LED line arc module, light-emitting module and display device
Patent Information
- Application Number
- CN202522232982.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-10-22
- Publication Date
- 2026-10-30
- Estimated Expiration
- 2035-10-22
AI Technical Summary
[0004]本实用新型的目的在于解决现有的LED线弧模块存在键合线抗应力较差，易出现断线、脱落的技术问题
该LED线弧模块包括支架、设于支架上的芯片以及至少一条连接于支架和芯片的键合线，各键合线的端部可通过多层植球结构连接于支架和/或芯片上，多层植球结构中与支架或芯片接触的植球层能有效解决键合线与支架或芯片键合不牢固的问题，其余的植球层能有效解决键合线易断线的问题；同时，多层植球结构还能有效保护键合线的鱼尾，以能有效避免出现漏鱼尾等缺陷问题，提升产品稳定性及生产良品率。
Smart Images
Figure CN224924135U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of LED technology, and in particular to an LED linear arc module, a light-emitting module, and a display device. Background Technology
[0002] Currently, a common bonding method used in the manufacturing of LED linear arc modules is as follows: First, ultrasonic welding balls are used to weld them onto the chip electrodes. Then, a ceramic nozzle guides the wire through various bends such as reverse height, distance, and angle to form a trapezoidal linear arc. Finally, welding is performed on the bracket, and the welding process is completed by attaching the solder balls.
[0003] The LED wire arc module obtained by the above process has poor stress resistance of the bonding wire, which makes it prone to wire breakage, detachment, and dead lamp defects. Utility Model Content
[0004] The purpose of this invention is to solve the technical problem that existing LED wire arc modules have poor stress resistance of the bonding wires, which easily leads to wire breakage and detachment.
[0005] To solve the above-mentioned technical problems, this utility model provides an LED arc module, which adopts the following technical solution: The LED arc module includes a bracket, a chip disposed on the bracket, and at least one bonding wire connecting the bracket and the chip. At least one end of each bonding wire is connected to the bracket and / or the chip through a multi-layer ball-planting structure.
[0006] Optionally, the multi-layer ball-mounting structure includes an upper ball-mounting layer and a lower ball-mounting layer stacked on top of each other. The lower ball-mounting layer can be mounted on the support or the chip. One end of the bonding wire passes through the upper ball-mounting layer and the lower ball-mounting layer and is connected to the corresponding support or the chip.
[0007] Optionally, the lower ball-mounted layer is implanted on the support or the chip, the end of the bonding wire is driven into the lower ball-mounted layer and soldered to the corresponding support or chip, and the upper ball-mounted layer is implanted on the lower ball-mounted layer.
[0008] Optionally, the bonding wire includes an arc segment and a straight segment and an extension segment respectively connected to both ends of the arc segment. The straight segment is connected to the chip, and the extension segment is connected to the bracket.
[0009] Optionally, one end of the bonding wire is disposed near the side of the chip, and the arc segment of the bonding wire is bent toward the other side of the chip.
[0010] Optionally, the straight line segment is perpendicular to the chip.
[0011] Optionally, the extension segment may be straight or curved.
[0012] Optionally, the bonding wire is a gold wire, silver wire, copper wire, or alloy wire.
[0013] To solve the above-mentioned technical problems, this utility model also provides a light-emitting module, which adopts the following technical solution: The light-emitting module includes the LED arc module described above.
[0014] To solve the above-mentioned technical problems, this utility model also provides a display device, which adopts the following technical solution: The display device includes the light-emitting module described above.
[0015] Compared with the prior art, the LED arc module, light-emitting module and display device provided by this utility model have the following advantages: The LED arc module includes a bracket, a chip mounted on the bracket, and at least one bonding wire connecting the bracket and the chip. The ends of each bonding wire can be connected to the bracket and / or the chip through a multi-layer ball-planting structure. The ball-planting layer in the multi-layer ball-planting structure that contacts the bracket or chip can effectively solve the problem of weak bonding between the bonding wire and the bracket or chip, while the remaining ball-planting layers can effectively solve the problem of easy breakage of the bonding wire. At the same time, the multi-layer ball-planting structure can also effectively protect the "fishtail" of the bonding wire, so as to effectively avoid defects such as "fishtail leakage", thereby improving product stability and production yield. Attached Figure Description
[0016] To more clearly illustrate the solutions in this utility model, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort. Wherein: Figure 1 This is a plan view of the LED arc module in one embodiment of the present invention; Figure 2 yes Figure 1 A magnified view of point A in the LED arc module.
[0017] The labels in the attached diagram are as follows: 100. LED linear arc module; 10. Support; 20. Chip; 30. Bonding wire; 31. Arc segment; 32. Straight segment; 33. Extension segment; 40. Multi-layer ball-planting structure; 41. Upper ball-planting layer; 42. Lower ball-planting layer. Detailed Implementation
[0018] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains; the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the invention. For example, terms such as “length,” “width,” “upper,” “lower,” “left,” “right,” “front,” “rear,” “vertical,” “horizontal,” “top,” “bottom,” “inner,” and “outer” indicate orientations or positions based on the orientations or positions shown in the accompanying drawings and are merely for ease of description and should not be construed as limiting the invention.
