LED support and LED package structure
Patent Information
- Application Number
- CN202521890503.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-09-02
- Publication Date
- 2026-10-30
- Estimated Expiration
- 2035-09-02
AI Technical Summary
但是，这样的支架由于表面平整导致与后续封装加工时的胶层接触面积少，容易发生胶层与支架剥离的现象
[0016]本实用新型的LED支架中的塑封体包含有底层和多个侧壁，利用凸起的侧壁结构使得与胶层之间的接触面积增大，从而有利于增强支架与胶层之间的结合力，提高可靠性，防止两者剥离。同时，在底层四周的侧壁之间均留有出光间隙，确保与芯片封装后可以四周发光，不影响LED模组的性能。进一步地，本实用新型中的侧壁结构和位置可以灵活调整，使得增强了LED支架与胶层之间的可靠性以外，还可利用侧壁灵活布局LED模组的四周出光形式。
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Figure CN224924133U_ABST
Abstract
Description
Technical Field
[0001] This utility model belongs to the field of chip packaging technology, specifically relating to an LED bracket and LED packaging structure. Background Technology
[0002] In existing technologies, the lead frame structure of four-sided LED packaging products is relatively simple, generally employing a planar molding compound structure. During processing, injection molding is used to fill the electroplated wafer with molding compound, covering part of the upper surface. The uncovered portions of the electroplated wafer form die-bonding pads and wire-bonding pads, used for chip fixation and electrical connection, respectively. However, due to the flat surface of such a lead frame, the contact area with the adhesive layer during subsequent packaging processes is small, making it prone to adhesive layer delamination from the lead frame. Utility Model Content
[0003] In order to overcome the above-mentioned shortcomings of the prior art, the purpose of this utility model is to provide an LED bracket with good bonding force between the LED bracket and the adhesive layer, which is beneficial to improving the reliability and service life of the LED packaging structure.
[0004] The technical solution adopted by this utility model to solve its technical problem is:
[0005] The sidewalls are provided with at least four, which are respectively arranged around the bottom layer; the light-emitting gap is provided between two adjacent sidewalls; the die bonding pad is located in the middle of each sidewall.
[0006] Preferably, the LED bracket is rectangular; the sum of the widths of all the light-emitting gaps on each side of the upper surface of the bottom layer is less than or equal to half the width of the LED bracket.
[0007] Preferably, the sidewalls are provided at all four corners of the bottom layer; or, the light-emitting gaps are formed by leaving empty spaces at the four corners of the bottom layer.
[0008] In a preferred embodiment of this utility model, the thickness of the bottom layer ranges from 0.05mm to 0.5mm; the thickness of the sidewall ranges from 0.05mm to 1.0mm; and the area of the die bonding pad is greater than or equal to the area of the chip to be packaged.
[0009] In a preferred embodiment of this utility model, the sidewall is inclined to form a side slope that is wider at the bottom and narrower at the top; the angle of the side slope is between 60° and 90°.
[0010] In a preferred embodiment of this utility model, the corners of the sidewalls are provided with rounded corners.
[0011] In a preferred embodiment of the present invention, the sidewall comprises a plurality of walls, which are stacked sequentially from bottom to top to form a stepped sidewall; the projected area of the upper wall is smaller than that of the lower wall, and the height of the upper wall is less than or equal to that of the lower wall.
[0012] In a preferred embodiment of this utility model, the encapsulation body is fixed to the electroplated sheet by injection molding.
[0013] The second objective of this invention is to provide an LED packaging structure that includes the aforementioned LED bracket.
[0014] An LED packaging structure includes an LED bracket, a chip, a light-reflecting layer, a light-converting layer, and a light-blocking layer. The chip is fixed on a die-bonding pad of the LED bracket and is connected to the wire bonding pad via metal interconnects to form an electrical connection. The light-reflecting layer covers and fills the light-emitting gap and part of the bottom layer, the height of the light-reflecting layer is lower than the height of the sidewall, and the upper surface of the light-reflecting layer is planar or curved. The light-converting layer covers the LED bracket, the chip, and the light-reflecting layer, and the side of the light-converting layer is flush with the LED bracket. The light-blocking layer covers the light-converting layer, and the side of the light-blocking layer is flush with the light-converting layer.
