both ends of each slide rod are fixedly connected to the base and the fixed frame, respectively. Each movable frame is slidably connected to two slide rods. Both ends of each buffer spring are fixedly connected to the base and the movable frame, respectively, and are respectively sleeved on the outside of the corresponding slide rod. The receiving plate is fixedly connected to the movable frame and located above the movable frame.

2. The optoelectronic product packaging equipment as described in claim 1, characterized in that, The buffer collection assembly further includes a positioning frame, which is fixedly connected to the base and located above the base, and the collection frame is adapted to the positioning frame.

3. The optoelectronic product packaging equipment as described in claim 2, characterized in that, The buffer collection assembly also includes a storage plate, which is movably connected to and extends through the collection frame. The storage plate has multiple receiving slots.

4. The optoelectronic product packaging equipment as described in claim 3, characterized in that, The buffer collection assembly includes multiple second sponge pads, and each of the receiving slots is fixedly disposed within a second sponge pad.

5. The optoelectronic product packaging equipment as described in claim 1, characterized in that, The packaging assembly includes a support base, a cylinder, a packaging plate, a detection plate, and a photoelectric sensor. The support base is fixedly connected to the conveyor belt and is located above the conveyor belt. The cylinder is fixedly connected to the support base. The packaging plate is fixedly connected to the output end of the cylinder. The detection plate is fixedly connected to the support base and is located on the outer side wall of the support base. The photoelectric sensor is fixedly disposed below the detection plate.

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