[0019] The terms "comprising" and "having," and any variations thereof, in the specification, claims, and accompanying drawings of this utility model are intended to cover non-exclusive inclusion; the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this utility model are used to distinguish different objects, not to describe a specific order. "A plurality of" means two or more, unless otherwise explicitly specified.
[0020] In the description, claims, and accompanying drawings of this utility model, when an element is referred to as "fixed to," "mounted to," "set on," or "connected to" another element, it can be directly or indirectly located on that other element. For example, when an element is referred to as "connected to" another element, it can be directly or indirectly connected to that other element.
[0021] Furthermore, the reference to "embodiment" herein means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of the present invention. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.
[0022] This utility model embodiment provides an LED linear arc module 100, such as... Figure 1 and Figure 2 As shown, the LED arc module 100 includes a bracket 10, a chip 20 disposed on the bracket 10, and at least one bonding wire 30. Both ends of each bonding wire 30 can be connected to the bracket 10 and the chip 20 respectively. Specifically, the two ends of the bonding wire 30 can be soldered to the bracket 10 and the chip 20 respectively by ball bonding.
[0023] The end of the bonding wire 30 can be connected to the substrate 10 and / or the chip 20 via a multilayer ball-mounting structure 40. Optionally, one end of the bonding wire 30 can be connected to the substrate 10 via the multilayer ball-mounting structure 40, and the other end can be connected to the chip 20 via ordinary soldering or a single-layer ball-mounting structure; or, one end of the bonding wire 30 can be connected to the chip 20 via ordinary soldering or a single-layer ball-mounting structure, and the other end can be connected to the substrate 10 via the multilayer ball-mounting structure 40; or, both ends of the bonding wire 30 can be connected to the substrate 10 and the chip 20 respectively via the multilayer ball-mounting structure 40.
[0024] Any of the ball-planting layers in the multi-layer ball-planting structure 40 can be first planted on the scaffold 10 or the chip 20; then the end of the bonding wire 30 is driven into the ball-planting layer in the multi-layer ball-planting structure 40, and the end of the bonding wire 30 is welded to the scaffold 10 or the chip 20. That is, the ball-planting layers in the multi-layer ball-planting structure 40 that are in contact with the scaffold 10 or the chip 20 can make the bonding wire 30 bond firmly to the scaffold 10 or the chip 20; then, the remaining ball-planting layers in the multi-layer ball-planting structure 40 are planted on the basis of the ball-planting layers in contact with the scaffold 10 or the chip 20, which can effectively prevent the bonding wire 30 from breaking.
[0025] In summary, compared with existing technologies, the LED arc module 100 has at least the following beneficial effects: In the multi-layer ball-planting structure 40 of the LED arc module 100, the ball-planting layer that contacts the bracket 10 or chip 20 can effectively solve the problem of weak bonding between the bonding wire 30 and the bracket 10 or chip 20, while the remaining ball-planting layers can effectively solve the problem of easy breakage of the bonding wire 30. At the same time, the multi-layer ball-planting structure 40 can also effectively protect the fishtail of the bonding wire 30, so as to effectively avoid defects such as the fishtail leakage, thereby improving product stability and production yield.
[0026] To enable those skilled in the art to better understand the present invention, the following will be described in conjunction with the appendix. Figure 1 and Figure 2 The technical solutions in the embodiments of this utility model will be clearly and completely described.
[0027] In some embodiments, such as Figure 2As shown, the multi-layer ball-mounted structure 40 includes an upper ball-mounted layer 41 and a lower ball-mounted layer 42 stacked on top of each other. The lower ball-mounted layer 42 can be mounted on the scaffold 10 or the chip 20. One end of the bonding wire 30 can pass through the upper ball-mounted layer 41 and the lower ball-mounted layer 42 and be connected to the corresponding scaffold 10 or chip 20. The upper ball-mounted layer 41 can be mounted on the lower ball-mounted layer 42 and wrap around the end of the bonding wire 30. Understandably, the lower ball-mounted layer 42 can make the bonding wire 30 bond firmly to the scaffold 10 or the chip 20, increasing the adhesion between the bonding wire 30 and the scaffold 10 or the chip 20; the upper ball-mounted layer 41 can further increase the strength of the bonding wire 30 and effectively prevent the bonding wire 30 from breaking.
[0028] In some embodiments, the bonding process of the bonding wire 30 is roughly as follows: First, the lower ball-mounting layer 42 is implanted onto the support 10 or the chip 20. Then, one end of the bonding wire 30 is driven into the lower ball-mounting layer 42 and soldered onto the corresponding support 10 or the chip 20. Next, the upper ball-mounting layer 41 is implanted onto the lower ball-mounting layer 42, and the upper ball-mounting layer 41 can cover the end of the bonding wire 30.