[0015] Compared with the prior art, the beneficial effects of this utility model are:
[0016] The LED bracket of this invention comprises a base layer and multiple sidewalls. The raised sidewall structure increases the contact area with the adhesive layer, thereby enhancing the bonding force between the bracket and the adhesive layer, improving reliability, and preventing delamination. Simultaneously, light-emitting gaps are provided between the sidewalls around the base layer, ensuring that the LED module can emit light from all sides after encapsulation with the chip, without affecting the performance of the LED module. Furthermore, the sidewall structure and position in this invention can be flexibly adjusted, which not only enhances the reliability between the LED bracket and the adhesive layer but also allows for flexible arrangement of the LED module's circumferential light emission pattern. Attached Figure Description
[0017] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0018] Figure 1 This is a schematic diagram of the first embodiment of the LED bracket of this utility model.
[0019] Figure 2 for Figure 1 A cross-sectional view.
[0020] Figure 3 for Figure 1 Longitudinal cross-sectional view.
[0021] Figure 4 for Figure 1 A perspective view of the upper and lower layers of the electroplated sheet.
[0022] Figure 5 This is a schematic diagram of the second embodiment of the LED bracket of this utility model.
[0023] Figure 6 This is another schematic diagram of the second embodiment of the LED bracket of this utility model.
[0024] Figure 7 This is a schematic diagram of the third embodiment of the LED bracket of this utility model.
[0025] Figure 8 This is a schematic diagram of the LED packaging structure of this utility model.
[0026] in:
[0027] 1-Molded package, 2-Wire bonding pad, 3-Die bonding pad, 4-Sidewall, 401-First sidewall, 402-Second sidewall, 403-Third sidewall, 404-Fourth sidewall, 405-Fifth sidewall, 406-Sixth sidewall, 407-Second wall, 408-Second wall, 5-Light emission gap, 501-First gap, 502-Second gap, 6-Bottom layer, 7-Metal interconnect, 8-Chip, 9-Light reflective layer, 10-Light conversion layer, 11-Light blocking layer, 12-Metal connecting rib, 13-Electroplated sheet. Detailed Implementation
[0028] To better understand the above-mentioned objectives, features, and advantages of this utility model, it will be described in detail below with reference to the accompanying drawings and specific embodiments. It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. Many specific details are set forth in the following description to provide a thorough understanding of this utility model; the described embodiments are merely some, not all, of the embodiments of this utility model. All other embodiments obtained by those skilled in the art based on the embodiments of this utility model without inventive effort are within the scope of protection of this utility model.
[0029] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used in this specification is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.
[0030] Example 1
[0031] See Figures 1-4 This embodiment discloses an LED bracket, including an electroplated sheet 13 and a molding compound 1. The electroplated sheet 13 has metal connecting ribs 12. The molding compound 1 includes a bottom layer 6 and multiple sidewalls 4; the bottom layer 6 fills the electroplated sheet 13 and covers part of the upper surface of the electroplated sheet 13, and the uncovered metal connecting ribs 12 in the electroplated sheet 13 form die-bonding pads 3 and wire-bonding pads 2 for chip 8 packaging; the thickness of the bottom layer ranges from 0.05mm to 0.5mm, and the thickness of the sidewalls ranges from 0.05mm to 1.0mm. Multiple sidewalls 4 protrude from the upper surface of the bottom layer 6, respectively arranged around the perimeter of the bottom layer 6, with light-emitting gaps 5 between adjacent sidewalls 4, meaning that light-emitting gaps 5 are left around the perimeter of the upper surface of the bottom layer 6. The die-bonding pads 3 are located in the middle of each sidewall 4, and the area of the die-bonding pads 3 is greater than or equal to the area of the chip to be packaged.
[0032] In this embodiment, the LED bracket is rectangular. The sum of the widths of all light-emitting gaps 5 on each side of the upper surface of the bottom layer 6 is less than or equal to half the width of the LED bracket. Of course, the LED bracket in this embodiment can also be set to other shapes, such as circular.
[0033] Furthermore, in this embodiment, sidewalls 4 are provided at the four corners of the bottom layer 6. This allows the chip 8 to emit light from all four sides after it is packaged and fixed on the die bond pad 3, and the light intensity can be made uniform and consistent in the 0° and 90° directions by controlling the spacing between the four sidewalls 4.