[0029] Understandably, the above bonding process can effectively solve the problems of weak bonding between the bonding wire 30 and the support 10 or the chip 20, as well as the easy breakage of the bonding wire 30. At the same time, the multi-layer ball structure 40 can also effectively protect the fishtail of the bonding wire 30, so as to effectively avoid defects such as the fishtail being exposed.
[0030] In some embodiments, such as Figure 2 As shown, each bonding wire 30 includes an arc segment 31 and a straight segment 32 and an extension segment 33 respectively connected to both ends of the arc segment 31. The straight segment 32 can be connected to the chip 20, the extension segment 33 can be connected to the bracket 10, and the arc segment 31 can be located on the chip 20.
[0031] Understandably, the arc segment 31 can decompose the force on the bonding wire 30 when it is subjected to internal stress or external force, thereby improving the stress resistance of the bonding wire 30 and effectively preventing the bonding wire 30 from breaking.
[0032] The arc segment 31 is connected to the chip 20 via the straight segment 32. The straight segment 32 effectively avoids the breakage that is prone to occur when the arc segment 31 is directly connected to the chip 20, thereby further increasing the stress resistance of the bonding wire 30. Correspondingly, when the adhesive on the bonding wire 30 expands due to heat, the arc segment 31 can act as a buffer, effectively reducing the risk of wire breakage and failure at the connection between the straight segment 32 and the chip 20.
[0033] In some embodiments, such as Figure 1 and Figure 2As shown, the bonding wire 30 is connected to one end of the chip 20 near the side of the chip 20. The arc segment 31 of the bonding wire 30 can be bent toward the other side of the chip 20 so that the arc segment 31 can be completely located above the chip 20, thereby improving the overall compactness of the LED arc module 100.
[0034] In some embodiments, such as Figure 1 and Figure 2 As shown, two bonding wires 30 may be provided, and the two bonding wires 30 may be symmetrically arranged relative to the chip 20. Furthermore, the arc portions of the two bonding wires 30 may be bent in opposite directions.
[0035] In some embodiments, such as Figure 2 As shown, the straight segment 32 can be vertically mounted on the chip 20, which can buffer the arc segment 31 and effectively prevent the arc segment 31 from breaking due to its bending structure when it is directly connected to the chip 20, thereby further improving the stress resistance of the bonding wire 30.
[0036] In some embodiments, such as Figure 2 As shown, the extension section 33 can be straight or curved, depending on the specific structure of the LED arc module 100.
[0037] In some embodiments, the bonding wire 30 may be a gold wire, silver wire, copper wire, or alloy wire.
[0038] Based on the aforementioned LED arc module 100, this embodiment of the present invention also provides a light-emitting module. This light-emitting module includes the aforementioned LED arc module 100. This light-emitting module can be applied to in-vehicle ambient lighting, exterior grilles, billboards, etc.
[0039] Based on the aforementioned LED arc module 100, this embodiment of the invention also provides a display device. This display device includes the aforementioned light-emitting module. The display device can be a lamp, an advertising screen, etc.
[0040] The above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention. Various modifications and variations can be made to the present invention by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the scope of the claims of the present invention.
Claims
1. An LED linear arc module, characterized in that, It includes a support, a chip disposed on the support, and at least one bonding wire connecting the support and the chip, wherein at least one end of each bonding wire is connected to the support and / or the chip through a multilayer ball-mounting structure.
2. The LED arc module according to claim 1, characterized in that, The multi-layer ball-mounting structure includes an upper ball-mounting layer and a lower ball-mounting layer stacked on top of each other. The lower ball-mounting layer can be implanted on the support or the chip. One end of the bonding wire passes through the upper ball-mounting layer and the lower ball-mounting layer and is connected to the corresponding support or chip.
3. The LED arc module according to claim 2, characterized in that, The lower ball-mounted layer is implanted on the support or the chip, the end of the bonding wire is driven into the lower ball-mounted layer and soldered to the corresponding support or chip, and the upper ball-mounted layer is implanted on the lower ball-mounted layer.
4. The LED arc module according to claim 1, characterized in that, The bonding wire includes an arc segment and a straight segment and an extension segment connected to both ends of the arc segment, the straight segment being connected to the chip and the extension segment being connected to the bracket.
5. The LED arc module according to claim 4, characterized in that, The bonding wire is connected to one end of the chip near the side of the chip, and the arc segment of the bonding wire is bent toward the other side of the chip.
6. The LED arc module according to claim 4, characterized in that, The straight line segment is perpendicular to the chip.
7. The LED arc module according to claim 4, characterized in that, The extended section can be straight or curved.
8. The LED arc module according to claim 1, characterized in that, The bonding wire is gold wire, silver wire, copper wire, or alloy wire.
9. A light-emitting module, characterized in that, Includes the LED arc module according to any one of claims 1 to 8.
10. A display device, characterized in that, Includes the light-emitting module according to claim 9.