[0034] For example, such as Figure 1 As shown, six sidewalls 4 can be provided on the upper surface of the bottom layer 6, namely the first sidewall 401, the second sidewall 402, the third sidewall 403, the fourth sidewall 404, the fifth sidewall 405, and the sixth sidewall 406. The distribution of these six sidewalls can be seen in [reference needed]. Figure 1The first sidewall 401, third sidewall 403, fourth sidewall 404, and sixth sidewall 406 are located at the four corners. The second sidewall 402 and fifth sidewall 405 are located on two opposite sides, forming two light-emitting gaps 5 on each opposite sidewall, denoted as the first gap 501. There is also a light-emitting gap 5 between the third sidewall 403 and the fourth sidewall 404, and between the first sidewall 401 and the sixth sidewall 406, denoted as the second gap 502. To ensure uniform light intensity, the sum of the widths of all first gaps 501 can be equal to the sum of the widths of all second gaps 502. Furthermore, the widths of all first gaps 501 and all second gaps 502 can be set to be equal to ensure uniform light emission in the same direction. Of course, to obtain different side-emitting effects, the number and width of the sidewalls 4 located in different directions, as well as the number and width of the light-emitting gaps 5 formed therein, can be flexibly adjusted.
[0035] Furthermore, in this embodiment, all corners of the sidewalls 4 are rounded. Specifically, the rounded radii of the first sidewall 401, the third sidewall 403, the fourth sidewall 404, and the sixth sidewall 406 can be set to be the same, and the rounded radii of the second sidewall 402 and the fifth sidewall 405 can be set to be the same.
[0036] See Figures 2-3 In this embodiment, all sidewalls 4 are inclined, forming a side slope that is wider at the bottom and narrower at the top; the angle of the side slope can be selected between 60° and 90°. In this embodiment, the height of the sidewall 4 is greater than 0.1mm, and the side of the sidewall 4 has a high reflectivity in order to obtain a better light reflection effect.
[0037] In this embodiment, the encapsulated body 1 is fixed to the electroplated sheet 13 by injection molding. That is, the bottom layer 6 and each side wall 4 of the encapsulated body 1 in this embodiment can be an integral structure, which can be formed by injection molding.
[0038] Example 2
[0039] See Figures 5-6The difference between this embodiment and Embodiment 1 is that in this embodiment, the four corners of the bottom layer 6 are left empty to form light-emitting gaps 5. That is, there are no sidewalls 4 at the four corners of the bottom layer 6 in this embodiment, and the sidewalls 4 on each side of the upper surface of the bottom layer 6 are the same, and the number and width of the light-emitting gaps 5 are also the same. Specifically, this embodiment has two sidewalls 4 on each side. The path of the light emitted by the LED chip 8 is farther in the 45° direction than in the 0° or 90° direction, and the light intensity at the 45° angle is relatively weaker. By setting sidewalls 4 in the 0° and 90° directions to block the light, it is beneficial to make the light intensity of the LED device the same at 0°, 90° and 45° angles, and the light distribution can be effectively controlled after the LED module is made. Of course, the number of sidewalls 4 on each side of the upper surface of the bottom layer 6 can also be flexibly adjusted, and is not limited to the implementation of setting two sidewalls 4 in this embodiment. Figure 5 As shown, two sidewalls 4 are provided on each side. Figure 6 As shown, there are two sidewalls 4 on two opposite sides and one sidewall 4 on the other two opposite sides.
[0040] Example 3
[0041] See Figure 7 The difference between this embodiment and Embodiment 1 is that the sidewall 4 in this embodiment includes several walls, which are stacked sequentially from bottom to top to form a stepped sidewall 4; the projected area of the upper wall is smaller than that of the lower wall, and the height of the upper wall is less than or equal to that of the lower wall. In this embodiment, the number of walls in the stepped sidewall 4 can be two, three, or more. By forming the stepped sidewall 4, the contact area between the adhesive layer and the support can be further increased, better preventing the adhesive layer from peeling off. Specifically, referring to the figure, the sidewall 4 in this embodiment includes a first wall 407 and a second wall 408.
[0042] Example 4
[0043] See Figure 8This embodiment discloses an LED packaging structure comprising an LED bracket according to any one of embodiments 1-3 above. The LED packaging structure further includes a chip 8, a light-reflecting layer 9, a light-converting layer 10, and a light-blocking layer 11. The chip 8 is fixed to the die-bonding pad 3 of the LED bracket. In this embodiment, the chip 8 can be a standard chip 8 or a vertical chip 8. The chip 8 is connected to the wire bonding pad 2 via a metal connecting wire 7 to form an electrical connection. The light-reflecting layer 9 can be obtained by dispensing, covering and filling the light-emitting gap 5 and part of the bottom layer 6. The height of the light-reflecting layer 9 is lower than the height of the sidewall 4. In this embodiment, the light-reflecting layer 9 can be made of a thermosetting resin material with reflective material, and its reflectivity is higher than that of the sidewall 4, the bottom layer 6, and the electroplated sheet 13. The light-converting layer 10 can be molded to cover the LED bracket, the chip 8, and the light-reflecting layer 9. The side of the light-converting layer 10 is flush with the LED bracket. In this embodiment, the light-converting layer 10 can be made of a thermosetting resin material with phosphor material, and the thickness of the light-converting layer 10 is greater than that of the LED bracket. The light blocking layer 11 can be molded onto the light conversion layer 10, and the side of the light blocking layer 11 is flush with the light conversion layer 10. In this embodiment, the light blocking layer 11 can be made of thermosetting resin material with reflective material, and its thickness is less than that of the light conversion layer 10 and greater than that of the LED bracket.
[0044] Furthermore, the upper surface of the light-reflecting layer 9 is either planar or curved. For example... Figure 8 As shown, the upper surface of the light-reflecting layer 9 in this embodiment is configured as a curved structure.
[0045] The above description is merely a preferred embodiment of the present utility model and is not intended to limit the present utility model in any way. Therefore, any modifications, equivalent changes, and alterations made to the above embodiments based on the technical essence of the present utility model without departing from the technical solution of the present utility model shall still fall within the scope of the technical solution of the present utility model.
Claims
1. An LED bracket, characterized in that, The device includes an electroplated sheet and a molding compound; the electroplated sheet has metal connecting ribs; the molding compound includes a bottom layer and multiple sidewalls; the bottom layer fills the electroplated sheet and covers part of the upper surface of the electroplated sheet, and the uncovered metal connecting ribs in the electroplated sheet form die bond pads and wire bond pads for chip packaging; multiple sidewall protrusions are disposed on the upper surface of the bottom layer, and light emission gaps are left around the upper surface of the bottom layer.
2. The LED bracket according to claim 1, characterized in that, The sidewalls are provided with at least four, which are respectively arranged around the bottom layer; the light-emitting gap is provided between two adjacent sidewalls; the die bonding pad is located in the middle of each sidewall.
3. The LED bracket according to claim 2, characterized in that, The LED bracket is rectangular; the sum of the widths of all the light-emitting gaps on each side of the upper surface of the bottom layer is less than or equal to half the width of the LED bracket.
4. The LED bracket according to claim 3, characterized in that, The bottom layer has sidewalls at all four corners; or, the bottom layer has empty spaces at all four corners to form the light-emitting gaps.
5. The LED bracket according to claim 1, characterized in that, The thickness of the bottom layer ranges from 0.05mm to 0.5mm; the thickness of the sidewalls ranges from 0.05mm to 1.0mm; and the area of the die bonding pads is greater than or equal to the area of the chip to be packaged.
6. The LED bracket according to any one of claims 1-5, characterized in that, The sidewall is inclined, forming a side slope that is wider at the bottom and narrower at the top; the angle of the side slope is between 60° and 90°.
7. The LED bracket according to any one of claims 1-5, characterized in that... The corners of the sidewalls are rounded.
8. The LED bracket according to any one of claims 1-5, characterized in that, The sidewall includes several wall bodies, which are stacked sequentially from bottom to top to form a stepped sidewall; the projected area of the upper wall body is smaller than that of the lower wall body, and the height of the upper wall body is less than or equal to that of the lower wall body.
9. The LED bracket according to any one of claims 1-5, characterized in that, The encapsulation body is fixed to the electroplated sheet by injection molding.
10. An LED packaging structure, characterized in that, The device includes an LED bracket, a chip, a light-reflecting layer, a light-converting layer, and a light-blocking layer as described in any one of claims 1-8; the chip is fixed on the die-bonding pads of the LED bracket, and the chip is connected to the wire bonding pads via metal interconnects to form an electrical connection; the light-reflecting layer covers and fills the light-emitting gap and part of the bottom layer, the height of the light-reflecting layer is lower than the height of the sidewall, and the upper surface of the light-reflecting layer is planar or curved; the light-converting layer covers the LED bracket, the chip, and the light-reflecting layer, and the side of the light-converting layer is flush with the LED bracket; the light-blocking layer covers the light-converting layer, and the side of the light-blocking layer is flush with the light-converting layer.